JP5989368B2 - Damping adhesive sheet - Google Patents

Description

  The present invention relates to a vibration-damping adhesive sheet and an electronic device in which the vibration-damping adhesive sheet is bonded to an electronic device and incorporated therein.

With the spread of small electronic devices such as mobile phones and notebook computers, in order to increase the resistance against vibration and collision during transportation of devices such as electronic components that are vulnerable to vibration, insertion of foaming agents, cushioning materials such as rubber, or housing Strengthening has been attempted (see Patent Document 1).
Conventional pressure-sensitive adhesive sheets are made of rubber or the like, and do not exhibit cushioning properties unless they have a certain thickness (for example, 5 mm or more). Since Patent Document 1 is a desktop PC and there is room in the space, it is possible to apply such a conventional adhesive sheet. However, “higher sensitivity” electronic devices (smartphones and tablet terminals) are required to be thinner and lighter, and there is little space in the housing. Therefore, a pressure-sensitive adhesive sheet that does not function unless it has a certain thickness as in the prior art is not applicable. Thinning and lightening are indispensable for recent smartphones and tablet terminals, and an adhesive sheet having a thickness of 1 mm or less is required.
In recent years, electronic devices have become thinner and lighter, and this tendency is particularly apparent in smartphones and tablet terminals. On the other hand, there is a limit to the strengthening of the casing by limiting the insertion of the buffering agent and reducing the weight by reducing the thickness. On the other hand, although it is a device such as an electronic component that is vulnerable to vibration, an improvement in sensitivity is also required, such as an operation by touching the touch panel with a finger. Therefore, there is a need for a device that takes into account both maintaining high sensitivity and protecting against the weakness of the device against shock and vibration.

Japanese Patent No. 3035293

  The present invention maintains high sensitivity to physical stress for electronic devices that are thinner and lighter, while maintaining resistance to vibration and collision during transportation of devices such as electronic components that are inherently susceptible to vibration and shock. An object is to provide a means for providing a device to enhance.

As a result of intensive studies on the above problems, the present inventors have found that the above problems can be solved by the following means.
That is, the present invention
(1) A base resin film and a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed on one surface of the base resin film, and using a test piece obtained by processing the pressure-sensitive adhesive sheet into a width of 5 mm, and the minimum value of the loss factor in the frequency 10~100Hz 0.15 or more at a temperature 23 ° C. as measured by a viscoelasticity measuring apparatus, and Ri der minimum value of the loss factor is 0.25 or more in the frequency 100 to 1000 Hz,
At the time of vibration and collision, the adhesive strength is 0.2 to 2.0 N / 25 mm when the adhesive sheet is measured by JIS B 7721 by a 90-degree peeling method at a tensile speed of 50 mm / min. The present invention provides a portable electronic device in which a vibration-damping pressure-sensitive adhesive sheet that imparts resistance to the above and a vibration-damping pressure-sensitive adhesive sheet that will be described in detail below are bonded to an electronic device.

  INDUSTRIAL APPLICABILITY The present invention can increase resistance to vibration / collision during transportation of devices such as electronic parts that are weak against vibration / impact on electronic devices that are thin and light. ADVANTAGE OF THE INVENTION According to this invention, at the time of use and carrying, the impact from the outside can be relieved and an internal precision instrument can be protected.

FIG. 1 is a schematic sectional view showing a preferred embodiment of the pressure-sensitive adhesive sheet of the present invention. FIG. 2 is an example of the pressure-sensitive adhesive sheet of the present invention, and is a schematic view of an assembly example when installed in an electronic device.

A preferred embodiment of the present invention will be described.
[Adhesive sheet]
In a preferred embodiment of the pressure-sensitive adhesive sheet of the present invention, as shown in FIG. 1, a base resin film 1 and a pressure-sensitive adhesive layer 2 are formed on the base resin film 1.
In the present invention, the loss factor value is 0 at a frequency of 10 to 100 Hz at a temperature of 23 ° C. measured by a dynamic viscoelasticity measuring device using a test piece obtained by processing the pressure-sensitive adhesive sheet into a width of 5 mm. .15 or more.

