JP5120027B2 - プローブ装置及びプロービング方法 - Google Patents

プローブ装置及びプロービング方法 Download PDF

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Publication number
JP5120027B2
JP5120027B2 JP2008092934A JP2008092934A JP5120027B2 JP 5120027 B2 JP5120027 B2 JP 5120027B2 JP 2008092934 A JP2008092934 A JP 2008092934A JP 2008092934 A JP2008092934 A JP 2008092934A JP 5120027 B2 JP5120027 B2 JP 5120027B2
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JP
Japan
Prior art keywords
wafer
imaging
mounting table
probe
imaging means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008092934A
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English (en)
Japanese (ja)
Other versions
JP2009099937A5 (enExample
JP2009099937A (ja
Inventor
保人 山本
和博 小沢
史 加賀美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008092934A priority Critical patent/JP5120027B2/ja
Priority to US12/237,920 priority patent/US7724007B2/en
Priority to KR1020080094007A priority patent/KR101020396B1/ko
Priority to TW097137038A priority patent/TWI442494B/zh
Priority to CN2008101695407A priority patent/CN101403785B/zh
Publication of JP2009099937A publication Critical patent/JP2009099937A/ja
Publication of JP2009099937A5 publication Critical patent/JP2009099937A5/ja
Application granted granted Critical
Publication of JP5120027B2 publication Critical patent/JP5120027B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2008092934A 2007-09-28 2008-03-31 プローブ装置及びプロービング方法 Expired - Fee Related JP5120027B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008092934A JP5120027B2 (ja) 2007-09-28 2008-03-31 プローブ装置及びプロービング方法
US12/237,920 US7724007B2 (en) 2007-09-28 2008-09-25 Probe apparatus and probing method
KR1020080094007A KR101020396B1 (ko) 2007-09-28 2008-09-25 프로브 장치 및 프로빙 방법
TW097137038A TWI442494B (zh) 2007-09-28 2008-09-26 Probe device and detection method
CN2008101695407A CN101403785B (zh) 2007-09-28 2008-09-28 探测装置以及探测方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007256804 2007-09-28
JP2007256804 2007-09-28
JP2008092934A JP5120027B2 (ja) 2007-09-28 2008-03-31 プローブ装置及びプロービング方法

Publications (3)

Publication Number Publication Date
JP2009099937A JP2009099937A (ja) 2009-05-07
JP2009099937A5 JP2009099937A5 (enExample) 2011-06-30
JP5120027B2 true JP5120027B2 (ja) 2013-01-16

Family

ID=40537857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008092934A Expired - Fee Related JP5120027B2 (ja) 2007-09-28 2008-03-31 プローブ装置及びプロービング方法

Country Status (4)

Country Link
JP (1) JP5120027B2 (enExample)
KR (1) KR101020396B1 (enExample)
CN (1) CN101403785B (enExample)
TW (1) TWI442494B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4949454B2 (ja) * 2009-11-17 2012-06-06 東京エレクトロン株式会社 プローブ装置
JP2013024829A (ja) * 2011-07-26 2013-02-04 Seiko Epson Corp 電子部品搬送装置及び電子部品搬送方法
JP2014135363A (ja) * 2013-01-09 2014-07-24 Tokyo Electron Ltd プローブ装置及びウエハ搬送ユニット
JP6220596B2 (ja) * 2013-08-01 2017-10-25 東京エレクトロン株式会社 プローバ
JP6084140B2 (ja) * 2013-09-06 2017-02-22 ヤマハファインテック株式会社 電気検査装置
US11159784B2 (en) * 2014-10-23 2021-10-26 Cognex Corporation System and method for calibrating a vision system with respect to a touch probe
JP6999321B2 (ja) * 2017-07-31 2022-01-18 東京エレクトロン株式会社 検査装置、検査方法及び記憶媒体
TWI794324B (zh) * 2017-11-24 2023-03-01 日商日本電產理德股份有限公司 基板檢查裝置、檢查位置補正方法、位置補正資訊產生方法、以及位置補正資訊產生系統
CN112798933B (zh) * 2021-01-28 2025-01-17 长春光华微电子设备工程中心有限公司 一种晶圆自动对针装置及方法
JP7638723B2 (ja) * 2021-02-18 2025-03-04 東京エレクトロン株式会社 検査装置のセットアップ方法及び検査装置
CN114308709A (zh) * 2021-12-28 2022-04-12 傲普(上海)新能源有限公司 一种电芯极片叠片对位检测方法
TWI861896B (zh) * 2023-05-24 2024-11-11 旺矽科技股份有限公司 探針座位置調整方法及使用該方法之可換探針座之測試機

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3306972B2 (ja) * 1993-02-26 2002-07-24 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH0915302A (ja) * 1995-06-30 1997-01-17 Olympus Optical Co Ltd 回路基板検査機の位置決め装置および位置決め方法
JP3303968B2 (ja) * 1998-02-19 2002-07-22 東京エレクトロン株式会社 ウエハと接触子の位置合わせ装置
JP4740405B2 (ja) 2000-11-09 2011-08-03 東京エレクトロン株式会社 位置合わせ方法及びプログラム記録媒体
JP2003152037A (ja) * 2001-11-12 2003-05-23 Moritex Corp ウェハ検査方法、検査装置及び検査用赤外線撮像装置
JP2004063877A (ja) 2002-07-30 2004-02-26 Tokyo Seimitsu Co Ltd ウェハの位置決め修正方法
JP2004140084A (ja) * 2002-10-16 2004-05-13 Sharp Corp 半導体チップのピックアップ方法およびそのピックアップ装置
KR20050024922A (ko) * 2003-09-05 2005-03-11 김광렬 웨이퍼의 결함 검사장치 및 그 방법
JP2005223251A (ja) * 2004-02-09 2005-08-18 Seiko Epson Corp 半導体装置の検査方法及びその検査装置、並びにその検査装置の制御プログラム
JP4799880B2 (ja) 2005-02-23 2011-10-26 オー・エイチ・ティー株式会社 検査装置及び検査方法並びに位置決め方法

Also Published As

Publication number Publication date
TWI442494B (zh) 2014-06-21
KR20090033036A (ko) 2009-04-01
KR101020396B1 (ko) 2011-03-08
TW200931556A (en) 2009-07-16
JP2009099937A (ja) 2009-05-07
CN101403785B (zh) 2012-01-11
CN101403785A (zh) 2009-04-08

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