574337 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（1 ) 〈發明之領域〉 本發明係有關一種具有防靜電性能之切割用膠帶（ dicing tape),尤其關於在電氣、電子及半導體組件生產. 時使用之一種具有防靜電性能之切割用膠帶。 〈發明之背景〉 在電氣、電子組件及半導體組件之生產時，在切割及 其他製程時，為固定或保護組件，一般均使用黏著用膠帶。 此種膠帶有例如在基材薄膜上塗有剝離性丙烯酸糸粘 膠劑層者，或在基材上塗有黏貼時對外力具有大阻抗性但 剝離時只要用小力量即可將其剝離之光交聯型剝離性黏膠 層者。該膠帶在所定之製程完了時，需要將其剝離。此時 .會在組件與膠帶之間產生所謂之剝離靜電。由於此靜電會 帶給被黏貼體（例如電路等）不良影響，因此一般使用基材 薄膜的背面經過靜電防止處理之膠帶，或於黏膠劑層添加 混合有靜電防止劑之膠帶或基材薄膜與黏膠劑層之間形成 有靜電防止用中間層之膠帶。 然而，形成電路之組件之基板若是陶瓷或玻璃等絕緣 材料時，靜電之發生量大且其衰減頗為費時。對於此種組 件，縱使使用上述之膠帶亦無法獲得滿意之防靜電效果， 甚且有破壞電路之虞。為此，時下，在上述組件之生產製 程中，進一步使用游電離器（ionizer)等靜電去除裝置， 使靜電難Μ發生。 但，上述之對策仍雞獲得滿意之防靜電效果，且會降 低生產效率。 一 4 一 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --11 · J.-----Γ ^---------—up* (請先閱讀背面之注意事項再填寫本頁) 574337 經濟部智慧財產局員工消費合作社印製 A7 ____B7_____ 五、發明說明（2 ) 膠帶之剝離靜電之防止一般被認為不是對基材薄膜， 而是對黏膠曆處理才能有效。但，對於黏膠層混摻界面活 性劑或導電性填充劑或碳黑等具有靜電防止效果之添加劑. 時，不但會使黏膠劑之.物性或其經時變化（隨時間之經過 發生之變化）的調整或抑制變為困難，且在剝離時黏膠劑 或混摻之添加劑有轉移至被黏貼體（如電路等）而將其污染 之虞。遇此情形時，被黏貼體的表面會沾附例如肉眼可見 之殘膠或顯微鏡可觀察到之粒狀物，或光學上無法觀測之 液狀物，從而在下述之製程中導致組件接著不良等之不良 影響。 藉使與被黏貼體接觸之外層的黏膠不含防靜電劑，而 在與基材薄膜接觸之面形成防靜電層κ圖解決上逑問題之 半導體晶圓的固定用膠帶已被提出（日本特開2000-183140) 。但，此膠帶，為了防止含有水溶性靜電防止劑之靜電防 止層之耐水性的低降，對靜電防止層須實施紫外線硬化處 理。上述耐水性低降的主要原因為水溶性之靜電防止劑之 .界面活性劑在切割（dicing)時使用超純水洗淨之製程中會 漏洩於該超純水中，同時靜電防止層本身之黏性會降低。 因此，為了提高耐水性，需防止界面活性劑之漏洩。依上 述，對膠帶之靜電防止層實施紫外線硬化處理雖可防止界 面活性劑之漏洩。但依此方法時製程變為複雜、增加製造 成本，而且為獲得膠帶之伸展性及耐水性的平衡須要精確 調整紫外線硬化度於適當範圍。 〈發明之課題〉 -5- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)574337 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (1) <Field of Invention> The present invention relates to a dicing tape with antistatic properties, especially for electrical, electronic and electronics A dicing tape with antistatic properties used in the production of semiconductor components. <Background of the invention> In the production of electrical, electronic and semiconductor components, in cutting and other processes, in order to fix or protect the components, adhesive tapes are generally used. Such tapes are, for example, those having a peelable acrylic resin adhesive layer coated on a base film, or having a high resistance to external forces when pasted on a base film, but can be peeled off with a small force when peeling. Persons who release the adhesive layer. The tape needs to be peeled when the predetermined process is finished. At this time, so-called peeling static electricity will be generated between the component and the tape. Because this static electricity will bring bad influence to the adherend (such as circuit, etc.), generally use the static-protection tape on the back of the base film, or add the tape or base film mixed with the anti-static agent to the adhesive layer. An intermediate layer of antistatic tape is formed between the adhesive layer and the adhesive layer. However, if the substrate of the circuit forming component is an insulating material such as ceramic or glass, the amount of static electricity generated is large and its attenuation is time-consuming. For such a component, even if the above-mentioned tape is used, a satisfactory antistatic effect cannot be obtained, and the circuit may be damaged. For this reason, at present, in the production process of the above-mentioned components, static electricity removal devices such as ionizers are further used to make it difficult for static electricity to occur. However, the above countermeasures still achieve satisfactory antistatic effects and reduce production efficiency. 1 4 A paper size applies to China National Standard (CNS) A4 (210 X 297 mm) --11 · J .----- Γ ^ ---------— up * (please first Read the notes on the back and fill in this page) 574337 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ____B7_____ V. Description of the invention (2) The prevention of static electricity from the strip of tape is generally considered not to be a base film, but to adhesive Calendar processing is effective. However, when the adhesive layer is mixed with additives such as surfactants, conductive fillers, or carbon black, which have antistatic effects, not only the physical properties of the adhesive or its change over time (which occurs over time) It becomes difficult to adjust or suppress), and the adhesive or mixed additives may be transferred to the adherend (such as a circuit, etc.) and contaminated during peeling. In this case, the surface of the adherend may be adhered with, for example, visible glue or granular matter observable by the naked eye, or liquid matter that is not optically observable, resulting in poor bonding of components in the following process, etc. Adverse effects. If the adhesive on the outer layer in contact with the adherend does not contain an antistatic agent, an antistatic layer is formed on the surface in contact with the substrate film. The adhesive tape for fixing semiconductor wafers has been proposed (Japan) JP 2000-183140). However, in order to prevent the water resistance of the static prevention layer containing a water-soluble antistatic agent from being lowered, the adhesive tape must be subjected to ultraviolet curing treatment. The main reason for the above-mentioned low water resistance is