A general method for measuring dynamic viscoelasticity is to apply periodic microstrain to a specimen and measure the response to it. By using this method, both elastic and viscous elements in the specimen are measured. It is possible to know how many elements are included. If the test body is a perfect elastic body, the response to it appears in the same phase, and the loss coefficient determined by the ratio of the storage elastic modulus and the loss elastic modulus becomes zero. However, if there is a viscous element, a delay occurs in the response, and the loss coefficient takes a positive value.
The storage elastic modulus appears due to the elastic element, and when the elastic element is deformed by applying stress, it receives a response to it and has the property of conserving mechanical energy, whereas the loss elastic modulus is attributed to the viscous element When it is deformed by stress application, mechanical energy corresponding to the applied stress has a property of being consumed as heat.

In the present invention, if the loss coefficient of the pressure-sensitive adhesive sheet is equal to or greater than a specific value, the vibration of the internal device relative to the vibration during transportation can be suppressed, so that damage to the device is avoided and the operation / operation of the electronic device is precisely performed. Can be controlled.
The value of dynamic viscoelasticity varies depending on the frequency and measurement temperature unique to the applied electronic device, so it is possible to collect frequency characteristics with a constant temperature, or to collect temperature characteristics by applying a constant frequency. Is possible.

In the present invention, the loss coefficient is a storage tensile elastic modulus (E ′) measured with a dynamic viscoelasticity measuring apparatus (for example, trade name “Rheogel-E4000” manufactured by UBM) and a loss tensile elastic modulus. It can be obtained from the ratio (E ′ / E ″) of (E ″). The minimum value of the loss coefficient at a frequency of 10 to 100 Hz at a temperature of 23 ° C. can be obtained from the response by fixing the temperature at 23 ° C.
A frequency of 10 to 100 Hz at a temperature of 23 ° C. corresponds to vibration when transporting an electronic device at room temperature, and the minimum loss coefficient at a frequency of 10 to 100 Hz at a temperature of 23 ° C. is set to 0.15 or more. It is possible to avoid destruction of the device due to vibrations when transporting the equipment. The minimum value of the loss coefficient of the pressure-sensitive adhesive sheet is suitably 0.15 or more, preferably 0.20 or more, more preferably 0.30 or more.

Te present invention smell, a base resin film, a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is formed on the substrate resin film, using a specimen obtained by processing the adhesive sheet into a width 5 mm, the dynamic viscosity The pressure-sensitive adhesive sheet has a minimum loss coefficient of 0.25 or more at a temperature of 23 ° C. and a frequency of 100 to 1000 Hz measured by an elasticity measuring device. Since the frequency of 100 to 1000 Hz at a temperature of 23 ° C. corresponds to the impact at the time of dropping and can mitigate the impact on the internal device, damage to the equipment can be avoided. The measurement method is the same as described above except for the frequency, and the minimum value of the loss coefficient of the adhesive sheet is suitably 0.25 or more, preferably 0.30 or more, more preferably 0.40 or more.

The present invention is a dynamic viscoelasticity measurement using a base resin film and a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer formed on the base resin film, the test piece obtained by processing the pressure sensitive adhesive sheet into a width of 5 mm. The pressure-sensitive adhesive sheet has a minimum loss coefficient of 0.15 or more at a frequency of 10 to 100 Hz at a temperature of 23 ° C. measured by an apparatus and a minimum loss coefficient of 0.25 or more at a frequency of 100 to 1000 Hz. This pressure-sensitive adhesive sheet can cope with both vibration during transportation and impact during dropping. The minimum value of the loss coefficient at a temperature of 23 ° C. and a frequency of 10 to 100 Hz is suitably 0.15 or more, preferably 0.20 or more, more preferably 0.30 or more. Further, the minimum value of the loss coefficient at a temperature of 23 ° C. and a frequency of 100 to 1000 Hz is suitably 0.25 or more, preferably 0.30 or more, and more preferably 0.40 or more.

