KR100983219B1 - 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판 - Google Patents

직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판 Download PDF

Info

Publication number
KR100983219B1
KR100983219B1 KR1020080122951A KR20080122951A KR100983219B1 KR 100983219 B1 KR100983219 B1 KR 100983219B1 KR 1020080122951 A KR1020080122951 A KR 1020080122951A KR 20080122951 A KR20080122951 A KR 20080122951A KR 100983219 B1 KR100983219 B1 KR 100983219B1
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
substrate
printing
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020080122951A
Other languages
English (en)
Korean (ko)
Other versions
KR20100064494A (ko
Inventor
허순영
박성실
Original Assignee
조근호
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 조근호 filed Critical 조근호
Priority to KR1020080122951A priority Critical patent/KR100983219B1/ko
Priority to EP09011519A priority patent/EP2200410A1/en
Priority to JP2009224190A priority patent/JP2010135752A/ja
Priority to CN200910224596A priority patent/CN101754586A/zh
Priority to TW098139959A priority patent/TW201031307A/zh
Priority to US12/630,580 priority patent/US20100263917A1/en
Publication of KR20100064494A publication Critical patent/KR20100064494A/ko
Application granted granted Critical
Publication of KR100983219B1 publication Critical patent/KR100983219B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020080122951A 2008-12-05 2008-12-05 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판 Expired - Fee Related KR100983219B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020080122951A KR100983219B1 (ko) 2008-12-05 2008-12-05 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판
EP09011519A EP2200410A1 (en) 2008-12-05 2009-09-08 A preparing method for printed circuit boards by directing printing and printed circuit boards prepared by the method
JP2009224190A JP2010135752A (ja) 2008-12-05 2009-09-29 直接印刷によるプリント回路基板の作製方法及び該方法により作製したプリント回路基板
CN200910224596A CN101754586A (zh) 2008-12-05 2009-11-19 印刷电路板的制备方法及由该方法制备的印刷电路板
TW098139959A TW201031307A (en) 2008-12-05 2009-11-24 A preparing method for printed circuit boards by directing printing and printed circuit boards prepared by the method
US12/630,580 US20100263917A1 (en) 2008-12-05 2009-12-03 Preparing Method for Printed Circuit Boards by Directing Printing and Printed Circuit Boards Prepared by the Method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080122951A KR100983219B1 (ko) 2008-12-05 2008-12-05 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020100064202A Division KR101350490B1 (ko) 2010-07-05 2010-07-05 직접인쇄방법에 의하여 회로가 형성되는 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20100064494A KR20100064494A (ko) 2010-06-15
KR100983219B1 true KR100983219B1 (ko) 2010-09-20

Family

ID=41402403

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080122951A Expired - Fee Related KR100983219B1 (ko) 2008-12-05 2008-12-05 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판

Country Status (6)

