201105425 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種控制塗施設備（coating apparatus )的 方法，且更明確地說，涉及一種控制用於塗施密封劑的密 封分配器（seal dispenser )的噴嘴（n〇zzle )與感測器（sensor ) 之間的距離的方法。 【先前技術】 迄今通常已使用陰極射線管（cathode ray tube，CRT ) 作為顯示裝置。然而，由於其缺點（例如體積大且重量重）， 針對包含液晶顯示器（liquid crystal display，LCD)、等離 子體顯示面板（plasma display panel，PDP)、有機發光裝 置（organic light emitting device，OLED )等在内的平板顯 示器（flatpanel display)的市場正在增長。 上文所描述的平板顯示器通常是通過連結一對平坦基 底來製造的。舉例來說，就液晶顯示面板（liquid crystal display panel)而論，首先製造上面形成有多個薄膜電晶體 (thin film transistor )和晝素電極（pixei eieetr〇(je )的下部 基底以及上面形成有彩色濾、光片（c〇l〇r mter)和共用電極 (common electrode)的上部基底。接著，將液晶滴落在下 部基底上，且在下部基底的邊緣區中塗施密封劑。此後， 將下部基底的上面形成有晝素電極的表面與上部基底的上 面形成有共用電極的表面定位成面向彼此、附接在一起且 雄封’以便製造液晶顯示面板。 在製造過程期間，使用塗施設備來塗施密封劑，且需 4 201105425 要所述設備使用精確地控制密封劑注射噴嘴（咖_ jec ion nozzle)與基底之間的間隙的技術。舉例 當 之間的間隙非常小時，所塗施的密封劑的圖案 = 圖案的高度變低。然而，當基底與喷嘴之 間的間隙過大時，基底上的塗施材料圖案的寬度變窄，且 有時塗施材料圖案可能具有不連貫的區段。 ^將密封劑塗施在基底上以形成塗施材料圖案的情況 下’當基底的表面科或基底的表面上的―部分中形成額 外膜層時’可能會無意地改變喷嘴與基底之間的間隙。 、旦因此，新近塗施設備中的一些設備經配置以包含用於 測量噴嘴與基底之_間_感測器。在密封劑的塗施期 間，使用感測器來週期性地測量喷嘴與基底之間的間隙， 使得基底射嘴之__可保躲定。由此，可抑制在 塗施材料圖案中產生缺陷。 然而’因為噴嘴與感測器組合並安裝到塗施設備，所 以噴嘴與感測器之間的實際距離變得不同於原始既定的距 離。所述距離可能在例如更換喷嘴等任何操作期間改變。 由於噴嘴與間隙感測器之間的距離的差異，感測器的 測量點可能改變。在此情況下，從感測器發射的光可能到 達非既定基底區，這導致塗施材料圖案的變化。舉例來說， 由於噴嘴與感測器之間的距離的差異，感測器可能測量基 底與噴嘴之間對應於上面塗施有膜層的基底區的間隙，而 不是測量基底與喷嘴之間對應於基底的密封劑塗施區的間 隙。因此’需要精確地測量噴嘴與感測器之間的距離。 201105425 、為了 ’則1喷嘴與感測益之間的距離，通常已使用例如 視覺相機（vision ea赌a)等額外裝置。然而，在此情況 下’應2外提_於測量噴嘴與感測器之間的距離的視覺 相機這伴有帛於製造分配器的成本增加或設備的體積增 加的缺點。 【發明内容】 、本發明提供—健觀錢_方法，麟方法能夠 通過使用/l!j .1基底與塗施構件之間的距離的制器測量光 ( optical spot) ^1 * ( coating material pattern) 之間的距離來增強測量所述距離的準確性。 〃根據示範性實施例，一種控制包含用於將塗施材料塗 施在基底上的塗施構件以及具有用於測量基底與塗施構件 之間的距離的感測器的分配器的塗施設備的方法可包含： 使用塗施構件在基底上形成塗施材料圖案；通過使用感測 器將光照射到基絲獲得光點與塗施材料圖案之間的距離 相對於塗施構件的垂直位置的變化率；基於所獲得的光點 與塗施材料圖案之間的距離相對於塗施構件的垂直位置的 變化率，輯相對魏技㈣過財使 垂直位置的光點與塗施材料圖案之間的距離；將所 光點與塗婦制案之_轉_設距雜進行比較； =及基於比較結果，㈣控概測器與塗施構件之間的距 離來控制光點與塗施材料圖案之間的距離。 從感測器騎的光㈣於基射具有在5 的範圍内的恆定傾角。 J ! 201105425 使用塗施構件在基底上形成塗 制塗施構件的垂言射，讀湘案可包含：控 塗施=垂直位置相同;以及形成塗施材料圖工使用的 點與塗施材_案之_距離相對於塗施構件 ^垂^位置的變化率可包含：升高或降低塗施構件，以使 、施構件相對於基底定位在兩個或^似上不同位置 ==於塗施構件的相應垂直位置的光點與塗施材 科圖案之_轉’賴㈣絲與塗 距離相對於塗施構件的垂直位置的變化率。㈣之間的 使用塗施構件的兩個或兩個以上不同垂直位置處的光 I塗施材料_之_距離來計算相對於既定在實際過 程中使用的塗施構件的垂直位置的光點與塗施材料圖^之 間的距離。 假定將塗施構件的垂直位置表示為Η，將相對於塗施 構件的垂直位置的光點與塗施材料圖案之間的距離表示為 X ’那麼 1可將垂直位置表達為等式Η=ΑΧ+Β。使用所述等 式來計算相對魏定在實際過程巾使㈣塗施構件的垂直 位置的光點與塗施材料圖案之間的距離。 測量相對於塗施構件的相應垂直位置的光點與塗施材 料圖案之間的距離可包含：控制塗施構件的垂直位置；使 用感測器將光照射到基底上；將從感測器照射到基底上的 光所形成的光點位於其上的第一點設置為虛擬坐標系上的 參考座標；通過在連續照射光的同時移動分配器且使用所 述光來檢測塗施材料圖案的中心點，且在虛擬坐標系上標 7 201105425 記所述中d錢計算設置在虛擬坐⑽上的參考座梗 與標記在錄錄紅的塗騎料的巾，⑽的座標: 問的矣盈。 。。檢測塗施材料圖案的中心點可包含：水平地移動分配 裔，且使用分配㈣❹彳科續地照射光，以檢測塗施材 料圖案的具有最大厚度的位置；以及將具有最大厚度的位 置的中心設置為中心點。 或者，檢測塗施材料圖案的中心點可包含：使用感 器來測量塗施㈣®案的線寬；以及將賴量的塗施材料 圖案的線寬的中心設置為中心點。 在控制塗施構件的垂直位置期間，控制塗施構件的垂 直位置使其高於既定在實際過程中使用的塗施構件的垂 位置。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 在下文中，將參看附圖詳細描述示範性實施例。然而， 本發明可以許多不同形式體現，且不應被解釋為限^本文 所陳述的示範性實施例。相反，提供這些示範性實施例是 為了使本揭示内容將為全面且完整的，且將把本發明的2 念完全傳達給所屬領域的技術人員。 圖1是說明根據示範性實施例的塗施設備的示意性概 念圖。圖2是說明根據示範性實施例的分配器的截面圖。 參看圖1和圖2’根據示範性實施例的塗施設備包含·201105425 VI. Description of the Invention: [Technical Field] The present invention relates to a method of controlling a coating apparatus, and more particularly to a sealed dispenser for controlling the application of a sealant The method of the distance between the nozzle (n〇zzle) and the sensor (sensor). [Prior Art] Conventionally, a cathode ray tube (CRT) has been used as a display device. However, due to its disadvantages (for example, bulky and heavy), it is intended to include a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting device (OLED), and the like. The market for flat panel displays is growing. The flat panel display described above is typically fabricated by joining a pair of flat substrates. For example, in the case of a liquid crystal display panel, first, a lower substrate on which a plurality of thin film transistors and a bismuth electrode (pixei eieetr〇(je) are formed and formed thereon are formed An upper substrate of a color filter, a light sheet, and a common electrode. Next, the liquid crystal is dropped on the lower substrate, and a sealant is applied to the edge region of the lower substrate. Thereafter, The surface of the lower substrate on which the halogen electrode is formed and the surface on which the common electrode is formed on the upper substrate are positioned to face each other, attached together and male' to manufacture a liquid crystal display panel. During the manufacturing process, the application device is used. Applying a sealant, and requires 4 201105425 to use the device to precisely control the gap between the sealant injection nozzle and the substrate. For example, when the gap is very small, the applied The pattern of the sealant = the height of the pattern becomes lower. However, when the gap between the substrate and the nozzle is too large, the pattern of the application material on the substrate The degree is narrowed, and sometimes the application material pattern may have a discontinuous section. ^When the sealant is applied to the substrate to form a pattern of the application material, 'on the surface of the substrate or on the surface of the substrate ― When an additional film layer is formed in the portion, the gap between the nozzle and