CN1394930A - Anti-electrostatic cutting band - Google Patents
Anti-electrostatic cutting band Download PDFInfo
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- CN1394930A CN1394930A CN02140142A CN02140142A CN1394930A CN 1394930 A CN1394930 A CN 1394930A CN 02140142 A CN02140142 A CN 02140142A CN 02140142 A CN02140142 A CN 02140142A CN 1394930 A CN1394930 A CN 1394930A
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- Prior art keywords
- antistatic
- mentioned
- band
- methyl
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D33/00—Details of, or accessories for, sacks or bags
- B65D33/002—Rolls, strips or like assemblies of bags
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D33/00—Details of, or accessories for, sacks or bags
- B65D33/06—Handles
- B65D33/065—Integral handles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D33/00—Details of, or accessories for, sacks or bags
- B65D33/16—End- or aperture-closing arrangements or devices
- B65D33/1608—Integral flaps for tying above the bag
Abstract
An antistatic dicing tape and its characteristic is that the tape has a photocrosslinkable antistatic adhesive layer on one side of a substrate film, which comprises a (meth) acrylate oligomer having a polyalkylene oxide chain the termination of which is converted to an alkoxide.
Description
Technical field
The present invention relates to have the cutting belt of antistatic property, particularly relate to and produce electrical equipment, electronics, half
1The cutting belt of using during parts with antistatic property.
Technical background
Just know for many years when producing electrical equipment, electronic unit, semiconductor device, in cutting action and other operations as the stickup band of fixing and guard block.As such stickup band, can enumerate the stickup band of the acrylic acid series bond layer that on the substrate material film, is provided with and external force be had very strong resistivity, the stickup band of the photo-crosslinking type releasable bond layer that just can peel off with very little power when peeling off when pasting with releasable.Stripped down though when the predetermined process operation finishes, should paste band, and at this moment, can produce to be called between parts and the stickup band and peel off electrostatic static.This static can be to being made a very bad impression by fit (for example circuit etc.), for suppressing this influence, use stickup band, add and mix the stickup band of static inhibitor and between substrate material film and bond layer, make the stickup band in antistatic middle layer to bond layer through antistatic treatment in substrate material film rear side.
, when the parts substrate that forms circuit was insulating material such as pottery and glass, the generation of static electricity amount was very big, and need take time and eliminate.For such parts, even use above-mentioned stickup band, antistatic effect is also insufficient, damages the dangerous big of circuit.For this reason, in the production process of above-mentioned parts, for example, also will further use Destaticizing devices such as ionizer, this moment, surrounding environment was difficult to produce static.
Yet, in above countermeasure, can not get sufficient antistatic effect, production efficiency is low, and protectiveness is also insufficient.
In order to prevent that pasting band peels off static,, be only effectively and the caking agent side handled not in the substrate material side.; in caking agent, add tensio-active agent and electroconductive stuffing, carbon black one class have the material of antistatic effect the time; bonding rerum natura and through the time adjustment that changes; and even suppress all to be difficult to; and; the material of caking agent and interpolation self all can be transferred to by on fit when peeling off, and forms pollution hazard.At this moment, the saccharoid of being seen by macroscopic pasty state residue and microscopically on the fit surface attachment or adhere to the fraction that optics can not be observed, operation afterwards can produce the bonding bad influence that waits to parts.
Also know, with by the fit outer bond layer that joins in do not contain with pollute relevant static inhibitor, by with the contacted interface of substrate material film on form antistatic layer, sheet material (spy opens 2000-183140) that the fixedly semi-conductor chip that addresses the above problem is used.Yet this sheet material contains water miscible static inhibitor, reduces for preventing the antistatic layer water tolerance, and antistatic layer is carried out the UV hardening treatment, and this processing becomes the factor that expense increases again.Reducing water-proof major cause is, the time utilizes in the operation that ultrapure water washs in cutting, and the tensio-active agent of water-solubility electrostatic resistance agent can leak in this ultrapure water, causes the bonding force of antistatic layer to reduce.Therefore, for improving water tolerance, must make this tensio-active agent non-leakage.To carry out the UV sclerosis as above-mentioned sheet antistatic layer, also can prevent this tensio-active agent seepage.Yet, utilize this method to cause manufacturing expense to increase, complex process for the extendability and the water tolerance of balancing band, must be adjusted to proper range with the UV hardenability.