the water-soluble antistatic agent. The surfactant will leak into the ultrapure water during the process of dicing and wash with ultrapure water. At the same time, the antistatic layer itself The viscosity will decrease. Therefore, in order to improve water resistance, it is necessary to prevent leakage of the surfactant. According to the above, the ultraviolet curing treatment of the antistatic layer of the tape can prevent the leakage of the surfactant. However, in this method, the manufacturing process becomes complicated and the manufacturing cost is increased. In addition, in order to obtain the balance between the stretchability and water resistance of the tape, it is necessary to precisely adjust the ultraviolet curing degree to an appropriate range. 〈Problems of Invention〉 -5- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)
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574337 Α7 Β7 五、發明說明（3) 本發明係K提供一種對於被黏貼體之污染或黏膠劑之 物性之經時變化少且具有良好的靜電防止性能之防靜電切 割用膠帶為目的。另外，提供一種使用該靜電防止膠帶而 在不影響電路面之下實施切割之方法或保護方法。 〈發明之詳细說明〉 為達成上逑目的，經本發明人潛心研究结果發現，於 膠帶之黏膠組份中添加可藉光交聯的特定離子傳導性化合 物即可在防止黏膠劑污染被黏貼體及減少黏膠劑物性的經 時變化的情況下發揮防靜電功能，從而完成本發明。 即，依本發明提供如下之防靜電切割用膠帶： (1) 於基材薄膜的一面設有光交聯型防靜電黏膠劑層 (A)，而該黏膠劑層含有一具有末端醇鹽Ulkoxide)化之 聚氧化鐽（polyalkyleneoxide chain)之（甲基）丙烯酸酯 低聚物為特徵之防靜電切割用膠帶。 (2) 上逑（1)之膠帶之該（甲基）丙烯酸酯低聚物之丙 烯酸成份為15〜80質量％。 (3) 上述（1)或（2)之膠帶之該光交聯型防靜電黏膠 劑層（A)上面進一步疊置有不含防靜電劑之丙烯酸糸黏膠 劑層（B ) 〇 (4) 上述（1)或（2)之膠帶中之（甲基）丙烯酸酯低聚 物具有6個Μ上之不飽和雙鍵功能基。 (5) 上述（1)〜（3)之膠帶中之（甲基）丙烯酸酯低聚 物具有2個Μ上之不飽和雙鐽功能基。 本發明之防靜電切割用膠帶所用之基材薄膜為選自聚 ' 6 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -^1 1 ϋ n ϋ L n i n n ϋ n n I I . 經濟部智慧財產局員工消費合作社印製 574337 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（4 ) 乙烯、聚丙烯及聚丁烯等聚烯屬烴，或乙烯-醋酸乙烯酯 共聚合物、乙烯-(甲基）丙烯酸共聚合物及乙烯-(甲基）丙 烯酸酯共聚合物等共聚合物，軟質聚氯乙烯、半硬質聚氯 乙烯、聚酯、聚氨基甲酸乙酯、聚釀胺、聚亞醯胺、天然 橡膠及合成橡膠等之高分子單層膜或此等膜之複層膜。基 材薄膜κ具有可視光或紫外線透過性為佳，尤其具有紫外 線透過性為佳。 基材薄膜之厚度並無特別限制，但Μ 10〜50 yin較可 取，40〜500/iia更可取，40〜250/iiii最為可取。 本發明之切割用膠帶在其至少一面具有一由光交聯型 防靜電黏膠劑或由其溶液塗佈或塗佈後乾燥所得之黏膠劑 層（A) 〇 此黏膠劑層（A)所用之黏膠劑含有一具有末端醇鹽化 之聚氧化烯鐽之（甲基）丙烯酸酯低聚物。本發明之切割用 膠帶係K具有防靜電作用之界面活性劑之主成份之氧化烯 構造作為在超純水洗淨時難K漏洩之特定化學構造組入上 .述之防靜電黏膠劑層（A)，從而使該切劄用膠帶保持良好 之黏著性能及防靜電性能，實現低污染及良好之耐水性。 聚氧化烯鏈可例舉聚乙二醇、聚丙二醇、聚丁二醇等 所成之鐽。所謂之”末端醇鹽化”係指上述低聚物所有之聚 氧化烯鐽之末端由-0 Μ基（Μ代表鹸金屬原子，例子L i、 N a及K原子）取代之意。本發明所用之低聚物之聚合度， 雖無特別限制，但Μ 2〜20為佳。 另外，為了使光硬化後之切割用膠帶顯現充份之剝離 一Ί — 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 裝·-- (請先閱讀背面之注意事項寫本頁) 訂： 574337 A7 B7 五、發明說明（5 ) 性能，必須提高光硬化之效率Μ增高隨光硬化而表現之黏 膠劑的收縮率，降低其黏著性。 為使黏膠劑光硬化後降低黏著性，依本發明可如後述· ，使黏膠劑含有光聚合性化合物，或使用含有不飽和雙鍵 功能基之低聚物（oligomer)作為上述低聚物使用。 所用之低聚物K含有2個Μ上之不飽和雙鍵功能基者 較為可取，6個Κ上者更為可取。其上限雖然無特別之限 制，但以2G個Κ下為宜。低聚物之不飽和雙鐽功能基之數 太少時，防靜電性雖然不錯，但往往有光硬化後黏著性之 降低不夠，有污染被黏貼體之表面之問題發生。 尤其，僅Κ上述之黏膠層（Α)單一來作膠帶之黏膠層 時，為了提高光硬化後之黏著性之降低度且抑制防靜電成 份之漏洩，最好使用低聚物中含不飽和雙鐽功能基6個Κ 上者。 依本發明，為了進一步降低污染性，Μ上逑丙烯酸系 黏膠劑層（Β)作為最外層，同時在此黏膠劑層（Β)及基材 .薄膜之間設置上逑之黏膠劑層（Α)。在此場合，宜使低聚 物中之不飽和雙鐽功能基2個Κ上者，又若是欲提高光硬 化後之防靜電性能，則宜使用2個左右者。 本發明所謂之”不飽和雙鐽功能基”係指具有光聚合性 碳-碳雙鐽之功能基，例如甲基丙烯酸酯基及丙烯酸酯基 等。 本發明所用之可取低聚物係由下通式（1)所示之化合 物聚合所得之低聚物： - 8 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公 請 先 閱 讀 背 面 之- 注 項 再J m 寫 本 頁 I I I L 1 訂 經濟部智慧財產局員工消費合作社印製 574337 A7 B7 五、發明說明（6) R1574337 Α7 Β7 V. Description of the invention (3) The present invention aims to provide an antistatic cutting tape with little change over time in the contamination of the adherend or the physical properties of the adhesive, and has good antistatic performance. In addition, a method or a protection method using the static electricity prevention tape without affecting the circuit surface is provided. <Detailed description of the invention> In order to achieve the above objective, the inventors have made intensive research and found that adding a specific ion-conducting compound that can be crosslinked by light to the adhesive component of the tape can prevent the adhesive from being contaminated. The present invention achieves the antistatic function under the condition that the adhesive body and the time-dependent change of the physical properties of the adhesive are reduced. That is, according to the present invention, the following antistatic cutting tape is provided: (1) A photocrosslinkable antistatic adhesive layer (A) is provided on one side of a substrate film, and the adhesive layer contains a terminal alcohol An antistatic cutting tape characterized by a (meth) acrylate oligomer of a polyalkyleneoxide chain converted from a salt of Ulkoxide. (2) The acrylic content of the (meth) acrylate oligomer on the tape of (1) is 15 to 80% by mass. (3) The photo-crosslinkable antistatic adhesive layer (A) of the above (1) or (2) tape is further superimposed with an acrylic anti-static adhesive layer (B) without antistatic agent. 〇 ( 4) The (meth) acrylate oligomer in the above (1) or (2) tape has 6 unsaturated double bond functional groups on M. (5) The (meth) acrylate oligomer in the tapes (1) to (3) above has two unsaturated difluorene functional groups on M. The substrate film used in the antistatic cutting tape of the present invention is selected from the group of poly '6-This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling in this Page)-^ 1 1 ϋ n ϋ L ninn ϋ nn II. Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 574337 Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economy Α7 Β7 V. Description of the invention (4) Ethylene, polypropylene and Polyolefins such as polybutene, or copolymers such as ethylene-vinyl acetate copolymers, ethylene- (meth) acrylic copolymers, and ethylene- (meth) acrylate copolymers, soft polyvinyl chloride , Semi-rigid polyvinyl chloride, polyester, polyurethane, polyurethane, polyimide, natural rubber and synthetic rubber and other polymer monolayer films or multilayer films of these films. The base film κ preferably has visible light or ultraviolet transmittance, and particularly has ultraviolet transmittance. The thickness of the substrate film is not particularly limited, but M 10 to 50 yin is preferable, 40 to 500 / iia is more preferable, and 40 to 250 / iiii is most preferable. The cutting tape of the present invention has, on at least one of its masks, an adhesive layer (A) obtained by coating with a photo-crosslinking antistatic adhesive or by applying or drying the solution. This adhesive layer (A ) The adhesive used contains a (meth) acrylate oligomer having a terminal alcoholated polyoxyalkylene hafnium. The cutting tape of the present invention is an alkylene oxide structure having a main component of a surfactant having an antistatic effect. The specific chemical structure that is difficult for K to leak when washed with ultrapure water is incorporated. The antistatic adhesive layer described above (A), so that the cutting tape maintains good adhesion performance and antistatic performance, and realizes low pollution and good water resistance. Examples of the polyoxyalkylene chain include polyethylene glycol, polypropylene glycol, and polybutylene glycol. The so-called "terminal alcoholation" means that the terminal of the polyoxyalkylene 鐽 owned by the above oligomers is replaced by a -0 M group (M represents a 鹸 metal atom, for example, Li, Na and K atoms). Although the degree of polymerization of the oligomer used in the present invention is not particularly limited, M 2 to 20 is preferred. In addition, in order to make the cutting tape after light hardening appear fully peeled off — this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). Packing --- (Please read the precautions on the back first (Write this page) Order: 574337 A7 B7 V. Description of the invention (5) The performance must improve the light curing efficiency M increase the shrinkage rate of the adhesive that manifests with the light curing and reduce its adhesiveness. In order to reduce the adhesiveness of the adhesive after photo-curing, according to the present invention, the adhesive may include a photopolymerizable compound, or an oligomer containing an unsaturated double bond functional group may be used as the oligomer, as described later.物 用。 Use. It is preferable that the oligomer K used contains 2 unsaturated double bond functional groups on M, and 6 K is more preferable. Although the upper limit is not particularly limited, it is preferably 2G K. When the number of unsaturated difluorene functional groups in the oligomer is too small, although the antistatic property is good, the adhesiveness after light hardening is often not reduced enough, and the problem of contaminating the surface of the adherend occurs. In particular, when only the above-mentioned adhesive layer (A) is used as the adhesive layer of the adhesive tape, in order to improve the degree of reduction in adhesion after photocuring and suppress leakage of antistatic components, it is best to use an oligomer containing Saturated difluorene functional group 6 K. According to the present invention, in order to further reduce the contamination, the M upper acrylic adhesive layer (B) is used as the outermost layer, and the upper adhesive is arranged between the adhesive layer (B) and the substrate and the film. Layer (Α). In this case, it is advisable to add two unsaturated fluorene functional groups in the oligomer, and if it is to improve the antistatic performance after light hardening, use two or more. The "unsaturated difluorene functional group" in the present invention means a functional group having a photopolymerizable carbon-carbon difluorene, such as a methacrylate group and an acrylate group. The desirable oligomer used in the present invention is an oligomer obtained by polymerizing a compound represented by the following general formula (1):-8-This paper size is applicable to China National Standard (CNS) A4 (210 X 297), please read first On the back-Note item again J m Write this page IIIL 1 Order Printed by the Intellectual Property Bureau of the Ministry of Economy Staff Consumer Cooperatives 574337 A7 B7 V. Description of the invention (6) R1