Country Link
US (1) US20100263917A1 (enExample)
EP (1) EP2200410A1 (enExample)
JP (1) JP2010135752A (enExample)
KR (1) KR100983219B1 (enExample)
CN (1) CN101754586A (enExample)
TW (1) TW201031307A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8847908B2 (en) * 2010-04-22 2014-09-30 Sharp Kabushiki Kaisha Display device
CN102186305A (zh) * 2011-05-06 2011-09-14 沈李豪 印制线路板、多层印制线路板及其制造方法
TWI509882B (zh) * 2011-06-30 2015-11-21 Jieng Tai Internat Electric Corp 形成天線的方法
CN102303464A (zh) * 2011-07-04 2012-01-04 昆山兴协和光电科技有限公司 笔记型键盘线路板的全自动卷式印刷工艺及印刷组件
KR20130066929A (ko) 2011-12-13 2013-06-21 한국전자통신연구원 패턴 형성 조성물 및 이를 이용한 패턴 형성 방법
KR101713791B1 (ko) 2012-03-05 2017-03-08 엠파이어 테크놀로지 디벨롭먼트 엘엘씨 플렉서블 회로
DE102012221940B4 (de) * 2012-11-30 2022-05-12 Robert Bosch Gmbh Modul zur drahtlosen Kommunikation und Verfahren zum Herstellen eines Moduls zur drahtlosen Kommunikation
KR101489206B1 (ko) * 2013-03-27 2015-02-04 하이쎌(주) 도금층을 포함하는 양면 연성 인쇄회로기판 및 이의 제조방법
EP3134259B1 (en) * 2014-04-22 2018-11-28 SABIC Global Technologies B.V. Ultraviolet curable transfer coating for applying nanometer sized metal particles to polymer surface
US10227465B2 (en) 2014-08-07 2019-03-12 Sabic Global Technologies B.V. Conductive multilayer sheet for thermal forming applications
CN104527246B (zh) * 2014-12-23 2017-02-01 睿芯(大连)股份有限公司 一种含有rfid电子标签的彩色包装产品的凹版印刷方法
TWI574595B (zh) 2015-10-28 2017-03-11 財團法人工業技術研究院 多層線路的製作方法與多層線路結構
CN107474724B (zh) * 2016-06-07 2019-10-18 鹏鼎控股(深圳)股份有限公司 覆铜基板的制备方法
DE202017100537U1 (de) * 2017-02-01 2017-02-20 ASTRA Gesellschaft für Asset Management mbH & Co. KG Elektrischer Leiter
CN109548270A (zh) * 2018-11-09 2019-03-29 广东洲明节能科技有限公司 线路板及其制作方法
CN111613888B (zh) * 2020-06-02 2021-10-08 华中科技大学 一种多层互联立体电路的一体化共形制造方法
CN115241135A (zh) * 2021-04-23 2022-10-25 北京梦之墨科技有限公司 一种晶圆级封装结构及工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100734234B1 (ko) * 2006-05-29 2007-07-02 전자부품연구원 다층 인쇄회로기판 및 그 제조방법
KR100815251B1 (ko) 2006-10-17 2008-03-19 이종욱 인터페이스에프피씨비
KR20080066033A (ko) * 2005-10-12 2008-07-15 이 아이 듀폰 디 네모아 앤드 캄파니 폴리이미드 및 소수성 에폭시를 포함하는 조성물, 및 그와관련된 방법
KR20080082365A (ko) * 2007-03-08 2008-09-11 삼성전자주식회사 금속 코어를 사용한 ｐｃｂ, 그 제조방법 및 반도체 패키지제조방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04222889A (ja) * 1990-12-25 1992-08-12 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト
US5461202A (en) * 1992-10-05 1995-10-24 Matsushita Electric Industrial Co., Ltd. Flexible wiring board and its fabrication method
JP3341311B2 (ja) * 1992-10-05 2002-11-05 松下電器産業株式会社 フレキシブル配線板およびその製造方法
US5508228A (en) * 1994-02-14 1996-04-16 Microelectronics And Computer Technology Corporation Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
JP2928223B2 (ja) * 1997-04-04 1999-08-03 オクシデンタル ケミカル コーポレイション 集積回路チップのサーキットリーへの結合方法
JP3520031B2 (ja) * 1999-06-11 2004-04-19 株式会社日本触媒 ポリアミド酸含有微粒子分散組成物およびその製造方法
US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
US6576493B1 (en) * 2000-10-13 2003-06-10 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
JP3768104B2 (ja) * 2001-01-22 2006-04-19 ソニーケミカル株式会社 フレキシブルプリント基板
US7211205B2 (en) * 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
US20040178391A1 (en) * 2003-01-29 2004-09-16 Conaghan Brian F. High conductivity inks with low minimum curing temperatures
US7169330B2 (en) * 2004-02-25 2007-01-30 E. I. Du Pont De Nemours And Company Composition of conductive paste
EP1916098A1 (en) * 2005-08-19 2008-04-30 Asahi Kasei Kogyo Kabushiki Kaisha Laminate and process for producing the same
JP4291857B2 (ja) * 2007-01-24 2009-07-08 三ツ星ベルト株式会社 銅導体ペースト、導体回路板及び電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080066033A (ko) * 2005-10-12 2008-07-15 이 아이 듀폰 디 네모아 앤드 캄파니 폴리이미드 및 소수성 에폭시를 포함하는 조성물, 및 그와관련된 방법
KR100734234B1 (ko) * 2006-05-29 2007-07-02 전자부품연구원 다층 인쇄회로기판 및 그 제조방법
KR100815251B1 (ko) 2006-10-17 2008-03-19 이종욱 인터페이스에프피씨비
KR20080082365A (ko) * 2007-03-08 2008-09-11 삼성전자주식회사 금속 코어를 사용한 ｐｃｂ, 그 제조방법 및 반도체 패키지제조방법