Abstract of invention
The purpose of this invention is to provide a kind of to affixed object pollute little and paste rerum natura through the time change little, and the high antistatic dicing band of antistatic property.What this antistatic stickup band of use also was provided influences little cutting method or guard method to circuit face.
Above-mentioned and other purpose of the present invention, feature and advantage are clearer and more definite according to following record meeting.
Describe in detail
Present inventors are for achieving the above object, that furthers investigate found that, paste the caking agent composition of band, if use the specific ion conductivity compound of Photocrosslinkable, not can because of caking agent to by fit pollution and paste rerum natura through the time change to wait and cause the reliability reduction, and can give anti-static function, finished the present invention based on this opinion.
The invention provides following method:
(1) antistatic dicing band, it is characterized in that on a face of substrate material film, having and contain the antistatic bond layer of photo-crosslinking type (A) that (methyl) origoester acrylate forms, and above-mentioned containing (methyl) origoester acrylate end be the polyalkyleneimine chain of pure salinization;
(2) the antistatic dicing band of (1) record, the acrylic component that it is characterized in that above-mentioned (methyl) origoester acrylate is 15～80 quality %;
(3) the antistatic dicing band of (1) or (2) record is characterized in that going up the also laminated acrylic acid series bond layer (B) that does not contain static inhibitor at the antistatic bond layer of above-mentioned photo-crosslinking type (A);
The antistatic dicing band of (4) (1)～(a 2) record, the unsaturated double-bond official energy radix that it is characterized in that above-mentioned (methyl) origoester acrylate is more than 6;
The antistatic dicing band of (5) (1)～(a 3) record, the unsaturated double-bond official energy radix that it is characterized in that above-mentioned (methyl) origoester acrylate is more than 2.
As the above-mentioned substrate material film that uses in the antistatic dicing band of the present invention, can use the unitary film of polymers such as polyolefine such as polyethylene, polypropylene and polybutene, ethylene-vinyl acetate copolymer, ethene-(methyl) acrylic copolymer and ethene-ethylene copolymers such as (methyl) acrylate copolymer, soft PVC, semi-rigid polyvinyl chloride, polyester, urethane, polymeric amide, polyimide, natural rubber and synthetic rubber, or their multicoat membrane.The substrate material film preferably visible light or the ultraviolet ray permeable, and the ultraviolet ray permeable be good especially.
The thickness of substrate material film, though there is not particular restriction, 10～500 μ m are preferred, and 40～500 μ m are preferred, and 40～250 μ m are particularly preferred.
Cutting belt of the present invention is the coating antistatic caking agent of photo-crosslinking type or its solution on its single face at least, or carry out the bond layer (A) that drying obtains after being coated with this solution.
Among the present invention, the caking agent that uses in this bond layer (A) contains (methyl) origoester acrylate, and the end that is somebody's turn to do (methyl) origoester acrylate is the polyalkyleneimine chain of pure salinization.Cutting belt of the present invention be will have antistatic property the alkylene oxide tectonic association of tensio-active agent main component in antistatic bond layer (A), this specific chemical constitution is even also be difficult to seepage when washing with ultrapure water.In view of the above, cutting belt can keep good stickup performance and antistatic property, can realize low contaminative and excellent water tolerance again.
As polyalkyleneimine chain, can enumerate the chain that forms by polyoxyethylene glycol, polypropylene glycol or polytetramethylene glycol etc.Said herein terminal alcohol salinization is meant the polyalkylene oxide chain end that above-mentioned oligopolymer has, and carries out the metathetical product with-OM base (M represents alkali metal atom, as Li atom, Na atom, K atom etc.).The polymerization degree of the oligopolymer that uses among the present invention does not have particular restriction, but preferably 2～20.
In order to make cutting belt behind photo-hardening, form sufficient stripping performance, the most important thing is to improve photo-hardening efficient, improve the shrinking percentage of caking agent when following photo-hardening, reduce cementability.
Among the present invention,, as following, in caking agent, also can contain the optical polymerism compound, but, also can use the compound that has the unsaturated double-bond functional group in the oligopolymer as above-mentioned oligopolymer in order to reduce the cementability behind the photo-hardening.