the substrate may be unintentionally changed. However, some of the devices in the recent applicator device are configured to include a sensor for measuring the nozzle and the substrate. During the application of the sealant, a sensor is used to periodically measure the gap between the nozzle and the substrate, so that the base nozzle can be prevented from being hidden. Thereby, defects in the pattern of the applied material can be suppressed. However, 'because the nozzle is combined with the sensor and mounted to the applicator, the actual distance between the nozzle and the sensor becomes different from the original set distance. The distance may change during any operation, such as changing the nozzle. Due to the difference in the distance between the nozzle and the gap sensor, the measuring point of the sensor may change. In this case, the light emitted from the sensor may reach a non-determined base area, which A change in the pattern of the applied material. For example, due to the difference in the distance between the nozzle and the sensor, the sensor may measure the gap between the substrate and the nozzle corresponding to the substrate region on which the film layer is applied, and It is not the gap between the substrate and the nozzle that corresponds to the sealant application area of the substrate. Therefore, it is necessary to accurately measure the distance between the nozzle and the sensor. 201105425, in order to 'the distance between the nozzle and the sensing benefit In general, additional devices such as a vision camera (vision ea a) have been used. However, in this case, a visual camera that measures the distance between the nozzle and the sensor is associated with manufacturing distribution. The disadvantage of increasing the cost of the device or increasing the size of the device. SUMMARY OF THE INVENTION The present invention provides a method for controlling money. The method can measure optical spots by using a distance between the substrate and the application member. The distance between pattern) to enhance the accuracy of measuring the distance. According to an exemplary embodiment, an applicator device for controlling a dispenser comprising an applicator member for applying an application material to a substrate and a sensor having a sensor for measuring a distance between the substrate and the applicator member is used. The method may include: forming an application material pattern on the substrate using the application member; and irradiating light to the base wire by using a sensor to obtain a distance between the light spot and the application material pattern relative to a vertical position of the application member. Rate of change; based on the rate of change of the distance between the obtained spot and the pattern of the applied material relative to the vertical position of the applicator member, between the spot of the vertical position and the pattern of the applied material relative to Wei (4) The distance between the light spot and the painter's case is compared with the miscellaneous _ set distance; = and based on the comparison result, (4) the distance between the control device and the application member to control the light spot and the application material pattern the distance between. The light (4) from the sensor ride has a constant tilt angle in the range of 5. J ! 201105425 Using the application member to form the coating of the coated member on the substrate, the reading case may include: the control application = the same vertical position; and the formation of the application material drawing point and the coating material _ The rate of change of the distance relative to the position of the applicator member may include: raising or lowering the applicator member such that the member is positioned at two or different positions relative to the substrate == The rate of change of the spot of the corresponding vertical position of the member and the vertical position of the coated member relative to the coated member. (d) Between the two or more different vertical positions of the application member using the light I application material_distance to calculate the relative position of the light relative to the vertical position of the application member used in the actual process The distance between the application materials ^. Assuming that the vertical position of the application member is denoted by Η, the distance between the spot relative to the vertical position of the application member and the pattern of the application material is expressed as X ' then 1 can be expressed as an equation Η = ΑΧ +Β. The equation is used to calculate the distance between the spot relative to the application material pattern relative to the vertical position of the (4) application member in the actual process towel. Measuring the distance between the spot relative to the respective vertical position of the applicator member and the pattern of the application material can include: controlling the vertical position of the applicator member; using a sensor to illuminate the light onto the substrate; illuminating from the sensor The first point on which the light spot