JP4824944B2 - Adhesive sheet - Google Patents
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- JP4824944B2 JP4824944B2 JP2005142241A JP2005142241A JP4824944B2 JP 4824944 B2 JP4824944 B2 JP 4824944B2 JP 2005142241 A JP2005142241 A JP 2005142241A JP 2005142241 A JP2005142241 A JP 2005142241A JP 4824944 B2 JP4824944 B2 JP 4824944B2
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Description
本発明は、粘着シートにかかり、特に、表面保護用又は各種電子部材を製造する工程において使用される粘着シートに関する。 The present invention relates to a pressure-sensitive adhesive sheet, and particularly relates to a pressure-sensitive adhesive sheet used for surface protection or in a process of manufacturing various electronic members.
粘着シートが偏光板、その他の表面保護用に用いられた場合、その粘着シートは、表面保護対象部材に粘着された後、その表面保護対象部材から剥離される。剥離時にその粘着シートに剥離帯電という静電気が生じ、その静電気が表面保護対象部材に悪影響を及ぼすことがあった。 When the pressure-sensitive adhesive sheet is used for polarizing plates or other surface protection, the pressure-sensitive adhesive sheet is peeled off from the surface protection target member after being adhered to the surface protection target member. At the time of peeling, static electricity such as peeling charge is generated on the pressure-sensitive adhesive sheet, and the static electricity may adversely affect the surface protection target member.
粘着シートが板状に形成された半導体ウエハ、チップ状の部品等の電子部品集合体に貼り付けられた後、バックグラインド工程やダイシング工程等を経て、電子部品から剥離されときにも、剥離帯電が生じ、電子部品が静電気破壊してしまった。また、バックグラインド時やダイシング時に摩擦による摩擦帯電という静電気が生じることがあり、この静電気によっても、電子部品が静電気破壊してしまった。 Even when the adhesive sheet is attached to an electronic component assembly such as a semiconductor wafer or chip-like component formed in a plate shape, and then peeled off from the electronic component through a back grinding process, a dicing process, etc. The electronic component was destroyed by static electricity. In addition, static electricity such as frictional charging due to friction may occur during back grinding or dicing, and this static electricity also causes electronic components to break down.
かかる課題を解決する技術として、特許文献１のように粘着剤層に帯電防止剤を添加した合成樹脂用の表面粘着材や、特許文献２のように基材層と粘着剤層の中間に帯電防止層を設けた帯電防止粘着シートや、特許文献３のように基材フィルム又はシートの粘着剤層が形成されている面の反対面にプラズマ処理を施し、表面固有抵抗を１×１０１２Ω以下とした粘着テープがある。
しかし、特許文献１では、基材層が絶縁性であるため、被着体に貼り付ける前、また、貼り付けた後も基材は摩擦帯電してしまい、被着体である半導体デバイスに不具合を発生させてしまった。 However, in Patent Document 1, since the base material layer is insulative, the base material is triboelectrically charged before and after being attached to the adherend, and the semiconductor device as the adherend is defective. Has been generated.
特許文献２では、ダイシング時に切断され露出される帯電防止層内の帯電防止剤が、ダイシング時に高圧で吹き付けられる水によって流れ出して帯電防止効果を消失したり、ダイシング刃により帯電防止剤が掻き上げられ電子部品を汚染したりする場合があった。 In Patent Document 2, the antistatic agent in the antistatic layer that is cut and exposed during dicing flows out by water sprayed at a high pressure during dicing and loses the antistatic effect, or the antistatic agent is scraped up by a dicing blade. In some cases, electronic components were contaminated.
特許文献３では、粘着剤が絶縁性であるため、ダイシング時のダイシング刃との摩擦帯電や、被着体を剥離する際に剥離帯電が生じ、被着体に不具合を発生させてしまった。 In Patent Document 3, since the adhesive is insulative, frictional charging with the dicing blade during dicing, or peeling charging occurs when the adherend is peeled off, causing problems on the adherend.
本発明は、被着体の障害を引き起こす剥離帯電と摩擦帯電の両方を生じ難くし、更に被着体の電子部品への汚染が少ない粘着シートを提供するものである。 The present invention provides a pressure-sensitive adhesive sheet that hardly causes both peeling charging and frictional charging that cause failure of the adherend, and that is less contaminated with electronic parts of the adherend.
