KR100981852B1 - 높은 접착성을 갖는 폴리이미드 필름의 제조 방법 - Google Patents

높은 접착성을 갖는 폴리이미드 필름의 제조 방법 Download PDF

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Publication number
KR100981852B1
KR100981852B1 KR1020077006992A KR20077006992A KR100981852B1 KR 100981852 B1 KR100981852 B1 KR 100981852B1 KR 1020077006992 A KR1020077006992 A KR 1020077006992A KR 20077006992 A KR20077006992 A KR 20077006992A KR 100981852 B1 KR100981852 B1 KR 100981852B1
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KR
South Korea
Prior art keywords
polyimide
thermoplastic polyimide
component
film
thermoplastic
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Expired - Lifetime
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KR1020077006992A
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English (en)
Korean (ko)
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KR20070056128A (ko
Inventor
히사야스 가네시로
다까시 기구찌
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가부시키가이샤 가네카
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulding By Coating Moulds (AREA)
  • Laminated Bodies (AREA)
KR1020077006992A 2004-09-24 2005-09-20 높은 접착성을 갖는 폴리이미드 필름의 제조 방법 Expired - Lifetime KR100981852B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00276766 2004-09-24
JP2004276766 2004-09-24

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020097026596A Division KR20100017883A (ko) 2004-09-24 2005-09-20 높은 접착성을 갖는 폴리이미드 필름의 제조 방법

Publications (2)

Publication Number Publication Date
KR20070056128A KR20070056128A (ko) 2007-05-31
KR100981852B1 true KR100981852B1 (ko) 2010-09-13

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KR1020077006992A Expired - Lifetime KR100981852B1 (ko) 2004-09-24 2005-09-20 높은 접착성을 갖는 폴리이미드 필름의 제조 방법
KR1020097026596A Withdrawn KR20100017883A (ko) 2004-09-24 2005-09-20 높은 접착성을 갖는 폴리이미드 필름의 제조 방법

Family Applications After (1)

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KR1020097026596A Withdrawn KR20100017883A (ko) 2004-09-24 2005-09-20 높은 접착성을 갖는 폴리이미드 필름의 제조 방법

Country Status (6)

Country Link
US (1) US8513373B2 (cg-RX-API-DMAC7.html)
JP (2) JP5054976B2 (cg-RX-API-DMAC7.html)
KR (2) KR100981852B1 (cg-RX-API-DMAC7.html)
CN (2) CN101027341B (cg-RX-API-DMAC7.html)
TW (1) TWI382040B (cg-RX-API-DMAC7.html)
WO (1) WO2006033324A1 (cg-RX-API-DMAC7.html)

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WO2006033272A1 (ja) * 2004-09-24 2006-03-30 Kaneka Corporation 接着性の改良された新規なポリイミドフィルム
CN101098909B (zh) * 2005-01-18 2010-07-28 株式会社钟化 粘合性经改良的新的聚酰亚胺薄膜
JP4957487B2 (ja) * 2007-09-28 2012-06-20 東レ株式会社 ポリアミック酸の製造方法
CN103772704A (zh) * 2013-11-12 2014-05-07 天津市天缘电工材料有限责任公司 一种低摩擦系数高粘结力聚酰亚胺薄膜的制备方法
KR101668059B1 (ko) * 2014-12-30 2016-10-20 에스케이씨코오롱피아이 주식회사 가교형 수용성 열가소성 폴리아믹산 및 이의 제조방법
CN105175722B (zh) * 2015-09-02 2017-05-10 无锡高拓新材料股份有限公司 一种芳香族高相对分子质量和分子量分布窄的聚酰胺酸的制备方法
JP2019093548A (ja) * 2016-03-30 2019-06-20 株式会社カネカ 長尺ポリイミド積層体およびその製造方法
WO2018181496A1 (ja) * 2017-03-30 2018-10-04 日産化学株式会社 剥離層形成用組成物及び剥離層
KR102345722B1 (ko) * 2019-11-07 2022-01-03 피아이첨단소재 주식회사 고내열 저유전 폴리이미드 필름 및 이의 제조방법
KR102347588B1 (ko) * 2019-11-07 2022-01-10 피아이첨단소재 주식회사 고내열 저유전 폴리이미드 필름 및 이의 제조방법
KR102347633B1 (ko) * 2019-11-07 2022-01-10 피아이첨단소재 주식회사 유전특성이 개선된 폴리이미드 필름 및 그 제조방법

Citations (4)

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JPH04161428A (ja) * 1990-10-24 1992-06-04 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム
JPH04161437A (ja) * 1990-10-24 1992-06-04 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム
JPH04320422A (ja) * 1991-04-19 1992-11-11 Kanegafuchi Chem Ind Co Ltd ポリアミック酸共重合体及びそれからなるポリイミドフィルム並びにそれらの製造方法
JP2955724B2 (ja) * 1991-04-24 1999-10-04 鐘淵化学工業株式会社 ポリイミドフィルムの製造方法

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KR20040108808A (ko) 2002-05-21 2004-12-24 가부시키가이샤 가네카 폴리이미드 필름 및 그의 제조 방법, 및 폴리이미드필름을 사용한 폴리이미드/금속 적층체
US7267883B2 (en) * 2002-09-25 2007-09-11 Kaneka Corporation Polyimide film and laminate having metal layer and same
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Publication number Priority date Publication date Assignee Title
JPH04161428A (ja) * 1990-10-24 1992-06-04 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム
JPH04161437A (ja) * 1990-10-24 1992-06-04 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム
JPH04320422A (ja) * 1991-04-19 1992-11-11 Kanegafuchi Chem Ind Co Ltd ポリアミック酸共重合体及びそれからなるポリイミドフィルム並びにそれらの製造方法
JP2955724B2 (ja) * 1991-04-24 1999-10-04 鐘淵化学工業株式会社 ポリイミドフィルムの製造方法

Also Published As

Publication number Publication date
CN101027341B (zh) 2012-06-06
US8513373B2 (en) 2013-08-20
CN102675634B (zh) 2015-06-17
JP2012214807A (ja) 2012-11-08
KR20100017883A (ko) 2010-02-16
TW200619270A (en) 2006-06-16
WO2006033324A1 (ja) 2006-03-30
US20080287642A1 (en) 2008-11-20
JP5054976B2 (ja) 2012-10-24
TWI382040B (zh) 2013-01-11
KR20070056128A (ko) 2007-05-31
JPWO2006033324A1 (ja) 2008-05-15
CN102675634A (zh) 2012-09-19
CN101027341A (zh) 2007-08-29
JP5514861B2 (ja) 2014-06-04

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