KR100988690B1 - 반도체 기억 장치 - Google Patents

반도체 기억 장치 Download PDF

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Publication number
KR100988690B1
KR100988690B1 KR1020030053000A KR20030053000A KR100988690B1 KR 100988690 B1 KR100988690 B1 KR 100988690B1 KR 1020030053000 A KR1020030053000 A KR 1020030053000A KR 20030053000 A KR20030053000 A KR 20030053000A KR 100988690 B1 KR100988690 B1 KR 100988690B1
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South Korea
Prior art keywords
misfet
film
misfets
gate
vertical
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Expired - Fee Related
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KR1020030053000A
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English (en)
Korean (ko)
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KR20040012564A (ko
Inventor
짜끼하라기라꾸
오꾸야마고우스께
모니와마사히로
미즈노마꼬또
오까모또게이지
노구찌미쯔히로
요시다다다노리
다까하시야스히꼬
니시다아끼오
Original Assignee
가부시키가이샤 히타치초엘에스아이시스템즈
가부시키가이샤 히타치세이사쿠쇼
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Publication of KR20040012564A publication Critical patent/KR20040012564A/ko
Application granted granted Critical
Publication of KR100988690B1 publication Critical patent/KR100988690B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H10B10/18—Peripheral circuit regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6728—Vertical TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0195—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices the components including vertical IGFETs

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  • Semiconductor Memories (AREA)
KR1020030053000A 2002-07-31 2003-07-31 반도체 기억 장치 Expired - Fee Related KR100988690B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00224254 2002-07-31
JP2002224254 2002-07-31
JPJP-P-2003-00097210 2003-03-31
JP2003097210A JP4343571B2 (ja) 2002-07-31 2003-03-31 半導体装置の製造方法

Related Child Applications (1)

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KR1020100051380A Division KR100979879B1 (ko) 2002-07-31 2010-05-31 반도체 장치 제조 방법

Publications (2)

Publication Number Publication Date
KR20040012564A KR20040012564A (ko) 2004-02-11
KR100988690B1 true KR100988690B1 (ko) 2010-10-18

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KR1020030053000A Expired - Fee Related KR100988690B1 (ko) 2002-07-31 2003-07-31 반도체 기억 장치
KR1020100051380A Expired - Fee Related KR100979879B1 (ko) 2002-07-31 2010-05-31 반도체 장치 제조 방법

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US (6) US7190031B2 (enExample)
JP (1) JP4343571B2 (enExample)
KR (2) KR100988690B1 (enExample)
TW (1) TWI308793B (enExample)

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JP2004356469A (ja) * 2003-05-30 2004-12-16 Renesas Technology Corp 半導体集積回路装置の製造方法
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KR100587692B1 (ko) * 2004-11-05 2006-06-08 삼성전자주식회사 반도체 메모리 장치에서의 회로 배선 배치구조와 그에따른 배치방법
KR100781033B1 (ko) * 2005-05-12 2007-11-29 주식회사 하이닉스반도체 반도체 소자의 제조방법
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US20090140342A1 (en) 2009-06-04
US7190031B2 (en) 2007-03-13
JP2004128448A (ja) 2004-04-22
US7495289B2 (en) 2009-02-24
KR20040012564A (ko) 2004-02-11
US20060208319A1 (en) 2006-09-21
US20040043550A1 (en) 2004-03-04
KR20100080882A (ko) 2010-07-13
TW200409343A (en) 2004-06-01
JP4343571B2 (ja) 2009-10-14
US7701020B2 (en) 2010-04-20
KR100979879B1 (ko) 2010-09-02
US7161215B2 (en) 2007-01-09
US20110230041A1 (en) 2011-09-22
TWI308793B (en) 2009-04-11
US20060202286A1 (en) 2006-09-14
US8476138B2 (en) 2013-07-02
US20100136778A1 (en) 2010-06-03
US7972920B2 (en) 2011-07-05

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