KR101154203B1 - 전해 동박, 그 전해 동박을 이용한 표면 처리 동박 및 그 표면 처리 동박을 이용한 동박 적층판 및 그 전해 동박의 제조 방법 - Google Patents

전해 동박, 그 전해 동박을 이용한 표면 처리 동박 및 그 표면 처리 동박을 이용한 동박 적층판 및 그 전해 동박의 제조 방법 Download PDF

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KR101154203B1
KR101154203B1 KR1020087027252A KR20087027252A KR101154203B1 KR 101154203 B1 KR101154203 B1 KR 101154203B1 KR 1020087027252 A KR1020087027252 A KR 1020087027252A KR 20087027252 A KR20087027252 A KR 20087027252A KR 101154203 B1 KR101154203 B1 KR 101154203B1
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copper foil
electrolytic copper
additive
manufacturing
electrolytic
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Korean (ko)
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KR20090026128A (ko
Inventor
히사오 사카이
마사루 타카하시
미쓰요시 마쓰다
마코토 도바시
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미쓰이 긴조꾸 고교 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
KR1020087027252A 2006-04-28 2007-04-26 전해 동박, 그 전해 동박을 이용한 표면 처리 동박 및 그 표면 처리 동박을 이용한 동박 적층판 및 그 전해 동박의 제조 방법 Active KR101154203B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006126720 2006-04-28
JPJP-P-2006-126720 2006-04-28
JPJP-P-2006-252595 2006-09-19
JP2006252595 2006-09-19
PCT/JP2007/059056 WO2007125994A1 (ja) 2006-04-28 2007-04-26 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法

Publications (2)

Publication Number Publication Date
KR20090026128A KR20090026128A (ko) 2009-03-11
KR101154203B1 true KR101154203B1 (ko) 2012-06-18

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KR1020087027252A Active KR101154203B1 (ko) 2006-04-28 2007-04-26 전해 동박, 그 전해 동박을 이용한 표면 처리 동박 및 그 표면 처리 동박을 이용한 동박 적층판 및 그 전해 동박의 제조 방법

Country Status (5)

Country Link
US (1) US9307639B2 (enExample)
KR (1) KR101154203B1 (enExample)
CN (1) CN101426959B (enExample)
TW (1) TW200745385A (enExample)
WO (1) WO2007125994A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
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KR20150130141A (ko) 2014-05-13 2015-11-23 (주)피엔티 합금박 제조 장치
US11505873B2 (en) 2017-07-31 2022-11-22 Sk Nexilis Co., Ltd. Copper foil free from generation of wrinkles, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same