Among the present invention, this unsaturated double-bond functional group's number is preferably in more than 2, better more than 6.Though this upper limit without limits, is preferably in below 20.When unsaturated double-bond official in the oligopolymer was can radix very few, though static resistance is fine, the cementability behind the photo-hardening can not fully reduce, or sometimes by fit surperficial contaminated.
Particularly Dai bond layer only when forming, for cementability after improving photo-hardening reduces, suppresses the seepage of antistatic composition by above-mentioned a kind of bond layer (A) simultaneously, and the number of the unsaturated double-bond functional group in the above-mentioned oligopolymer is preferably in more than 6.
Among the present invention, for further reduce contaminative, aforesaid propylene acid be set be bond layer (B) as outermost layer, above-mentioned bond layer (A) also can be set between this bond layer (B) and substrate material film.At this moment, unsaturated double-bond official in the above-mentioned oligopolymer can be preferably in more than 2 by radix, in order to improve the antistatic property behind the photo-hardening, is preferably about 2.
Bond layer among the present invention both can be a multilayered structure, also can be arranged on the two sides of substrate material film.
Said unsaturated double-bond functional group is meant and has optical polymerism carbon-to-carbon double bond functional group among the present invention, and is for example methacrylate based, acrylate-based etc.
The preferred oligopolymer that uses among the present invention is that the compound with following general formula (1) expression carries out polymerization and the oligopolymer that obtains.
General formula (1):
[in the formula, R
1Expression hydrogen atom or methyl, R
2Expression diol residue, M represent to have as above-mentioned convertible alkali metal atom, m and represent 1～20 integer, and n represents 1～50 integer.X is with R
3-O (R wherein
3Expression polyvalent alcohol residue) base of expression, and Y is with CONH-R
4-NHCOO (wherein, R
4Expression vulcabond residue) base of expression].
In the above-mentioned general formula (1), said diol residue is meant removes the base that forms behind the hydroxyl fully from glycol.As this glycol, the straight or branched alkylene glycol (for example, ethylene glycol, propylene glycol, tetramethylene glycol) of 2～100 carbon atoms etc. is arranged specifically.Above-mentioned polyvalent alcohol residue is meant removes the base that forms behind whole hydroxyls from polyvalent alcohol.As polyvalent alcohol, the straight or branched alkylene glycol of 2～100 carbon atoms etc. is for example arranged.Above-mentioned vulcabond residue is meant removes the base that forms after whole isocyanate group from vulcabond.
The oligopolymer that uses among the present invention can utilize polymerization process manufacturing commonly used, this is not had particular restriction, and UV cured method, radical polymerization method, electronics line hardening process etc. are for example arranged.
The oligomer molecules amount of using among the present invention, in weight-average molecular weight, preferably 1000～20000.When molecular weight is too small, to by fit transfer, become easily easily by the major reason of fit surface contamination.When excessive, be difficult to obtain sufficient antistatic effect.
In the oligopolymer that the present invention uses, the ratio of acrylic component (in (methyl) origoester acrylate, the constituent ratio of Acrylic Acid Monomer) is preferably 15～80 quality %, more preferably 20～70 weight %.
As the oligopolymer that uses among the present invention, the urethane acrylate oligomer U-601 LPA-60 (trade(brand)name) of Xin Zhong village chemistry society system is for example arranged.
(methyl) origoester acrylate of the polyalkyleneimine chain with terminal alcohol salinization that uses among the present invention is given ionic conductivity to caking agent.This is by pure salinization because of the polyalkyleneimine chain in the oligopolymer, the positively charged ion that lithium ion, potassium ion or the sodium ion plasma radius ratio that contains in molecular configuration as pure salinization metal is less and this oligopolymer form the complexing body, so think ionic conductivity is provided.
In order to give sufficient antistatic property, the content of above-mentioned oligopolymer is preferred more than 30 quality % in above-mentioned caking agent, is preferred at 30～70 weight %.When its content is very few, can not give sufficient antistatic property, and too much the time, be difficult to obtain sufficient adhesion properties, and be easy to pollute being formed by fit.