formed by the light on the substrate is located is set as a reference coordinate on the virtual coordinate system; the center of the application material pattern is detected by moving the dispenser while continuously irradiating the light and using the light Point, and in the virtual coordinate system on the standard 7 201105425, the d money is calculated to set the reference seat on the virtual seat (10) and the towel marked on the record of the red, the coordinates of (10): Q. . . Detecting the center point of the application material pattern may include: moving the person to be distributed horizontally, and illuminating the light using the distribution (4) to detect the position of the application material pattern having the maximum thickness; and the center of the position having the maximum thickness Set as the center point. Alternatively, detecting the center point of the application material pattern may include: using a sensor to measure the line width of the application (4)®; and setting the center of the line width of the application material pattern as the center point. During control of the vertical position of the applicator member, the vertical position of the applicator member is controlled to be higher than the vertical position of the applicator member that is intended to be used in the actual process. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, the exemplary embodiments are provided so that this disclosure will be thorough and complete, and the invention will be fully conveyed by those skilled in the art. FIG. 1 is a schematic conceptual view illustrating an applicator apparatus according to an exemplary embodiment. 2 is a cross-sectional view illustrating a dispenser in accordance with an exemplary embodiment. Referring to Figures 1 and 2', the application device according to an exemplary embodiment includes
S 201105425 台（stage) 100，基底l〇安放於所述台100上；分配器 (dispenser) 200，其用於將塗施材料塗施在安放於臺上的 基底上；驅動單元（drivingunit) 500，其用於升高和降低 分配器200 ;傳送單元（transferunit) 300，其用於水平地 傳送台100和分配器200 ;以及控制單元（controlling unit) 400 ’其用於控制傳送單元300、台100和分配器200。儘 管在示範性實施例中將密封劑用作塗施材料，但不限於 此’且可將各種材料用作塗施材料。 台100可在X和y方向上移動，以沿基底1〇的邊緣區 的周長形成塗施材料圖案。或者，分配器200可在X和y 方向上移動，以將塗施材料塗施在基底10上，或台1〇〇 和分配器200兩者均可在X和y方向上移動以塗施塗施材 料，或台100可在一個方向上移動，而分配器2〇〇在另一 方向上移動，以塗施塗施材料。傳送單元3〇〇使用電動機 或軌道來移動台100和分配器200。可使用另一各種構件 來移動台100和分配器200。 分配器200包含塗施構件210、感測器22〇和支撐部 件（supporting member) 230。塗施構件21〇包含：注射器 (syringe) 212’其中儲存塗施材料（例如，密封劑）；主^ 部分（bodypart) 213,注射器212安裝並固定在其中；以 及喷嘴211，其安置在主體部分213下方’且將儲存在注 射器212中的塗施材料塗施到基底1〇上。感測器22〇檢測 塗施構件210的噴嘴211與基底1〇之間的距離。支撐部件 230安置在塗施構件210與感測器220之間，使得感測器 9 201105425 220可安裝並固定到支撐部件23〇。 塗施構件210的噴嘴211和注射器212可附接到主體 部分213且可從主體部分213拆卸，以實現噴嘴211和注 射器212的更換。另外，感測器220可附接到支撐部件230 且可從支撐部件230拆卸，且支撐部件230可附接到分配 器210的主體部分213且可從分配器210的主體部分213 拆卸。感測器安裝並固定到其的支撐部件230與分配器210 的主體部分213可使用輕合部件（C0Upiing member)(未 圖示）（例如螺絲）彼此連接。由此，可通過控制耦合部件 (未圖示）來控制安裝到支撐部件230的感測器220與喷嘴 211之間的距離。 分配器200隨著其在X和y方向上移動而經由喷嘴211 將注射器212中的塗施材料塗施到基底10上。同時，感測 器220測量基底1〇與噴嘴211之間的距離，且基於測量結 果’使用驅動單元在向上和向下方向上移動分配器200, 以使基底10與喷嘴211之間的距離保持恆定。以此方式， 可使沿基底的邊緣的周長形成的塗施材料圖案維持為均一 線性形狀。 根據示範性實施例的感測器使用（例如）利用雷射的 距離測量感測器（distance measuring sensor )。儘管未圖 示’但此類型的感測器包含：發光部分（light emitting part) (未圖示）’其用於朝基底10發射距離測量光（distance measuring light);以及光接收部分（light receiving part)(未 圖示）’其用於接收從發光部分（未圖示）發射的光。發光 201105425 部分（未圖示）和光接收部分（未圖示）可-體式形成， 且彼此間隔開預定距離。 .如前面所提到，當從感測器220照射到基底1〇的亮點 (hght spot)與塗施材料圖案之間的距離變得超出預設距離 值時，可能產生塗施材料圖案的缺陷。 ,出於所述原因，根據示範性實施例，在基底1Q上實際 上形成塗施材料圖案之前’獲得從感測器22G _的光^ 203與塗施材料圖案202之間的距離。 ‘‘" 圖3是繪示根據示範性實施例的控制分配器的塗施構 件以及感測H的綠的流程圖。圖4是綱根據示範性實 施例使用分配H的塗施構件在賴基底上形成塗施材料圖 案的圖° ® 5和® 6是财地制在假定塗施構件的垂直 位置為H1的情況下測量塗婦料圖案與光點之間的距離 的圖。圖7是繪示當塗施構件㈣直位置為m時塗施材 料圖案和光點的座標的圖。圖8和圖9是循序地說明在假 定塗施構件的垂直位置為H2的情況下測量塗施材料圖案 與光點之間的距離的圖。圖1〇是繪示當塗施構件的垂直位 置為H2時塗施材料圖案和光點的座標的圖。 在下文中，將參看圖3到圖1〇來闡釋控制塗施構件 210與感測器220之間的距離。 根據示範性實施例，控制塗施構件21〇與感測器22〇 之間的距離包含將測試基底201定位在台1〇〇上。^使用 與實際過程中使㈣基底10 __的基底作為測試基 底201。如圖3和圖4中所說明，在測試基底2〇1上形成 11 201105425 塗施材料圖案202 (步驟S100)。將塗施構件210的垂直 位置設置為Ht，且從塗施構件210釋放密封劑以形成塗施 材料圖案202，用於測量測試基底201上的距離。如前面 所提到，根據示範性實施例，塗施構件210的用於釋放塗 施材料的噴嘴211安裝在主體部分213下方，且塗施材料 202使用噴嘴211形成於基底201上。因此，可能優選的 是塗施構件210的喷嘴211相對於基底201的垂直位置為 Ht〇Ht與如圖1中所說明的當在實際過程期間在基底上形 成塗施材料圖案202時所使用的噴嘴211的垂直位置相 同，這允許塗施材料圖案202在與實際過程相同的條件下 形成於測試基底201上。Ht可在20微米到70微米的範圍 内。根據示範性實施例，塗施材料圖案2〇2形成為圓形形 狀，且如圖4中所說明測量塗施材料圖案2〇2與光點2的 之間的距離。然而，本發明不限於此，且塗施材料圖案 可以預定桿（或條）形狀形成於測試基底2〇丨上。 此後，使用感測器220獲得光點203與塗施材料圖案 202之間的距離相對於喷嘴211的垂直位置的變化率 驟S120)。為此，如圖5和圖8中所說明，將喷嘴21丨的 垂直位置設置於兩個不同位置H1和H2 ’且計算相對 嘴211的垂直位置H1和H2的光點2〇3與塗施材料圖案 =和X2 °用f式H=AX+B來獲得光點 2〇3與塗施材料圖案2〇2之間的距離相對於喷嘴叫 直位置的變化率。Η表示喷嘴211的垂直位置，且 光點203與塗施材料圖案2〇2之間的距離。Α和β是表徵 12 201105425 塗施材料圖案202與光點203之間的距離相對於 的垂直位置的變化率的係數。為了獲得Α#σβ的值二 示範性實施例，測量相對於喷嘴211的垂直位置Ηι和^2 的光點203與塗施材料圖案2〇2之間的距離χι和。將 所測量的值應用於等式Η=ΑΧ+Β，以將所述尊★ 也 Η刚制，侧。可通過求解以 得係數Α和Β。以此方式，可獲得光點2〇3與塗施材料^ 案202之間的距離相對於喷嘴211的垂直位置的變化率。 下文中將給出更詳細的闡釋。 如圖5中所說明，使用驅動單元5〇〇來升高和降低分 配器200 ’以將噴嘴211定位於相對於測試基底2〇1的垂 直位置H1處。換句話說，將測試基底2〇1與噴嘴211之 間的距離設置為H1。可能優選的是H1大於上文所述的 Ht。當喷嘴211的垂直位置等於或低於扭時，可能難以測 i光點203與塗施材料圖案202之間的距離。也就是說， 喷嘴211可能在測量光點2〇3與塗施材料圖案之間的距離 的過程期間刮傷測試基底201，或塗施在測試基底2〇1上 的塗施材料圖案202可能污染喷嘴211的末端。 此後’使用感測崙220將光（例如，雷射）照射到測 試基底201上。從感測器220照射的光相對於測試基底201 的傾角可在50度到70度的範圍内，且優選為6〇度。根據 示範性實施例，如圖7中所說明，將從感測器22〇照射的 光最初入射到的基底201的點設置為原點（〇,0八可能優 選的是將最初照射到測試基底2〇1的光點203的中心點設 201105425 置為原點（〇,〇)。 