KR101238123B1 - 세정 장치, 세정 방법, 및 컴퓨터 판독 가능한 매체 - Google Patents

세정 장치, 세정 방법, 및 컴퓨터 판독 가능한 매체 Download PDF

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Publication number
KR101238123B1
KR101238123B1 KR1020070106922A KR20070106922A KR101238123B1 KR 101238123 B1 KR101238123 B1 KR 101238123B1 KR 1020070106922 A KR1020070106922 A KR 1020070106922A KR 20070106922 A KR20070106922 A KR 20070106922A KR 101238123 B1 KR101238123 B1 KR 101238123B1
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South Korea
Prior art keywords
liquid
substrate
rinse
cleaning
discharge port
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Korean (ko)
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KR20080036542A (ko
Inventor
히로미츠 난바
노리히로 이또
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도쿄엘렉트론가부시키가이샤
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Publication of KR20080036542A publication Critical patent/KR20080036542A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Cleaning Or Drying Semiconductors (AREA)
KR1020070106922A 2006-10-23 2007-10-23 세정 장치, 세정 방법, 및 컴퓨터 판독 가능한 매체 Active KR101238123B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00287758 2006-10-23
JP2006287758 2006-10-23
JP2007224237A JP4940066B2 (ja) 2006-10-23 2007-08-30 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体
JPJP-P-2007-00224237 2007-08-30

Publications (2)

Publication Number Publication Date
KR20080036542A KR20080036542A (ko) 2008-04-28
KR101238123B1 true KR101238123B1 (ko) 2013-02-27

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ID=39244595

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KR1020070106922A Active KR101238123B1 (ko) 2006-10-23 2007-10-23 세정 장치, 세정 방법, 및 컴퓨터 판독 가능한 매체

Country Status (5)

Country Link
US (1) US8043440B2 (https=)
JP (1) JP4940066B2 (https=)
KR (1) KR101238123B1 (https=)
DE (1) DE102007050594A1 (https=)
TW (1) TW200836251A (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7927429B2 (en) * 2003-11-18 2011-04-19 Tokyo Electron Limited Substrate cleaning method, substrate cleaning apparatus and computer readable recording medium
KR100979979B1 (ko) * 2006-07-26 2010-09-03 도쿄엘렉트론가부시키가이샤 액처리 장치 및 액처리 방법
JP2012064800A (ja) * 2010-09-16 2012-03-29 Sumco Corp ウェーハ洗浄装置
JP5788349B2 (ja) * 2012-03-19 2015-09-30 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
JP6186499B2 (ja) * 2013-05-09 2017-08-23 エーシーエム リサーチ （シャンハイ） インコーポレーテッド ウェハのメッキおよび／または研磨のための装置および方法
JP6134673B2 (ja) 2014-03-13 2017-05-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6258132B2 (ja) * 2014-06-06 2018-01-10 東京エレクトロン株式会社 基板液処理装置
JP6392035B2 (ja) * 2014-09-02 2018-09-19 東京エレクトロン株式会社 基板液処理装置
JP6320945B2 (ja) * 2015-01-30 2018-05-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6391524B2 (ja) * 2015-03-31 2018-09-19 株式会社Ｓｃｒｅｅｎホールディングス 脱酸素装置および基板処理装置
JP6618032B2 (ja) * 2015-08-27 2019-12-11 Toto株式会社 トイレ装置
JP6903441B2 (ja) * 2016-03-31 2021-07-14 芝浦メカトロニクス株式会社 基板処理装置
JP6431128B2 (ja) * 2017-05-15 2018-11-28 エーシーエム リサーチ （シャンハイ） インコーポレーテッド ウェハのメッキおよび／または研磨のための装置および方法
JP6887912B2 (ja) * 2017-08-07 2021-06-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7292107B2 (ja) * 2019-05-27 2023-06-16 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP7287271B2 (ja) * 2019-12-26 2023-06-06 株式会社Sumco ワークの洗浄装置および洗浄方法
WO2021205994A1 (ja) * 2020-04-10 2021-10-14 東京エレクトロン株式会社 基板処理方法、及び基板処理装置
JP7611043B2 (ja) 2021-03-26 2025-01-09 株式会社東京精密 ウエハ裏面洗浄装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09298181A (ja) * 1996-05-07 1997-11-18 Tokyo Ohka Kogyo Co Ltd 基板の裏面洗浄装置
JPH11340180A (ja) 1998-03-23 1999-12-10 Tokyo Electron Ltd 基板の洗浄装置及び洗浄方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249765B2 (ja) * 1997-05-07 2002-01-21 東京エレクトロン株式会社 基板処理装置
JP2000138163A (ja) * 1998-10-30 2000-05-16 Tokyo Electron Ltd 液処理装置
JP3739220B2 (ja) * 1998-11-19 2006-01-25 大日本スクリーン製造株式会社 基板処理方法及びその装置
US20020096196A1 (en) * 2001-01-23 2002-07-25 Takayuki Toshima Substrate processing apparatus and substrate processing method
JP4342324B2 (ja) * 2004-01-16 2009-10-14 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
EP1763072A4 (en) * 2004-06-04 2010-02-24 Tokyo Electron Ltd SUBSTRATE PURIFICATION METHOD AND COMPUTER READABLE RECORDING MEDIUM
JP4446917B2 (ja) * 2005-03-29 2010-04-07 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
US7767026B2 (en) * 2005-03-29 2010-08-03 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09298181A (ja) * 1996-05-07 1997-11-18 Tokyo Ohka Kogyo Co Ltd 基板の裏面洗浄装置
JPH11340180A (ja) 1998-03-23 1999-12-10 Tokyo Electron Ltd 基板の洗浄装置及び洗浄方法

Also Published As

Publication number Publication date
KR20080036542A (ko) 2008-04-28
TW200836251A (en) 2008-09-01
TWI355022B (https=) 2011-12-21
JP2008135703A (ja) 2008-06-12
US8043440B2 (en) 2011-10-25
US20080173333A1 (en) 2008-07-24
JP4940066B2 (ja) 2012-05-30
DE102007050594A1 (de) 2008-04-30

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