KR100945768B1 - 기판 처리 장치, 기판 처리 방법 및 배액컵의 세정 방법 - Google Patents

기판 처리 장치, 기판 처리 방법 및 배액컵의 세정 방법 Download PDF

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KR100945768B1
KR100945768B1 KR1020087006814A KR20087006814A KR100945768B1 KR 100945768 B1 KR100945768 B1 KR 100945768B1 KR 1020087006814 A KR1020087006814 A KR 1020087006814A KR 20087006814 A KR20087006814 A KR 20087006814A KR 100945768 B1 KR100945768 B1 KR 100945768B1
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South Korea
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substrate
liquid
rinse
cup
processing
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Korean (ko)
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KR20080056165A (ko
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히로미츠 난바
노리히로 이토
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

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  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020087006814A 2006-10-05 2007-10-04 기판 처리 장치, 기판 처리 방법 및 배액컵의 세정 방법 Active KR100945768B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00274304 2006-10-05
JPJP-P-2006-00274303 2006-10-05
JP2006274304 2006-10-05
JP2006274303 2006-10-05

Publications (2)

Publication Number Publication Date
KR20080056165A KR20080056165A (ko) 2008-06-20
KR100945768B1 true KR100945768B1 (ko) 2010-03-08

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KR1020087006814A Active KR100945768B1 (ko) 2006-10-05 2007-10-04 기판 처리 장치, 기판 처리 방법 및 배액컵의 세정 방법

Country Status (5)

Country Link
US (1) US8152933B2 (https=)
JP (1) JP4723001B2 (https=)
KR (1) KR100945768B1 (https=)
TW (1) TW200832587A (https=)
WO (1) WO2008041741A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100979979B1 (ko) * 2006-07-26 2010-09-03 도쿄엘렉트론가부시키가이샤 액처리 장치 및 액처리 방법
JP5390824B2 (ja) * 2008-10-10 2014-01-15 大日本スクリーン製造株式会社 基板処理装置
JP5420222B2 (ja) * 2008-10-10 2014-02-19 大日本スクリーン製造株式会社 基板処理装置
JP5401255B2 (ja) * 2008-11-05 2014-01-29 東京エレクトロン株式会社 洗浄装置、洗浄方法、および記憶媒体
JP5546472B2 (ja) * 2010-03-24 2014-07-09 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
KR101678229B1 (ko) * 2010-03-24 2016-11-21 도쿄엘렉트론가부시키가이샤 액처리 장치, 액처리 방법, 및 그 액처리 방법을 실행시키기 위한 프로그램을 기록한 기록 매체
JP5864232B2 (ja) * 2011-02-01 2016-02-17 東京エレクトロン株式会社 液処理装置および液処理方法
JP5890108B2 (ja) 2011-04-27 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス 洗浄処理方法
CN103801527B (zh) * 2012-11-13 2015-08-26 沈阳芯源微电子设备有限公司 一种光刻胶收集杯自动清洗系统
JP6250973B2 (ja) * 2013-08-08 2017-12-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6229933B2 (ja) * 2013-09-27 2017-11-15 株式会社Ｓｃｒｅｅｎホールディングス 処理カップ洗浄方法、基板処理方法および基板処理装置
JP6928797B2 (ja) 2015-11-14 2021-09-01 東京エレクトロン株式会社 希ｔｍａｈを使用してマイクロエレクトロニック基板を処理する方法
JP6845696B2 (ja) * 2016-02-25 2021-03-24 芝浦メカトロニクス株式会社 基板処理装置、基板処理方法及び基板の製造方法
JP6513048B2 (ja) * 2016-03-28 2019-05-15 東京エレクトロン株式会社 液処理装置
JP6722532B2 (ja) * 2016-07-19 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および処理カップ洗浄方法
JP6836912B2 (ja) 2017-01-17 2021-03-03 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
US11747742B2 (en) * 2017-04-11 2023-09-05 Visera Technologies Company Limited Apparatus and method for removing photoresist layer from alignment mark
JP6983602B2 (ja) * 2017-09-26 2021-12-17 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6513774B2 (ja) * 2017-11-24 2019-05-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6735384B2 (ja) * 2019-04-09 2020-08-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7438015B2 (ja) * 2020-05-01 2024-02-26 東京エレクトロン株式会社 基板処理装置
JP7752985B2 (ja) * 2021-07-21 2025-10-14 ダイキンファインテック株式会社 基板処理装置
JP2024030355A (ja) * 2022-08-24 2024-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000315671A (ja) * 1999-04-30 2000-11-14 Tokyo Electron Ltd 基板処理装置および基板処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136528A (ja) * 1986-11-27 1988-06-08 Mitsubishi Electric Corp 処理液塗布装置
SG76527A1 (en) * 1996-09-24 2000-11-21 Tokyo Electron Ltd Method and apparatus for cleaning treatment
US6207231B1 (en) * 1997-05-07 2001-03-27 Tokyo Electron Limited Coating film forming method and coating apparatus
JP2002368066A (ja) 2001-06-06 2002-12-20 Tokyo Electron Ltd 処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000315671A (ja) * 1999-04-30 2000-11-14 Tokyo Electron Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
KR20080056165A (ko) 2008-06-20
JP4723001B2 (ja) 2011-07-13
US20100212701A1 (en) 2010-08-26
TWI354344B (https=) 2011-12-11
WO2008041741A1 (en) 2008-04-10
TW200832587A (en) 2008-08-01
JPWO2008041741A1 (ja) 2010-02-04
US8152933B2 (en) 2012-04-10

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