KR101028598B1 - 레이저 조사 장치 - Google Patents

레이저 조사 장치 Download PDF

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Publication number
KR101028598B1
KR101028598B1 KR1020087023807A KR20087023807A KR101028598B1 KR 101028598 B1 KR101028598 B1 KR 101028598B1 KR 1020087023807 A KR1020087023807 A KR 1020087023807A KR 20087023807 A KR20087023807 A KR 20087023807A KR 101028598 B1 KR101028598 B1 KR 101028598B1
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KR
South Korea
Prior art keywords
laser beam
laser
axis direction
strip
irradiation area
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KR1020087023807A
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English (en)
Korean (ko)
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KR20080109788A (ko
Inventor
료타로 도가시
도시오 이나미
준이치 시다
히데아키 구사마
나오유키 고바야시
Original Assignee
더 재팬 스틸 워크스 엘티디
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Publication of KR20080109788A publication Critical patent/KR20080109788A/ko
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Publication of KR101028598B1 publication Critical patent/KR101028598B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Recrystallisation Techniques (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Semiconductor Lasers (AREA)
KR1020087023807A 2006-03-30 2007-02-13 레이저 조사 장치 Active KR101028598B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00094484 2006-03-30
JP2006094484A JP4549996B2 (ja) 2006-03-30 2006-03-30 レーザ照射装置

Publications (2)

Publication Number Publication Date
KR20080109788A KR20080109788A (ko) 2008-12-17
KR101028598B1 true KR101028598B1 (ko) 2011-04-11

Family

ID=38580878

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087023807A Active KR101028598B1 (ko) 2006-03-30 2007-02-13 레이저 조사 장치

Country Status (5)

Country Link
JP (1) JP4549996B2 (enExample)
KR (1) KR101028598B1 (enExample)
DE (1) DE112007000735T5 (enExample)
TW (1) TW200737352A (enExample)
WO (1) WO2007116576A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140083026A (ko) * 2011-10-27 2014-07-03 어플라이드 머티어리얼스, 인코포레이티드 박막 태양 전지를 위한 레이저 결정화 및 다결정 효율 개선
KR101881423B1 (ko) 2011-11-24 2018-07-25 삼성디스플레이 주식회사 결정화 장치, 결정화 방법 및 유기 발광 표시 장치의 제조 방법
KR101997095B1 (ko) * 2016-07-22 2019-07-08 전자부품연구원 수평 분해능 및 영상획득 프레임이 제어되는 스캐닝 라이다
CN113169502B (zh) * 2019-01-23 2023-09-08 极光先进雷射株式会社 激光加工装置和被加工物的加工方法
JP2023011329A (ja) * 2021-07-12 2023-01-24 住友重機械工業株式会社 アニール装置の制御装置、アニール装置、及びアニール方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52143755A (en) 1976-05-26 1977-11-30 Hitachi Ltd Laser, zone melting device
JPH09260684A (ja) * 1996-01-17 1997-10-03 Toshiba Corp 液晶表示装置の製造方法
JP2004349415A (ja) 2003-05-21 2004-12-09 Hitachi Ltd アクティブ・マトリクス基板の製造方法およびこれを用いた画像表示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0410216A (ja) 1990-04-26 1992-01-14 Fuji Photo Film Co Ltd 磁気記録媒体及びその製造方法
WO2004042806A1 (ja) * 2002-11-05 2004-05-21 Sony Corporation 光照射装置及び光照射方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52143755A (en) 1976-05-26 1977-11-30 Hitachi Ltd Laser, zone melting device
JPH09260684A (ja) * 1996-01-17 1997-10-03 Toshiba Corp 液晶表示装置の製造方法
JP2004349415A (ja) 2003-05-21 2004-12-09 Hitachi Ltd アクティブ・マトリクス基板の製造方法およびこれを用いた画像表示装置

Also Published As

Publication number Publication date
TWI380369B (enExample) 2012-12-21
KR20080109788A (ko) 2008-12-17
JP2007273539A (ja) 2007-10-18
TW200737352A (en) 2007-10-01
WO2007116576A1 (ja) 2007-10-18
JP4549996B2 (ja) 2010-09-22
DE112007000735T5 (de) 2009-01-22

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