WO2020244784A1 - Led illumination apparatus - Google Patents

Led illumination apparatus Download PDF

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Publication number
WO2020244784A1
WO2020244784A1 PCT/EP2019/067352 EP2019067352W WO2020244784A1 WO 2020244784 A1 WO2020244784 A1 WO 2020244784A1 EP 2019067352 W EP2019067352 W EP 2019067352W WO 2020244784 A1 WO2020244784 A1 WO 2020244784A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
connection
led die
dice
die
Prior art date
Application number
PCT/EP2019/067352
Other languages
French (fr)
Inventor
Roman Jaikow
Torsten Trenkler
Kai Flämig
Original Assignee
Jenoptik Optical Systems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102019115594.0 priority Critical
Priority to DE102019115594 priority
Application filed by Jenoptik Optical Systems Gmbh filed Critical Jenoptik Optical Systems Gmbh
Publication of WO2020244784A1 publication Critical patent/WO2020244784A1/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The invention relates to an LED illumination apparatus having a group of at least three LED dice that are electrically connected in series. Here, the upper-side second connection (11.b) of the first LED die (8. a) is electrically connected to the upper-side third connection (11.c) of the second LED die (8.b) by way of a bond wire (6). In addition, the lower-side fourth connection (11.d) of the second LED die (8.b) is electrically connected to the lower-side fifth connection (11.e) of the third LED die (8.c) by way of a conductor track (5) located on the carrier (3). In this case, the second upper-side connection (11.b), the fourth lower-side connection (11.d) and the sixth upper-side connection (11.f) are either all embodied as cathode connections or are all embodied as anode connections.

Description

LED illumination apparatus
Technical field
The invention relates to an LED illumination apparatus. Such illumination apparatuses are used for example for carrying out photochemical reactions, for photosynthesis in plants, or for illumi- nating samples for analytical purposes. Such an LED illumination apparatus is suitable in partic ular as microscope illumination, or as a light source for fluorescence examinations.
Prior art
W02017008042A1 discloses an LED module in which a plurality of LEDs with reflectors are electrically connected in series. US2016013361 1 A1 discloses an arrangement of LEDs. In this arrangement, bond pads are provided next to or between the LED dice. Disadvantages are the space requirement of the bond pads and the non-light-emitting surface areas between the LED dice.
It is known from W02016015030A1 to connect LED dice with in each case one carrier one next to the other with contact lugs by way of screws. A similar arrangement is also known from W02013040453A2.
It is known from US20120286301 A1 to connect LED dice by way of bond wires and to connect them in series. A disadvantage is that, to this end, in each case two contacts are required on the upper side of the dice, as a result of which the surface area that does not emit light be comes larger. WO2015093180A1 discloses a matrix arrangement of LED dice with a high packing density. A disadvantage is that only flip chip LED elements can be used therefor.
JP2010251796A discloses an LED module in which LED dice are connected in series using bond wires. A disadvantage is that, to this end, in each case two contacts are required on the upper side of the dice, as a result of which the surface area that does not emit light becomes larger.
US20110180817 A1 discloses an LED module in which LED dice are connected in series using bond wires. A disadvantage is that, to this end, in each case two contacts are required on the upper side of the dice, as a result of which the surface area that does not emit light becomes larger.
WO2010098457 A1 discloses an LED module in which LED dice are connected in series using bond wires. A disadvantage is that, to this end, in each case two contacts are required on the upper side of the dice, as a result of which the surface area that does not emit light becomes larger.
DE202009018941 U1 discloses an LED module having a metallic carrier, in which LED dice are connected in series using bond wires. A disadvantage is that, to this end, in each case two con tacts are required on the upper side of the dice, as a result of which the surface area that does not emit light becomes larger.
US20080042151 A1 discloses an LED module having a matrix arrangement of LED dice, in which the LED dice are connected in series using bond wires. A disadvantage is that, to this end, in each case two contacts are required on the upper side of the dice, as a result of which the surface area that does not emit light becomes larger.
