KR101226289B1 - 템플릿의 표면 처리 방법 및 장치 및 패턴 형성 방법 - Google Patents

템플릿의 표면 처리 방법 및 장치 및 패턴 형성 방법 Download PDF

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Publication number
KR101226289B1
KR101226289B1 KR1020110018954A KR20110018954A KR101226289B1 KR 101226289 B1 KR101226289 B1 KR 101226289B1 KR 1020110018954 A KR1020110018954 A KR 1020110018954A KR 20110018954 A KR20110018954 A KR 20110018954A KR 101226289 B1 KR101226289 B1 KR 101226289B1
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template
chamber
surface treatment
coupling agent
silane coupling
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Korean (ko)
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KR20110109845A (ko
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요시히사 가와무라
가쯔또시 고바야시
신이찌 이또
히데까즈 하야시
히로시 도미따
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가부시끼가이샤 도시바
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020110018954A 2010-03-31 2011-03-03 템플릿의 표면 처리 방법 및 장치 및 패턴 형성 방법 Expired - Fee Related KR101226289B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010081019 2010-03-31
JPJP-P-2010-081019 2010-03-31
JPJP-P-2010-280514 2010-12-16
JP2010280514A JP5693941B2 (ja) 2010-03-31 2010-12-16 テンプレートの表面処理方法及び装置並びにパターン形成方法

Publications (2)

Publication Number Publication Date
KR20110109845A KR20110109845A (ko) 2011-10-06
KR101226289B1 true KR101226289B1 (ko) 2013-01-24

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KR1020110018954A Expired - Fee Related KR101226289B1 (ko) 2010-03-31 2011-03-03 템플릿의 표면 처리 방법 및 장치 및 패턴 형성 방법

Country Status (5)

Country Link
US (1) US20110244131A1 (enExample)
JP (1) JP5693941B2 (enExample)
KR (1) KR101226289B1 (enExample)
CN (1) CN102208335B (enExample)
TW (1) TWI500071B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350424B2 (ja) * 2011-03-24 2013-11-27 東京エレクトロン株式会社 表面処理方法
JP5898549B2 (ja) * 2012-03-29 2016-04-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN102866582B (zh) * 2012-09-29 2014-09-10 兰红波 一种用于高亮度led图形化的纳米压印装置和方法
JP2015149390A (ja) * 2014-02-06 2015-08-20 キヤノン株式会社 インプリント装置、型、および物品の製造方法
JP6532419B2 (ja) * 2015-03-31 2019-06-19 芝浦メカトロニクス株式会社 インプリント用のテンプレート製造装置
WO2016159312A1 (ja) * 2015-03-31 2016-10-06 芝浦メカトロニクス株式会社 インプリント用のテンプレート製造装置
JP6486206B2 (ja) * 2015-03-31 2019-03-20 芝浦メカトロニクス株式会社 インプリント用のテンプレート製造装置
WO2016159310A1 (ja) * 2015-03-31 2016-10-06 芝浦メカトロニクス株式会社 インプリント用のテンプレート製造装置
JP6529843B2 (ja) * 2015-07-14 2019-06-12 芝浦メカトロニクス株式会社 インプリント用のテンプレート製造装置及びテンプレート製造方法
JP6441181B2 (ja) 2015-08-04 2018-12-19 東芝メモリ株式会社 インプリント用テンプレートおよびその製造方法、および半導体装置の製造方法
CN109804275B (zh) 2016-08-26 2023-08-25 分子印记公司 制造单片光子器件的方法、光子器件
JP6698489B2 (ja) * 2016-09-26 2020-05-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN111526838B (zh) 2017-11-02 2022-03-22 奇跃公司 制备和分配聚合物材料并从其生产聚合物制品
JP2019220647A (ja) * 2018-06-22 2019-12-26 株式会社アルバック 表面処理方法、プリント配線板の製造方法、および、表面処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006512213A (ja) 2002-06-20 2006-04-13 オブデュキャット、アクチボラグ 成形工具を製造するための方法およびその成形工具を用いて形成された記憶媒体
KR20060104737A (ko) * 2005-03-31 2006-10-09 삼성전기주식회사 인쇄회로기판용 임프린트 몰드의 이형처리방법
KR100763349B1 (ko) 2006-09-14 2007-10-04 삼성전기주식회사 금속 스탬프 제조방법
KR20080021956A (ko) * 2006-09-05 2008-03-10 삼성전기주식회사 스탬퍼 이형처리 방법

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US5626820A (en) * 1988-12-12 1997-05-06 Kinkead; Devon A. Clean room air filtering
US5690749A (en) * 1996-03-18 1997-11-25 Motorola, Inc. Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material
WO2003021642A2 (en) * 2001-08-31 2003-03-13 Applied Materials, Inc. Method and apparatus for processing a wafer
WO2006041115A1 (ja) * 2004-10-13 2006-04-20 Central Glass Company, Limited 含フッ素重合性単量体及びそれを用いた高分子化合物
US20100009290A1 (en) * 2006-12-03 2010-01-14 Central Glass Co., Ltd. Photosensitive Polybenzoxazines and Methods of Making the Same
JP4999069B2 (ja) * 2007-01-23 2012-08-15 株式会社日立製作所 ナノインプリント用スタンパ、ナノインプリント用スタンパの製造方法、およびナノインプリント用スタンパの表面処理剤
WO2009099191A1 (ja) * 2008-02-07 2009-08-13 Sumitomo Bakelite Company Limited 半導体用フィルム、半導体装置の製造方法および半導体装置
JP4695679B2 (ja) * 2008-08-21 2011-06-08 株式会社東芝 テンプレートの洗浄方法及びパターン形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006512213A (ja) 2002-06-20 2006-04-13 オブデュキャット、アクチボラグ 成形工具を製造するための方法およびその成形工具を用いて形成された記憶媒体
KR20060104737A (ko) * 2005-03-31 2006-10-09 삼성전기주식회사 인쇄회로기판용 임프린트 몰드의 이형처리방법
KR20080021956A (ko) * 2006-09-05 2008-03-10 삼성전기주식회사 스탬퍼 이형처리 방법
KR100763349B1 (ko) 2006-09-14 2007-10-04 삼성전기주식회사 금속 스탬프 제조방법

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Publication number Publication date
TWI500071B (zh) 2015-09-11
TW201140653A (en) 2011-11-16
JP2011224965A (ja) 2011-11-10
CN102208335A (zh) 2011-10-05
JP5693941B2 (ja) 2015-04-01
US20110244131A1 (en) 2011-10-06
CN102208335B (zh) 2013-09-18
KR20110109845A (ko) 2011-10-06

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