Pressure-sensitive adhesive sheet of the present invention, in JIS B 7721, the 90-degree peeling method, adhesion when measured at a tensile speed 50 mm / min is Ru 0.2~2.0N / 25mm der. Adhesive strength shows the required bonding properties within this range. By setting it to 0.2 N / 25 mm or more, it is possible to fix to an adherend, and self-peeling over time does not occur. Preferably it is 0.4 N / 25mm or more, More preferably, it is 0.5 N / 25mm.
When the upper limit is 2.0 N / 25 mm or less, when it is not possible to bond at an accurate position, it is possible to peel and bond again. Preferably it is 1.5 N / 25mm or less, More preferably, it is 1.0 N / 25mm or less. If the adhesive strength is too large, the reworkability will deteriorate.

(Base resin film)
The base resin film used in the pressure-sensitive adhesive sheet of the present invention can be used without particular limitation as long as it can withstand vibration during transportation or impact during dropping. In the present invention, the resin of the base resin film includes those that can be formed into a sheet shape, such as plastic, thermoplastic elastomer, and rubber. Examples of this resin include styrene-hydrogenated isoprene-styrene block copolymer (hereinafter referred to as “SEPS”), styrene-isoprene-styrene copolymer (hereinafter also referred to as “SIS”), and styrene-hydrogenated. At least one selected from a butadiene-styrene copolymer (hereinafter sometimes referred to as “SEBS”) and a styrene-hydrogenated isoprene / butadiene-styrene copolymer (hereinafter sometimes referred to as “SEEPS”). Can be mentioned. The base resin film 1 may be a single layer or multiple layers. In the case of multiple layers, different materials or the same material may be used.
When the layer constituting the base resin film is a multilayer, at least one layer is a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-isoprene-styrene copolymer, a styrene-hydrogenated butadiene-styrene copolymer. It is preferable to contain at least one selected from a polymer and a styrene-hydrogenated isoprene / butadiene-styrene copolymer. The layers composed of at least one selected from SEPS, SIS, SEBS, and SEEPS can be laminated and used in combination.

Further preferred layers constituting the base resin film are described below.
At least one of the layers constituting the base resin film is styrene-hydrogenated isoprene-styrene block copolymer, styrene-isoprene as component (B) with respect to 100 parts by mass of polypropylene resin as component (A). A resin composition containing at least one 30-100 parts by mass selected from a styrene copolymer, a styrene-hydrogenated butadiene-styrene copolymer, and a styrene-hydrogenated isoprene / butadiene-styrene copolymer. Is preferred.

  Further, at least one layer selected from SEPS, SIS, SEBS, and SEEPS includes polypropylene, low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ethylene / propylene copolymer, and propylene copolymer. , Ethylene-propylene-diene copolymer vulcanizate, polybutene, polybutadiene, polymethylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) methyl acrylate copolymer Copolymer, Ethylene- (meth) acrylate copolymer, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polyurethane, polyamide, ionomer, nitrile rubber, butyl rubber, styrene Isoprene rubber, styrene butadiene Rubber may be natural rubber and its hydrogenated product or a modified product such as a resin composition containing such.

  At least one of the layers constituting the base resin film is composed of a polypropylene resin as the component (A), a styrene-hydrogenated isoprene-styrene block copolymer, and a styrene-isoprene-styrene copolymer as the component (B). It is preferable to use a resin composition containing at least one selected from styrene-hydrogenated butadiene-styrene copolymers and styrene-hydrogenated isoprene / butadiene-styrene copolymers. The polypropylene resin in this case includes a polypropylene homopolymer, an ethylene / propylene copolymer, a propylene copolymer, an ethylene-propylene-diene copolymer vulcanizate, etc., and in the case of a copolymer, a random copolymer, Any of block copolymers may be used and is appropriately selected.