此後，搜索塗施材料圖案202的中心點。為此，如圖 6中所說明’使用傳送單元300和控制單元4〇〇來水平地 傳送分配器200 ’同時使用感測器220連續地將光照射到 測試基底201。可通過測量塗施材料圖案202的厚度以找 出最高點來搜索塗施材料圖案202的中心點。為此，如前 面所提到那樣傳送分配器200 ’以找出感測器220顯示最 低輪出的區。將感測器220顯示最低輸出的區設置為塗施 材料圖案202的中心點。 儘管圖中未繪示，但可通過測量塗施材料圖案2〇2的 線寬來找出塗施材料圖案202的中心點。因為塗施在測試 基底201上的塗施材料圖案202經形成為具有實質上恆定 的寬度’所以可通過使用感測器220測量塗施材料圖案2〇2 的線寬且將所測量的塗施材料圖案2〇2的線寬的中心設置 為中心點來找出塗施材料圖案202的中心點。 接著，如圖7中所說明，將使用感測器22〇找出的塗 施材料圖案202的中心點（Xx，Yy)標記在虛擬坐標系上。 在虛擬坐標系上，_記最初照射到測試基底2〇1的光點 2〇3的中心點，即原點（M)。因此，可通過檢測光點⑽ 的中心所位於的原點（0, 0)以及塗施材料圖案2〇2的中 心點（Xx，Yy)來計算光點203與塗施材料圖案2〇2之門 的距離值Xi。光點203與塗施材料圖案2〇2之間的距雜 X1對應於喷嘴211的垂直位置hi。 接著，將喷嘴211的垂直位置改變為與以上描述的hi 201105425 不同的位置’且計算相對於改變的垂直位置的光點203與 塗施材料圖案202之間的距離值。 具體地說’使用傳送單元500來升高或降低分配器 200，直到喷嘴211的垂直位置變為H2為止，如圖8中所 說明。H2可大於以上描述的Ht，且不同於H1。在示範性 實施例中，將H2設置為大於H1。接著，使用感測器220 將光照射到測試基底201。如圖10中所說明，將從感測器 220照射的光最初入射到的測試基底201的點設置為原點 (0，0)。可能優選的是將最初照射到測試基底2〇1的光點 203的中心點設置為原點’（〇，〇 )。 此後，搜索塗施材料圖案202的中心點。為此，如圖 9中所說明，使用傳送單元300和控制單元400來水平地 傳送分配器200，同時使用感測器220連續地將光照射到 測試基底201。可通過測量塗施材料圖案202的厚度以找 出最高點來搜索塗施材料圖案202的中心點。為此，如前 面所提到那樣傳送分配器200 ’以找出感測器220顯示最 低輸出的區。將感測220顯不最低輸出的區設置為塗施 材料圖案202的中心點。 接著，如圖10中所說明，將使用感測器220找出的塗 施材料圖案202的中心點（Xx，Yy)標記在虛擬坐標系上。 在虛擬坐標系上，還標記最初照射到測試基底201的光點 203的中心，即原點（0, 0)。因此，可通過檢測光點203 的中心所位於的原點（〇，0)以及塗施材料圖案202的中 心點（Xx，Yy)來計算光點203與塗施材料圖案202之間 15 201105425 的距離值X2〇光點203與塗施材料圖案202之間的距離值 X2對應於喷嘴211的垂直位置H2。 根據示範性實施例，將噴嘴211的垂直位置設置於不 同位置H1和H2，以測量相對於相應位置H1和H2的光 點203與塗施材料圖案202之間的距離值XI和χ2。然而， 本發明不限於此，且可將喷嘴211控制為處於兩個或兩個 以上不同垂直位置，以便計算相對於喷嘴211的垂直位置 的光點20.3與塗施材料圖案202之間的距離值。 一旦相對於喷嘴211的垂直位置hi和H2測量了光點 203與塗施材料圖案202之間的距離值，便可基於所測量 的值獲得光點203與塗施材料圖案搬之_距離值相對 於喷嘴211㈣直位置的變化率。這可表達為等式 H=AX+B，其中Η表示噴嘴的垂直位置，且χ為光點2〇3 與塗施材料圖案202之_距離。Α和Β是表徵塗施材料 圖案202與光點203之間的距離相對於噴嘴211的垂直位 置的變化率的係數。為了獲得a#dB的值，如前面所提到， 測量相對於喷嘴2η的垂直位置HM〇H2力光點2〇3盘塗 案的距離X1和X2。將所測量的值應用 將所料式錢為和 解以上聯立等式來獲得係數Α和 B。以此方式，可獲侍光點2〇3與塗S 201105425 stage 100, a substrate 10 is placed on the stage 100; a dispenser 200 for applying a coating material on a substrate placed on the stage; a driving unit 500 It is used to raise and lower the dispenser 200; a transfer unit 300 for horizontally transferring the stage 100 and the dispenser 200; and a control unit 400' for controlling the transfer unit 300, the stage 100 and dispenser 200. Although the sealant is used as the application material in the exemplary embodiment, it is not limited thereto and various materials can be used as the application material. The stage 100 is movable in the X and y directions to form a pattern of application material along the circumference of the edge region of the substrate 1〇. Alternatively, the dispenser 200 can be moved in the X and y directions to apply the application material to the substrate 10, or both the table 1 and the dispenser 200 can be moved in the X and y directions for application. The material, or table 100, can be moved in one direction while the dispenser 2 is moved in the other direction to apply the application material. The transfer unit 3 uses a motor or track to move the stage 100 and the dispenser 200. Another variety of components can be used to move station 100 and dispenser 200. The dispenser 200 includes an application member 210, a sensor 22, and a supporting member 230. The application member 21A includes: a syringe (212) in which a coating material (for example, a sealant) is stored; a body part 213 in which the syringe 212 is mounted and fixed; and a nozzle 211 disposed in the body portion 213 is below and the application material stored in the syringe 212 is applied to the substrate 1 . The sensor 22 detects the distance between the nozzle 211 of the application member 210 and the substrate 1〇. The support member 230 is disposed between the application member 210 and the sensor 220 such that the sensor 9 201105425 220 can be mounted and fixed to the support member 23A. The nozzle 211 and syringe 212 of the applicator member 210 can be attached to and detachable from the body portion 213 to effect replacement of the nozzle 211 and the injector 212. Additionally, the sensor 220 can be attached to and detachable from the support member 230, and the support member 230 can be attached to and detachable from the body portion 213 of the dispenser 210. The support member 230 to which the sensor is mounted and fixed and the main body portion 213 of the dispenser 210 may be connected to each other using a coupling member (not shown) such as a screw. Thereby, the distance between the sensor 220 mounted to the support member 230 and the nozzle 211 can be controlled by controlling a coupling member (not shown). The dispenser 200 applies the application material in the syringe 212 to the substrate 10 via the nozzle 211 as it moves in the X and y directions. At the same time, the sensor 220 measures the distance between the substrate 1 and the nozzle 211, and moves the dispenser 200 in the upward and downward directions using the driving unit based on the measurement result to keep the distance between the substrate 10 and the nozzle 211 constant. . In this way, the pattern of the application material formed along the circumference of the edge of the substrate can be maintained in a uniform linear shape. A sensor according to an exemplary embodiment uses, for example, a distance measuring sensor