I (CH2 = C- COO-H x 十 Y-R2-〇 十η Μ (1) 式中：R1為氫原子或甲基；R2為二醇殘基；Μ為鹼性 金屬原子；a代表1〜20之整數；η代表1〜5 (3之整數；X 代表R3-0基（其中R3為多元醇殘基）；Υ代表CONH-RiNHCOO 基（其中R4為二異氰酸鹽殘基）。 上式（1)中之二醇殘基係指從二醇去除所有之羥基後 之基。該二醇為例如碳原子數2〜100之直鐽或支鐽狀亞烴 基二醇（例如乙二醇、丙二醇、丁二醇）等。上述多元醇殘 基係指從多元醇去除所有之羥基後之基。該多元醇為例如 碳原子數2〜100之直鐽或支鐽狀亞烴基二醇。又，上述二 異氰酸鹽殘基係指從二異氰酸鹽除去所有之異氰酸鹽基後 之基。 本發明使用之低聚物可由習知方法製取，例如藉由紫 外線硬化法、游離基聚合法及電子線硬化法等。 經濟部智慧財產局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) #· 本發明使用之低聚物之分子量以重量平均分子量1Q00 〜2GQ()者為較可取，分子量太小時易轉移至被黏貼體上 而成被黏貼體表面污染之原因，反之太大時難得滿意之防 靜電效果。 本發明使用之低聚物中之丙烯酸成份（acrylic component )之比率[(甲基）丙烯酸酯低聚物中之由丙烯酸單體構成 之成份的比率]K 15〜80質量％,尤其20〜7.0質量X為較可 取。 -9 一 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 574337 A7 B7 五、發明說明（7) 適用之低聚物為例如新中村化學社製之U-6GUPA-60 (尿烷丙烯酸酯低聚物的商品名）。 本發明使用之具有末端醇鹽化之聚氧化烯鏈之（甲基） 丙烯酸酯低聚物會使黏膠劑具備離子傳導性。此乃因低聚 物中之聚氧化烯鐽被氧化烯化，而含於分子構造中之作為 氧化烯化金屬之如鋰雛子、鉀離子或鈉離子等離子半徑較 小之陽離子與該低聚物形成絡合物（complex),故而提供 離子傳導性。 為了充份的提供膠帶之防靜電性能，上逑之低聚物之 含量應設定為上述黏膠劑之30質量％,最好為30〜70質量 %，因含量太少時不能提供充份之防靜電性能，太多時不 能獲得充份黏著特性，易引起被黏貼表面之污染。 防靜電性能可藉測定膠帶之表面固有電阻、平衡帶電 壓及半衰期等加K評估。表面固有電阻愈低愈佳，例如依 JIS K6911對Advantest公司製R- 8 7 4 0 (商品名）測定之值 為 lxi〇-a 〜1Χ1012£2/口（ohms per square)，更佳為 1 、X10-8〜1X10 10 Ω/口。帶電壓及半衰期係例如使用 SHISHID0靜電公司製之靜電測定器（static honest meter )於施加電壓10KV測定時平衡帶電壓為〇〜〇·8ΚΗ(更可取 為0〜0.3KV)，而其半衰期（half life)最好為0〜10S(秒）。 上述低聚物K外之樹脂成份之黏膠劑基料聚合物可用 一般習知者，但以丙烯酸糸聚合物較為可取。具體而言， 由K丙烯酸酯為主要構成單體單元之單獨聚合物及共聚合 物選出之丙烯酸聚合體與其他功能性單體之共聚合物及此 -10 - 本紙張尺度適用中國國家標準（CNS)A4規袼（210 X 297公釐） •丨 — 1!!! · 1 I (請先閱讀背面之注客事項4||.寫本頁) 訂： 線- 574337 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（8 ) 等聚合物之混合物。上述丙烯酸酯可為丙烯酸乙酯、丙烯 酸丁酯、丙烯酸2.-乙基己酯、丙烯酸縮水甘油酯、丙烯酸 2-羥乙基酯等，而上述之丙烯酸酯亦可由甲基丙烯酸酯取 代0 另外，為了抑制接著性或凝集力目的，亦可使丙烯酸 或甲基丙烯酸、丙烯睛、醋酸乙烯酯等單體共聚合。由這 些單體聚合所得之丙烯酸糸聚合物之重量平均分子量宜在 5X 104 〜2X 10s,更可取為 4..0X 105 〜8.0X 105 範圍。 上述黏膠劑基料聚合物之含量，在上黏膠劑中佔3 0〜 70質量％為佳，40〜60質量％更佳。含量太少時黏著性不 夠，反之太多時無法顯現足夠之防靜電性能。 本發明中可視需要配設之上述不含防靜電劑之丙烯酸 系黏膠劑層（B)可藉由將通常使用之丙烯酸糸黏膠劑或其 溶液塗敷或塗敷後予K乾燥而配設。此種丙烯酸糸黏膠劑 可使用例如上述之丙烯酸糸聚合物。 本發明使用之黏膠劑可藉使用交聯劑任意的調整接著 .力及凝集力。可用之交聯劑包括：多價異氰酸鹽化合物， 例如甲代苯二異氰酸鹽、二笨甲烷二異氰酸鹽、己撐二異 氛酸鹽、異佛爾酮二異氰酸鹽及彼等之加合物（adduct); 多價環氧化合物，例如乙二醇二縮水甘油醚、對苯二酸二 縮水甘油酯丙婦酸酯等；多價氮丙啶（aziridine)化合物 ,例如三- 2,4, 6-U-吖丙啶基）-1,3, 5-三嗪、三[1-(2-甲 基）-吖丙啶基]膦化氧、六[1-(2-甲基）-fl、r丙啶基]三膦三 _等·，及螯合化合物，例如乙基乙醯醋酸鋁二異丙酸鹽及 -11- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） • ΙΙΙΙΙΙΙΙΜ· — ^· ^ I I I I I ---I I I I I--. (請先閱讀背面之注意事項再填寫本頁) 574337 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明說明（9 ) 三（乙基乙醯醋酸鋁）等。 上述之交聯劑的含量乃依所要求之黏著力適當調節， 通常佔黏膠劑之5〜10質量％。 在本發明中，用K調製黏膠劑溶液之溶劑雖無特別限 制，但可從醋酸乙酯、甲苯、丁酮、正己烷中選用。 本發明之切割用膠帶之黏著力係光照射前高而光照射 後會降低者，可依用途加K適當選擇，並無特別限制。例 如依JIS Z 0 2 3 7測定之值（該法為90度引拉剝除法、剝離 速度50επι/分，試Η為/矽晶圓）在光照射前之黏著力1〜6 Ν/2 5mm者為可取，光照射後之黏著力愈低愈佳，例如G . 01 〜0.3N/25fflffl者較可取。 本發明之切割用膠帶視需要藉光，較可取為藉紫外線 之照射使其黏著力降低。為此，一般使黏膠劑具有光交聯 性，Μ利光照射時顯現光硬化性，其一例為如上述，使黏 膠層中含有光聚合性化合物。 此種光聚合性化合物為例如揭示於日本特開昭60-196 .9 5 6號公報及特開昭6 0 - 2 2 3 1 3 9號公報之可因光照射形成 立體網狀化之化合物，即分子內含有至少2個Μ上之光聚 合性碳-碳雙鐽之低分子量化合物，例如三甲羥基丙烷三 丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、 二季戊四醇單經基五丙烯酸酯、二季戊四醇六丙烯酸酯或 1，4 -丁二醇二丙烯酸酯、1,6_己二醇二丙烯酸酯、聚乙二 _二丙烯酸酯Κ及市售之寡酯丙烯酸酯等。 本發明之黏膠層中之光聚合性化合物含量宜為1G〜50 - 12- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------ (請先閱讀背面之注意事項寫本頁)I (CH2 = C-COO-H x YY-R2-〇 Μη Μ (1) where: R1 is a hydrogen atom or a methyl group; R2 is a diol residue; M is a basic metal atom; a represents 1 An integer of ~ 20; η represents 1 ~ 5 (an integer of 3; X represents an R3-0 group (where R3 is a polyol residue); Υ represents a CONH-RiNHCOO group (where R4 is a diisocyanate residue). The diol residue in the above formula (1) refers to a group obtained by removing all hydroxyl groups from the diol. The diol is, for example, a straight or branched alkylene diol having 2 to 100 carbon atoms (for example, ethylene diethylene glycol) Alcohol, propylene glycol, butanediol), etc. The above polyol residue refers to a group obtained by removing all hydroxyl groups from a polyol. The polyol is, for example, a straight or branched alkylene glycol having 2 to 100 carbon atoms. In addition, the above diisocyanate residue refers to a group obtained by removing all the isocyanate groups from the diisocyanate. The oligomer used in the present invention can be prepared by a conventional method, for example, by UV curing Method, radical polymerization method, electron wire hardening method, etc. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) # · 本It is clear that the molecular weight of the oligomer used is preferably 1Q00 ~ 2GQ (). The molecular weight is too small and it is easy to transfer to the adherend to cause contamination on the surface of the adherend. Otherwise, it is difficult to obtain a satisfactory prevention. Static effect. The ratio of acrylic component in the oligomer used in the present invention [ratio of the component composed of acrylic monomer in (meth) acrylate oligomer] K 15 ~ 80 mass%, especially 20 ~ 7.0 quality X is preferable. -9 A paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) Printed by the Employees' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 574337 A7 B7 V. Invention Description (7 A suitable oligomer is, for example, U-6GUPA-60 (trade name of urethane acrylate oligomer) manufactured by Shin Nakamura Chemical Co., Ltd. (a methyl group having a terminal alcoholate polyoxyalkylene chain used in the present invention) ) Acrylate oligomer will make the adhesive have ionic conductivity. This is because the polyoxyalkylene fluorene in the oligomer is oxyalkylenated, and the oxyalkylene metal contained in the molecular structure, such as lithium, Potassium ion or The