In the present invention, the blending amount of the (A) component polypropylene resin and the (B) component at least one selected from SEPS, SIS, SEBS and SEEPS takes into consideration the balance between film strength and vibration damping properties. As appropriate.
Specifically, it is preferable that at least one selected from SEPS, SIS, SEBS, and SEEPS of component (B) is 30 to 100 parts by mass with respect to 100 parts by mass of polypropylene resin of component (A). . The component (A) 100 parts by weight of (B) component of the SEPS, SIS, if at least one member selected from SEBS and SEEPS is less than 30 parts by weight, if not a sufficient damping property is obtained There is. Further, when at least one selected from SEPS, SIS, SEBS and SEEPS of component (B) exceeds 100 parts by mass with respect to 100 parts by mass of component (A), the film itself becomes too soft and hinders handling. Occurs.

  In addition, at least one of the layers constituting the base resin film may have the component (A) as a continuous phase and the component (B) as a dispersed phase, and the average diameter of the dispersed phase may be 15 nm or more. .

  Polypropylene resin as component (A), styrene-hydrogenated isoprene-styrene block copolymer, styrene-isoprene-styrene copolymer, styrene-hydrogenated butadiene-styrene copolymer and styrene-water as component (B) In the resin composition containing at least one selected from the isoprene / butadiene-styrene copolymer, the (A) component is the continuous phase, the (B) component is the dispersed phase, and the average diameter of the dispersed phase particles Is preferably 15 nm or more. The upper limit of the particles of the dispersed phase is not particularly limited, but if it is too large, the film strength may locally vary and is preferably 25 nm or less.

  In the resin composition in which the component (A) is a continuous phase and the component (B) is a disperse phase, energy is applied due to collision of molecular chains or side chains of the components (B) during the tension or restoration process during application of stress. Cause loss. When the average diameter of the dispersed phase of component (B) is less than 15 nm, there are few adjacent molecular chains, so that sufficient energy loss for suppressing chipping cannot be obtained, and the chip vibration generated during dicing is attenuated. It may be difficult.

  In order to improve adhesion, the surface of the base resin film that contacts the pressure-sensitive adhesive layer may be subjected to corona treatment or may be provided with other layers such as a primer. The thickness of the base resin film 1 is not particularly limited, but is preferably 50 μm or more, more preferably 70 μm or more, and still more preferably 140 μm or more in order to obtain vibration damping properties. If the thickness is too large, it is difficult to install in a small device, so the thickness of 1 mm or less is preferable, more preferably 800 μm or less, still more preferably 600 μm or less, and most preferably 200 μm or less. Moreover, when the base resin film 1 is comprised with a multilayer, it is preferable that the thickness of the said SEPS, SIS, SEBS, or SEEPS containing layer is 5-500 micrometers.

(Adhesive layer)
The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is preferably an acrylic pressure-sensitive adhesive, but the pressure-sensitive adhesive layer can be formed of various pressure-sensitive adhesives. Such an adhesive is not limited at all, but for example, an adhesive having a base polymer such as rubber, acrylic, silicone or polyvinyl ether is used.
In order to add cohesion to these base polymers, a crosslinking agent can be blended.
Examples of the crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, a metal chelate crosslinking agent, an aziridine crosslinking agent, and an amine resin corresponding to the base polymer. Further, the pressure-sensitive adhesive can contain various additive components as desired within the range in which the object of the present invention is not impaired.
The above rubber-based or acrylic base resins are natural rubber, rubber polymers such as various synthetic rubbers, or poly (meth) acrylic acid alkyl esters, (meth) acrylic acid alkyl esters, (meth) acrylic acid alkyl esters. And an acrylic polymer such as a copolymer of the above and other unsaturated monomer copolymerizable therewith.

