DE602005027689D1 - Vertikalwärmebehandlungseinrichtung und verfahren zum übertragen von zu behandelnden objekten - Google Patents
Vertikalwärmebehandlungseinrichtung und verfahren zum übertragen von zu behandelnden objektenInfo
- Publication number
- DE602005027689D1 DE602005027689D1 DE602005027689T DE602005027689T DE602005027689D1 DE 602005027689 D1 DE602005027689 D1 DE 602005027689D1 DE 602005027689 T DE602005027689 T DE 602005027689T DE 602005027689 T DE602005027689 T DE 602005027689T DE 602005027689 D1 DE602005027689 D1 DE 602005027689D1
- Authority
- DE
- Germany
- Prior art keywords
- heat treatment
- treatment device
- vertical heat
- treated objects
- transferring treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/04—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
- F27B5/12—Arrangement of devices for charging
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
- F27B5/13—Arrangement of devices for discharging
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/12—Travelling or movable supports or containers for the charge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004089515 | 2004-03-25 | ||
JP2005055271A JP2005311306A (ja) | 2004-03-25 | 2005-03-01 | 縦型熱処理装置及び被処理体移載方法 |
PCT/JP2005/005518 WO2005093354A1 (ja) | 2004-03-25 | 2005-03-25 | 縦型熱処理装置及び被処理体移載方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005027689D1 true DE602005027689D1 (de) | 2011-06-09 |
Family
ID=35056283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005027689T Active DE602005027689D1 (de) | 2004-03-25 | 2005-03-25 | Vertikalwärmebehandlungseinrichtung und verfahren zum übertragen von zu behandelnden objekten |
Country Status (7)
Country | Link |
---|---|
US (1) | US7677858B2 (de) |
EP (1) | EP1752725B1 (de) |
JP (1) | JP2005311306A (de) |
KR (1) | KR100980961B1 (de) |
DE (1) | DE602005027689D1 (de) |
TW (1) | TW200603289A (de) |
WO (1) | WO2005093354A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100754771B1 (ko) * | 2005-12-27 | 2007-09-03 | 주식회사 엔씨비네트웍스 | 웨이퍼 맵핑을 위한 구조를 갖는 웨이퍼 트랜스퍼 및 이를이용하여 보우트에 적재된 웨이퍼를 맵핑하는 방법 |
JP4642787B2 (ja) | 2006-05-09 | 2011-03-02 | 東京エレクトロン株式会社 | 基板搬送装置及び縦型熱処理装置 |
JP4821756B2 (ja) | 2007-10-19 | 2011-11-24 | 東京エレクトロン株式会社 | 被処理体の移載機構、被処理体の移載方法及び被処理体の処理システム |
JP5558673B2 (ja) * | 2008-03-25 | 2014-07-23 | 大日本スクリーン製造株式会社 | 熱処理装置 |
JP5131094B2 (ja) | 2008-08-29 | 2013-01-30 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法並びに記憶媒体 |
US9254566B2 (en) | 2009-03-13 | 2016-02-09 | Kawasaki Jukogyo Kabushiki Kaisha | Robot having end effector and method of operating the same |
JP5473857B2 (ja) * | 2010-10-14 | 2014-04-16 | 東京エレクトロン株式会社 | 搬送装置および処理システム |
JP5243569B2 (ja) * | 2011-03-07 | 2013-07-24 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体 |
JP6077919B2 (ja) * | 2013-04-12 | 2017-02-08 | 東京エレクトロン株式会社 | 基板把持装置及びこれを用いた基板処理装置、並びに基板把持方法 |
JP6204226B2 (ja) * | 2014-02-24 | 2017-09-27 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法 |
JP6468848B2 (ja) * | 2015-01-13 | 2019-02-13 | 株式会社ディスコ | 搬送装置 |
JP6596375B2 (ja) | 2016-03-31 | 2019-10-23 | 株式会社荏原製作所 | ティーチング装置およびティーチング方法 |
CN106382814B (zh) * | 2016-11-25 | 2018-11-06 | 芜湖新兴铸管有限责任公司 | 马弗炉热处理装置 |