Can estimate antistatic property by measuring surperficial intrinsic resistance value, balancing band voltage and the transformation period etc. of cutting belt.The surface intrinsic resistance value is low more good more, for example, according to JIS K6911, uses (strain) ア De バ Application テ ス ト system R-8740 (trade(brand)name) measured value, 1 * 10
8～1 * 10
12Ω/ is preferred, 1 * 10
8～1 * 10
10Ω/ is preferred.Balancing band voltage and transformation period for example, make the electrostatic measurement instrument of society of シ シ De chamber of commerce system, and applied voltage 10kV measures, and balancing band voltage is that (better 0～0.3kV), its transformation period is preferably 0～10s to 0～0.8kV.
As the caking agent matrix polymer of the resinous principle beyond the above-mentioned oligopolymer, people know before can using, but acrylic acid polymer preferably.The concrete use from acrylate as the acrylic acid polymer of selecting the homopolymer of main composition monomeric unit and the multipolymer, with other functional monomers' multipolymer and these mixture of polymers.For example, as acrylate, preferably use ethyl propenoate, butyl acrylate, 2-EHA, glycidyl acrylate, vinylformic acid 2-hydroxyl ethyl ester etc., with the aforesaid propylene acid esters, it also is preferred for example replacing to methacrylic ester etc.
And then, in order to control cementability and cohesive force, also monomers such as acrylic or methacrylic acid, vinyl cyanide, vinyl acetate between to for plastic can be carried out copolymerization.The weight-average molecular weight of the acrylic acid polymer that these monomer copolymerizations are obtained is preferably 5 * 10
4～2 * 10
6, and 4.0 * 10
5～8.0 * 10
5Be preferred.
The content of above-mentioned caking agent matrix polymer be preferably 30～70 quality % in above-mentioned caking agent, and 40～60 quality % is preferred.When content is very few, can not give sufficient cementability, in the time of too much, be difficult to give sufficient antistatic property.
The above-mentioned acrylic acid series bond layer (B) that does not contain static inhibitor also can be set among the present invention, can be with acrylic acid series caking agent or its solution coat of usefulness usually, or carry out drying formation after the coating.As such acrylic acid series caking agent, for example can enumerate aforesaid propylene acid based polymer.
The caking agent that uses among the present invention can be located at arbitrary value with bonding force and cohesive force by using linking agent, and clinging power can be adjusted to desired value.As such linking agent, polyvalent isocyanate compound, multivalence epoxy compounds, multivalence aziridine cpd, inner complex etc. are arranged.As the polyvalent isocyanate compound, specifically can use cresylene vulcabond, '-diphenylmethane diisocyanate, HDI, isophorone diisocyanate and their adducts type.As the multivalence epoxy compounds, concrete used ethylene glycol diglycidylether, terephthalic acid 2-glycidyl ester acrylate etc.As multivalence ethylenimide compound, concrete uses three-2,4,6-(1-'-aziridino)-1,3,5-triazines, three [1-(2-methyl)-'-aziridino] phosphine oxide, six [1-(2-methyl)-'-aziridino] three phosphorus triazines etc.As inner complex, concrete used ethyl acetoacetic acid aluminium diisopropyl acid esters, aluminium three (ethyl acetoacetic ester) etc.
The content of above-mentioned linking agent is preferably adjusted according to desired bounding force, and 5～10 quality % suit in above-mentioned caking agent.
Among the present invention,, do not have particular determination, vinyl acetic monomer, toluene, methylethylketone, normal hexane etc. are for example arranged as the spendable solvent of above-mentioned adhesive solution.
High before the cutting belt bounding force of the present invention, illumination, the crosslinked back of illumination reduces, and can suitably select according to its purposes, this is not had particular restriction.
Silicon chip), the bounding force before the illumination is preferably 1～6N/25mm for example, the value of measuring according to JIS Z 0237 (is peeled off method, peeling rate 50mm/ minute, test board for 90 °:.Bounding force after the illumination is low more good more, for example 0.01～0.3N/25mm (more preferably 0.01～0.2N/25mm) preferably.
Cutting belt of the present invention, as required, to above-mentioned bond layer irradiates light, preferably irradiation ultraviolet radiation reduces bounding force.For this reason, caking agent given photocrosslinking reaction and make have photo-hardening and extensively adopt, for example, make and contain optical polymerism compound etc. in the above-mentioned bond layer.