Object of the invention
It is the object of the invention to specify a cost-effective multi-chip LED illumination apparatus having a high luminance that is easy to construct.
Advantages of the invention
The LED illumination apparatus according to the invention is able to be produced cost-effec tively. The compact construction permits a high luminance. The non-light-emitting surface areas located between the dice are minimized. In addition, an LED illumination apparatus having a spectrum that is tailored to the respective application can be provided. The LED illumination ap paratus according to the invention can be provided, for example, for one or more of the follow ing uses:
• for carrying out photochemical reactions,
• for curing light-curing adhesives,
• for the photosynthesis in plants or bacteria,
• for illuminating samples for analytical purposes,
• as microscope illumination for illuminating the observation object, for example as per PCT/EP2019/06431 1 ,
• as a light source for spectral analyses or fluorescence examinations,
• as a light source in cameras, photo cameras, tablet computers or mobile telephones, for example as a light source for image recordings with an image sensor,
• for illuminating aquariums or terrariums,
• for charging phosphorescent materials,
• for illuminating goods for sale, in particular food such as fruit, vegetables, tofu, seitan, meat, sausage, fish, etc., with a specially adapted spectrum, as a result of which the goods appear for example fresher or more attractive,
• for light therapy or colorpuncture,
• for skin treatment,
• as a projector for dancing or concert events,
• as stage lighting.
Horizontal LED dice can be used, in which the light output is not limited by the“current crowd ing” that occurs in lateral LED dice. Consequently, a particularly high luminance can be achieved. Achieving the object
The object is achieved by an LED illumination apparatus according to Claim 1 or the use ac cording to Claim 9 or 1 1. The LED illumination apparatus can be produced according to Claim 10.
Description
An LED illumination apparatus is an apparatus for producing light using light-emitting diodes (LED). Light emitting diodes can also be referred to as electroluminescent diodes. The light can comprise visible, infrared and/or ultraviolet light. The LED illumination apparatus can be oper ated electrically. Here, a first power connection and a second power connection can be pro vided, by way of which at least one operating current can be supplied to the LED illumination apparatus.
The LED illumination apparatus for producing light radiation comprises a carrier. The carrier can be embodied in the form of a printed circuit board, for example a laminated paper circuit board, an epoxy resin circuit board, a flexible circuit board, for example made from polyimide, or a ce ramic circuit board, for example a DCB (direct copper bonding) board with aluminium oxide, alu minium nitride or silicon carbide as the base material. The base material of the carrier can be electrically insulating. The carrier can comprise a patterned metal layer. The patterned metal layer can comprise conductor tracks and attachment locations for LED dice. A non-packaged piece of a semiconductor wafer can be referred to as“die”. Alternatively, the carrier can be formed as a metal plate or as a metal matrix composite plate. A thin insulating layer can be ar ranged on the surface of such a plate. A patterned metal layer can in turn be arranged on the former. Alternatively, the carrier can be embodied as a diamond wafer, glass wafer or silicon wafer or as a sapphire plate. The carrier can comprise a CVD diamond layer.
The LED illumination apparatus additionally comprises at least nine LED dice having in each case a lower side and an upper side.
The upper side of an LED die can be the side that is provided for the light exit. The upper side of an LED die can thus be the side on which a light exit surface is provided. The light emitted by an LED die can have a central wavelength. Depending on the material system of the LED die, different central wavelengths are possible. For example, ultraviolet, blue, green, yellow, red and infrared light-emitting diodes are known. The central wavelength of an LED die can amount, for example, between 200 nm and 2000 nm. In epitaxially produced LED dice, the upper side can be the side on which the epitaxial layer system is arranged. The upper side of the LED die can include the p-n junction. The latter can be located within the epitaxial layer system or at the in terface of the epitaxial layer system with the substrate. The main emission direction of the light can be a z-direction. The upper side can be arranged in a first x-y-plane. The upper side can have a reflection-reducing coating so that the light can exit from the LED die without being im peded.