請求項１にかかる発明は、シート状の基材と、基材の一方又は双方の面に粘着層を有する粘着シートにおいて、上記基材及び上記粘着層のうちの少なくとも一方が導電性材料を含有し、粘着シート全体の体積抵抗率が、２.０×１０ １２ Ωｃｍ以上１.７×１０ １４ Ωｃｍ以下である表面保護用粘着シートである。 The invention according to claim 1 is a pressure-sensitive adhesive sheet having a sheet-like base material and an adhesive layer on one or both surfaces of the base material, wherein at least one of the base material and the adhesive layer contains a conductive material. and the volume resistivity of the whole adhesive sheet is 2.0 × 10 12 surface protective pressure sensitive adhesive sheet is 1.7 × 10 14 Ωcm or less than [Omega] cm.
請求項２にかかる発明は、シート状の基材と、基材の一方又は双方の面に粘着層を有する粘着シートにおいて、上記基材及び上記粘着層のうちの少なくとも一方が導電性材料を含有し、粘着シート全体の体積抵抗率が２.０×１０ １２ Ωｃｍ以上１.０×１０ １３ Ωｃｍ以下である電子部材用粘着シートである。 The invention according to claim 2 is a pressure-sensitive adhesive sheet having a sheet-like base material and an adhesive layer on one or both surfaces of the base material, wherein at least one of the base material and the adhesive layer contains a conductive material. And the volume resistivity of the whole adhesive sheet is 2.0 * 10 < 12 > ohm-cm or more and 1.0 * 10 < 13 > ohm-cm or less the adhesive sheet for electronic members .
請求項１にかかる発明にあっては、粘着シートの体積抵抗率を２.０×１０ １２ Ωｃｍ以上１.７×１０ １４ Ωｃｍ以下にすることにより、剥離帯電に対して高い帯電防止効果を発揮する粘着シートを得ることができた。 In the invention according to claim 1, when the volume resistivity of the pressure-sensitive adhesive sheet is set to 2.0 × 10 12 Ωcm or more and 1.7 × 10 14 Ωcm or less, a high antistatic effect with respect to peeling charging is exhibited. A pressure-sensitive adhesive sheet was obtained.
請求項２にかかる発明にあっては、剥離帯電と摩擦帯電の両方に対して高い帯電防止効果を発揮する粘着シートを得ることができた。 In the invention according to claim 2 , it was possible to obtain a pressure-sensitive adhesive sheet exhibiting a high antistatic effect against both peeling charging and frictional charging.
本発明にかかる粘着シートの体積抵抗率を１×１０１５Ωｃｍ以下とするのは、剥離帯電と摩擦帯電の両方の影響を低下させるためである。被着体が静電気の影響を受けやすい電子部材の場合には、粘着シートの体積抵抗率を１×１０１３Ωｃｍ以下とするのが好ましい。 The reason why the volume resistivity of the pressure-sensitive adhesive sheet according to the present invention is 1 × 10 15 Ωcm or less is to reduce the influence of both peeling charging and friction charging. In the case where the adherend is an electronic member that is easily affected by static electricity, the volume resistivity of the pressure-sensitive adhesive sheet is preferably 1 × 10 13 Ωcm or less.
