KR101020396B1 - 프로브 장치 및 프로빙 방법 - Google Patents

프로브 장치 및 프로빙 방법 Download PDF

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Publication number
KR101020396B1
KR101020396B1 KR1020080094007A KR20080094007A KR101020396B1 KR 101020396 B1 KR101020396 B1 KR 101020396B1 KR 1020080094007 A KR1020080094007 A KR 1020080094007A KR 20080094007 A KR20080094007 A KR 20080094007A KR 101020396 B1 KR101020396 B1 KR 101020396B1
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KR
South Korea
Prior art keywords
wafer
imaging
imaging means
probe
mounting table
Prior art date
Application number
KR1020080094007A
Other languages
English (en)
Korean (ko)
Other versions
KR20090033036A (ko
Inventor
야스히토 야마모토
가즈히로 오자와
후미토 가가미
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090033036A publication Critical patent/KR20090033036A/ko
Application granted granted Critical
Publication of KR101020396B1 publication Critical patent/KR101020396B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020080094007A 2007-09-28 2008-09-25 프로브 장치 및 프로빙 방법 KR101020396B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00256804 2007-09-28
JP2007256804 2007-09-28
JP2008092934A JP5120027B2 (ja) 2007-09-28 2008-03-31 プローブ装置及びプロービング方法
JPJP-P-2008-00092934 2008-03-31

Publications (2)

Publication Number Publication Date
KR20090033036A KR20090033036A (ko) 2009-04-01
KR101020396B1 true KR101020396B1 (ko) 2011-03-08

Family

ID=40537857

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080094007A KR101020396B1 (ko) 2007-09-28 2008-09-25 프로브 장치 및 프로빙 방법

Country Status (4)

Country Link
JP (1) JP5120027B2 (zh)
KR (1) KR101020396B1 (zh)
CN (1) CN101403785B (zh)
TW (1) TWI442494B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4949454B2 (ja) * 2009-11-17 2012-06-06 東京エレクトロン株式会社 プローブ装置
JP2013024829A (ja) * 2011-07-26 2013-02-04 Seiko Epson Corp 電子部品搬送装置及び電子部品搬送方法
JP2014135363A (ja) * 2013-01-09 2014-07-24 Tokyo Electron Ltd プローブ装置及びウエハ搬送ユニット
JP6220596B2 (ja) * 2013-08-01 2017-10-25 東京エレクトロン株式会社 プローバ
JP6084140B2 (ja) * 2013-09-06 2017-02-22 ヤマハファインテック株式会社 電気検査装置
US11159784B2 (en) * 2014-10-23 2021-10-26 Cognex Corporation System and method for calibrating a vision system with respect to a touch probe
JP6999321B2 (ja) * 2017-07-31 2022-01-18 東京エレクトロン株式会社 検査装置、検査方法及び記憶媒体
TWI794324B (zh) * 2017-11-24 2023-03-01 日商日本電產理德股份有限公司 基板檢查裝置、檢查位置補正方法、位置補正資訊產生方法、以及位置補正資訊產生系統
CN114308709A (zh) * 2021-12-28 2022-04-12 傲普(上海)新能源有限公司 一种电芯极片叠片对位检测方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151555A (ja) 2000-11-09 2002-05-24 Tokyo Electron Ltd 位置合わせ方法
JP2004063877A (ja) 2002-07-30 2004-02-26 Tokyo Seimitsu Co Ltd ウェハの位置決め修正方法
KR20050024922A (ko) * 2003-09-05 2005-03-11 김광렬 웨이퍼의 결함 검사장치 및 그 방법
JP2006234510A (ja) 2005-02-23 2006-09-07 Oht Inc 検査装置及び検査方法並びに位置決め方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3306972B2 (ja) * 1993-02-26 2002-07-24 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH0915302A (ja) * 1995-06-30 1997-01-17 Olympus Optical Co Ltd 回路基板検査機の位置決め装置および位置決め方法
JP3303968B2 (ja) * 1998-02-19 2002-07-22 東京エレクトロン株式会社 ウエハと接触子の位置合わせ装置
JP2003152037A (ja) * 2001-11-12 2003-05-23 Moritex Corp ウェハ検査方法、検査装置及び検査用赤外線撮像装置
JP2004140084A (ja) * 2002-10-16 2004-05-13 Sharp Corp 半導体チップのピックアップ方法およびそのピックアップ装置
JP2005223251A (ja) * 2004-02-09 2005-08-18 Seiko Epson Corp 半導体装置の検査方法及びその検査装置、並びにその検査装置の制御プログラム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151555A (ja) 2000-11-09 2002-05-24 Tokyo Electron Ltd 位置合わせ方法
JP2004063877A (ja) 2002-07-30 2004-02-26 Tokyo Seimitsu Co Ltd ウェハの位置決め修正方法
KR20050024922A (ko) * 2003-09-05 2005-03-11 김광렬 웨이퍼의 결함 검사장치 및 그 방법
JP2006234510A (ja) 2005-02-23 2006-09-07 Oht Inc 検査装置及び検査方法並びに位置決め方法

Also Published As

Publication number Publication date
KR20090033036A (ko) 2009-04-01
TWI442494B (zh) 2014-06-21
CN101403785A (zh) 2009-04-08
CN101403785B (zh) 2012-01-11
JP5120027B2 (ja) 2013-01-16
JP2009099937A (ja) 2009-05-07
TW200931556A (en) 2009-07-16

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