As such optical polymerism compound, for example be extensive use of the spy open disclosed in clear 60-196956 communique and the clear 60-223139 communique of Te Kai, utilize rayed can form three-dimensional nettedization, have the low-molecular weight compound of 2 above optical polymerism carbon-to-carbon double bonds at intramolecularly at least.Concrete available Viscoat 295, pentaerythritol triacrylate, tetramethylol methane tetraacrylate, Dipentaerythritol monohydroxy five acrylate, dipentaerythritol acrylate or 1,4-butylene glycol diacrylate, 1,6 hexanediol diacrylate, polyethyleneglycol diacrylate, low ester acrylate of buying from market etc.
In the caking agent that the present invention uses, the content of above-mentioned optical polymerism compound is preferably 10～50 quality %, more preferably 20～40 quality %.When content was very few, the bounding force after the illumination reduced insufficient, and during more than this scope, the antistatic property after the UV sclerosis reduces.
Among the present invention, also can contain light trigger in the above-mentioned caking agent.The polymerization setting time and the quantity of illumination when containing light trigger and can reduce rayed are ideal.As such light trigger, concrete have bitter almond oil camphor, benzoin methylether, ethoxybenzoin, benzoin iso-propylether, benzyl diphenyl sulfide, the waste basic single sulfide of tetramethyl-di-methylamine, Diisopropyl azodicarboxylate, dibenzyl, diacetyl, a β-chloroanthraquinone etc.The consumption of light trigger, the optical polymerism compound with respect to 100 mass parts is generally 0.1～10 mass parts.
The caking agent that uses among the present invention, according to above formation, for being had a sufficient adhesive by fit, bounding force significantly reduces after the illumination before the illumination.
Therefore, has the cutting belt of the present invention of the photo-crosslinking type bond layer that forms by this caking agent, before illumination, cutting belt and formed tight joint with sufficient adhesive by fit, fixing securely by fit, after the illumination, again can be easily from being stripped down by fit.
The thickness of bond layer among the present invention can not have particular restriction according to suitably being set by fit of using to this, but 5～30 μ m preferably.
By measuring surface contamination population etc., can estimate cutting belt to by fit pollution level.For example, few more good more after cutting belt is peeled off by the particle-like substance quantity more than the fit last 0.3 μ m, preferably be 0.
Antistatic dicing band of the present invention, when making electrical equipment, electronics, semiconducter device, for example, the stickup band of using during not only as sections such as silicon chip, glass, pottery, polymkeric substance, and, this substrate is also had provide protection.
Dicing method as using cutting belt of the present invention for example, is attached to the back side of the tabular device that is formed by several electronic circuits, cuts into slices the method that circuit element is cut apart.According to the dicing method that uses cutting belt of the present invention, can effectively reduce the electronic circuit face peeled off influences such as static and pollution.
Antistatic dicing band of the present invention has excellent antistatic energy and low pollutant performance, and, good as desired adhesiveproperties of cutting belt and water resistance.Therefore, antistatic dicing band of the present invention, the semiconductor article section particularly suitable very high to electrostatic susceptibility also can effectively prevent because of electrostatic damage, causes the qualification rate of semiconductor article to reduce.
Followingly illustrate in greater detail the present invention, but the present invention is not limited by these embodiment according to embodiment.
Embodiment
Embodiment 1
Polyethylene (PE) film of thickness 100 μ m is used as the substrate material film, on an interarea of this substrate material film, the bond layer (thickness 20 μ m) of the ultraviolet-crosslinkable type releasable type that formation obtains by following cooperation, promptly, with acrylic acid polymer, 6 functional acrylic ester oligomer (weight-average molecular weight: 5500 with polyalkyleneimine chain of lithium alcohol salinization, Xin Zhong village chemistry society system, trade(brand)name U-601 LPA-60, unsaturated double-bond official in the oligopolymer can radix be 6, acrylic component is 65 weight %), polyvalent isocyanate compound and light trigger, by 100: 150: 8: 5 solids component mass ratio cooperated.Make the antistatic stickup band of ultraviolet-crosslinkable type releasable type of the present invention.
Embodiment 2
Except with the acrylic acid polymer among the embodiment 1, have 6 functional acrylic ester oligomer (weight-average molecular weight: 5500 of the polyalkyleneimine chain of lithium alcohol salinization, Xin Zhong village chemistry society system, trade(brand)name U-601LPA-60, unsaturated double-bond official in the oligopolymer can radix be 6, acrylic component is 65 quality %), the solids component mass ratio of polyvalent isocyanate compound and light trigger is taken as 100: 100: 8: outside 5, other are the same with embodiment 1, make the antistatic stickup band of ultraviolet-crosslinkable type releasable type of the present invention.