粘着シートの体積抵抗率を１×１０１５Ωｃｍ以下、さらには１×１０１３Ωｃｍ以下とするためには、粘着シートの基材と粘着層の少なくとも一方又は双方に導電性材料、例えば帯電防止剤（アニオン系、カチオン系、両性、非イオン性）、帯電防止可塑剤、導電性ポリマー、金属系導電性フィラー、カーボンブラック、カーボンナノチューブ、イオン性液体を練り込むことによって、達成する。例えば高い体積抵抗率（例えば塩化ビニルやポリプロピレンの体積抵抗率は１×１０１６Ωｃｍ前後、アクリル系粘着剤の体積抵抗率は１×１０１５Ωｃｍ以上）を有する樹脂組成物や粘着剤組成物に導電性材料を適当量練り込むことによって、粘着シート全体、基材又は粘着剤層の体積抵抗率を１×１０１５Ωｃｍ以下、さらには１×１０１３Ωｃｍ以下にすることができる。例えば、基材素材として重合度１０５０の塩化ビニル１００質量部に帯電防止可塑剤（旭電化社製ＬＶ−８３８）を５０質量部添加することで、体積抵抗率は２．２×１０９Ωｃｍとなる。 In order to set the volume resistivity of the pressure-sensitive adhesive sheet to 1 × 10 15 Ωcm or less, and further to 1 × 10 13 Ωcm or less, a conductive material such as an antistatic agent is used for at least one or both of the base material and the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet. (Anionic, cationic, amphoteric, nonionic), an antistatic plasticizer, a conductive polymer, a metallic conductive filler, carbon black, carbon nanotube, and ionic liquid. For example, a resin composition or a pressure-sensitive adhesive composition having a high volume resistivity (for example, a volume resistivity of vinyl chloride or polypropylene is around 1 × 10 16 Ωcm, and a volume resistivity of an acrylic pressure-sensitive adhesive is 1 × 10 15 Ωcm or more). By kneading an appropriate amount of the conductive material, the volume resistivity of the entire pressure-sensitive adhesive sheet, base material, or pressure-sensitive adhesive layer can be reduced to 1 × 10 15 Ωcm or less, and further to 1 × 10 13 Ωcm or less. For example, by adding 50 parts by mass of an antistatic plasticizer (LV-838 manufactured by Asahi Denka Co., Ltd.) to 100 parts by mass of vinyl chloride having a polymerization degree of 1050 as a base material, the volume resistivity is 2.2 × 10 9 Ωcm. Become.
本発明にかかる粘着シートの基材の素材としては、導電性材料との相関で適宜選択でき、具体的にはポリ塩化ビニル、ポリエチレン、ポリプロピレン、ポリエステル、エチレンビニルアルコール、ポリウレタン、ポリアミド、ポリイミドがある。基材は、その厚みを用途に応じて適宜選択でき、シート状、テープ状、フィルム状等のいずれであってもよく、単層でも複層でもよい。基材と粘着剤の密着性向上の為に、基材にコロナ放電やアンカーコート等の処理を施しても良い。 The material of the base material of the pressure-sensitive adhesive sheet according to the present invention can be appropriately selected depending on the correlation with the conductive material, and specifically includes polyvinyl chloride, polyethylene, polypropylene, polyester, ethylene vinyl alcohol, polyurethane, polyamide, and polyimide. . The thickness of the substrate can be appropriately selected depending on the application, and may be any of a sheet shape, a tape shape, a film shape, etc., and may be a single layer or a multilayer. In order to improve the adhesion between the base material and the adhesive, the base material may be subjected to treatment such as corona discharge or anchor coating.
本発明にかかる粘着層の粘着性樹脂組成物は、導電性材料との相関で適宜選択でき、具体的にはゴム粘着剤、アクリル粘着剤、ウレタン粘着剤、シリコーン粘着剤を挙げることができる。 The pressure-sensitive adhesive composition of the pressure-sensitive adhesive layer according to the present invention can be appropriately selected depending on the correlation with the conductive material, and specific examples thereof include a rubber pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, a urethane pressure-sensitive adhesive, and a silicone pressure-sensitive adhesive.
上記粘着剤中に、本発明の目的が損なわれない範囲で、従来公知の添加剤、例えば粘着付与剤、硬化剤、可塑剤、光重合性化合物、光開始剤、発泡剤、重合禁止剤、老化防止剤、充填剤を適宜選択して添加してもよい。 In the above-mentioned pressure-sensitive adhesive, as long as the purpose of the present invention is not impaired, conventionally known additives such as tackifiers, curing agents, plasticizers, photopolymerizable compounds, photoinitiators, foaming agents, polymerization inhibitors, An antioxidant and a filler may be appropriately selected and added.
この粘着シートの用途としては、表面保護用、電子部材用があり、電子部材用としては、ダイシング用、バックグラインド用がある。 Applications of this pressure-sensitive adhesive sheet include surface protection and electronic member use, and electronic member use includes dicing use and back grinding use.
粘着剤を基材に塗工する方法は、例えばコーター法、スクリーン法、グラビア法、メッシュ法等がある。塗工された粘着剤の厚みは、乾燥後の厚みで１〜１００μｍである。 Examples of methods for applying the adhesive to the substrate include a coater method, a screen method, a gravure method, and a mesh method. The thickness of the applied pressure-sensitive adhesive is 1 to 100 μm as the thickness after drying.
以下に本発明について、表１を用いて、実施例・比較例を挙げて詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to Table 1 with examples and comparative examples.