cations with a small ion radius of sodium ions form a complex with the oligomer, thus providing ionic conductivity. In order to fully provide the antistatic performance of the tape, the content of the upper oligomer should be set to the above 30% by mass of the adhesive, preferably 30 to 70% by mass, because too little anti-static performance cannot be provided when it is too small, and sufficient adhesive properties cannot be obtained when too much, which may easily cause contamination of the surface being adhered. The electrostatic performance can be evaluated by measuring the surface intrinsic resistance, equilibrium band voltage, and half-life of the tape plus K. The lower the surface intrinsic resistance, the better, for example, the value measured by R- 8 7 4 0 (trade name) manufactured by Advantest in accordance with JIS K6911. It is lxi〇-a ~ 1 × 1012 £ 2 / port (ohms per square), more preferably 1, X10-8 ~ 1X10 10 Ω / port. The charged voltage and half-life are, for example, using a static honest meter manufactured by Shishido Electrostatics Co., Ltd. at a voltage of 10 KV for measurement. The equilibrium band voltage is 0 to 0.8 KΗ (more preferably, 0 to 0.3 KV), and the half-life (half life) is preferably 0 to 10S (seconds). The adhesive base polymer of the resin component other than the above oligomer K may be used by a conventional one, but an acrylic acrylate polymer is preferable. Specifically, the copolymer of acrylic polymer and other functional monomers selected by K acrylate as the individual polymer and copolymer of main monomer units and this -10-This paper size applies to Chinese national standards ( CNS) A4 Regulations (210 X 297 mm) • 丨 — 1 !!! · 1 I (Please read the note on the back 4 ||. Write this page) Order: Line-574337 Employees, Bureau of Intellectual Property, Ministry of Economic Affairs Consumption cooperative prints A7 B7 V. Invention description (8) A mixture of polymers. The above acrylate may be ethyl acrylate, butyl acrylate, 2.-ethylhexyl acrylate, glycidyl acrylate, 2-hydroxyethyl acrylate, etc., and the above acrylate may be replaced by methacrylate. For the purpose of suppressing adhesion or cohesion, monomers such as acrylic acid or methacrylic acid, acrylonitrile, and vinyl acetate may be copolymerized. The weight average molecular weight of the acrylic fluorene polymer obtained by polymerizing these monomers is preferably in the range of 5X 104 to 2X 10s, and more preferably in the range of 4..0X 105 to 8.0X 105. The content of the above-mentioned adhesive base polymer is preferably 30 to 70% by mass in the upper adhesive, and more preferably 40 to 60% by mass. When the content is too small, the adhesiveness is not sufficient, and when the content is too large, sufficient antistatic performance cannot be exhibited. The above-mentioned acrylic antistatic agent-free acrylic adhesive layer (B), which may be provided in the present invention, may be prepared by applying or drying the acrylic fluorene adhesive or a solution thereof commonly used and then drying it by K. Assume. As the acrylic fluorene adhesive, for example, the acrylic fluorene polymer described above can be used. The adhesive used in the present invention can be arbitrarily adjusted by using a cross-linking agent, and then the adhesive force and the cohesive force can be adjusted. Useful crosslinkers include: polyvalent isocyanate compounds such as methylbenzene diisocyanate, dibenzyl diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate Salts and their adducts; polyvalent epoxy compounds, such as ethylene glycol diglycidyl ether, terephthalic acid diglycidyl propionate, etc .; polyvalent aziridine compounds , Such as tri-2,4,6-U-aziridinyl) -1,3,5-triazine, tris [1- (2-methyl) -aziridinyl] phosphine oxide, hexa [1 -(2-methyl) -fl, r-propidinyl] triphosphine tri- and the like, and chelating compounds, such as ethyl ethyl acetoacetate aluminum diisopropylate and -11- This paper size applies to Chinese national standards (CNS) A4 specifications (210 X 297 mm) • ΙΙΙΙΙΙΙΙΙΜ · — ^ · ^ IIIII --- IIII I--. (Please read the notes on the back before filling out this page) 574337 Α7 Β7 Employees of the Intellectual Property Office, Ministry of Economic Affairs Printed by Consumer Cooperatives V. Description of Invention (9) Tris (ethyl ethylacetate aluminum acetate), etc. The content of the above-mentioned cross-linking agent is appropriately adjusted according to the required adhesion, and usually accounts for 5 to 10% by mass of the adhesive. In the present invention, although the solvent for preparing the adhesive solution using K is not particularly limited, it can be selected from ethyl acetate, toluene, methyl ethyl ketone, and n-hexane. The adhesive force of the dicing tape of the present invention is high before light irradiation and decreases after light irradiation, and can be appropriately selected depending on the application plus K, and there is no particular limitation. For example, the adhesion value measured according to JIS Z 0 2 3 7 (this method is a 90-degree pull-and-strip method, a