KR101238981B1 - 광선방출 반도체 몸체를 포함한 모듈 - Google Patents
광선방출 반도체 몸체를 포함한 모듈 Download PDFInfo
- Publication number
- KR101238981B1 KR101238981B1 KR1020077019817A KR20077019817A KR101238981B1 KR 101238981 B1 KR101238981 B1 KR 101238981B1 KR 1020077019817 A KR1020077019817 A KR 1020077019817A KR 20077019817 A KR20077019817 A KR 20077019817A KR 101238981 B1 KR101238981 B1 KR 101238981B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting semiconductor
- semiconductor body
- module
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Landscapes
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005009060A DE102005009060A1 (de) | 2005-02-28 | 2005-02-28 | Modul mit strahlungsemittierenden Halbleiterkörpern |
| DE102005009060.5 | 2005-02-28 | ||
| PCT/DE2006/000232 WO2006089512A1 (de) | 2005-02-28 | 2006-02-10 | Modul mit strahlungsemittierenden halbleiterkörpern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070106624A KR20070106624A (ko) | 2007-11-02 |
| KR101238981B1 true KR101238981B1 (ko) | 2013-03-08 |
Family
ID=36442045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077019817A Expired - Fee Related KR101238981B1 (ko) | 2005-02-28 | 2006-02-10 | 광선방출 반도체 몸체를 포함한 모듈 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8154031B2 (https=) |
| EP (1) | EP1854139A1 (https=) |
| JP (1) | JP2008532299A (https=) |
| KR (1) | KR101238981B1 (https=) |
| CN (1) | CN100595918C (https=) |
| DE (1) | DE102005009060A1 (https=) |
| TW (1) | TW200711099A (https=) |
| WO (1) | WO2006089512A1 (https=) |
Families Citing this family (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4729441B2 (ja) * | 2006-06-09 | 2011-07-20 | スタンレー電気株式会社 | 車両用灯具 |
| FR2906347B1 (fr) * | 2006-09-22 | 2008-12-12 | Valeo Vision Sa | Module d'eclairage |
| DE102006045440A1 (de) * | 2006-09-26 | 2008-03-27 | Osram Opto Semiconductors Gmbh | Optisches Projektionsgerät |
| TWI344708B (en) * | 2007-04-30 | 2011-07-01 | Jin Chyuan Biar | Package structure of lighting element and lighting device thereof |
| US8143777B2 (en) * | 2007-08-23 | 2012-03-27 | Stanley Electric Co., Ltd. | LED lighting unit with LEDs and phosphor materials |
| DE102008021618A1 (de) * | 2007-11-28 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Chipanordnung, Anschlussanordnung, LED sowie Verfahren zur Herstellung einer Chipanordnung |
| DE102008005935A1 (de) * | 2007-11-29 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Halbleiteranordnung sowie Verfahren zur Herstellung einer Halbleiteranordnung |
| KR100939304B1 (ko) * | 2009-06-18 | 2010-01-28 | 유트로닉스주식회사 | Led어레이모듈 및 그 제조방법 |
| JP5340879B2 (ja) * | 2009-10-13 | 2013-11-13 | スタンレー電気株式会社 | 発光装置 |
| US8482015B2 (en) * | 2009-12-03 | 2013-07-09 | Toyoda Gosei Co., Ltd. | LED light emitting apparatus and vehicle headlamp using the same |
| JP5571419B2 (ja) * | 2010-03-24 | 2014-08-13 | スタンレー電気株式会社 | 車両用前照灯 |
| KR101192181B1 (ko) | 2010-03-31 | 2012-10-17 | (주)포인트엔지니어링 | 광 소자 디바이스 및 그 제조 방법 |
| JP2010251796A (ja) * | 2010-07-06 | 2010-11-04 | Toshiba Lighting & Technology Corp | 発光モジュール |
| DE102010026344A1 (de) | 2010-07-07 | 2012-01-12 | Osram Opto Semiconductors Gmbh | Leuchtdiode |
| JP2012018307A (ja) | 2010-07-08 | 2012-01-26 | Sony Corp | 表示装置 |
| JP2012018305A (ja) * | 2010-07-08 | 2012-01-26 | Sony Corp | 表示装置 |
| DE102011077614B4 (de) * | 2011-06-16 | 2023-08-17 | Osram Gmbh | Verfahren zur Herstellung einer Leuchtvorrichtung und Leuchtvorrichtung |
| DE102011077644A1 (de) * | 2011-06-16 | 2012-12-20 | Osram Ag | Leuchtvorrichtung mit Metallisierungsbereich bestückt mit Halbleiterleuchtchip |
