KR101020396B1 - 프로브 장치 및 프로빙 방법 - Google Patents

프로브 장치 및 프로빙 방법 Download PDF

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Publication number
KR101020396B1
KR101020396B1 KR1020080094007A KR20080094007A KR101020396B1 KR 101020396 B1 KR101020396 B1 KR 101020396B1 KR 1020080094007 A KR1020080094007 A KR 1020080094007A KR 20080094007 A KR20080094007 A KR 20080094007A KR 101020396 B1 KR101020396 B1 KR 101020396B1
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South Korea
Prior art keywords
wafer
imaging
imaging means
probe
mounting table
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Korean (ko)
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KR20090033036A (ko
Inventor
야스히토 야마모토
가즈히로 오자와
후미토 가가미
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도쿄엘렉트론가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020080094007A 2007-09-28 2008-09-25 프로브 장치 및 프로빙 방법 Active KR101020396B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00256804 2007-09-28
JP2007256804 2007-09-28
JP2008092934A JP5120027B2 (ja) 2007-09-28 2008-03-31 プローブ装置及びプロービング方法
JPJP-P-2008-00092934 2008-03-31

Publications (2)

Publication Number Publication Date
KR20090033036A KR20090033036A (ko) 2009-04-01
KR101020396B1 true KR101020396B1 (ko) 2011-03-08

Family

ID=40537857

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080094007A Active KR101020396B1 (ko) 2007-09-28 2008-09-25 프로브 장치 및 프로빙 방법

Country Status (4)

Country Link
JP (1) JP5120027B2 (enExample)
KR (1) KR101020396B1 (enExample)
CN (1) CN101403785B (enExample)
TW (1) TWI442494B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4949454B2 (ja) * 2009-11-17 2012-06-06 東京エレクトロン株式会社 プローブ装置
JP2013024829A (ja) * 2011-07-26 2013-02-04 Seiko Epson Corp 電子部品搬送装置及び電子部品搬送方法
JP2014135363A (ja) * 2013-01-09 2014-07-24 Tokyo Electron Ltd プローブ装置及びウエハ搬送ユニット
JP6220596B2 (ja) * 2013-08-01 2017-10-25 東京エレクトロン株式会社 プローバ
JP6084140B2 (ja) * 2013-09-06 2017-02-22 ヤマハファインテック株式会社 電気検査装置
US11159784B2 (en) * 2014-10-23 2021-10-26 Cognex Corporation System and method for calibrating a vision system with respect to a touch probe
JP6999321B2 (ja) * 2017-07-31 2022-01-18 東京エレクトロン株式会社 検査装置、検査方法及び記憶媒体
TWI794324B (zh) * 2017-11-24 2023-03-01 日商日本電產理德股份有限公司 基板檢查裝置、檢查位置補正方法、位置補正資訊產生方法、以及位置補正資訊產生系統
CN112798933B (zh) * 2021-01-28 2025-01-17 长春光华微电子设备工程中心有限公司 一种晶圆自动对针装置及方法
JP7638723B2 (ja) * 2021-02-18 2025-03-04 東京エレクトロン株式会社 検査装置のセットアップ方法及び検査装置
CN114308709A (zh) * 2021-12-28 2022-04-12 傲普(上海)新能源有限公司 一种电芯极片叠片对位检测方法
TWI861896B (zh) * 2023-05-24 2024-11-11 旺矽科技股份有限公司 探針座位置調整方法及使用該方法之可換探針座之測試機

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151555A (ja) 2000-11-09 2002-05-24 Tokyo Electron Ltd 位置合わせ方法
JP2004063877A (ja) 2002-07-30 2004-02-26 Tokyo Seimitsu Co Ltd ウェハの位置決め修正方法
KR20050024922A (ko) * 2003-09-05 2005-03-11 김광렬 웨이퍼의 결함 검사장치 및 그 방법
JP2006234510A (ja) 2005-02-23 2006-09-07 Oht Inc 検査装置及び検査方法並びに位置決め方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3306972B2 (ja) * 1993-02-26 2002-07-24 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH0915302A (ja) * 1995-06-30 1997-01-17 Olympus Optical Co Ltd 回路基板検査機の位置決め装置および位置決め方法
JP3303968B2 (ja) * 1998-02-19 2002-07-22 東京エレクトロン株式会社 ウエハと接触子の位置合わせ装置
JP2003152037A (ja) * 2001-11-12 2003-05-23 Moritex Corp ウェハ検査方法、検査装置及び検査用赤外線撮像装置
JP2004140084A (ja) * 2002-10-16 2004-05-13 Sharp Corp 半導体チップのピックアップ方法およびそのピックアップ装置
JP2005223251A (ja) * 2004-02-09 2005-08-18 Seiko Epson Corp 半導体装置の検査方法及びその検査装置、並びにその検査装置の制御プログラム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151555A (ja) 2000-11-09 2002-05-24 Tokyo Electron Ltd 位置合わせ方法
JP2004063877A (ja) 2002-07-30 2004-02-26 Tokyo Seimitsu Co Ltd ウェハの位置決め修正方法
KR20050024922A (ko) * 2003-09-05 2005-03-11 김광렬 웨이퍼의 결함 검사장치 및 그 방법
JP2006234510A (ja) 2005-02-23 2006-09-07 Oht Inc 検査装置及び検査方法並びに位置決め方法

Also Published As

Publication number Publication date
JP5120027B2 (ja) 2013-01-16
TWI442494B (zh) 2014-06-21
KR20090033036A (ko) 2009-04-01
TW200931556A (en) 2009-07-16
JP2009099937A (ja) 2009-05-07
CN101403785B (zh) 2012-01-11
CN101403785A (zh) 2009-04-08

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