The lower side of an LED die can be the side that is remote from the light exit surface. The lower side of an LED die can be the substrate side. The lower side can be arranged in a second x-y-plane. The latter can be offset from the first x-y-plane by a relatively small z-value. The lower side can be provided for attaching the LED die to a carrier. The directions x, y and z can define a rectangular coordinate system.
The upper side of an LED die can also be referred to as the top side, the lower side can also be referred to as the bottom side.
The LED dice can be produced for example on the substrate using an epitaxial process at the wafer scale (wafer level). Subsequently, the LED dice can be singulated by dividing the wafer.
Alternatively, the LED dice can be produced for example by virtue of the layer system being de posited on an auxiliary substrate using an epitaxial process at the wafer scale. Next, the layer system can be transferred to a substrate and the auxiliary substrate can be removed for exam ple using a lift-off process or by etching. Subsequently, the LED dice can be singulated by divid ing the wafer. The upper side can be the side on which, in the finished LED die, the epitaxial layer system is arranged. The lower side can be the substrate side of the finished LED die.
Alternatively, the LED dice can be produced for example by virtue of the layer system being de posited on an auxiliary substrate using an epitaxial process at the wafer scale. Next, the auxil iary substrate can be removed for example using a lift-off process or by etching producing a self-supporting layer system. Subsequently, the LED dice can be singulated by dividing the layer system. The upper side can then be the side on which the light exit is provided. The lower side can then be the side that is provided for attaching the LED die to a carrier.
The LED dice can be embodied geometrically as flat cuboids. The upper side and the lower side can be the two largest cuboid surfaces. The LED dice are attached to the carrier by way of the lower side. Here, the LED dice are ar ranged in at least three rows.
A row can be understood to mean a number of LED dice that are arranged, with a mutual offset, in each case in one direction, for example a direction x. The LED dice can advantageously have edges, for example four edges per die. Edges of adjacent LED dice that lie opposite one an other in the row can advantageously be oriented parallel with respect to one another. The spac- ings between adjacent LED dice in a row can be reduced to a minimum that is subject to tech nical constraints. The spacings between adjacent LED dice in a row can advantageously be less than 1 mm, with particular advantage less than 0.3 mm, with very great advantage less than 0.1 mm. A lower limit of these spacings can exist due to the fact that short circuits between adjacent LED dice must be avoided and/or that the dimensions of the LED dice are different and/or subject to tolerances. The spacing could be defined as the distance of the opposite edges of each two adjacent dies within a row, i.e. the intermediate space (i.e. the gap width) be tween these adjacent dies.
A plurality of rows can be arranged next to one another, preferably parallel with respect to one another. The rows can to this end be arranged for example in a y-direction with a mutual offset. The spacings between LED dice of adjacent rows can advantageously be less than 1 mm, with particular advantage less than 0.3 mm, with very great advantage less than 0.1 mm. A lower limit of these spacings can exist due to the fact that short circuits between adjacent LED dice must be avoided and/or that the dimensions of the LED dice are different and/or subject to toler ances. These spacing could be defined as the distance of the opposite edges of each two adja cent dies belonging to adjacent rows, i.e. the intermediate space (i.e. the gap width) between these adjacent dies of adjacent rows.
A plurality of rows can be, but do not have to be, arranged next to one another such that the LED dice are additionally arranged in columns. A column can be understood to mean a number of LED dice that are arranged, with a mutual offset, in each case in one direction, for example a direction y. A matrix arrangement of the LED dice can be particularly advantageous.
According to the invention, at least one first group of at least three LED dice that are electrically connected in series is present. Here, at least one first LED die has a lower-side first connection and an upper-side second connection, and at least one second LED die has an upper-side third connection and a lower-side fourth connection, and at least one third LED die has a lower-side fifth connection and an upper-side sixth connection. A connection can be understood to mean an electrical connection provided for establishing electrical contact with the LED die.
According to the invention, the second LED die is arranged adjacent to the first LED die, and the third LED die is arranged adjacent to the second LED die.