CN117308583B (zh) * | 2023-11-24 | 2024-02-02 | 陕西三义高科石墨新材料有限公司 | 一种环式焙烧炉 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH680275A5 (de) * | 1990-03-05 | 1992-07-31 | Tet Techno Investment Trust | |
JP3081025B2 (ja) | 1991-07-03 | 2000-08-28 | 東京エレクトロン株式会社 | ウエハの移載装置 |
US5445486A (en) * | 1992-03-29 | 1995-08-29 | Tokyo Electron Sagami Limited | Substrate transferring apparatus |
KR940006241A (ko) * | 1992-06-05 | 1994-03-23 | 이노우에 아키라 | 기판이재장치 및 이재방법 |
KR0152324B1 (ko) * | 1994-12-06 | 1998-12-01 | 양승택 | 웨이퍼 측면파지 이송 반도체 제조장치 |
US6167322A (en) * | 1998-07-10 | 2000-12-26 | Holbrooks; Orville Ray | Intelligent wafer handling system and method |
JP3664897B2 (ja) * | 1998-11-18 | 2005-06-29 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP2001267262A (ja) | 2000-03-17 | 2001-09-28 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
US20010048867A1 (en) * | 2000-03-29 | 2001-12-06 | Lebar Technology, Inc. | Method and apparatus for processing semiconductor wafers |
JP2001284276A (ja) * | 2000-03-30 | 2001-10-12 | Hitachi Kokusai Electric Inc | 基板処理装置 |
US6828772B1 (en) * | 2000-06-14 | 2004-12-07 | Micron Technology, Inc. | Rotating gripper wafer flipper |
JP4600856B2 (ja) * | 2000-10-24 | 2010-12-22 | ムラテックオートメーション株式会社 | 基板保持装置 |
JP3724361B2 (ja) | 2000-10-31 | 2005-12-07 | ダイキン工業株式会社 | 基板搬送装置 |
JP3939101B2 (ja) * | 2000-12-04 | 2007-07-04 | 株式会社荏原製作所 | 基板搬送方法および基板搬送容器 |
JP2002184853A (ja) * | 2000-12-15 | 2002-06-28 | Yaskawa Electric Corp | ウェハー把持装置 |
JP2002289666A (ja) * | 2001-03-27 | 2002-10-04 | Tokyo Electron Ltd | 熱処理装置 |
JP2003007800A (ja) * | 2001-06-21 | 2003-01-10 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
US6817640B2 (en) * | 2001-06-28 | 2004-11-16 | Applied Materials, Inc. | Four-bar linkage wafer clamping mechanism |
US7140655B2 (en) * | 2001-09-04 | 2006-11-28 | Multimetrixs Llc | Precision soft-touch gripping mechanism for flat objects |
JP2003338531A (ja) * | 2002-05-20 | 2003-11-28 | Toshiba Ceramics Co Ltd | 半導体ウエハの搬送装置および熱処理装置 |
JP2004079569A (ja) | 2002-08-09 | 2004-03-11 | Sipec Corp | 基板搬送装置及び基板搬送方法 |
-
2005
- 2005-03-01 JP JP2005055271A patent/JP2005311306A/ja active Pending
- 2005-03-25 EP EP05726958A patent/EP1752725B1/de not_active Expired - Fee Related
- 2005-03-25 KR KR1020057022867A patent/KR100980961B1/ko active IP Right Grant
- 2005-03-25 TW TW094109400A patent/TW200603289A/zh not_active IP Right Cessation
- 2005-03-25 US US10/593,973 patent/US7677858B2/en not_active Expired - Fee Related
- 2005-03-25 DE DE602005027689T patent/DE602005027689D1/de active Active
- 2005-03-25 WO PCT/JP2005/005518 patent/WO2005093354A1/ja not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR100980961B1 (ko) | 2010-09-07 |
EP1752725A4 (de) | 2007-12-12 |
TWI351723B (de) | 2011-11-01 |
JP2005311306A (ja) | 2005-11-04 |
KR20060126857A (ko) | 2006-12-11 |
TW200603289A (en) | 2006-01-16 |
WO2005093354A1 (ja) | 2005-10-06 |
EP1752725B1 (de) | 2011-04-27 |
EP1752725A1 (de) | 2007-02-14 |
US7677858B2 (en) | 2010-03-16 |
US20070199860A1 (en) | 2007-08-30 |
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