that utilizes a laser. Although not illustrated 'but this type of sensor includes: a light emitting part (not shown) 'for transmitting distance measuring light toward the substrate 10; and a light receiving portion Part) (not shown) 'is used to receive light emitted from a light emitting portion (not shown). Light-emitting 201105425 A portion (not shown) and a light receiving portion (not shown) may be formed in a body shape and spaced apart from each other by a predetermined distance. As mentioned above, when the distance between the hght spot irradiated to the substrate 1 from the sensor 220 and the pattern of the application material becomes beyond the preset distance value, a defect in the pattern of the applied material may be generated. . For the reason described, according to an exemplary embodiment, the distance between the light 203 from the sensor 22G_ and the application material pattern 202 is obtained before the actual application of the pattern of the application material on the substrate 1Q. ‘‘" FIG. 3 is a flow chart illustrating controlling the application mechanism of the dispenser and sensing the green of H, according to an exemplary embodiment. 4 is a diagram showing the formation of a pattern of a coating material on a substrate by using an application member of a distribution H according to an exemplary embodiment. FIG. 5 and FIG. 6 are in the case where the vertical position of the coating member is assumed to be H1. A graph of the distance between the matte pattern and the spot is measured. Fig. 7 is a view showing a coordinate of a material pattern and a light spot when the application member (4) is in a straight position of m. 8 and 9 are views sequentially illustrating the measurement of the distance between the application material pattern and the light spot in the case where the vertical position of the application member is H2. Fig. 1A is a view showing a texture of a material pattern and a light spot when the vertical position of the application member is H2. Hereinafter, the distance between the control application member 210 and the sensor 220 will be explained with reference to Figs. 3 to 1B. According to an exemplary embodiment, controlling the distance between the applicator member 21A and the sensor 22A includes positioning the test substrate 201 on the table. ^Use the substrate of the (4) substrate 10__ as the test substrate 201 in the actual process. As illustrated in FIGS. 3 and 4, an 11 201105425 application material pattern 202 is formed on the test substrate 2〇1 (step S100). The vertical position of the application member 210 is set to Ht, and the sealant is released from the application member 210 to form an application material pattern 202 for measuring the distance on the test substrate 201. As mentioned previously, according to an exemplary embodiment, the nozzle 211 of the application member 210 for releasing the application material is installed under the body portion 213, and the application material 202 is formed on the substrate 201 using the nozzle 211. Therefore, it may be preferable that the vertical position of the nozzle 211 of the application member 210 with respect to the substrate 201 is Ht 〇 Ht and that when the application material pattern 202 is formed on the substrate during the actual process as illustrated in FIG. 1 The vertical positions of the nozzles 211 are the same, which allows the application material pattern 202 to be formed on the test substrate 201 under the same conditions as the actual process. Ht can range from 20 microns to 70 microns. According to an exemplary embodiment, the application material pattern 2〇2 is formed in a circular shape, and the distance between the application material pattern 2〇2 and the light spot 2 is measured as illustrated in FIG. However, the present invention is not limited thereto, and the application material pattern may be formed on the test substrate 2 by a predetermined rod (or strip) shape. Thereafter, the sensor 220 is used to obtain a rate of change of the distance between the light spot 203 and the application material pattern 202 with respect to the vertical position of the nozzle 211 (S120). To this end, as illustrated in FIGS. 5 and 8, the vertical position of the nozzle 21A is set at two different positions H1 and H2' and the spot 2〇3 of the vertical positions H1 and H2 of the nozzle 211 is calculated and applied. The material pattern = and X2 ° are obtained by f formula H = AX + B to obtain the rate of change of the distance between the spot 2 〇 3 and the application material pattern 2 〇 2 with respect to the straight position of the nozzle. Η denotes the vertical position of the nozzle 211, and the distance between the spot 203 and the application material pattern 2〇2. Α and β are coefficients which characterize the rate of change of the distance between the application material pattern 202 and the spot 203 with respect to the vertical position of 12 201105425. In order to obtain a value of Α#σβ, an exemplary embodiment, the distance χι sum between the light spot 203 and the application material pattern 2〇2 with respect to the vertical positions Ηι and ^2 of the nozzle 211 is