KR101011425B1 - 폴리싱 상태 모니터링 장치와 폴리싱 장치 및 방법 - Google Patents

폴리싱 상태 모니터링 장치와 폴리싱 장치 및 방법 Download PDF

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KR101011425B1
KR101011425B1 KR1020057004531A KR20057004531A KR101011425B1 KR 101011425 B1 KR101011425 B1 KR 101011425B1 KR 1020057004531 A KR1020057004531 A KR 1020057004531A KR 20057004531 A KR20057004531 A KR 20057004531A KR 101011425 B1 KR101011425 B1 KR 101011425B1
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South Korea
Prior art keywords
light
polishing
workpiece
spectral data
unit
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Korean (ko)
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KR20050050106A (ko
Inventor
요이치 고바야시
šœ스케 나카이
히토시 츠지
야스오 츠쿠다
준키 이시모토
가즈나리 신야
Original Assignee
가부시키가이샤 시마즈세이사꾸쇼
가부시키가이샤 에바라 세이사꾸쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020057004531A 2002-10-17 2003-10-15 폴리싱 상태 모니터링 장치와 폴리싱 장치 및 방법 Expired - Lifetime KR101011425B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002303628 2002-10-17
JPJP-P-2002-00303628 2002-10-17
JPJP-P-2003-00321639 2003-09-12
JP2003321639A JP4542324B2 (ja) 2002-10-17 2003-09-12 研磨状態監視装置及びポリッシング装置

Publications (2)

Publication Number Publication Date
KR20050050106A KR20050050106A (ko) 2005-05-27
KR101011425B1 true KR101011425B1 (ko) 2011-01-28

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KR1020057004531A Expired - Lifetime KR101011425B1 (ko) 2002-10-17 2003-10-15 폴리싱 상태 모니터링 장치와 폴리싱 장치 및 방법

Country Status (6)

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US (4) US7252575B2 (https=)
EP (1) EP1551593B1 (https=)
JP (1) JP4542324B2 (https=)
KR (1) KR101011425B1 (https=)
TW (1) TWI336279B (https=)
WO (1) WO2004035265A1 (https=)

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KR20020053771A (ko) * 2000-12-27 2002-07-05 오쯔보 히데오 웨이퍼 연마장치의 연마 종점 검출방법 및 장치

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US20100075576A1 (en) 2010-03-25
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US7252575B2 (en) 2007-08-07
US7438627B2 (en) 2008-10-21
US20090011680A1 (en) 2009-01-08
US7645181B2 (en) 2010-01-12
KR20050050106A (ko) 2005-05-27
JP2004154928A (ja) 2004-06-03
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