Embodiment 3
Thickness 100 μ m polyethylene (PE) films are used as the substrate material film, on an interarea of this substrate material film, form the antistatic bond layer (thickness 10 μ m) that obtains by following cooperation, promptly, acrylic acid polymer, 2 functional acrylic ester oligomer (weight-average molecular weight: 5500 with polyalkyleneimine chain of lithium alcohol salinization, Xin Zhong village chemistry society system, trade(brand)name U-601-LHA2, unsaturated double-bond official in the oligopolymer can radix be 2, acrylic component is 20 weight %), polyvalent isocyanate and light trigger, by 100: 80: 8: 5 solids component mass ratio cooperated.And then on this caking agent aspect, form and not contain antistatic composition, the common UV sclerotic type bond layer of acrylic acid series caking agent (thickness 10 μ m) is made the antistatic stickup band of ultraviolet-crosslinkable type releasable type of the present invention.
Comparative example 1
Except the above-mentioned 6 functional acrylic ester oligomers among the embodiment 1 being replaced to the oligopolymer that is not the present invention and stipulates, commercially available ester acrylic acid oligomer (Xin Zhong village chemistry society system, trade(brand)name U-6HAF) outside, other are fully the same with embodiment 1, make the antistatic stickup band of ultraviolet-crosslinkable type releasable type.
Comparative example 2
Except the antistatic bond layer among the embodiment 3 being taken as the layer (thickness 10 μ m) that forms by following proportioning, promptly, polyoxyethylene glycol 50 mass parts of acrylic acid series caking agent 100 mass parts, weight-average molecular weight 1000 and the proportioning of lithium perchlorate's 5 mass parts, other are the same with embodiment 3, make the antistatic stickup band of ultraviolet-crosslinkable type releasable type.The performance test of antistatic dicing band
For the various stickup bands that obtain in the foregoing description 1～3 and the comparative example 1,2, by shown below each test, measure bounding force, surface contamination population, water tolerance behind its surperficial intrinsic resistance, static voltage, the UV pre-irradiation, obtain table 1 result.
The surface intrinsic resistance value:
According to JIS K6911, use (strain) ア De バ Application テ ス ト system R-8740 (trade(brand)name) to measure.
Balance static voltage and transformation period:
Use the electrostatic measurement instrument of society of シ シ De chamber of commerce system, applied voltage is 10kV, measures.
Bounding force:
According to JIS Z 0237, (the UV irradiation dose is 1000mJ/cm to measure bounding force behind the UV pre-irradiation respectively
2).The test usefulness by fit be the silicon chip minute surface, with peeling rate 50mm/ minute, carry out 90 ° of stripping tests.
The surface contamination population:
To paste band and be attached on the semiconductor chip, with 1000mJ it is carried out UV irradiation after, peel off and paste band.The above population of 0.3 μ m on this sheet after measure pasting band and peel off with Superficial Foreign Body inspection units (trade(brand)name Surfscan 6420, KLA-Tencor society system).
Water tolerance:
Attach the fixed semiconductor chip with cutting belt, cut into the square semi-conductor chip of 1mm, utilize ultrapure water to wash, what this moment, semi-conductor chip was not peeled off is taken as zero, produce being taken as of peeling off *.
Table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example 1 | Comparative example 2 | ||
| Antistatic property | The surface intrinsic resistance value (Ω/) | ????1×10 9 | ???1×10 10 | ??1×10 11 | ??1×10 14 | ??1×10 11 |
| Balance static voltage (kV) | ????0.01 | ???0.2 | ??0.8 | ??3.0 | ??0.6 | |
| Transformation period (s) | Below 1 | ???1 | ??2 | ??1100 | ??2 | |
| Bounding force (N/25mm) | Before the UV | ????2.1 | ???3.1 | ??5.2 | ??5.9 | ??6.5 |
| Behind the UV | ????0.16 | ???0.15 | ??0.23 | ??0.1 | ??0.41 | |
| The surface contamination population | ????3 | ???4 | ??2 | ??7 | ??5 | |
| Water tolerance | ????○ | ???○ | ??○ | ??○ | ??× | |
As shown in Table 1, the stickup band of comparative example 1 does not contain the oligopolymer of the present invention's regulation, owing to do not contain antistatic composition, is very easy to charged.The stickup band of comparative example 2, owing to contain polyoxyethylene glycol as static inhibitor, thus have antistatic property, but water tolerance is inferior.