According to the invention, the upper-side second connection of the first LED die is electrically connected via at least one bond wire to the upper-side third connection of the second LED die. An upper-side connection can be understood to mean the connection arranged on the upper side of the LED die. Said connection can be embodied as a pad for bonding, preferably for wire bonding. The connection can be arranged centrally on the LED die or off-centre. A central ar rangement can ensure uniform electrical current entry. An off-centre arrangement, on the other hand, can avoid shading of the light exit surface due to the bond wire.
According to the invention, the lower-side fourth connection of the second LED die is electrically connected to the lower-side fifth connection of the third LED die by way of at least one conduc tor track located on the carrier. A lower-side connection can be understood to mean the connec tion arranged on the lower side of the LED die.
According to the invention, either the second upper-side connection, the fourth lower-side con nection and the sixth upper-side connection are embodied as a cathode connection of the re spective LED die, or the second upper-side connection, the fourth lower-side connection and the sixth upper-side connection are embodied as an anode connection of the respective LED die. This can mean that the first LED die and the third LED die have a first polarity, and the sec ond LED die has a second polarity that differs from the first polarity. A polarity can be under stood to mean that the upper-side connection is embodied as an anode or as a cathode of the LED die. The lower-side connection is then correspondingly embodied as a cathode or as an anode of the LED die. For example, an anode arranged on the upper side can mean the first po larity, a cathode arranged on the upper side can mean the second polarity. Alternatively, the first polarity can mean a cathode arranged on the upper side, and the second polarity can corre spondingly mean an anode arranged on the upper side.
Advantageously, at least two of the LED dice can have different central wavelengths. An LED illumination apparatus can thereby be provided with a light spectrum that is appropriate for the respective use. For example, red, green and if necessary infrared and/or ultraviolet emitting LED dice can be combined for illuminating plants so as to encourage for example growth and flower formation. Advantageously, at least six, with particular advantage at least eight, with very great advantage at least 12 LED dice having different central wavelengths can be present. If at least 6, 8 or 12 different central wavelengths are present, it is possible to obtain a particularly homogeneous spectrum of the LED illumination apparatus. Such an embodiment can have a better efficiency than white light-emitting diodes because a light-conversion element can be dis pensed with. It is likewise advantageously possible for all LED dice of the LED illumination ap paratus to have central wavelengths that differ from one another.
The LED illumination apparatus can advantageously be embodied such that no bond pad is ar ranged between the dice. The LED dice can thus be arranged within a partial surface area of the carrier that is free from bond pads. In that case, the highest possible packing density of LED dice on the LED illumination apparatus is possible in that non-light-emitting areas can be mini mized. In mathematical sense the aforementioned partial surface area can be the smallest pos sible convex polygon area enclosing all LED dice on the carrier. It can lie within a x-y plane.
Advantageously, at least one bond pad can be provided. Said bond pads can advantageously be arranged outside the LED arrangement on the carrier. The lower-side connection of a fourth LED die can be electrically connected to the upper-side connection of a fifth LED die by way of a further conductor track, the bond pad and a second bond wire. In this way, it is also possible for LED dice of the same polarity to be series-connected. An arrangement of the bond pads out side the LED arrangement cannot negatively impact the luminance of the arrangement, but merely a slightly larger surface of the carrier may be necessary.
Advantageously, twelve, sixteen, twenty or twenty-five LED dice can be present, arranged in a matrix arrangement 3x4, 4x4, 4x5 or 5x5. At least four LED dice can have an upper-side cath ode connection, and at least four different LED dice can have an upper-side anode connection. An n x m matrix arrangement can be understood to mean an arrangement having n rows and m columns.
The LED illumination apparatus can comprise at least one second group of at least three LED dice that are electrically connected in series. The second group can be connected parallel to the first group.
Alternatively, the second group can be operable independently of the first group. To this end, separate power connections can be provided. In this case, a plurality of different operating cur rents can be supplied to the LED illumination apparatus. The second group can comprise a number of LED dice that differs from the first group. The first group can have a first forward voltage, the second group can have a second forward voltage. The second forward voltage can be the same as the first one. Advantageously, a larger number of LED dice having in each case a lower forward voltage, for example infrared (IR) and/or red LED dice, can be provided for example in the first group, and a lower number of LED dice hav ing in each case a greater forward voltage, for example ultraviolet (UV) and/or blue LED dice, can be provided in the second group.