| US8426227B1 (en) | 2011-11-18 | 2013-04-23 | LuxVue Technology Corporation | Method of forming a micro light emitting diode array |
| US9620478B2 (en) | 2011-11-18 | 2017-04-11 | Apple Inc. | Method of fabricating a micro device transfer head |
| US8518204B2 (en) | 2011-11-18 | 2013-08-27 | LuxVue Technology Corporation | Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer |
| US8573469B2 (en) | 2011-11-18 | 2013-11-05 | LuxVue Technology Corporation | Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer |
| US8349116B1 (en) | 2011-11-18 | 2013-01-08 | LuxVue Technology Corporation | Micro device transfer head heater assembly and method of transferring a micro device |
| US9773750B2 (en) | 2012-02-09 | 2017-09-26 | Apple Inc. | Method of transferring and bonding an array of micro devices |
| US9548332B2 (en) | 2012-04-27 | 2017-01-17 | Apple Inc. | Method of forming a micro LED device with self-aligned metallization stack |
| US9105492B2 (en) | 2012-05-08 | 2015-08-11 | LuxVue Technology Corporation | Compliant micro device transfer head |
| US8415768B1 (en) | 2012-07-06 | 2013-04-09 | LuxVue Technology Corporation | Compliant monopolar micro device transfer head with silicon electrode |
| US9171826B2 (en) | 2012-09-04 | 2015-10-27 | Micron Technology, Inc. | High voltage solid-state transducers and solid-state transducer arrays having electrical cross-connections and associated systems and methods |
| US8791530B2 (en) | 2012-09-06 | 2014-07-29 | LuxVue Technology Corporation | Compliant micro device transfer head with integrated electrode leads |
| US9162880B2 (en) | 2012-09-07 | 2015-10-20 | LuxVue Technology Corporation | Mass transfer tool |
| US9558721B2 (en) | 2012-10-15 | 2017-01-31 | Apple Inc. | Content-based adaptive refresh schemes for low-power displays |
| US9236815B2 (en) | 2012-12-10 | 2016-01-12 | LuxVue Technology Corporation | Compliant micro device transfer head array with metal electrodes |
| US9217541B2 (en) | 2013-05-14 | 2015-12-22 | LuxVue Technology Corporation | Stabilization structure including shear release posts |
| US9484504B2 (en) | 2013-05-14 | 2016-11-01 | Apple Inc. | Micro LED with wavelength conversion layer |
| US9136161B2 (en) | 2013-06-04 | 2015-09-15 | LuxVue Technology Corporation | Micro pick up array with compliant contact |
| ES2952036T3 (es) | 2013-06-12 | 2023-10-26 | Rohinni Inc | Teclado de retroiluminación con fuentes generadoras de luz depositadas |
| US8987765B2 (en) | 2013-06-17 | 2015-03-24 | LuxVue Technology Corporation | Reflective bank structure and method for integrating a light emitting device |
| US9111464B2 (en) | 2013-06-18 | 2015-08-18 | LuxVue Technology Corporation | LED display with wavelength conversion layer |
| US8928021B1 (en) | 2013-06-18 | 2015-01-06 | LuxVue Technology Corporation | LED light pipe |
| US9035279B2 (en) | 2013-07-08 | 2015-05-19 | LuxVue Technology Corporation | Micro device with stabilization post |
| US9296111B2 (en) | 2013-07-22 | 2016-03-29 | LuxVue Technology Corporation | Micro pick up array alignment encoder |
| US9087764B2 (en) | 2013-07-26 | 2015-07-21 | LuxVue Technology Corporation | Adhesive wafer bonding with controlled thickness variation |
| US9153548B2 (en) | 2013-09-16 | 2015-10-06 | Lux Vue Technology Corporation | Adhesive wafer bonding with sacrificial spacers for controlled thickness variation |
| DE102013218541A1 (de) * | 2013-09-16 | 2015-03-19 | Osram Gmbh | Leuchtmodul mit Halbleiterlichtquellen und Trägerplatte |
| CN104576883B (zh) | 2013-10-29 | 2018-11-16 | 普因特工程有限公司 | 芯片安装用阵列基板及其制造方法 |
| US9367094B2 (en) | 2013-12-17 | 2016-06-14 | Apple Inc. | Display module and system applications |
