KR100980961B1 - 종형 열처리 장치 및 피처리체 이동 탑재 방법 - Google Patents

종형 열처리 장치 및 피처리체 이동 탑재 방법 Download PDF

Info

Publication number
KR100980961B1
KR100980961B1 KR1020057022867A KR20057022867A KR100980961B1 KR 100980961 B1 KR100980961 B1 KR 100980961B1 KR 1020057022867 A KR1020057022867 A KR 1020057022867A KR 20057022867 A KR20057022867 A KR 20057022867A KR 100980961 B1 KR100980961 B1 KR 100980961B1
Authority
KR
South Korea
Prior art keywords
inclined surface
substrate support
heat treatment
substrate
movable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057022867A
Other languages
English (en)
Korean (ko)
Other versions
KR20060126857A (ko
Inventor
사또시 아사리
가쯔히꼬 미하라
히로시 기꾸찌
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20060126857A publication Critical patent/KR20060126857A/ko
Application granted granted Critical
Publication of KR100980961B1 publication Critical patent/KR100980961B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/04—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/06—Details, accessories or equipment specially adapted for furnaces of these types
    • F27B5/12—Arrangement of devices for charging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/06—Details, accessories or equipment specially adapted for furnaces of these types
    • F27B5/13—Arrangement of devices for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/12—Travelling or movable supports or containers for the charge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020057022867A 2004-03-25 2005-03-25 종형 열처리 장치 및 피처리체 이동 탑재 방법 Expired - Fee Related KR100980961B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004089515 2004-03-25
JPJP-P-2004-00089515 2004-03-25
JPJP-P-2005-00055271 2005-03-01
JP2005055271A JP2005311306A (ja) 2004-03-25 2005-03-01 縦型熱処理装置及び被処理体移載方法

Publications (2)

Publication Number Publication Date
KR20060126857A KR20060126857A (ko) 2006-12-11
KR100980961B1 true KR100980961B1 (ko) 2010-09-07

Family

ID=35056283

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057022867A Expired - Fee Related KR100980961B1 (ko) 2004-03-25 2005-03-25 종형 열처리 장치 및 피처리체 이동 탑재 방법

Country Status (7)

Country Link
US (1) US7677858B2 (https=)
EP (1) EP1752725B1 (https=)
JP (1) JP2005311306A (https=)
KR (1) KR100980961B1 (https=)
DE (1) DE602005027689D1 (https=)
TW (1) TW200603289A (https=)
WO (1) WO2005093354A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754771B1 (ko) * 2005-12-27 2007-09-03 주식회사 엔씨비네트웍스 웨이퍼 맵핑을 위한 구조를 갖는 웨이퍼 트랜스퍼 및 이를이용하여 보우트에 적재된 웨이퍼를 맵핑하는 방법
JP4642787B2 (ja) 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP4821756B2 (ja) 2007-10-19 2011-11-24 東京エレクトロン株式会社 被処理体の移載機構、被処理体の移載方法及び被処理体の処理システム
JP5558673B2 (ja) * 2008-03-25 2014-07-23 大日本スクリーン製造株式会社 熱処理装置
JP5131094B2 (ja) * 2008-08-29 2013-01-30 東京エレクトロン株式会社 熱処理装置及び熱処理方法並びに記憶媒体
US9254566B2 (en) 2009-03-13 2016-02-09 Kawasaki Jukogyo Kabushiki Kaisha Robot having end effector and method of operating the same
JP5473857B2 (ja) * 2010-10-14 2014-04-16 東京エレクトロン株式会社 搬送装置および処理システム
JP5243569B2 (ja) * 2011-03-07 2013-07-24 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
JP6077919B2 (ja) * 2013-04-12 2017-02-08 東京エレクトロン株式会社 基板把持装置及びこれを用いた基板処理装置、並びに基板把持方法
JP6204226B2 (ja) * 2014-02-24 2017-09-27 東京エレクトロン株式会社 基板処理装置、基板処理方法
JP6468848B2 (ja) * 2015-01-13 2019-02-13 株式会社ディスコ 搬送装置
JP6596375B2 (ja) 2016-03-31 2019-10-23 株式会社荏原製作所 ティーチング装置およびティーチング方法
CN106382814B (zh) * 2016-11-25 2018-11-06 芜湖新兴铸管有限责任公司 马弗炉热处理装置
CN117308583B (zh) * 2023-11-24 2024-02-02 陕西三义高科石墨新材料有限公司 一种环式焙烧炉