The LED illumination apparatus can be embodied such that the first LED die is arranged in a first row, and the second LED die is arranged in a second row that is adjacent to the first row.
In addition, the LED illumination apparatus can comprise encapsulation. For example, this may be a housing and/or potting with a transparent potting compound, for example an epoxy resin or silicone resin. In this way, in particular the light exit surfaces of the LED dice can be protected against dirt, moisture and/or penetration by termites.
The invention comprises the use of LED dice of different polarity for an LED illumination appa ratus, wherein a first LED die and a third LED die have a first polarity and a second LED die has a second polarity that differs from the first polarity, and the first LED die, the second LED die and the third LED die are arranged on a carrier and are electrically connected in series.
The invention additionally comprises a method for producing an LED illumination apparatus.
Said method comprises
• providing a carrier having attachment locations for LED dice, wherein a second attach ment location is electrically connected to an adjacent third attachment location by way of a conductor track, and a first attachment location adjacent to the second attachment lo cation is present,
• providing the LED dice with in each case one lower side and one upper side and in each case at least one lower-side and at least one upper-side connection, wherein a first LED die and a third LED die have a first polarity and a second LED die has a second polarity that differs from the first polarity,
• arranging the LED dice in at least three rows on the carrier,
• attaching the LED dice by way of the lower side to the attachment locations of the car rier, wherein a first LED die is attached to the first attachment location, a second LED die is attached to the second attachment location, and a third LED die is attached to the third attachment location,
• establishing electrical contact with the upper-side connections of the LED dice with bond wires, wherein the upper-side second connection of the first LED die is connected to the upper-side third connection of the second LED die by way of at least one bond wire.
The LED dice can be attached to the attachment locations of the carrier for example by way of an electrically conductive adhesive or by way of metallic solder. The attachment locations can be embodied in the form of pads of a patterned metallic layer located on the carrier.
In the figures:
Figure 1 shows a first exemplary embodiment.
Figure 2 shows the designation of the polarities of a first form of the first exemplary embodi ment.
Figure 3 shows a detail from the first exemplary embodiment.
Figure 4 shows an LED die.
Figure 5 shows a second exemplary embodiment.
Figure 6 shows a third exemplary embodiment.
Figure 7 shows a fourth exemplary embodiment.
Figure 8 shows a fifth exemplary embodiment.
Exemplary embodiments
The invention will be explained below with reference to exemplary embodiments.
Figure 1 shows a first exemplary embodiment. It shows an LED illumination apparatus 1 for pro ducing light radiation 2, comprising a carrier 3 and nine LED dice 8. The LED dice 8 are at tached to the carrier 3 by way of the lower side.
Here, the LED dice 8 are arranged in three rows 13.a-c. The arrangement likewise represents three columns 14.a-c, that is to say a 3x3 matrix arrangement overall. In each case an interme diate space 12 is situated between two adjacent dice 8. The intermediate space is a gap be tween the dice. The dice are all electrically connected in series. The entire series can be oper ated using an operating current that is supplied by way of the first and second power connec tions 15 and 16. Three LED dice 8.a-c which are electrically connected in series are designated individually. A first LED die 8. a has a lower-side first connection 1 1 .a and an upper-side second connection 1 1.b. A second LED die 8.b has an upper-side third connection 1 1.c and a lower-side fourth connection 1 1.d. A third LED die 8.c has a lower-side fifth connection 1 1.e and an upper-side sixth connection 1 1 .f. The first connection 1 1 .a is electrically connected to the first attachment surface 4. a, the fourth connection 1 1 .d is electrically connected to the second attachment sur face 4.b, and the fifth connection 1 1 .e is electrically connected to the third attachment surface 4.c by virtue of the dice being soldered onto the attachment surfaces or adhesively affixed thereto in an electrically conductive manner.
The second LED die 8.b is arranged adjacent to the first LED die 8. a. The third LED die is ar ranged adjacent to the second LED die 8.b.
