KR100912158B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR100912158B1
KR100912158B1 KR1020070099952A KR20070099952A KR100912158B1 KR 100912158 B1 KR100912158 B1 KR 100912158B1 KR 1020070099952 A KR1020070099952 A KR 1020070099952A KR 20070099952 A KR20070099952 A KR 20070099952A KR 100912158 B1 KR100912158 B1 KR 100912158B1
Authority
KR
South Korea
Prior art keywords
substrate
board
posture
conveying
processing
Prior art date
Application number
KR1020070099952A
Other languages
English (en)
Korean (ko)
Other versions
KR20080031809A (ko
Inventor
이와오 다나까
도모야스 아라키
Original Assignee
다이니폰 스크린 세이조우 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 스크린 세이조우 가부시키가이샤 filed Critical 다이니폰 스크린 세이조우 가부시키가이샤
Publication of KR20080031809A publication Critical patent/KR20080031809A/ko
Application granted granted Critical
Publication of KR100912158B1 publication Critical patent/KR100912158B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020070099952A 2006-10-06 2007-10-04 기판 처리 장치 KR100912158B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00274906 2006-10-06
JP2006274906A JP2008098227A (ja) 2006-10-06 2006-10-06 基板処理装置

Publications (2)

Publication Number Publication Date
KR20080031809A KR20080031809A (ko) 2008-04-11
KR100912158B1 true KR100912158B1 (ko) 2009-08-14

Family

ID=39307255

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070099952A KR100912158B1 (ko) 2006-10-06 2007-10-04 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP2008098227A (zh)
KR (1) KR100912158B1 (zh)
CN (1) CN101159229A (zh)
TW (1) TW200834788A (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100964127B1 (ko) * 2008-08-11 2010-06-16 (주)에스티아이 슬라이딩 틸팅부를 구비한 평판 디스플레이의 습윤 공정 처리 장치
JP4696165B2 (ja) * 2009-02-03 2011-06-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR20110072926A (ko) * 2009-12-23 2011-06-29 주식회사 인아텍 평판형 피처리물의 공급 및 배출방법
JP6812262B2 (ja) * 2017-02-09 2021-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7166817B2 (ja) * 2018-07-12 2022-11-08 株式会社荏原製作所 基板搬送装置および基板搬送装置を備える基板処理装置
CN110420889B (zh) * 2019-08-13 2024-06-18 浙江亿龙检测技术有限公司 一种轴承滚子生产检测流水线
WO2021154528A1 (en) * 2020-01-27 2021-08-05 Corning Incorporated Method and apparatus for trimming edges of glass substrates during inline processing
CN113798298B (zh) * 2021-08-25 2023-03-17 河北光兴半导体技术有限公司 一种玻璃基板清洗装置
CN116022417B (zh) * 2023-03-30 2023-06-06 小仙炖霸州食品有限公司 一种包装箱码放传送系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140336A (ja) 2002-08-19 2004-05-13 Sumitomo Precision Prod Co Ltd 昇降式基板処理装置及びこれを備えた基板処理システム
JP2005247491A (ja) 2004-03-03 2005-09-15 Dainippon Printing Co Ltd 基板搬送システム
KR20060083866A (ko) * 2005-01-17 2006-07-21 다이니폰 스크린 세이조우 가부시키가이샤 기판 처리 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252200A (ja) * 2001-02-22 2002-09-06 Hitachi Electronics Eng Co Ltd 基板処理装置及び処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140336A (ja) 2002-08-19 2004-05-13 Sumitomo Precision Prod Co Ltd 昇降式基板処理装置及びこれを備えた基板処理システム
JP2005247491A (ja) 2004-03-03 2005-09-15 Dainippon Printing Co Ltd 基板搬送システム
KR20060083866A (ko) * 2005-01-17 2006-07-21 다이니폰 스크린 세이조우 가부시키가이샤 기판 처리 장치

Also Published As

Publication number Publication date
TW200834788A (en) 2008-08-16
KR20080031809A (ko) 2008-04-11
CN101159229A (zh) 2008-04-09
JP2008098227A (ja) 2008-04-24

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