measured. Apply the measured value to the equation Η=ΑΧ+Β to make the ★★ Η ,, side. The coefficients Α and Β can be obtained by solving. In this way, the rate of change of the distance between the spot 2〇3 and the application material 202 with respect to the vertical position of the nozzle 211 can be obtained. A more detailed explanation will be given below. As illustrated in Fig. 5, the drive unit 5'' is used to raise and lower the dispenser 200' to position the nozzle 211 at a vertical position H1 with respect to the test substrate 2''. In other words, the distance between the test substrate 2〇1 and the nozzle 211 is set to H1. It may be preferred that H1 is greater than Ht as described above. When the vertical position of the nozzle 211 is equal to or lower than the twist, it may be difficult to measure the distance between the spot 203 and the application material pattern 202. That is, the nozzle 211 may scratch the test substrate 201 during the process of measuring the distance between the spot 2〇3 and the application material pattern, or the application material pattern 202 applied to the test substrate 2〇1 may be contaminated. The end of the nozzle 211. Thereafter, light (e.g., a laser) is irradiated onto the test substrate 201 using the senser 220. The angle of inclination of the light irradiated from the sensor 220 with respect to the test substrate 201 may range from 50 degrees to 70 degrees, and is preferably 6 degrees. According to an exemplary embodiment, as illustrated in FIG. 7, the point from the substrate 201 to which the light irradiated by the sensor 22 is initially incident is set as the origin (〇, 0 may preferably be initially irradiated to the test substrate) The center point of the spot 203 of 2〇1 is set to 201105425 as the origin (〇, 〇). Thereafter, the center point of the application material pattern 202 is searched. To this end, as illustrated in Fig. 6, 'use of the transfer unit 300 and control The unit 4 transmits the dispenser 200' horizontally while simultaneously irradiating light to the test substrate 201 using the sensor 220. The application material pattern 202 can be searched by measuring the thickness of the application material pattern 202 to find the highest point. To this end, the dispenser 200' is transported as previously mentioned to find the area in which the sensor 220 displays the lowest round. The area where the sensor 220 displays the lowest output is set to the application material pattern 202. The center point. Although not shown in the drawings, the center point of the application material pattern 202 can be found by measuring the line width of the application material pattern 2〇2 because the application material pattern 202 applied to the test substrate 201 is applied. Formed to be substantially constant Width' so the coating material pattern can be found by measuring the line width of the application material pattern 2〇2 using the sensor 220 and setting the center of the line width of the measured application material pattern 2〇2 as a center point The center point of 202. Next, as illustrated in Fig. 7, the center point (Xx, Yy) of the application material pattern 202 found using the sensor 22 is marked on the virtual coordinate system. On the virtual coordinate system, _ Record the center point of the spot 2〇3, which is the first to be irradiated to the test substrate 2〇1, that is, the origin (M). Therefore, by detecting the origin (0, 0) where the center of the spot (10) is located and the application The center point (Xx, Yy) of the material pattern 2〇2 is used to calculate the distance value Xi of the light spot 203 and the gate of the application material pattern 2〇2. The distance X1 between the light spot 203 and the application material pattern 2〇2 Corresponding to the vertical position hi of the nozzle 211. Next, the vertical position of the nozzle 211 is changed to a position different from the above described hi 201105425' and the calculation between the light spot 203 and the application material pattern 202 with respect to the changed vertical position is calculated. Distance value. Specifically, the transfer unit 500 is used to raise or lower the dispenser 200, The vertical position to the nozzle 211 becomes H2 as illustrated in Fig. 8. H2 may be larger than Ht described above and different from H1. In an exemplary embodiment, H2 is set to be larger than H1. Next, sensing is used. The light is irradiated onto the test substrate 201. As illustrated in Fig. 10, the point from the test substrate 201 to which the light irradiated from the sensor 220 is initially incident is set to the origin (0, 0). It may be preferable to The center point of the light spot 203 initially irradiated to the test substrate 2〇1 is set to the origin '(〇, 〇). Thereafter, the center point of the application material pattern 202 is searched. For this, as illustrated in Fig. 9, the transfer is used. The unit 300 and the control unit 400 horizontally convey the dispenser 200 while continuously irradiating light to the test substrate 201 using the sensor 220. The center point of the application material pattern 202 can be searched by measuring the thickness of the