peeling speed of 50 επι / min, and a test wafer is a silicon wafer) 1 to 6 Ν / 2 5mm It is preferable that the lower the adhesion after light irradiation, the better. For example, G. 01 ~ 0.3N / 25fflffl is preferable. The cutting tape of the present invention borrows light if necessary, and it is more preferable to reduce the adhesion by irradiating with ultraviolet rays. For this reason, the adhesive is generally made photo-crosslinkable and exhibits photo-hardening properties when irradiated with light. An example of the photo-polymerizable compound is contained in the adhesive layer as described above. Such photopolymerizable compounds are, for example, compounds disclosed in Japanese Patent Application Laid-Open No. 60-196.96 and Japanese Patent Application Laid-Open No. 60- 2 2 3 1 3 9 which can be formed into a three-dimensional network by light irradiation. That is, low molecular weight compounds containing at least 2 photopolymerizable carbon-carbon difluorene on the molecule, such as trimethylhydroxypropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaerythryl pentaacrylate , Dipentaerythritol hexaacrylate or 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, polyethylene diacrylate K and commercially available oligoester acrylate, and the like. The content of the photopolymerizable compound in the adhesive layer of the present invention is preferably 1G ~ 50-12- The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ---------- -(Please read the notes on the back and write this page)
訂V ;線- 574337 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（10 ) 質量％，最好為20〜40質量％範圍。含量太少時光照射後 之黏著力的降低不足，反之過多時則紫外線硬化後之防靜 電性能會降低。 在本發明中，上逑之黏膠劑亦可含有光聚合起始劑， 含有此劑時可縮短光照射時之聚合硬化時間且可減少光照 射量。此種光聚合起始劑包括苯偶姻（即安息香）、苯偶姻 甲醚、苯偶姻乙醚、苯偶姻丙醚、芊基二苯基硫化物、一 硫化四甲基秋蘭姆、偶氮二異丁睛、二苯基乙烷、二甲基 二嗣、/9 -氯蒽醌等。此種光聚合起始劑係對光聚合性化 合物100質量份通常使用0.1〜10質量份。 本發明所用之黏膠劑可藉由上述之構成，在光照射前 對於被黏貼體發揮充份之黏著力，而在光照射後顯著減低 黏著力。 因此，具有由此黏膠劑形成之光交聯型黏膠層之本發 明切割用膠帶，在光照射前可使切割用膠帶與被黏貼體充 分密貼而確實地固定被黏貼體，同時在光照射後可使其容 .易的從被黏貼體剝離。 本發明之上述黏膠劑層之厚度可依被黏貼體而適當的 設定，雖無特別的限制，但一般較可取為5〜3〇win。 由切割用膠帶引起之被黏貼體之污染程度可藉測定表 面污染粒子之數予K評估。例如，切割用膠帶剝離後，被 黏貼體上之粒徑上之粒狀物質之數目愈少愈好， 尤其零（〇)最好。 本發明之防靜電切割用膠帶，不但可當作電氣、電子 - 13 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） — — — — — — — — — — I— - I I ! I I Γ I « — — — — — — I— — — — — — — ll-lf—Γ (請先閱讀背面之注意事項再填寫本頁) 574337 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（11 ) 、半導體組件之製造時，例如矽晶圓、玻璃、陶瓷、聚合 物等之切割時之膠帶使用，同時又具有保護其基板之作用。 使用本發明切割用膠帶之切割方法包括，但不限定為 ，將該膠帶黏貼於例如形成有多數之電子電路之板狀裝置 的背面，利用切刀將其分割成多數之電路元件，依此便能 有效的減少電子電路面因剝離而帶靜電或受殘留黏膠之污 染，製取品質優良之電路元件。 除了上述之具有防靜電性能及低污染性能之外，尚具 有切割用膠帶所必備之黏著性能及耐水性能。因此，本發 明之切割用膠帶特別有用於對靜電敏感之高性能半導體製 品之切割，甚且可有效防止由靜電引起之損傷導致半導體 製品之製造效率之減低。 玆依實施例詳细說明本發明於下： 實施例1 Μ厚度IQO^id之聚乙烯（PE)薄膜作為基材薄膜，於該 基材薄膜之表面形成由丙烯酸糸聚合物、具有被鋰醇鹽化 .之聚氧化烯鐽之6功能基丙烯酸酯低聚物（重量平均分子 量1500,新中村化學公司製，商品名U-601 LPA-6 0，其低 聚物中之不飽和雙鍵功能基數6,丙烯酸成份65質量：Π、 多價異氡酸鹽化合物及光聚合起始劑Κ 1 Q 0 : 1 5 0 : 8 : 5之 固形份質量比混合調製而成之紫外線交聯型剝離性黏膠劑 層（厚度20/im)作為本發明之紫外線交聯型剝離性型之防 靜電膠帶。 -14 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------— 裝---------訂-------- (請先閱讀背面之注意事項再填寫本頁) 574337 A7 B7 五、發明說明（l2 ) 實施例2 除使用由丙烯酸系聚合物、具有被鋰醇鹽化之聚氧化 烯鐽之6功能基丙烯酸酯低聚物（重量平均分子量1 5 0 0， 新中村化學公司製，商品名U-601 LPA-60，其低聚物中之 不飽和雙鍵功能基數6,丙烯酸成份65質量X)、多價異氰 酸鹽化合物及光聚合起始劑K 1 0 0 : 1 G 0 : 8 : 5.之固形份質 量比混合調製黏膠層之外，其餘悉依實施例1製取本發明 之紫外線交聯型剝離性型之防靜電膠帶。 實施例3 Μ厚度10 0/i in之聚乙烯（PE)薄膜作為基材薄膜，於該 基材薄膜之表面形成由丙烯酸糸聚合物、具有被鋰醇鹽化 之聚氧化烯鏈之2功能基丙烯酸酯低聚物（重量平均分子 量1500，新中村化學公司製，商品名U-601 LHA-60,其低 聚物中之不飽和雙鐽功能基數2,丙烯酸成份20質量X)、 多價異氰酸鹽化合物及光聚合起始劑K100: 80: 8: 5之 固形份質量比混合調製而成之紫外線交聯型剝離性黏膠劑 .層（厚度10 u a)作為本發明之紫外線交聯型剝離性型之防 靜電膠帶。 比較例1 除6功能基丙烯酸酯低聚物Μ非本發明規定之低聚物 之市售酯丙烯酸酯低聚物（新中村化學公司製，商品名ϋ-6 H A F)替代之外，其餘悉依實施例1製取紫外線交聯型剝 離性型之防靜電膠帶。 _ 1 5- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） - — till — — — — — — . ------_ί 訂-------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 574337 A7 __ B7 五、發明說明（I3 ) 比較例2 (請先閱讀背面之注意事項再填寫本頁) 除使用由丙烯酸系黏膠劑1〇〇質量份、重量平均分子 量1QGG之聚乙二醇5G質量份及過氯酸鋰5重量份混合而. 成之混合物形成防靜電黏膠劑層（厚度之外，其餘 悉依實施例3製取紫外線交聯型剝離性型之防靜電膠帶。 〈防靜電切割用膠帶之性能試驗〉 對上述實施例1〜3及比較例1、2製得之各膠帶，依 下逑各試驗測定其表面固有電阻、帶靜電壓、紫外線（[JV) 照射前後之黏著力、表面污染粒子數及耐水性，结果如表 1所示。 A)表面固有電阻值 使用Advantest公司製R-87 4 0 (電阻測定器，商品名） 依JIS K6911測定。 B )平衡帶電壓及半衰期 使用SHISHI DO靜電公司製之靜電測定器於施加電壓 .1 0 K V下測定。 C) 黏著力 經濟部智慧財產局員工消費合作社印製 依JIS Z 0 2 3 7測定紫外線（DV)照射前及照射後之黏 著力（紫外線照射量為lOOOroJ/cDi2)。試驗用之被黏貼體具 矽晶圓鏡面，試驗用90度引拉剝除法，剝離速度50πιιη/分。 D) 表面污染粒子數 於半導體晶圓表面黏貼膠帶，照射紫外線lGOOmJ/ci^ 後剝離膠帶。然後用表面雜質檢査裝置（商品名Surf scan -16- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 574337 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（14) 6 4 2 0，KLA-Tencor公司製）測定粒子數。 E)耐水性 將黏貼固定於切割用膠帶之半導體晶圚切割成丨roHI平 方之晶片後，利用超純水洗淨，此時不剝離者為〇（良好） ，剝離者為X (不好）。 