Opposite with it, from the result of embodiment 1～3 as can be known, antistatic dicing band of the present invention, antistatic property is good, the bounding force height of UV pre-irradiation, the postradiation bounding force of UV is low, and not contaminated by fit surface, water tolerance is also fine.
Though the present invention is described with its example, we do not do special appointment, for our invention, even in a certain details of explanation, do not make qualification yet,, can do the understanding of wide region at the spirit and scope of the invention shown in the violation of a right claimed range not.
Claims (5)
1. an antistatic dicing band is characterized in that, by containing the antistatic bond layer of photo-crosslinking type (A) that (methyl) origoester acrylate forms, and the end of above-mentioned (methyl) origoester acrylate is the polyalkyleneimine chain of pure salinization on the substrate material film.
2. according to the antistatic dicing band of claim 1 record, it is characterized in that the acrylic component of above-mentioned (methyl) origoester acrylate is 15～80 quality %.
3. according to the antistatic dicing band of claim 1 or 2 records, it is characterized in that the unsaturated double-bond official energy radix of above-mentioned (methyl) origoester acrylate is more than 6.
4. according to the antistatic dicing band of claim 1 or 2 records, it is characterized in that, go up the acrylic acid series bond layer (B) that further formation does not contain static inhibitor at the antistatic bond layer of above-mentioned photo-crosslinking type (A).
5. according to the antistatic dicing band of claim 4 record, it is characterized in that the unsaturated double-bond official energy radix of above-mentioned (methyl) origoester acrylate is more than 2.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001203831 | 2001-07-04 | ||
| JP203831/01 | 2001-07-04 | ||
| JP203831/2001 | 2001-07-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1394930A true CN1394930A (en) | 2003-02-05 |
| CN100404569C CN100404569C (en) | 2008-07-23 |
Family
ID=19040396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB02140142XA Expired - Lifetime CN100404569C (en) | 2001-07-04 | 2002-07-03 | Anti-electrostatic cutting band |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4247956B2 (en) |
| KR (1) | KR100889888B1 (en) |
| CN (1) | CN100404569C (en) |
| TW (1) | TW574337B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101326254B (en) * | 2005-10-14 | 2010-09-08 | Lg化学株式会社 | Acrylic pressure sensitive adhesive compositions |
| CN103865416A (en) * | 2012-12-10 | 2014-06-18 | 日东电工株式会社 | Dicing tape integrated adhesive sheet, method of manufacturing semiconductor device using dicing tape integrated adhesive sheet, and semiconductor device |
| CN105492558A (en) * | 2013-08-30 | 2016-04-13 | 琳得科株式会社 | Sheet for processing semiconductor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4865192B2 (en) * | 2004-03-16 | 2012-02-01 | 古河電気工業株式会社 | Semiconductor fixing adhesive tape |
| JP4664005B2 (en) * | 2004-05-11 | 2011-04-06 | リンテック株式会社 | Manufacturing method of semiconductor chip with adhesive layer |
| JP4800778B2 (en) * | 2005-05-16 | 2011-10-26 | 日東電工株式会社 | Dicing pressure-sensitive adhesive sheet and processing method of workpiece using the same |
| KR100980187B1 (en) | 2005-06-07 | 2010-09-03 | 주식회사 엘지화학 | Polarizing plate |
| KR100838973B1 (en) * | 2005-06-08 | 2008-06-17 | 주식회사 엘지화학 | Acrylic pressure sensitive adhesive compositions |
| KR100784991B1 (en) * | 2005-06-10 | 2007-12-11 | 주식회사 엘지화학 | Acrylic pressure-sensitive adhesive compositions |
