KR101061926B1 - 건조 장치, 건조 방법, 기판 처리 장치, 기판 처리 방법,프로그램이 기록된 컴퓨터 판독가능한 기록 매체 - Google Patents

건조 장치, 건조 방법, 기판 처리 장치, 기판 처리 방법,프로그램이 기록된 컴퓨터 판독가능한 기록 매체 Download PDF

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KR101061926B1
KR101061926B1 KR1020060111687A KR20060111687A KR101061926B1 KR 101061926 B1 KR101061926 B1 KR 101061926B1 KR 1020060111687 A KR1020060111687 A KR 1020060111687A KR 20060111687 A KR20060111687 A KR 20060111687A KR 101061926 B1 KR101061926 B1 KR 101061926B1
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carrier gas
supply
drying
mixed fluid
supplying
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KR20070053112A (ko
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히로시 다나카
히데토시 나카오
나오키 신도
아츠시 야먀시타
코타로 쯔루사키
츠카사 히라야마
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S118/00—Coating apparatus
    • Y10S118/90—Semiconductor vapor doping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
KR1020060111687A 2005-11-18 2006-11-13 건조 장치, 건조 방법, 기판 처리 장치, 기판 처리 방법,프로그램이 기록된 컴퓨터 판독가능한 기록 매체 Expired - Fee Related KR101061926B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00334538 2005-11-18
JP2005334538 2005-11-18
JP2006216464A JP4758846B2 (ja) 2005-11-18 2006-08-09 乾燥装置、乾燥方法、及び乾燥プログラム、並びに、これらを有する基板処理装置、基板処理方法、及び基板処理プログラム
JPJP-P-2006-00216464 2006-08-09

Publications (2)

Publication Number Publication Date
KR20070053112A KR20070053112A (ko) 2007-05-23
KR101061926B1 true KR101061926B1 (ko) 2011-09-02

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KR1020060111687A Expired - Fee Related KR101061926B1 (ko) 2005-11-18 2006-11-13 건조 장치, 건조 방법, 기판 처리 장치, 기판 처리 방법,프로그램이 기록된 컴퓨터 판독가능한 기록 매체

Country Status (4)

Country Link
US (1) US7581335B2 (https=)
JP (1) JP4758846B2 (https=)
KR (1) KR101061926B1 (https=)
TW (1) TW200731386A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170122271A (ko) * 2015-03-10 2017-11-03 엠이아이, 엘엘씨 웨이퍼 건조기 장치 및 방법
KR200486679Y1 (ko) * 2011-11-29 2018-07-20 레나 게엠베하 기판의 건조 장치

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JP4758846B2 (ja) * 2005-11-18 2011-08-31 東京エレクトロン株式会社 乾燥装置、乾燥方法、及び乾燥プログラム、並びに、これらを有する基板処理装置、基板処理方法、及び基板処理プログラム
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JP4805862B2 (ja) * 2007-02-21 2011-11-02 富士通セミコンダクター株式会社 基板処理装置、基板処理方法、及び半導体装置の製造方法
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JP5122371B2 (ja) * 2008-05-26 2013-01-16 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラムならびに記憶媒体
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JP5522028B2 (ja) * 2010-03-09 2014-06-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
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KR101430750B1 (ko) * 2012-04-30 2014-08-14 세메스 주식회사 기판 처리 장치 및 이의 처리 유체 공급 방법
JP6454470B2 (ja) * 2013-03-14 2019-01-16 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
JP6430870B2 (ja) * 2015-03-20 2018-11-28 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
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CN205561438U (zh) * 2016-03-23 2016-09-07 常州捷佳创精密机械有限公司 一种槽式烘干结构
US10656525B2 (en) * 2017-09-01 2020-05-19 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Photoresist baking apparatus
US10890377B2 (en) * 2018-05-01 2021-01-12 Rochester Institute Of Technology Volcano-shaped enhancement features for enhanced pool boiling
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TWI792146B (zh) * 2021-01-07 2023-02-11 弘塑科技股份有限公司 晶圓浸泡清洗裝置
CN118009647B (zh) * 2024-04-09 2024-06-07 常州比太科技有限公司 一种硅片生产烘干装置及其烘干方法

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KR200486679Y1 (ko) * 2011-11-29 2018-07-20 레나 게엠베하 기판의 건조 장치
KR20170122271A (ko) * 2015-03-10 2017-11-03 엠이아이, 엘엘씨 웨이퍼 건조기 장치 및 방법
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Publication number Publication date
JP4758846B2 (ja) 2011-08-31
US7581335B2 (en) 2009-09-01
TWI361455B (https=) 2012-04-01
KR20070053112A (ko) 2007-05-23
US20070113423A1 (en) 2007-05-24
TW200731386A (en) 2007-08-16
JP2007165833A (ja) 2007-06-28

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