表1Order V; line-574337 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of invention (10) Mass%, preferably in the range of 20 to 40 mass%. When the content is too small, the reduction of adhesion after light irradiation is insufficient. On the other hand, when the content is too large, the antistatic property after ultraviolet curing is reduced. In the present invention, the adhesive of the upper layer may also contain a photopolymerization initiator. When the agent is contained, the polymerization hardening time during light irradiation can be shortened and the amount of light irradiation can be reduced. Such photopolymerization initiators include benzoin (ie benzoin), benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, fluorenyl diphenyl sulfide, tetramethylthiuram monosulfide, Azobisisobutyl, diphenylethane, dimethyldifluorene, / 9-chloroanthraquinone, and the like. Such a photopolymerization initiator is usually used in an amount of 0.1 to 10 parts by mass per 100 parts by mass of the photopolymerizable compound. The adhesive used in the present invention can have the above-mentioned structure, exert sufficient adhesive force on the adherend before light irradiation, and significantly reduce the adhesive force after light irradiation. Therefore, the dicing tape of the present invention having the light-crosslinkable adhesive layer formed by the adhesive can sufficiently adhere the dicing tape and the adherend before light irradiation, and securely fix the adherend. After light irradiation, it can be easily peeled off from the adherend. The thickness of the above-mentioned adhesive layer of the present invention can be appropriately set depending on the adherend, although there is no particular limitation, it is generally preferably 5 to 30 wins. The degree of contamination of the adherend caused by the cutting tape can be evaluated by measuring the number of contaminated particles on the surface. For example, after the cutting tape is peeled off, the smaller the number of particulate matter on the particle size on the adherend, the better, especially zero (0). The antistatic cutting tape of the present invention can not only be used as electrical and electronic products.-13-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) — — — — — — — — — — — -II! II Γ I «— — — — — — — I — — — — — — ll-lf—Γ (Please read the notes on the back before filling out this page) A7 B7 V. Description of the Invention (11) When manufacturing semiconductor components, such as silicon wafers, glass, ceramics, polymers, etc., the tape is used while protecting the substrate. The cutting method using the dicing tape of the present invention includes, but is not limited to, adhering the tape to, for example, the back surface of a plate-shaped device in which a large number of electronic circuits are formed, and dividing it into a plurality of circuit elements using a cutter, and so on Can effectively reduce the static electricity of the electronic circuit surface due to peeling or contamination by residual adhesive, and produce circuit components of good quality. In addition to the above-mentioned antistatic performance and low pollution performance, it also has the necessary adhesion properties and water resistance properties for cutting tapes. Therefore, the dicing tape of the present invention is particularly useful for cutting high-performance semiconductor products sensitive to static electricity, and can effectively prevent damage caused by static electricity from reducing the manufacturing efficiency of semiconductor products. The following is a detailed description of the present invention with reference to the following examples: Example 1 A polyethylene (PE) film with a thickness of 100 μm as a substrate film is formed on the surface of the substrate film. Acrylic acid polymer and lithium alcohol Salinization. Polyoxyalkylene 低 6-functional acrylate oligomer (weight average molecular weight 1500, manufactured by Shin Nakamura Chemical Co., trade name U-601 LPA-6 0, its unsaturated double bond function in the oligomer Base number 6, acrylic component 65 mass: Π, polyvalent isophosphonate compound and photopolymerization initiator K 1 Q 0: 1 5 0: 8: 5 solid-state mass ratio mixed and prepared by ultraviolet crosslinking peeling The adhesive layer (thickness 20 / im) is used as the UV-crosslinkable peelable antistatic tape of the present invention. -14-This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)- -------— Install --------- Order -------- (Please read the notes on the back before filling this page) 574337 A7 B7 V. Description of the invention (l2) Example 2 Except the use of an acrylic polymer and a 6-functional acrylate oligomer having a polyoxyalkylene fluorinated with lithium alkoxide (weight average Sub-quantity 1 500, manufactured by Shin Nakamura Chemical Co., under the trade name U-601 LPA-60, the unsaturated double bond functional group number 6 in its oligomer, acrylic mass 65 mass X), polyvalent isocyanate compound And photopolymerization initiator K 1 0 0: 1 G 0: 8: 5. In addition to the solid content mass ratio of the mixed adhesive layer, the rest of the UV cross-linking release type of the present invention was prepared according to Example 1. Example 3 An anti-static tape with a thickness of 10 0 / in in a polyethylene (PE) film was used as a base film, and the surface of the base film was formed with a polyacrylic acid polymer and a lithium alkoxide-polymerized poly-oxide. Alkenyl chain 2 functional group acrylate oligomer (weight average molecular weight 1500, manufactured by Shin Nakamura Chemical Co., Ltd., trade name U-601 