application material pattern 202 to find the highest point. To this end, the dispenser 200' is transported as previously mentioned to find the area where the sensor 220 displays the lowest output. The zone where the sense 220 is not at the lowest output is set to the center point of the applied material pattern 202. Next, as illustrated in Fig. 10, the center point (Xx, Yy) of the application material pattern 202 found using the sensor 220 is marked on the virtual coordinate system. On the virtual coordinate system, the center of the spot 203 initially irradiated to the test substrate 201, i.e., the origin (0, 0), is also marked. Therefore, the light spot 203 and the application material pattern 202 can be calculated by detecting the origin (〇, 0) where the center of the light spot 203 is located and the center point (Xx, Yy) of the application material pattern 202 15 201105425 The distance value X2 between the distance value X2 luminescent spot 203 and the application material pattern 202 corresponds to the vertical position H2 of the nozzle 211. According to an exemplary embodiment, the vertical position of the nozzle 211 is set at different positions H1 and H2 to measure the distance values XI and χ2 between the light spot 203 and the application material pattern 202 with respect to the respective positions H1 and H2. However, the present invention is not limited thereto, and the nozzle 211 may be controlled to be in two or more different vertical positions in order to calculate the distance value between the light spot 20.3 and the application material pattern 202 with respect to the vertical position of the nozzle 211. . Once the distance value between the light spot 203 and the application material pattern 202 is measured with respect to the vertical positions hi and H2 of the nozzle 211, the light spot 203 can be obtained based on the measured value and the application material pattern is moved relative to the distance value. The rate of change in the straight position of the nozzle 211 (four). This can be expressed as the equation H = AX + B, where Η represents the vertical position of the nozzle and χ is the distance between the spot 2 〇 3 and the applied material pattern 202. Tantalum and niobium are coefficients that characterize the rate of change of the distance between the application material pattern 202 and the spot 203 relative to the vertical position of the nozzle 211. In order to obtain the value of a#dB, as mentioned above, the distances X1 and X2 of the disc coating case with respect to the vertical position HM 〇 H2 of the nozzle 2n are measured. The measured values are applied to obtain the coefficients Α and B by reconciling the above equations. In this way, you can get the light spot 2〇3 and apply
的距離相對於喷嘴211的垂直位置的變^才匕圖案 之間 U 為 時，所料式可表私_um = h5A 201105425 mi^+B和700um= l.7Amm+B。通過求解聯立等式，A經 計算為1000,且B經計算為_1〇〇〇。因此，相對於H的光 點203與塗施材料圖案2〇2之間的距離χ可表達為等式Η =looox-iooo。八和Β的值可根據喷嘴211與感測器22〇 之間的距離而改變。 另外’用既定在實際過程中使用的喷嘴211的垂直位 置Ht代替等式（Η=1〇〇〇χ_1〇〇〇)中的&以計算照射到 基底10上的光點203與塗施材料圖案2〇2之間的距離Xt (步驟S120)。舉例來說，當喷嘴211的垂直位置Ht在實 際過程中為30 um時，根據以上等式，光點2〇3與塗施材 料圖案202之間的距離Xt經計算為1〇3mm。 在a十异相對於既定在實際過程中使用的噴嘴Mi的垂 直位置的光點203與塗施材料圖案2〇2之間的距離之後， 將所计具的值與預設距離值進行比較（步驟sl3〇)。如果 兩個值相同，那麼完成對光點2〇3與塗施材料圖案2〇2之 間的距離_整。如果兩個值不同，那麼控制感測器與塗 施構件之間的距離，以調整光點2G3與塗施材料圖案2〇2 之間的距離（步驟S140)。 可通過精細地控制連接感測器22〇安裝到其的支撐邙 件23〇與塗施構件別的輕合部件（未圖示）來調整光點 203與塗施材料圖案202之間的距離。連接支樓部件^咖 與塗施構件2H)_合部件（未圖示）可包含呈螺紋形狀 的X軸和y軸主體，所述主體與支撐部件23〇和塗施構件 210組合以精細地控騎述轉。纽是說，通過旋轉所 17 201105425 述主體，感測器安裝到其的支撐部件230可移動。用於 細地控制所述距離的構件不限於此，且可使用各種構件二 可通過僅移動喷嘴211來控制噴嘴211與感測器22〇之間 的距離。或者，噴嘴211和感測器22〇兩者均可移動。 當调整噴嘴211與感測器220之間的距離時，重複 4到圖10中所說明的前述過程。也就是說，以嘴嘴叫二 感測器22G之間經調整的距離來測量塗施材料圖案2〇2^ 光點203之間的距離。 〃 〃 如前面在示範性實施例中提到，使用感測器22〇來 與塗施材料圖案2〇2之間的距離，且根據所; ^值來控制感測器22〇與塗施構件21〇之間的距離。因 ϋοΓίίΐ外儀器的情況下測量光點203與塗施材料圖 案202之間的距離，且可改進測量所述距離的準確性。 範性儀於塗絲賴的塗施設備的方法闡釋了示 但所述方法不限於此，且可應用於各種類型 轉，根據賴實施例，使用用於測量基底 =來控制感測器軸 3確圖案之間的距離，且可改進測量所述距離 材料二底與塗施構件之間轉 L獨保触定，且可職塗施材料随中的缺 201105425 ι 。另外，在無額外儀器的情況下使用感測器來測量從感 測器照射到基底上的光點與喷嘴之間的距離，可降低 分配器的成本。 雖“、;、本發明已以實施例揭露如上’然其並非用以限定 号X月任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍内，當可作些許之更動與潤飾，故本 7明之保絲15當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 可從結合附圖進行的以下描述更詳細地理解示 施例，在附圖中： 貫 人圖1是說明根據示範性實施例的塗施設備的示意性概 而圖0 圖2是說明根據示範性實施例的分配器的截面圖。 件以=精錄鮮紐纽_㈣分配11的塗施構 件以及感測器的方法的流程圖。 稱 在測朗根據示紐實施舰用分崎的塗施構件 在冽试基底上形成塗施材料圖案的圖。 為6是循序地朗在蚊倾構件的垂直位置 為出的纽下騎塗崎料㈣與絲之_距離的圖 圖宏f、7讀不當塗施構件的11直位置為H1時塗施材料 圖案和光點的座標的圖。 材料 為繼綱物直位置 嗎况下測里塗施材料圖案與光點 圖1。是緣示當塗施構件的垂直位置為 19 201105425 圖案和光點的座標的圖。 