実施例１の粘着シートは、基材として厚さ１００μｍで導電性材料（三洋化成社製ペレスタット３００）を５質量％練り込んだポリプロピレン製シートと、基材の一方の面に乾燥時に厚さ２５μｍの粘着層を設けたものである。ここで、粘着層は、粘着性樹脂組成物としてアクリル粘着剤（２−エチルヘキシルアクリレート９６質量％及び２−ヒドロキシエチルアクリレート４質量％を共重合させたもの）を１００質量部、硬化剤としてイソシアネート硬化剤（日本ポリウレタン工業社製Ｌ−４５Ｅ）を３質量部配合したものに、導電性材料としてイオン性液体（広栄化学工業社製ＩＬ−Ａ２）を５質量部添加したものである。なお、他の比較例にあっては、特に言及した部分以外、実施例１と同様である。 The pressure-sensitive adhesive sheet of Example 1 has a thickness of 100 μm as a base material and a polypropylene sheet kneaded with 5% by mass of a conductive material (Pelestat 300 manufactured by Sanyo Chemical Co., Ltd.), and a thickness of 25 μm when dried on one surface of the base material. The adhesive layer is provided. Here, the pressure-sensitive adhesive layer is 100 parts by mass of an acrylic pressure-sensitive adhesive (96% by mass of 2-ethylhexyl acrylate and 4% by mass of 2-hydroxyethyl acrylate) as an adhesive resin composition, and is isocyanate-cured as a curing agent. 5 parts by mass of an ionic liquid (IL-A2 manufactured by Guangei Chemical Industry Co., Ltd.) as a conductive material is added to one containing 3 parts by mass of an agent (L-45E manufactured by Nippon Polyurethane Industry Co., Ltd.). The other comparative examples are the same as those in Example 1 except for the parts specifically mentioned.
表１の体積抵抗率は、本実施例にかかる粘着シートを、温度２３℃、湿度５０％の雰囲気下でエレクトロメータ（アドバンテスト社Ｒ８３４０Ａ）とレジスティビティ・チャンバ（アドバンテスト社Ｒ１２７０４Ａ）を用い、ＪＩＳ Ｋ ６９１１に準じて測定したものである。 The volume resistivity shown in Table 1 is based on the pressure sensitive adhesive sheet according to this example using an electrometer (Advantest R8340A) and a resistance chamber (Advantest R12704A) in an atmosphere of 23 ° C. and 50% humidity. It was measured according to 6911.
表１の剥離帯電量は、当社で開発し特開２００２−３６５３２３号公報に開示した剥離帯電測定装置で測定したもので、被着体は５インチのシリコンウエハである。この方法で測定した数値は、表面保護用の場合、７０ｎＣ／２０ｃｍ２以下が好ましく、電子部材用では５ｎＣ／２０ｃｍ２以下が好ましく、１０ｎＣ／２０ｃｍ２以上であると、本発明の被着体である電子部材に不具合が発生してしまう。 The peel charge amount shown in Table 1 was measured by a peel charge measuring device developed by the Company and disclosed in Japanese Patent Laid-Open No. 2002-365323, and the adherend is a 5-inch silicon wafer. Values measured in this way, when the surface protection, preferably 70nC / 20cm 2 or less, preferably 5 nC / 20 cm 2 or less in the electronic member, if it is 10 nC / 20 cm 2 or more, with an adherend of the present invention A problem occurs in an electronic member.
実施例１にあっては、粘着シート全体の剥離帯電量が１．８２ｎＣ／２０ｃｍ２であり、剥離帯電及び摩擦帯電の両方に対応できるものであった。 In Example 1, the peel charge amount of the entire pressure-sensitive adhesive sheet was 1.82 nC / 20 cm 2 , and it was possible to cope with both peel charge and friction charge.
実施例２の粘着シートは、実施例１の粘着シートの基材を用いつつ粘着剤層に導電性材料を添加しなかったものであり、実施例３の粘着シートは実施例１の粘着シートの粘着剤を用いつつ基材にのみ導電性材料を添加しなかったものである。また、比較例の粘着シートは、実施例１の粘着シートの基材、粘着剤ともに導電性材料を添加していないものである。 The pressure-sensitive adhesive sheet of Example 2 was obtained by adding the conductive material to the pressure-sensitive adhesive layer while using the base material of the pressure-sensitive adhesive sheet of Example 1, and the pressure-sensitive adhesive sheet of Example 3 is the same as that of the pressure-sensitive adhesive sheet of Example 1. The conductive material is not added only to the base material while using the adhesive. Moreover, the adhesive sheet of a comparative example is a thing which has not added the electroconductive material to the base material of the adhesive sheet of Example 1, and an adhesive.