LHA-60, the number of unsaturated difluorene functional groups in the oligomer is 2, acrylic acid content 20 mass X), a polyvalent isocyanate compound, and a photopolymerization initiator K100: 80: 8: 5 with a solid mass ratio of ultraviolet cross-linking release adhesive. The layer (thickness 10 ua) is used as The ultraviolet-crosslinkable peeling type antistatic tape of the present invention. Comparative Example 1 6-functional acrylate Except that the polymer M is not a commercially available ester acrylate oligomer (manufactured by Shin Nakamura Chemical Co., Ltd., trade name ϋ-6 HAF) other than the oligomer specified in the present invention, the rest is prepared in accordance with Example 1 to obtain an ultraviolet crosslinked type. Peel-off type anti-static tape. _ 1 5- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)-— till — — — — — — —---_ Order- ------- (Please read the notes on the back before filling out this page) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 574337 A7 __ B7 V. Description of Invention (I3) Comparative Example 2 (Please read the back Please fill in this page again) Except using 100 parts by mass of acrylic adhesive, 5 parts by mass of polyethylene glycol with a weight average molecular weight of 1QGG and 5 parts by weight of lithium perchlorate. The resulting mixture forms an antistatic Adhesive layer (except for the thickness, the rest is made in accordance with Example 3 to prepare an ultraviolet-crosslinkable peelable antistatic tape. <Performance test of antistatic cutting tape> For each of the tapes prepared in Examples 1 to 3 and Comparative Examples 1 and 2, the surface specific resistance, static voltage, and ultraviolet ([JV) irradiation were measured according to the following tests. The adhesive force before and after, the number of surface contamination particles, and water resistance are shown in Table 1. A) Surface specific resistance value Measured in accordance with JIS K6911 using R-87 4 0 (resistance tester, trade name) manufactured by Advantest. B) Equilibrium band voltage and half-life were measured using an electrostatic measuring device manufactured by Shishi Do Electrostatics Co., Ltd. at an applied voltage of .10 KV. C) Adhesive force Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Measure the adhesive force before and after UV (DV) irradiation in accordance with JIS Z 0 2 37 (UV exposure is 1000roJ / cDi2). The adhered body used in the test had a silicon wafer mirror surface. The test used a 90-degree pull-and-peel method with a peeling speed of 50 μm / min. D) Number of surface contamination particles Adhere the tape to the surface of the semiconductor wafer, and then peel off the tape after irradiating the UV light with 1 GOOmJ / ci ^. Then use a surface impurity inspection device (brand name Surf scan -16- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 574337 printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs A7 B7 V. Description of the invention (14) 6 4 2 0, manufactured by KLA-Tencor Corporation) The number of particles was measured. E) Water resistance After the semiconductor wafer bonded and fixed on the dicing tape is cut into wafers with squared square roots, wash them with ultrapure water. At this time, those that do not peel off are 0 (good), and those that peel off are X (bad). . Table 1
防靜電性 能 實細1 實施例2 實施例3 比較例1 比較例2 表面固有電阻值 (Ω/Π) IX109 1X1010 1X1011 1X10“ 1X1011 平衡帶電壓(kV) 0.01 0.2 0.8 3.0 0.6 半衰期(s) 1 K下 1 2 1100 2 黏著力 (N/25 丽） W照射前 2.1 3.1 5.2 5.9 6.5 UV照射後 0.16 0.15 0.23 0.1 0.41 表面污染粒子數 3 4 2 7· 5 耐水性 〇 〇 〇 Ο . X 由上表可知，比較例1之膠帶因不含有本發明規定之 低聚物，即防靜電成份，故極易帶靜電。比較例2之膠帶 因含有防靜電成份之聚乙二醇，故具有防靜電性能，但耐 水性不好（X )。 對此，本發明實施例1〜3之膠帶具有良好之防靜電 性能，而且紫外線（UV)照射前之黏著力高，照射後之黏著 力低，同時被黏貼體（晶圓）之表面污染明顯較少，耐水性 良好（〇）。 -17- 本紙張尺度適用中國國家標準（CNS)A4規格(210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -------訂---------線.Actual antistatic performance 1 Example 2 Example 3 Comparative example 1 Comparative example 2 Surface specific resistance (Ω / Π) IX109 1X1010 1X1011 1X10 "1X1011 Balance band voltage (kV) 0.01 0.2 0.8 3.0 0.6 Half-life (s) 1 K Lower 1 2 1100 2 Adhesion (N / 25 Li) W Before irradiation 2.1 3.1 5.2 5.9 6.5 After UV irradiation 0.16 0.15 0.23 0.1 0.41 Number of surface pollution particles 3 4 2 7 · 5 Water resistance 〇〇〇〇. It can be seen that the tape of Comparative Example 1 is highly susceptible to static electricity because it does not contain the oligomer specified in the present invention, that is, an antistatic component. The tape of Comparative Example 2 has antistatic properties because it contains polyethylene glycol with antistatic components However, the water resistance is not good (X). In this regard, the tapes of Examples 1 to 3 of the present invention have good antistatic performance, and have high adhesion before ultraviolet (UV) irradiation, low adhesion after irradiation, and The surface contamination of the adherend (wafer) is significantly less, and the water resistance is good (〇). -17- This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back first (Fill in this page again) ------- Order --------- Line.