Also Published As

Publication number Publication date
KR20100064494A (ko) 2010-06-15
EP2200410A1 (en) 2010-06-23
CN101754586A (zh) 2010-06-23
JP2010135752A (ja) 2010-06-17
US20100263917A1 (en) 2010-10-21
TW201031307A (en) 2010-08-16

Similar Documents

Publication Publication Date Title
KR100983219B1 (ko) 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판
JP2010135752A5 (enExample)
CN101449633B (zh) 用于制备铜布线聚酰亚胺膜的方法和铜布线聚酰亚胺膜
KR101233609B1 (ko) 선택적 금속화 수용을 위한 광활성화가능한 폴리이미드조성물, 및 그에 관련된 방법 및 조성물
TWI395525B (zh) 銅配線聚醯亞胺膜之製造方法
WO2008016148A1 (en) Conductive paste, and conductive coating film and conductive film using the same
JP2004189981A (ja) 熱可塑性ポリイミド樹脂材料および積層体およびプリント配線板の製造方法
KR20100092937A (ko) 프린트 배선판의 제조 방법
EP2192598A1 (en) Paste composition for forming heat-resistant conductive patterns on substrate
US20090263639A1 (en) Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto
CN101009973A (zh) 树脂复合铜箔、印刷线路板和它们的制造方法
JP2010126725A5 (enExample)
KR20100038015A (ko) 양면 인쇄회로기판의 제조방법
KR100999820B1 (ko) 직접인쇄방법으로 기판에 내열성 도전성 패턴을 형성하기 위한 페이스트 조성물
WO2020121651A1 (ja) 半導体素子搭載用パッケージ基板の製造方法
KR101350490B1 (ko) 직접인쇄방법에 의하여 회로가 형성되는 인쇄회로기판
KR20210053937A (ko) 적층체
KR20140090961A (ko) 절연수지 필름, 상기 필름을 포함하는 금속박 적층판 및 인쇄회로기판, 및 상기 필름을 포함하는 회로기판의 제조방법
JPH05110218A (ja) リサイクル可能な積層板及びそれを用いたプリント配線板
JP2004244674A (ja) 孔内メッキ方法及び配線基板
JP2005116660A (ja) 導電性ペースト充填基板およびその製造方法
KR102491338B1 (ko) 연성금속박적층체 및 연성금속박적층체용 열가소성 폴리이미드 전구체 조성물
JP4179696B2 (ja) 多層プリント配線板およびその製造方法
KR102521460B1 (ko) 연성금속박적층체, 이를 포함하는 연성인쇄회로기판 및 폴리이미드 전구체 조성물
JP2016181562A (ja) 配線板の製造方法及び配線板

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

A302 Request for accelerated examination
PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A107 Divisional application of patent
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20130916

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20140915

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20150915

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

K11-X000 Ip right revival requested

St.27 status event code: A-6-4-K10-K11-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20150915

PR0401 Registration of restoration

St.27 status event code: A-6-4-K10-K13-oth-PR0401

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20161111

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20170915

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

FPAY Annual fee payment

Payment date: 20180614

Year of fee payment: 8

K11-X000 Ip right revival requested

St.27 status event code: A-6-4-K10-K11-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20170915

PR0401 Registration of restoration

St.27 status event code: A-6-4-K10-K13-oth-PR0401

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

R401 Registration of restoration
LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20180915

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20180915

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000