TWI335637B - - Google Patents

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Publication number
TWI335637B
TWI335637B TW096109923A TW96109923A TWI335637B TW I335637 B TWI335637 B TW I335637B TW 096109923 A TW096109923 A TW 096109923A TW 96109923 A TW96109923 A TW 96109923A TW I335637 B TWI335637 B TW I335637B
Authority
TW
Taiwan
Prior art keywords
substrate
support
shielding
substrates
wafer
Prior art date
Application number
TW096109923A
Other languages
English (en)
Chinese (zh)
Other versions
TW200805558A (en
Inventor
Fumihiro Kamimura
Osamu Tsuda
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200805558A publication Critical patent/TW200805558A/zh
Application granted granted Critical
Publication of TWI335637B publication Critical patent/TWI335637B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H10P72/135—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterised by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H10P72/155—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterised by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW096109923A 2006-03-23 2007-03-22 Substrate support, substrate processing unit and substrate supporting method TW200805558A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006079955 2006-03-23

Publications (2)

Publication Number Publication Date
TW200805558A TW200805558A (en) 2008-01-16
TWI335637B true TWI335637B (https=) 2011-01-01

Family

ID=38522505

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109923A TW200805558A (en) 2006-03-23 2007-03-22 Substrate support, substrate processing unit and substrate supporting method

Country Status (2)

Country Link
TW (1) TW200805558A (https=)
WO (1) WO2007108477A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077500A (ja) * 1998-09-03 2000-03-14 Toho Kasei Kk 基板処理装置
JP2000100910A (ja) * 1998-09-24 2000-04-07 Dainippon Screen Mfg Co Ltd 基板リフター
US6845779B2 (en) * 2001-11-13 2005-01-25 Fsi International, Inc. Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
JP2003174075A (ja) * 2001-12-05 2003-06-20 Semi Techno:Kk 基板のピッチ変換装置

Also Published As

Publication number Publication date
WO2007108477A1 (ja) 2007-09-27
TW200805558A (en) 2008-01-16

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