KR101173708B1 - 감방사선 조성물, 적층체 및 그의 제조방법, 및 전자 부품 - Google Patents

감방사선 조성물, 적층체 및 그의 제조방법, 및 전자 부품 Download PDF

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Publication number
KR101173708B1
KR101173708B1 KR1020067020216A KR20067020216A KR101173708B1 KR 101173708 B1 KR101173708 B1 KR 101173708B1 KR 1020067020216 A KR1020067020216 A KR 1020067020216A KR 20067020216 A KR20067020216 A KR 20067020216A KR 101173708 B1 KR101173708 B1 KR 101173708B1
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KR
South Korea
Prior art keywords
resin film
radiation
substrate
sensitive composition
ether
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Expired - Fee Related
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KR1020067020216A
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English (en)
Korean (ko)
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KR20060130691A (ko
Inventor
히로카즈 히가시
가즈요 데라다
다카시 기우치
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니폰 제온 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020067020216A 2004-03-31 2005-03-22 감방사선 조성물, 적층체 및 그의 제조방법, 및 전자 부품 Expired - Fee Related KR101173708B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00104226 2004-03-31
JP2004104226 2004-03-31
PCT/JP2005/005094 WO2005098539A1 (ja) 2004-03-31 2005-03-22 感放射線組成物、積層体及びその製造方法並びに電子部品

Publications (2)

Publication Number Publication Date
KR20060130691A KR20060130691A (ko) 2006-12-19
KR101173708B1 true KR101173708B1 (ko) 2012-08-13

Family

ID=35125234

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067020216A Expired - Fee Related KR101173708B1 (ko) 2004-03-31 2005-03-22 감방사선 조성물, 적층체 및 그의 제조방법, 및 전자 부품

Country Status (5)

Country Link
JP (1) JP4380703B2 (https=)
KR (1) KR101173708B1 (https=)
CN (1) CN1957299B (https=)
TW (1) TW200604226A (https=)
WO (1) WO2005098539A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4771086B2 (ja) * 2006-03-01 2011-09-14 日本ゼオン株式会社 感放射線性樹脂組成物、積層体及びその製造方法
TWI408496B (zh) * 2006-03-01 2013-09-11 Zeon Corp A radiation linear resin composition, a laminate, and a method for producing the same
JP5040432B2 (ja) * 2007-05-15 2012-10-03 住友ベークライト株式会社 感光性樹脂組成物
JP2009244801A (ja) * 2008-03-31 2009-10-22 Fujifilm Corp 感光性樹脂組成物、高分子化合物、パターンの製造法および電子デバイス
TWI559079B (zh) * 2008-11-18 2016-11-21 Sumitomo Chemical Co Photosensitive resin composition and display device
CN102024562B (zh) * 2009-09-17 2016-03-09 大赛璐化学工业株式会社 用于制造叠层陶瓷部件的溶剂或溶剂组合物
JP2012107206A (ja) * 2010-10-26 2012-06-07 Daicel Corp 印刷用溶剤又は溶剤組成物
JP5886591B2 (ja) * 2011-08-09 2016-03-16 株式会社ダイセル 印刷用溶剤及びペースト組成物
US10025182B2 (en) * 2014-03-20 2018-07-17 Zeon Corporation Radiation-sensitive resin composition and electronic device
WO2015141719A1 (ja) * 2014-03-20 2015-09-24 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
CN107922741A (zh) * 2015-08-31 2018-04-17 日本瑞翁株式会社 树脂组合物
JP7058214B2 (ja) * 2015-11-06 2022-04-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド 感光性樹脂組成物及びそれから調製される硬化膜
KR102269563B1 (ko) * 2016-03-23 2021-06-24 니폰 제온 가부시키가이샤 수지 조성물, 수지막, 및 전자 부품
CN107703685B (zh) * 2016-08-08 2022-03-18 东京应化工业株式会社 层叠体和层叠体的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065116A (ja) * 1996-08-13 1998-03-06 Fujitsu Ltd 半導体装置及びその製造方法
JPH1165116A (ja) * 1997-06-09 1999-03-05 Jsr Corp 感放射線性樹脂組成物
JP2003156838A (ja) * 2001-11-20 2003-05-30 Nippon Zeon Co Ltd 感放射線性樹脂組成物、樹脂パターン形成方法、樹脂パターン及びその利用
JP2003307847A (ja) * 2002-04-16 2003-10-31 Jsr Corp インクジェット方式により層間絶縁膜を形成するための組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6190833B1 (en) * 1997-03-30 2001-02-20 Jsr Corporation Radiation-sensitive resin composition
JPH10307388A (ja) * 1997-05-06 1998-11-17 Jsr Corp 感放射線性樹脂組成物
US6984476B2 (en) * 2002-04-15 2006-01-10 Sharp Kabushiki Kaisha Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065116A (ja) * 1996-08-13 1998-03-06 Fujitsu Ltd 半導体装置及びその製造方法
JPH1165116A (ja) * 1997-06-09 1999-03-05 Jsr Corp 感放射線性樹脂組成物
JP2003156838A (ja) * 2001-11-20 2003-05-30 Nippon Zeon Co Ltd 感放射線性樹脂組成物、樹脂パターン形成方法、樹脂パターン及びその利用
JP2003307847A (ja) * 2002-04-16 2003-10-31 Jsr Corp インクジェット方式により層間絶縁膜を形成するための組成物

Also Published As

Publication number Publication date
WO2005098539A1 (ja) 2005-10-20
CN1957299B (zh) 2010-04-21
JP4380703B2 (ja) 2009-12-09
JPWO2005098539A1 (ja) 2008-02-28
KR20060130691A (ko) 2006-12-19
CN1957299A (zh) 2007-05-02
TWI377215B (https=) 2012-11-21
TW200604226A (en) 2006-02-01

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