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141405A (ja) * 2000-10-31 2002-05-17 Daikin Ind Ltd 基板搬送装置
JP2002289666A (ja) * 2001-03-27 2002-10-04 Tokyo Electron Ltd 熱処理装置
JP2003338531A (ja) * 2002-05-20 2003-11-28 Toshiba Ceramics Co Ltd 半導体ウエハの搬送装置および熱処理装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH680275A5 (https=) * 1990-03-05 1992-07-31 Tet Techno Investment Trust
JP3081025B2 (ja) 1991-07-03 2000-08-28 東京エレクトロン株式会社 ウエハの移載装置
US5445486A (en) * 1992-03-29 1995-08-29 Tokyo Electron Sagami Limited Substrate transferring apparatus
KR940006241A (ko) * 1992-06-05 1994-03-23 이노우에 아키라 기판이재장치 및 이재방법
KR0152324B1 (ko) * 1994-12-06 1998-12-01 양승택 웨이퍼 측면파지 이송 반도체 제조장치
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
JP3664897B2 (ja) * 1998-11-18 2005-06-29 東京エレクトロン株式会社 縦型熱処理装置
JP2001267262A (ja) * 2000-03-17 2001-09-28 Hitachi Kokusai Electric Inc 半導体製造装置
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
JP2001284276A (ja) * 2000-03-30 2001-10-12 Hitachi Kokusai Electric Inc 基板処理装置
US6828772B1 (en) * 2000-06-14 2004-12-07 Micron Technology, Inc. Rotating gripper wafer flipper
JP4600856B2 (ja) * 2000-10-24 2010-12-22 ムラテックオートメーション株式会社 基板保持装置
JP3939101B2 (ja) * 2000-12-04 2007-07-04 株式会社荏原製作所 基板搬送方法および基板搬送容器
JP2002184853A (ja) * 2000-12-15 2002-06-28 Yaskawa Electric Corp ウェハー把持装置
JP2003007800A (ja) * 2001-06-21 2003-01-10 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
US6817640B2 (en) * 2001-06-28 2004-11-16 Applied Materials, Inc. Four-bar linkage wafer clamping mechanism
US7140655B2 (en) * 2001-09-04 2006-11-28 Multimetrixs Llc Precision soft-touch gripping mechanism for flat objects
JP2004079569A (ja) 2002-08-09 2004-03-11 Sipec Corp 基板搬送装置及び基板搬送方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141405A (ja) * 2000-10-31 2002-05-17 Daikin Ind Ltd 基板搬送装置
JP2002289666A (ja) * 2001-03-27 2002-10-04 Tokyo Electron Ltd 熱処理装置
JP2003338531A (ja) * 2002-05-20 2003-11-28 Toshiba Ceramics Co Ltd 半導体ウエハの搬送装置および熱処理装置

Also Published As

Publication number Publication date
WO2005093354A1 (ja) 2005-10-06
EP1752725A4 (en) 2007-12-12
EP1752725A1 (en) 2007-02-14
US7677858B2 (en) 2010-03-16
US20070199860A1 (en) 2007-08-30
TW200603289A (en) 2006-01-16
JP2005311306A (ja) 2005-11-04
DE602005027689D1 (de) 2011-06-09
KR20060126857A (ko) 2006-12-11
EP1752725B1 (en) 2011-04-27
TWI351723B (https=) 2011-11-01

Similar Documents

Publication Publication Date Title
KR101383935B1 (ko) 종형 열처리 장치 및 피처리 기판 이동 탑재 방법
KR100980961B1 (ko) 종형 열처리 장치 및 피처리체 이동 탑재 방법
JP3664897B2 (ja) 縦型熱処理装置
JP4047826B2 (ja) 縦型熱処理装置及び移載機構の自動教示方法
TWI379373B (en) Substrate processing apparatus and manufacturing method for a semiconductor device
TWI423373B (zh) 工件移載機構、工件移載方法及工件處理系統
KR101287656B1 (ko) 종형 열처리 장치 및 기판 지지구
JP5906429B2 (ja) プラズマ処理装置及びプラズマ処理方法
KR101272436B1 (ko) 이동 탑재 기구를 구비한 처리 장치 및 종형 열처리 장치
JP2009099996A (ja) 縦型熱処理装置及び被処理体移載方法
JP5849232B2 (ja) プラズマ処理装置及びプラズマ処理方法
KR101296476B1 (ko) 피처리체의 이동 적재 기구 및 피처리체의 처리 시스템
JP3836812B2 (ja) 熱処理装置のシャッター機構及び縦型熱処理装置
JP2002299421A (ja) ノッチ整列方法及びノッチ整列機構並びに半導体製造装置
KR100947135B1 (ko) 종형 열처리 장치 및 이동 적재 기구의 자동 교시 방법
JP2004311781A (ja) 処理装置
JP2003092330A (ja) 熱処理装置および熱処理方法
JP2002289666A (ja) 熱処理装置
JP4670863B2 (ja) 熱処理装置及び熱処理方法並びに記憶媒体
JP4519348B2 (ja) 熱処理装置および熱処理方法
JP2006093201A (ja) 半導体製造装置
JP2005093491A (ja) 基板処理装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20130822

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20150730

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20160818

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20170822

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20210902

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20210902