実施例２、３の粘着シートは、剥離帯電量が３２．３ｎＣ／２０ｃｍ２、６６．１ｎＣ／２０ｃｍ２であり、表面保護用として優れた帯電防止効果を有するものであった。比較例の粘着シートは、剥離帯電量が９４．６ｎＣ／２０ｃｍ２であり、剥離帯電、摩擦帯電のいずれも好ましくないものであった。 The pressure-sensitive adhesive sheets of Examples 2 and 3 had peeling electrification amounts of 32.3 nC / 20 cm 2 and 66.1 nC / 20 cm 2 , and had excellent antistatic effects for surface protection. The pressure-sensitive adhesive sheet of the comparative example had a peel charge amount of 94.6 nC / 20 cm 2 , and neither peel charge nor friction charge was preferable.
本願にかかる粘着シートは、剥離時や摩擦時に発生する静電気そのものを少なくすることのできるものとして用いられるものであり、特に、偏光板の表面に貼る表面保護用や、半導体ウエハ、チップ状の部品といった電子部品用の集合体をバックグラインド工程やダイシング工程する際に用いられる粘着剤及び粘着シートとして用いられるものである。
The pressure-sensitive adhesive sheet according to the present application is used as a material capable of reducing static electricity generated at the time of peeling or rubbing, particularly for surface protection to be applied to the surface of a polarizing plate, semiconductor wafer, chip-shaped component. Such an adhesive for electronic parts is used as a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet used in the back grinding process and the dicing process.
Claims (2)
前記基材及び前記粘着層のうちの少なくとも一方が導電性材料を含有し、
粘着シート全体の体積抵抗率が、２.０×１０ １２ Ωｃｍ以上１.７×１０ １４ Ωｃｍ以下である表面保護用粘着シート。 In the pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on one or both surfaces of the sheet-like base material,
At least one of the base material and the adhesive layer contains a conductive material,
The adhesive sheet for surface protection whose volume resistivity of the whole adhesive sheet is 2.0 * 10 < 12 > ohm-cm or more and 1.7 * 10 < 14 > ohm-cm or less.
前記基材及び前記粘着層のうちの少なくとも一方が導電性材料を含有し、
粘着シート全体の体積抵抗率が、２.０×１０ １２ Ωｃｍ以上１.０×１０ １３ Ωｃｍ以下である電子部材用粘着シート。 In the pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on one or both surfaces of the sheet-like base material,
At least one of the base material and the adhesive layer contains a conductive material,
The adhesive sheet for electronic members whose volume resistivity of the whole adhesive sheet is 2.0 * 10 < 12 > ohm-cm or more and 1.0 * 10 < 13 > ohm-cm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005142241A JP4824944B2 (en) | 2005-05-16 | 2005-05-16 | Adhesive sheet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005142241A JP4824944B2 (en) | 2005-05-16 | 2005-05-16 | Adhesive sheet |
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| Publication Number | Publication Date |
|---|---|
| JP2006316208A JP2006316208A (en) | 2006-11-24 |
| JP4824944B2 true JP4824944B2 (en) | 2011-11-30 |
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| JP2005142241A Expired - Fee Related JP4824944B2 (en) | 2005-05-16 | 2005-05-16 | Adhesive sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5863157B2 (en) * | 2006-12-18 | 2016-02-16 | 日東電工株式会社 | Adhesive sheet |
| JP5143671B2 (en) * | 2008-08-27 | 2013-02-13 | 電気化学工業株式会社 | Protective sheet |
| JP6007069B2 (en) * | 2012-11-05 | 2016-10-12 | リンテック株式会社 | Adhesive sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0574373A (en) * | 1991-09-17 | 1993-03-26 | Shinko Kagaku Kogyo Kk | Adhesive tape for removing static electricity |
| JP2980874B2 (en) * | 1997-09-19 | 1999-11-22 | 株式会社寺岡製作所 | Removable antistatic protective adhesive film |
| JP2003051396A (en) * | 2001-08-07 | 2003-02-21 | Fujikura Rubber Ltd | Conductive sheet, conductive spacer, and conductive gasket |
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