| KR100812507B1 (en) * | 2005-08-19 | 2008-03-11 | 주식회사 엘지화학 | Acrylic Pressure Sensitive Adhesive Composition |
| US20070082196A1 (en) * | 2005-10-07 | 2007-04-12 | Ali Mahfuza B | Antistatic additive and tapes made therefrom |
| JP2008055710A (en) * | 2006-08-30 | 2008-03-13 | Nitto Denko Cs System Kk | Antistatic adhesive tape |
| JP4994895B2 (en) * | 2007-03-09 | 2012-08-08 | リンテック株式会社 | Adhesive sheet |
| JP5328132B2 (en) * | 2007-04-11 | 2013-10-30 | 積水化学工業株式会社 | Semiconductor processing tape |
| JP5361244B2 (en) * | 2008-05-15 | 2013-12-04 | 日本カーバイド工業株式会社 | Adhesive composition for optical member surface protective film and optical member surface protective film |
| US20120291944A1 (en) * | 2010-08-06 | 2012-11-22 | Nitto Denko Corporation | Method of producing electronic component |
| JP2013209559A (en) * | 2012-03-30 | 2013-10-10 | Furukawa Electric Co Ltd:The | Ultraviolet light curable adhesive tape for processing semiconductor device |
| JP6656222B2 (en) * | 2015-03-03 | 2020-03-04 | リンテック株式会社 | Semiconductor processing sheet |
| WO2017169958A1 (en) * | 2016-03-31 | 2017-10-05 | 三井化学東セロ株式会社 | Adhesive film for semiconductor wafer processing |
| CN109913154A (en) * | 2019-03-20 | 2019-06-21 | 上海百卡新材料科技有限公司 | Chip cutting UV visbreaking film |
| JP7005805B1 (en) | 2021-04-28 | 2022-02-10 | 藤森工業株式会社 | tape |
| US20230369136A1 (en) * | 2022-05-13 | 2023-11-16 | Adeia Semiconductor Bonding Technologies Inc. | Bonding surface validation on dicing tape |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5534322A (en) * | 1993-06-29 | 1996-07-09 | Kao Corporation | Recording medium |
| JP3038542B2 (en) * | 1996-01-18 | 2000-05-08 | 三洋化成工業株式会社 | Antistatic pressure sensitive adhesive |
| JP3673590B2 (en) * | 1996-03-12 | 2005-07-20 | 新中村化学工業株式会社 | UV curable conductive composition |
| JP2000129235A (en) * | 1998-10-27 | 2000-05-09 | Minnesota Mining & Mfg Co <3M> | Antistatic pressure-sensitive adhesive composition |
| JP3907331B2 (en) * | 1998-12-21 | 2007-04-18 | 電気化学工業株式会社 | Semiconductor wafer fixing sheet |
| JP2001011411A (en) * | 1999-07-02 | 2001-01-16 | Toray Ind Inc | Composition for adhesive |
| KR100387536B1 (en) * | 2000-10-18 | 2003-06-18 | 주식회사 루밴틱스 | Optical Adhesive Composition for manufacturing optical adhesive filler and a method for manufacturing optical adhesive using the same |
-
2002
- 2002-06-24 JP JP2002183712A patent/JP4247956B2/en not_active Expired - Lifetime
- 2002-06-28 TW TW91114248A patent/TW574337B/en not_active IP Right Cessation
- 2002-07-03 CN CNB02140142XA patent/CN100404569C/en not_active Expired - Lifetime
- 2002-07-03 KR KR1020020038279A patent/KR100889888B1/en active IP Right Grant
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101326254B (en) * | 2005-10-14 | 2010-09-08 | Lg化学株式会社 | Acrylic pressure sensitive adhesive compositions |
| CN103865416A (en) * | 2012-12-10 | 2014-06-18 | 日东电工株式会社 | Dicing tape integrated adhesive sheet, method of manufacturing semiconductor device using dicing tape integrated adhesive sheet, and semiconductor device |
| CN105492558A (en) * | 2013-08-30 | 2016-04-13 | 琳得科株式会社 | Sheet for processing semiconductor |
| TWI636113B (en) * | 2013-08-30 | 2018-09-21 | 琳得科股份有限公司 | Semiconductor processing sheet |
| CN105492558B (en) * | 2013-08-30 | 2019-03-22 | 琳得科株式会社 | Sheet for processing semiconductor material |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030004136A (en) | 2003-01-14 |
| JP4247956B2 (en) | 2009-04-02 |
| KR100889888B1 (en) | 2009-03-20 |
| CN100404569C (en) | 2008-07-23 |
| TW574337B (en) | 2004-02-01 |
| JP2003105292A (en) | 2003-04-09 |
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