The upper-side second connection 1 1 .b of the first LED die 8. a is electrically connected to the upper-side third connection 1 1.c of the second LED die 8.b by way of a bond wire 6, here desig nated first bond wire 6. a. The lower-side fourth connection 1 1.d of the second LED die 8.b is electrically connected to the lower-side fifth connection 1 1.e of the third LED die 8.c by way of a conductor track 5 located on the carrier 3.
In addition, a bond pad 7 is present. The lower-side connection of a fourth LED die 8.d is electri cally connected to the upper-side connection of a fifth LED die 8.e by way of a further conductor track 5.b, the bond pad 7 and a second bond wire 6.b. The bond pad 7 and further bond pads are arranged here on the carrier 3 only outside the die arrangement in the peripheral region. Consequently, the intermediate spaces 12 between respectively adjacent LED dice can be kept small.
Figure 2 shows the designation of the polarities of a first form of the first exemplary embodi ment. The formations of the upper-side connections are designated as anode (A) or cathode (K) of the respective die. The lower-side connections in that case have the respectively other elec trode.
The second upper-side connection 1 1 .b, the fourth lower-side connection 1 1.d and the sixth up per-side connection 1 1 .f are embodied as a cathode connection of the respective LED die. The first power connection 15 is then the plus connection, the second power connection 16 is the minus connection of the LED illumination apparatus. In a second form (not illustrated), the second upper-side connection 1 1 .b, the fourth lower-side connection 1 1 .d and the sixth upper-side connection 1 1 .f are embodied as an anode connection of the respective LED die. The polarities of the power connections are then the other way around.
Figure 3 shows a detail from the first exemplary embodiment. Attachment locations 4 for LED dice 8 are present on the carrier 3. A second attachment location 4.b is electrically connected to an adjacent third attachment location 4.c by way of a conductor track 5 located on the carrier. In addition, a first attachment location 4. a that is adjacent to the second attachment location 4.b is present. The attachment locations and the conductor track are embodied as part of a patterned metal layer on an insulating carrier base material.
The LED dice 8 are attached to the carrier 3 by way of the lower side. The lower side of the dice in the depiction is at the bottom, the upper side is at the top. The first LED die 8. a is attached to the first attachment location 4. a, the second LED die 8.b is attached to the second attachment location 4.b and the third LED die 8.c is attached to the third attachment location 4.c. The at tachments are embodied to be electrically conductive. The second LED die 8.b is arranged ad jacent to the first LED die 8. a. The third LED die is arranged adjacent to the second LED die 8.b.
A detail is depicted with three LED dice 8.a-c which are electrically connected in series. A first LED die 8. a has a lower-side first connection 1 1 .a and an upper-side second connection 1 1 .b. A second LED die 8.b has an upper-side third connection 1 1 .c and a lower-side fourth connection 1 1.d. A third LED die 8.c has a lower-side fifth connection 1 1.e and an upper-side sixth connec tion 1 1.f. The upper-side second connection 1 1 .b of the first LED die 8. a is electrically con nected to the upper-side third connection 1 1 .c of the second LED die 8.b by way of a bond wire 6. The lower-side fourth connection 1 1.d of the second LED die 8.b is electrically connected to the lower-side fifth connection 1 1 .e of the third LED die 8.c by way of a conductor track 5 lo cated on the carrier 3. The first LED die 8. a and the third LED die 8.c have a first polarity and the second LED die 8.b has a second polarity that differs from the first polarity. As a result, the depiction shows the series connection of the LEDs.
Figure 4 shows an LED die. The upper side 10 is embodied as the surface emitting light radia tion 2. The direction of the light radiation is the z-direction. The light radiation is divergent. The direction of the light radiation should be understood to be the main emission direction. A first connection 1 1.a that is arranged close to the periphery is provided here on the upper side. Alter natively, it can be arranged centrally. A second connection 1 1.b that here has a full-area em bodiment is present on the lower side 9.
Figure 5 shows a second exemplary embodiment. The LED dice 8 are embodied here with a rectangular area, but not a square area. The LED dice 8 are arranged, likewise constituting col umns 14, in a 4x4 matrix arrangement.
