KR100889888B1 - 대전방지 다이싱테이프 - Google Patents

대전방지 다이싱테이프 Download PDF

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Publication number
KR100889888B1
KR100889888B1 KR1020020038279A KR20020038279A KR100889888B1 KR 100889888 B1 KR100889888 B1 KR 100889888B1 KR 1020020038279 A KR1020020038279 A KR 1020020038279A KR 20020038279 A KR20020038279 A KR 20020038279A KR 100889888 B1 KR100889888 B1 KR 100889888B1
Authority
KR
South Korea
Prior art keywords
antistatic
adhesive
dicing tape
adhesive layer
oligomer
Prior art date
Application number
KR1020020038279A
Other languages
English (en)
Korean (ko)
Other versions
KR20030004136A (ko
Inventor
모리시마야스마사
마루야마히로미쓰
가노요시히사
미야기히데후미
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20030004136A publication Critical patent/KR20030004136A/ko
Application granted granted Critical
Publication of KR100889888B1 publication Critical patent/KR100889888B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D33/00—Details of, or accessories for, sacks or bags
    • B65D33/002—Rolls, strips or like assemblies of bags
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D33/00—Details of, or accessories for, sacks or bags
    • B65D33/06—Handles
    • B65D33/065—Integral handles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D33/00—Details of, or accessories for, sacks or bags
    • B65D33/16—End- or aperture-closing arrangements or devices
    • B65D33/1608—Integral flaps for tying above the bag

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020020038279A 2001-07-04 2002-07-03 대전방지 다이싱테이프 KR100889888B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00203831 2001-07-04
JP2001203831 2001-07-04

Publications (2)

Publication Number Publication Date
KR20030004136A KR20030004136A (ko) 2003-01-14
KR100889888B1 true KR100889888B1 (ko) 2009-03-20

Family

ID=19040396

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020038279A KR100889888B1 (ko) 2001-07-04 2002-07-03 대전방지 다이싱테이프

Country Status (4)

Country Link
JP (1) JP4247956B2 (ja)
KR (1) KR100889888B1 (ja)
CN (1) CN100404569C (ja)
TW (1) TW574337B (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4865192B2 (ja) * 2004-03-16 2012-02-01 古河電気工業株式会社 半導体固定用粘着テープ
JP4664005B2 (ja) * 2004-05-11 2011-04-06 リンテック株式会社 接着剤層付き半導体チップの製造方法
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
KR100980187B1 (ko) 2005-06-07 2010-09-03 주식회사 엘지화학 편광판
KR100838973B1 (ko) * 2005-06-08 2008-06-17 주식회사 엘지화학 아크릴계 점착제 조성물
KR100784991B1 (ko) * 2005-06-10 2007-12-11 주식회사 엘지화학 아크릴계 점착제 조성물
KR100812507B1 (ko) * 2005-08-19 2008-03-11 주식회사 엘지화학 아크릴계 점착제 조성물
US20070082196A1 (en) * 2005-10-07 2007-04-12 Ali Mahfuza B Antistatic additive and tapes made therefrom
KR100830814B1 (ko) 2005-10-14 2008-05-20 주식회사 엘지화학 아크릴계 점착제 조성물
JP2008055710A (ja) * 2006-08-30 2008-03-13 Nitto Denko Cs System Kk 帯電防止性粘着テープ
JP4994895B2 (ja) 2007-03-09 2012-08-08 リンテック株式会社 粘着シート
JP5328132B2 (ja) * 2007-04-11 2013-10-30 積水化学工業株式会社 半導体加工用テープ
JP5361244B2 (ja) * 2008-05-15 2013-12-04 日本カーバイド工業株式会社 光学部材表面保護フィルム用粘着剤組成物及び光学部材表面保護フィルム
EP2602814A1 (en) * 2010-08-06 2013-06-12 Nitto Denko Corporation Electronic component manufacturing method
JP2013209559A (ja) * 2012-03-30 2013-10-10 Furukawa Electric Co Ltd:The 紫外線硬化性半導体デバイス加工用粘着テープ
KR102108102B1 (ko) * 2012-12-10 2020-05-11 닛토덴코 가부시키가이샤 다이싱 테이프 일체형 접착 시트, 다이싱 테이프 일체형 접착 시트를 이용한 반도체 장치의 제조 방법 및 반도체 장치
EP3040389B1 (en) * 2013-08-30 2021-04-21 LINTEC Corporation Sheet for processing semiconductor
KR102449502B1 (ko) * 2015-03-03 2022-09-30 린텍 가부시키가이샤 반도체 가공용 시트
KR102162905B1 (ko) * 2016-03-31 2020-10-07 미쓰이 가가쿠 토세로 가부시키가이샤 반도체 웨이퍼 가공용 점착성 필름
CN113667428A (zh) * 2019-03-20 2021-11-19 上海百卡新材料科技有限公司 芯片切割用uv減粘膜
JP7005805B1 (ja) 2021-04-28 2022-02-10 藤森工業株式会社 テープ
US20230369136A1 (en) * 2022-05-13 2023-11-16 Adeia Semiconductor Bonding Technologies Inc. Bonding surface validation on dicing tape

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001011411A (ja) * 1999-07-02 2001-01-16 Toray Ind Inc 接着剤用組成物
KR20010080332A (ko) * 1998-10-27 2001-08-22 스프레이그 로버트 월터 대전방지 감압성 접착제 조성물
KR20020030852A (ko) * 2000-10-18 2002-04-26 오주언 광학 접착제 수지 조성물 및 광학 접착제 수지의 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534322A (en) * 1993-06-29 1996-07-09 Kao Corporation Recording medium
JP3038542B2 (ja) * 1996-01-18 2000-05-08 三洋化成工業株式会社 帯電防止性感圧接着剤
JP3673590B2 (ja) * 1996-03-12 2005-07-20 新中村化学工業株式会社 紫外線硬化型導電性組成物
JP3907331B2 (ja) * 1998-12-21 2007-04-18 電気化学工業株式会社 半導体ウエハ固定用シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010080332A (ko) * 1998-10-27 2001-08-22 스프레이그 로버트 월터 대전방지 감압성 접착제 조성물
JP2001011411A (ja) * 1999-07-02 2001-01-16 Toray Ind Inc 接着剤用組成物
KR20020030852A (ko) * 2000-10-18 2002-04-26 오주언 광학 접착제 수지 조성물 및 광학 접착제 수지의 제조방법

Also Published As

Publication number Publication date
TW574337B (en) 2004-02-01
CN100404569C (zh) 2008-07-23
KR20030004136A (ko) 2003-01-14
JP2003105292A (ja) 2003-04-09
JP4247956B2 (ja) 2009-04-02
CN1394930A (zh) 2003-02-05

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