【主要元件符號說明】 10、201 :基底 100 :台 200 :分配器 202 :塗施材料圖案 203 :光點 210 :塗施構件 211 :喷嘴 212 :注射器 213 :主體部分 220 :感測器 230 :支撐部件 300 :傳送單元 400 :控制單元 500 :驅動單元 S100-S140 :步驟The distance between the distances of the nozzles 211 and the vertical position of the nozzle 211 is U, and the formula can be expressed as _um = h5A 201105425 mi^+B and 700um = l.7Amm+B. By solving the simultaneous equation, A is calculated to be 1000, and B is calculated as _1 〇〇〇. Therefore, the distance χ between the light spot 203 with respect to H and the application material pattern 2〇2 can be expressed as the equation Η = looox-iooo. The value of the octagonal enthalpy may vary depending on the distance between the nozzle 211 and the sensor 22A. Further, 'the vertical position Ht of the nozzle 211 which is intended to be used in the actual process is substituted for & in the equation (Η=1〇〇〇χ_1〇〇〇) to calculate the spot 203 and the coating material irradiated onto the substrate 10. The distance Xt between the patterns 2〇2 (step S120). For example, when the vertical position Ht of the nozzle 211 is 30 um in the actual process, the distance Xt between the spot 2〇3 and the application material pattern 202 is calculated to be 1 〇 3 mm according to the above equation. After the distance between the spot 203 and the application material pattern 2〇2 relative to the vertical position of the nozzle Mi used in the actual process is compared, the value of the gauge is compared with the preset distance value ( Step sl3〇). If the two values are the same, the distance _ between the spot 2〇3 and the applied material pattern 2〇2 is completed. If the two values are different, the distance between the sensor and the application member is controlled to adjust the distance between the spot 2G3 and the application material pattern 2〇2 (step S140). The distance between the light spot 203 and the application material pattern 202 can be adjusted by finely controlling the support member 23 to which the connection sensor 22 is attached and the light fitting member (not shown) of the application member. The connection member member and the application member 2H) - the assembly member (not shown) may include an X-axis and a y-axis body in a thread shape, the body being combined with the support member 23 and the application member 210 to be finely Control the ride to talk. New is said that by rotating the body, the support member 230 to which the sensor is mounted can be moved. The member for finely controlling the distance is not limited thereto, and the distance between the nozzle 211 and the sensor 22A can be controlled by moving only the nozzle 211 using various members. Alternatively, both the nozzle 211 and the sensor 22 can be moved. When the distance between the nozzle 211 and the sensor 220 is adjusted, the aforementioned process explained in Fig. 10 is repeated. That is, the distance between the application material patterns 2〇2^ the light spots 203 is measured by the adjusted distance between the nozzles and the two sensors 22G. 〃 〃 As previously mentioned in the exemplary embodiment, the distance between the sensor 22 〇 and the application material pattern 2 〇 2 is used, and the sensor 22 〇 and the application member are controlled according to the value The distance between 21〇. The distance between the light spot 203 and the application material pattern 202 is measured in the case of a 仪器οΓίίΐ instrument, and the accuracy of measuring the distance can be improved. The method of applying the apparatus to the coating apparatus is illustrative, but the method is not limited thereto, and can be applied to various types of rotations. According to the embodiment, the sensor axis 3 is controlled using the measurement substrate. The distance between the patterns is confirmed, and the measurement of the distance between the bottom of the material and the application member can be improved, and the occupational application material is missing 201105425 ι. In addition, the use of a sensor to measure the distance between the spot of light impinging on the substrate from the sensor and the nozzle without additional instrumentation can reduce the cost of the dispenser. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the scope of the invention, and it is possible to make some changes without departing from the spirit and scope of the invention. And the retouching, the present invention is defined by the scope of the patent application, which is defined in the appended claims. [FIG. Brief Description] The embodiment can be understood in more detail from the following description taken in conjunction with the accompanying drawings. 1 is a schematic overview of an applicator apparatus according to an exemplary embodiment. FIG. 2 is a cross-sectional view illustrating a dispenser according to an exemplary embodiment. A flow chart of a method of dispensing an applicator member and a sensor of 11. A method of forming a pattern of a coating material on a test substrate by applying a member of the ship's sub-salt according to the guide. Lang in the vertical position of the mosquito tilting member is the bottom of the button to paint the raw material (four) and the wire _ distance of the map macro f, 7 improperly applied to the member of the 11 straight position is H1 when the material pattern and the coordinates of the light point The material is the direct position of the object. The application material pattern and the light spot pattern are the figures of the coordinates of the pattern and the light spot when the vertical position of the application member is 19 201105425. [Main component symbol description] 10, 201: substrate 100: station 200: dispenser 202 : application material pattern 203 : spot 210 : application member 211 : nozzle 212 : injector 213 : main body portion 220 : sensor 230 : support member 300 : transfer unit 400 : control unit 500 : drive unit S100 - S140 : steps