Figure 6 shows a third exemplary embodiment. Here, in each row 13.a-d, in each case one group of four LED dice that are electrically connected in series is present. Each group has a first power connection 15 and a second power connection 16. The groups can be operated in paral- lei connection. Alternatively, the groups can be operated independently of one another because they have separate power supplies.
Figure 7 shows a fourth exemplary embodiment. The LED dice 8 of adjacent rows 13 are here in each case offset in the x-direction, which means that no columns are formed.
Figure 8 shows a fifth exemplary embodiment. This exemplary embodiment is characterized in that the first LED die 8. a is arranged in a first row 13. a, and the second LED die 8.b is arranged in a second row 13.b that is adjacent to the first row 13. a. In addition, the polarities of the dice are stated in that the upper-side connections are denoted as an anode (A) or cathode (K). A first group comprising the dice in the first and second columns 14. a and 14. b is present here. A sec ond group comprises the dice in column 14.c. Both groups have a common second power con- nection 16, embodied as a minus pole, and separate first power connections 15.
Such an arrangement can be advantageous when dice having a low forward voltage, for exam ple IR LEDs or red LEDs, are combined in the first group, and dice having a higher forward volt age, for example UV or blue LEDs, are combined in the second group. In this case, the sum of the forward voltage of the first group can be approximately the same as that of the second group.
It is additionally apparent from this figure that upper-side connections 11.b, 1 1.c, 11.f that are arranged near the periphery permit the use of shorter bond wires and avoid shading of the light emission surfaces.
Reference signs 1. LED illumination apparatus
2. Light radiation
3. Carrier
4. Attachment location
a. First attachment location b. Second attachment location c. Third attachment location
5. Conductor track
a. First conductor track b. Second conductor track
6. Bond wire
a. First bond wire
b. Second bond wire
7. Bond pad
8. LED die
a. First LED die
b. Second LED die c. Third LED die
d. Fourth LED die
e. Fifth LED die
9. Lower side
10. Upper side
11. Connection
a. First connection
b. Second connection c. Third connection d. Fourth connection e. Fifth connection
f. Sixth connection
12. Intermediate space
13. Row
a. First row
b. Second row
c. Third row
d. Fourth row
14. Column a. First column b. Second column c. Third column
15. First power connection
16. Second power connection

Claims

Patent claims
1. LED illumination apparatus (1 ) for producing light radiation (2), comprising
a. a carrier (3),
b. at least nine LED dice (8) in each case having one lower side (9) and one upper side (10), wherein the LED dice (8) are attached to the carrier (3) by way of the lower side and the LED dice (8) are arranged in at least three rows (13.a-c), wherein at least one first group of at least three LED dice (8) that are electrically con nected in series is present, wherein
at least one first LED die (8. a) has a lower-side first connection (11.a) and an upper- side second connection (1 1.b), and
at least one second LED die (8.b) has an upper-side third connection (11.c) and a lower-side fourth connection (11.d), and
at least one third LED die (8.c) has a lower-side fifth connection (1 1.e) and an upper- side sixth connection (1 1.f), and
the second LED die (8.b) is arranged adjacent to the first LED die (8. a), and the third LED die is arranged adjacent to the second LED die (8.b), and
the upper-side second connection (1 1.b) of the first LED die (8. a) is electrically con nected to the upper-side third connection (11.c) of the second LED die (8.b) by way of at least one bond wire (6, 6. a), and
the lower-side fourth connection (1 1.d) of the second LED die (8.b) is electrically con nected to the lower-side fifth connection (1 1.e) of the third LED die (8.c) by way of at least one conductor track (5) located on the carrier (3), and
either the second upper-side connection (11.b), the fourth lower-side connection (1 1.d) and the sixth upper-side connection (1 1.f) are embodied as a cathode connection of the respective LED die
or the second upper-side connection (1 1.b), the fourth lower-side connection (1 1.d) and the sixth upper-side connection (11.f) are embodied as an anode connection of the re spective LED die.