| US9768345B2 (en) | 2013-12-20 | 2017-09-19 | Apple Inc. | LED with current injection confinement trench |
| DE102013114691A1 (de) | 2013-12-20 | 2015-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und adaptiver Scheinwerfer für ein Kraftfahrzeug |
| US9583466B2 (en) | 2013-12-27 | 2017-02-28 | Apple Inc. | Etch removal of current distribution layer for LED current confinement |
| US9450147B2 (en) | 2013-12-27 | 2016-09-20 | Apple Inc. | LED with internally confined current injection area |
| US9542638B2 (en) | 2014-02-18 | 2017-01-10 | Apple Inc. | RFID tag and micro chip integration design |
| US9583533B2 (en) | 2014-03-13 | 2017-02-28 | Apple Inc. | LED device with embedded nanowire LEDs |
| DE102014103751A1 (de) * | 2014-03-19 | 2015-09-24 | Osram Opto Semiconductors Gmbh | Organisches strahlungsemittierendes Bauelement |
| US9522468B2 (en) | 2014-05-08 | 2016-12-20 | Apple Inc. | Mass transfer tool manipulator assembly with remote center of compliance |
| US9318475B2 (en) | 2014-05-15 | 2016-04-19 | LuxVue Technology Corporation | Flexible display and method of formation with sacrificial release layer |
| US9741286B2 (en) | 2014-06-03 | 2017-08-22 | Apple Inc. | Interactive display panel with emitting and sensing diodes |
| US9624100B2 (en) | 2014-06-12 | 2017-04-18 | Apple Inc. | Micro pick up array pivot mount with integrated strain sensing elements |
| US9425151B2 (en) | 2014-06-17 | 2016-08-23 | Apple Inc. | Compliant electrostatic transfer head with spring support layer |
| US9570002B2 (en) | 2014-06-17 | 2017-02-14 | Apple Inc. | Interactive display panel with IR diodes |
| US9705432B2 (en) | 2014-09-30 | 2017-07-11 | Apple Inc. | Micro pick up array pivot mount design for strain amplification |
| US9828244B2 (en) | 2014-09-30 | 2017-11-28 | Apple Inc. | Compliant electrostatic transfer head with defined cavity |
| US9478583B2 (en) | 2014-12-08 | 2016-10-25 | Apple Inc. | Wearable display having an array of LEDs on a conformable silicon substrate |
| US9666558B2 (en) | 2015-06-29 | 2017-05-30 | Point Engineering Co., Ltd. | Substrate for mounting a chip and chip package using the substrate |
| KR102298484B1 (ko) | 2016-01-15 | 2021-09-03 | 로히니, 엘엘씨. | 장치 상의 커버를 통해 후면 발광하는 장치 및 방법 |
| WO2020040740A1 (en) | 2018-08-21 | 2020-02-27 | Hewlett-Packard Development Company, L.P. | P-type semiconductor layers coupled to n-type semiconductor layers |
| WO2020244784A1 (en) * | 2019-06-07 | 2020-12-10 | Jenoptik Optical Systems Gmbh | Led illumination apparatus |
| JP2022107942A (ja) * | 2021-01-12 | 2022-07-25 | シーシーエス株式会社 | Led光源 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0146525A2 (en) * | 1983-12-19 | 1985-06-26 | Fina Technology, Inc. | Process for preparing crystalline silicas |
| US4775645A (en) * | 1983-12-26 | 1988-10-04 | Victor Company Of Japan, Limited | Method of producing a flat LED panel display |
| US4845405A (en) * | 1986-05-14 | 1989-07-04 | Sanyo Electric Co., Ltd. | Monolithic LED display |
| JP2004006582A (ja) * | 2002-04-12 | 2004-01-08 | Shiro Sakai | 発光装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4952477U (https=) * | 1972-08-16 | 1974-05-09 | ||
| JPS5135069B2 (https=) | 1972-09-27 | 1976-09-30 | ||
| DE2315709A1 (de) | 1973-03-29 | 1974-10-10 | Licentia Gmbh | Strahlung abgebende halbleiteranordnung mit hoher strahlungsleistung |
| JPS538586A (en) | 1976-07-13 | 1978-01-26 | Seiko Instr & Electronics Ltd | Led substrate |
| JPS604215Y2 (ja) * | 1979-05-31 | 1985-02-05 | 三洋電機株式会社 | 発光ダイオ−ドマトリクス表示器 |
| JPS60147178A (ja) | 1984-01-11 | 1985-08-03 | Canon Inc | Ledアレイ |
