KR100991339B1 - 중간배치형 영역을 구비한 스페이서 마스크를 이용하여빈도수를 3배로 증대시키는 방법 - Google Patents

중간배치형 영역을 구비한 스페이서 마스크를 이용하여빈도수를 3배로 증대시키는 방법 Download PDF

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KR100991339B1
KR100991339B1 KR1020080050414A KR20080050414A KR100991339B1 KR 100991339 B1 KR100991339 B1 KR 100991339B1 KR 1020080050414 A KR1020080050414 A KR 1020080050414A KR 20080050414 A KR20080050414 A KR 20080050414A KR 100991339 B1 KR100991339 B1 KR 100991339B1
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South Korea
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mask
spacer
layer
lines
sacrificial
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KR1020080050414A
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English (en)
Korean (ko)
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KR20080106070A (ko
Inventor
크리스토퍼 디. 벤체어
케이지 호리오카
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/405—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their composition, e.g. multilayer masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
    • H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/947—Subphotolithographic processing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/95—Multilayer mask including nonradiation sensitive layer

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Weting (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020080050414A 2007-06-01 2008-05-29 중간배치형 영역을 구비한 스페이서 마스크를 이용하여빈도수를 3배로 증대시키는 방법 Expired - Fee Related KR100991339B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US93261807P 2007-06-01 2007-06-01
US60/932,618 2007-06-01
US11/875,205 US7846849B2 (en) 2007-06-01 2007-10-19 Frequency tripling using spacer mask having interposed regions
US11/875,205 2007-10-19

Publications (2)

Publication Number Publication Date
KR20080106070A KR20080106070A (ko) 2008-12-04
KR100991339B1 true KR100991339B1 (ko) 2010-11-01

Family

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KR1020080050414A Expired - Fee Related KR100991339B1 (ko) 2007-06-01 2008-05-29 중간배치형 영역을 구비한 스페이서 마스크를 이용하여빈도수를 3배로 증대시키는 방법

Country Status (7)

Country Link
US (1) US7846849B2 (https=)
EP (1) EP1998362A2 (https=)
JP (1) JP5236996B2 (https=)
KR (1) KR100991339B1 (https=)
CN (1) CN101315515B (https=)
SG (1) SG148135A1 (https=)
TW (1) TWI381424B (https=)

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US7807578B2 (en) * 2007-06-01 2010-10-05 Applied Materials, Inc. Frequency doubling using spacer mask
WO2009150870A1 (ja) * 2008-06-13 2009-12-17 東京エレクトロン株式会社 半導体装置の製造方法
US9953885B2 (en) * 2009-10-27 2018-04-24 Taiwan Semiconductor Manufacturing Company, Ltd. STI shape near fin bottom of Si fin in bulk FinFET
US7923305B1 (en) * 2010-01-12 2011-04-12 Sandisk 3D Llc Patterning method for high density pillar structures
US8865600B2 (en) * 2013-01-04 2014-10-21 Taiwan Semiconductor Manufacturing Company Limited Patterned line end space
US8828885B2 (en) 2013-01-04 2014-09-09 Taiwan Semiconductor Manufacturing Company Limited Photo resist trimmed line end space
CN104425223B (zh) * 2013-08-28 2017-11-03 中芯国际集成电路制造(上海)有限公司 图形化方法
US9070630B2 (en) * 2013-11-26 2015-06-30 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming patterns
US9524878B2 (en) * 2014-10-02 2016-12-20 Macronix International Co., Ltd. Line layout and method of spacer self-aligned quadruple patterning for the same
CN105590894B (zh) * 2014-11-12 2018-12-25 旺宏电子股份有限公司 线路布局以及线路布局的间隙壁自对准四重图案化的方法
CN107785247A (zh) * 2016-08-24 2018-03-09 中芯国际集成电路制造(上海)有限公司 金属栅极及半导体器件的制造方法
US10566194B2 (en) 2018-05-07 2020-02-18 Lam Research Corporation Selective deposition of etch-stop layer for enhanced patterning
US10811256B2 (en) * 2018-10-16 2020-10-20 Asm Ip Holding B.V. Method for etching a carbon-containing feature
WO2020209939A1 (en) * 2019-04-08 2020-10-15 Applied Materials, Inc. Methods for modifying photoresist profiles and tuning critical dimensions
CN112309838B (zh) * 2019-07-31 2023-07-28 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法
US12068168B2 (en) * 2022-02-17 2024-08-20 Taiwan Semiconductor Manufacturing Co., Ltd. Processes for reducing line-end spacing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060046484A1 (en) * 2004-09-02 2006-03-02 Abatchev Mirzafer K Method for integrated circuit fabrication using pitch multiplication

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Publication number Priority date Publication date Assignee Title
US5328810A (en) * 1990-05-07 1994-07-12 Micron Technology, Inc. Method for reducing, by a factor or 2-N, the minimum masking pitch of a photolithographic process
KR100354440B1 (ko) * 2000-12-04 2002-09-28 삼성전자 주식회사 반도체 장치의 패턴 형성 방법
JP4235404B2 (ja) * 2002-06-12 2009-03-11 キヤノン株式会社 マスクの製造方法
US6924191B2 (en) * 2002-06-20 2005-08-02 Applied Materials, Inc. Method for fabricating a gate structure of a field effect transistor
JP2004207385A (ja) * 2002-12-24 2004-07-22 Rohm Co Ltd マスク、その製造方法およびこれを用いた半導体装置の製造方法
DE10345455A1 (de) * 2003-09-30 2005-05-04 Infineon Technologies Ag Verfahren zum Erzeugen einer Hartmaske und Hartmasken-Anordnung
JP2005203672A (ja) * 2004-01-19 2005-07-28 Sony Corp 半導体装置の製造方法
US7064078B2 (en) * 2004-01-30 2006-06-20 Applied Materials Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme
CN1832109A (zh) * 2005-03-08 2006-09-13 联华电子股份有限公司 掩模的制造方法与图案化制造方法
US7253118B2 (en) * 2005-03-15 2007-08-07 Micron Technology, Inc. Pitch reduced patterns relative to photolithography features
KR100674970B1 (ko) * 2005-04-21 2007-01-26 삼성전자주식회사 이중 스페이서들을 이용한 미세 피치의 패턴 형성 방법
US7560390B2 (en) * 2005-06-02 2009-07-14 Micron Technology, Inc. Multiple spacer steps for pitch multiplication
KR100752674B1 (ko) * 2006-10-17 2007-08-29 삼성전자주식회사 미세 피치의 하드마스크 패턴 형성 방법 및 이를 이용한반도체 소자의 미세 패턴 형성 방법

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US20060046484A1 (en) * 2004-09-02 2006-03-02 Abatchev Mirzafer K Method for integrated circuit fabrication using pitch multiplication

Also Published As

Publication number Publication date
JP5236996B2 (ja) 2013-07-17
TW200910419A (en) 2009-03-01
KR20080106070A (ko) 2008-12-04
SG148135A1 (en) 2008-12-31
EP1998362A2 (en) 2008-12-03
US20080299465A1 (en) 2008-12-04
JP2009027146A (ja) 2009-02-05
TWI381424B (zh) 2013-01-01
US7846849B2 (en) 2010-12-07
CN101315515A (zh) 2008-12-03
CN101315515B (zh) 2013-03-27

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