2. LED illumination apparatus (1 ) according to Claim 1 , characterized in that at least two of the LED dice (8) have different central wavelengths.
3. LED illumination apparatus (1 ) according to one of the preceding claims, characterized in that the LED dice are arranged within a partial surface area of the carrier that is free from bond pads.
4. LED illumination apparatus (1 ) according to one of the preceding claims, characterized in that at least one bond pad (7) is provided and the lower-side connection of a fourth LED die (8.d) is electrically connected to the upper-side connection of a fifth LED die (8.e) by way of a further conductor track (5.b), the bond pad (7) and a second bond wire (6-b).
5. LED illumination apparatus (1 ) according to one of the preceding claims, characterized in that twelve, sixteen, twenty or twenty-five LED dice are present, arranged in a matrix arrangement 3x4, 4x4, 4x5 or 5x5, and at least four LED dice have an upper-side cath ode connection, and at least four different LED dice have an upper-side anode connec tion.
6. LED illumination apparatus (1 ) according to one of the preceding claims, characterized in that at least one second group of at least three LED dice that are electrically con nected in series is present, wherein the second group is connected parallel with respect to the first group.
7. LED illumination apparatus (1 ) according to one of the preceding claims, characterized in that at least one third group of at least three LED dice that are electrically connected in series is present, wherein the third group is operable independently of the first group.
8. LED illumination apparatus (1 ) according to one of the preceding claims, characterized in that the first LED die (8. a) is arranged in a first row (13. a), and the second LED die (8.b) is arranged in a second row (13.b) that is adjacent to the first row (13. a).
9. Use of an LED illumination apparatus (1 ) according to one of the preceding claims for one or more of the following purposes:
• for carrying out photochemical reactions,
• for curing light-curing adhesives,
• for the photosynthesis in plants or bacteria,
• for illuminating samples for analytical purposes,
• as microscope illumination,
• as a light source for spectral analyses or fluorescence examinations,
• as a light source in cameras, photo cameras, tablet computers or mobile tele phones,
• for illuminating aquariums or terrariums,
• for charging phosphorescent materials, • for illuminating goods for sale, in particular food,
• for light therapy or colorpuncture,
• for skin treatment,
• as a projector for dancing or concert events,
• as stage lighting.
10. Method for producing an LED illumination apparatus (1 ), comprising
a. providing a carrier (3) having attachment locations (4) for LED dice (8), wherein a second attachment location (4.b) is electrically connected to an adjacent third at tachment location (4.c) by way of a conductor track (5), and a first attachment lo cation (4. a) adjacent to the second attachment location (4.b) is present, b. providing the LED dice (8) with in each case one lower side (9) and one upper side (10) and in each case at least one lower-side and at least one upper-side connection, wherein a first LED die (8. a) and a third LED die (8.c) have a first po larity and a second LED die (8.b) has a second polarity that differs from the first polarity,
c. arranging the LED dice (8) in at least three rows (13.a-c) on the carrier (3), d. attaching the LED dice (8) by way of the lower side to the attachment locations of the carrier (3), wherein the first LED die (8. a) is attached to the first attachment location (4. a), the second LED die (8.b) is attached to the second attachment lo cation (4.b), and the third LED die (8.c) is attached to the third attachment loca tion (4c),
e. establishing electrical contact with the upper-side connections of the LED dice (8) with bond wires, wherein the upper-side second connection (1 1.b) of the first LED die (8. a) is connected to the upper-side third connection (1 1.c) of the sec ond LED die (8.b) by way of at least one bond wire (6).
11. Use of LED dice (8) of different polarity for an LED illumination apparatus (1 ), wherein a first LED die (8. a) and a third LED die (8.c) have a first polarity and a second LED die (8.b) has a second polarity that differs from the first polarity, and the first LED die (8. a), the second LED die (8.b) and the third LED die (8.c) are arranged on a carrier (3) and are electrically connected in series.
PCT/EP2019/067352 2019-06-07 2019-06-28 Led illumination apparatus WO2020244784A1 (en)

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