| US4914731A (en) | 1987-08-12 | 1990-04-03 | Chen Shen Yuan | Quickly formed light emitting diode display and a method for forming the same |
| DE3737861A1 (de) | 1987-11-07 | 1989-05-18 | Mueller Werner Dipl Wirtsch In | Elektronisches leuchtelement mit optimierter lichtausbeute, verfahren zu seiner herstellung |
| US5936353A (en) | 1996-04-03 | 1999-08-10 | Pressco Technology Inc. | High-density solid-state lighting array for machine vision applications |
| WO2000007235A1 (fr) | 1998-07-28 | 2000-02-10 | Seiko Epson Corporation | Dispositif a semi-conducteurs, procede de fabrication, module a semi-conducteurs, et dispositif electronique comprenant une carte imprimee et une carte equipee |
| US6459100B1 (en) | 1998-09-16 | 2002-10-01 | Cree, Inc. | Vertical geometry ingan LED |
| TW444932U (en) | 2000-01-29 | 2001-07-01 | Opto Tech Corp | Improved structure of light emitting diode package |
| DE10051159C2 (de) | 2000-10-16 | 2002-09-19 | Osram Opto Semiconductors Gmbh | LED-Modul, z.B. Weißlichtquelle |
| US6939730B2 (en) * | 2001-04-24 | 2005-09-06 | Sony Corporation | Nitride semiconductor, semiconductor device, and method of manufacturing the same |
| JP2002329896A (ja) * | 2001-05-02 | 2002-11-15 | Kansai Tlo Kk | Led面発光装置 |
| US7001057B2 (en) * | 2001-05-23 | 2006-02-21 | Ivoclar Vivadent A.G. | Lighting apparatus for guiding light onto a light polymerizable piece to effect hardening thereof |
| US7602035B2 (en) * | 2001-10-19 | 2009-10-13 | Josuke Nakata | Light emitting or light receiving semiconductor module and method for manufacturing same |
| EP1892764B1 (en) * | 2002-08-29 | 2016-03-09 | Seoul Semiconductor Co., Ltd. | Light-emitting device having light-emitting diodes |
| US7009199B2 (en) | 2002-10-22 | 2006-03-07 | Cree, Inc. | Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current |
| EP1465256A1 (en) * | 2003-04-03 | 2004-10-06 | Micro Photonics Technology | A method of producing a light source and a light source assembly |
-
2005
- 2005-02-28 DE DE102005009060A patent/DE102005009060A1/de not_active Withdrawn
-
2006
- 2006-02-10 JP JP2007557317A patent/JP2008532299A/ja active Pending
- 2006-02-10 CN CN200680005824A patent/CN100595918C/zh not_active Expired - Fee Related
- 2006-02-10 US US11/885,204 patent/US8154031B2/en not_active Expired - Fee Related
- 2006-02-10 EP EP06705951A patent/EP1854139A1/de not_active Withdrawn
- 2006-02-10 WO PCT/DE2006/000232 patent/WO2006089512A1/de not_active Ceased
- 2006-02-10 KR KR1020077019817A patent/KR101238981B1/ko not_active Expired - Fee Related
- 2006-02-24 TW TW095106301A patent/TW200711099A/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0146525A2 (en) * | 1983-12-19 | 1985-06-26 | Fina Technology, Inc. | Process for preparing crystalline silicas |
| US4775645A (en) * | 1983-12-26 | 1988-10-04 | Victor Company Of Japan, Limited | Method of producing a flat LED panel display |
| US4845405A (en) * | 1986-05-14 | 1989-07-04 | Sanyo Electric Co., Ltd. | Monolithic LED display |
| JP2004006582A (ja) * | 2002-04-12 | 2004-01-08 | Shiro Sakai | 発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102005009060A1 (de) | 2006-09-07 |
| TW200711099A (en) | 2007-03-16 |
| CN100595918C (zh) | 2010-03-24 |
| WO2006089512A1 (de) | 2006-08-31 |
| EP1854139A1 (de) | 2007-11-14 |
| KR20070106624A (ko) | 2007-11-02 |
| US20080303038A1 (en) | 2008-12-11 |
| TWI332259B (https=) | 2010-10-21 |
| JP2008532299A (ja) | 2008-08-14 |
| CN101128932A (zh) | 2008-02-20 |
| US8154031B2 (en) | 2012-04-10 |
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