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JP5588607B2 (ja) * 2007-10-31 2014-09-10 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法
JP5752301B2 (ja) * 2007-10-31 2015-07-22 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法
TWI434965B (zh) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
JP5255349B2 (ja) * 2008-07-11 2013-08-07 三井金属鉱業株式会社 表面処理銅箔
JP4422790B1 (ja) * 2009-09-17 2010-02-24 宇部興産株式会社 フレキシブル金属積層体の製造方法
JP5598700B2 (ja) * 2010-02-25 2014-10-01 福田金属箔粉工業株式会社 電解銅箔及びその製造方法
KR101385760B1 (ko) * 2010-07-01 2014-04-17 미쓰이금속광업주식회사 전해 동박 및 그 제조 방법
CN104651836B (zh) * 2010-11-22 2018-11-02 三井金属矿业株式会社 表面处理铜箔
JP5074611B2 (ja) * 2011-03-30 2012-11-14 Ｊｘ日鉱日石金属株式会社 二次電池負極集電体用電解銅箔及びその製造方法
KR20160138321A (ko) * 2011-06-30 2016-12-02 후루카와 덴키 고교 가부시키가이샤 전해 동박, 상기 전해 동박의 제조 방법 및 상기 전해 동박을 집전체로 하는 리튬 이온 이차 전지
US8956688B2 (en) 2011-10-12 2015-02-17 Ut-Battelle, Llc Aqueous processing of composite lithium ion electrode material
US9347441B2 (en) * 2012-03-30 2016-05-24 Sabic Global Technologies B.V. Compressors including polymeric components
CN102703938B (zh) * 2012-06-07 2015-04-22 上海交通大学 硫酸铜电镀液的应力消除剂
KR101716988B1 (ko) * 2012-09-10 2017-03-15 제이엑스금속주식회사 표면 처리 동박 및 그것을 사용한 적층판
TWI518210B (zh) * 2013-01-31 2016-01-21 三井金屬鑛業股份有限公司 電解銅箔、該電解銅箔之製造方法及使用該電解銅箔而得之表面處理銅箔
WO2015016271A1 (ja) * 2013-08-01 2015-02-05 古河電気工業株式会社 プリント配線基板用銅箔
KR101500565B1 (ko) * 2014-03-20 2015-03-12 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지
KR101500566B1 (ko) * 2014-03-20 2015-03-12 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지
JP2017014608A (ja) * 2015-07-06 2017-01-19 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池、プリント配線板並びに電磁波シールド材
WO2017090161A1 (ja) * 2015-11-26 2017-06-01 近藤　和夫 酸性銅めっき液、酸性銅めっき物および半導体デバイスの製造方法
KR101992840B1 (ko) 2017-06-20 2019-06-27 케이씨에프테크놀로지스 주식회사 울음과 찢김이 최소화된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조 방법
EP3896198A4 (en) * 2018-12-10 2022-01-26 Nippon Denkai, Ltd. Electrolytic copper foil and method for producing same
CN110331421A (zh) * 2019-04-30 2019-10-15 江苏华威铜业有限公司 一种电解铜箔及其制造工艺
KR102772840B1 (ko) 2019-07-10 2025-02-27 주식회사 엘지에너지솔루션 금속 박막 보관장치 및 이를 이용한 금속 박막 보관방법
JP6667840B1 (ja) 2019-07-22 2020-03-18 テックス・テクノロジー株式会社 電解銅箔の製造方法
TWI705160B (zh) * 2019-12-09 2020-09-21 長春石油化學股份有限公司 電解銅箔、包含其的電極和覆銅積層板
PL245191B1 (pl) * 2020-01-30 2024-05-27 Mitsui Mining & Smelting Co Ltd Elektrolityczna folia miedziana
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CN111607810A (zh) * 2020-07-14 2020-09-01 安徽铜冠铜箔集团股份有限公司 一种超薄电解铜箔高效生产方法
CN112469194B (zh) * 2020-11-27 2022-08-05 广东嘉元科技股份有限公司 一种高密互联电路板用低轮廓电解铜箔
CN112680751A (zh) * 2020-12-08 2021-04-20 九江德福科技股份有限公司 一种高强度电子铜箔制备方法
CN112964495B (zh) * 2021-02-04 2024-07-09 赣州逸豪新材料股份有限公司 一种电解铜箔电解高温剥离抽样检测装置及其实施方法
KR102495997B1 (ko) * 2021-03-11 2023-02-06 일진머티리얼즈 주식회사 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판
CN113354445B (zh) * 2021-05-24 2022-04-15 常州大学 填充材料及制备方法、高延展性低轮廓电解铜箔制造方法

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WO1997043466A1 (en) 1996-05-13 1997-11-20 Mitsui Mining & Smelting Co., Ltd. High-tensile electrolytic copper foil and process for producing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150130141A (ko) 2014-05-13 2015-11-23 (주)피엔티 합금박 제조 장치
US11505873B2 (en) 2017-07-31 2022-11-22 Sk Nexilis Co., Ltd. Copper foil free from generation of wrinkles, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same

Also Published As

Publication number Publication date
US20090095515A1 (en) 2009-04-16
TW200745385A (en) 2007-12-16
CN101426959A (zh) 2009-05-06
TWI359212B (enExample) 2012-03-01
WO2007125994A1 (ja) 2007-11-08
CN101426959B (zh) 2010-11-17
US9307639B2 (en) 2016-04-05
KR20090026128A (ko) 2009-03-11

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