KR101082268B1 - 귀금속의 ｃｍｐ 방법 - Google Patents

귀금속의 ｃｍｐ 방법 Download PDF

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Publication number
KR101082268B1
KR101082268B1 KR1020057015903A KR20057015903A KR101082268B1 KR 101082268 B1 KR101082268 B1 KR 101082268B1 KR 1020057015903 A KR1020057015903 A KR 1020057015903A KR 20057015903 A KR20057015903 A KR 20057015903A KR 101082268 B1 KR101082268 B1 KR 101082268B1
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KR
South Korea
Prior art keywords
acid
polishing
abrasive
alumina
sulfonic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020057015903A
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English (en)
Korean (ko)
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KR20050105495A (ko
Inventor
프란세스코 드 레게 데소로
블라스타 브루직
벤자민 피. 바이엘
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
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Publication of KR20050105495A publication Critical patent/KR20050105495A/ko
Application granted granted Critical
Publication of KR101082268B1 publication Critical patent/KR101082268B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/694—Electrodes comprising noble metals or noble metal oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020057015903A 2003-02-27 2005-08-26 귀금속의 ｃｍｐ 방법 Expired - Lifetime KR101082268B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/376,172 2003-02-27
US10/376,172 US7097541B2 (en) 2002-01-22 2003-02-27 CMP method for noble metals
PCT/IB2004/000993 WO2004076574A2 (en) 2003-02-27 2004-02-19 Cmp composition comprising a sulfonic acid and a method for polishing noble metals

Publications (2)

Publication Number Publication Date
KR20050105495A KR20050105495A (ko) 2005-11-04
KR101082268B1 true KR101082268B1 (ko) 2011-11-09

Family

ID=32926283

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057015903A Expired - Lifetime KR101082268B1 (ko) 2003-02-27 2005-08-26 귀금속의 ｃｍｐ 방법

Country Status (7)

Country Link
US (1) US7097541B2 (https=)
EP (1) EP1599555B1 (https=)
JP (1) JP4709136B2 (https=)
KR (1) KR101082268B1 (https=)
CN (1) CN1753961B (https=)
TW (1) TWI241937B (https=)
WO (1) WO2004076574A2 (https=)

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US7514363B2 (en) * 2003-10-23 2009-04-07 Dupont Air Products Nanomaterials Llc Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use
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KR20050105495A (ko) 2005-11-04
WO2004076574A2 (en) 2004-09-10
TW200427549A (en) 2004-12-16
CN1753961B (zh) 2010-08-11
TWI241937B (en) 2005-10-21
US7097541B2 (en) 2006-08-29
JP4709136B2 (ja) 2011-06-22
CN1753961A (zh) 2006-03-29
JP2006519490A (ja) 2006-08-24
WO2004076574A3 (en) 2004-12-23
US20030181142A1 (en) 2003-09-25
EP1599555A2 (en) 2005-11-30
EP1599555B1 (en) 2019-06-12

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