Moreover, an initial stage adhesive force can be set to arbitrary values by mixing an isocyanate type hardening | curing agent in said adhesive. Specific examples of such a curing agent include polyvalent isocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane. -4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, Lysine isocyanate and the like are used.
Although the quantity of a hardening | curing agent is suitably determined in consideration of adhesive force, Preferably it is 0.1-15 mass parts with respect to 100 mass parts of base polymers with respect to an adhesive, More preferably, it is 1-10 mass parts.
Although the thickness in particular of an adhesive layer is not restrict | limited, Preferably it is 4-30 micrometers, Most preferably, it is 5-25 micrometers.

[How to use as damping tape]
The vibration-damping pressure-sensitive adhesive tape of the present invention can be used for portable purposes by bonding the pressure-sensitive adhesive sheet to an electronic device and incorporating the electronic device. As a result, it is possible to increase resistance to vibration and collision during transportation of electronic devices and the like that are vulnerable to vibration.

A preferred embodiment of such an application will be described with reference to FIG.
FIG. 2 is a schematic view showing an assembly example when the pressure-sensitive adhesive sheet of the present invention is installed in an electronic device.
In the figure, reference numeral 10 denotes a pressure-sensitive adhesive sheet according to the present invention, which has a pressure-sensitive adhesive layer 12 on a base film 11. Reference numeral 13 denotes an electronic substrate on which the pressure-sensitive adhesive layer 12 of the pressure-sensitive adhesive sheet 10 is bonded. The housing that houses the electronic substrate 13 (bonding step) on which the pressure-sensitive adhesive layer 12 is bonded is formed by assembling (assembling step) the front case 14 and the rear case plate 15.
Arrows in the figure indicate operations for assembling the respective members so as to accommodate the electronic substrate 4 to which the above-mentioned pressure-sensitive adhesive layer 3 is bonded.
On the electronic board 13, a circuit (not shown) is formed using a space in a casing in which the front casing 14 and the rear casing plate 15 are combined. In a mobile electronic device (for example, a smartphone) as appropriate, a circuit is formed. Various very fine electronic components are mounted with high density. This is performed using a narrow space in the housing.

  EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to these Examples. In addition, the adhesive and base material constituent resin used in Examples and Comparative Examples are as follows.

[Adhesive]
Polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd.) in 100 parts by mass of acrylic base polymer (copolymer comprising 2-ethylhexyl acrylate, methyl acrylate, 2-hydroxyethyl acrylate, weight average molecular weight 200,000, glass transition point = −35 ° C.) The product name Coronate L) was obtained by mixing the mass parts shown in Table 1.

[Substrate constituting resin]
Examples 1 to 8, 12 and Comparative Examples 1 to 3 are styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (manufactured by Kuraray Co., Ltd., trade name “Septon KF-2104”) and homopropylene (PP) ( Ube Industries, Ltd., trade name “J-105G”) is mixed at the compounding ratio shown in Table 1, and processed by a film extrusion molding at about 200 ° C. with a biaxial kneader, and a base resin film having a thickness of 100 μm Manufactured.
In Example 11, the intermediate layer has a styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (Kuraray Co., Ltd., trade name “Septon KF-2104”) of 30 μm, and homopropylene (PP) (Ube Industries) on both sides thereof. The product consists of 30 parts by mass of styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (manufactured by KURARAY, trade name “Septon KF-2104”) per 100 parts by mass. A base resin film having a thickness of 100 μm and a three-layer structure each having a resin composition layer of 35 μm was obtained by film extrusion molding at about 200 ° C.
Examples 9 and 10 were the same as Example 1 except that the following copolymers were mixed in the mixing ratios shown in Table 1 instead of the styrene-hydrogenated isoprene-styrene block copolymer (SEPS). To produce a pressure-sensitive adhesive sheet for wafer attachment.
Styrene-hydrogenated butadiene-styrene copolymer (SEBS)
(Kuraray's product name "Septon 8104")
Styrene-hydrogenated isoprene / butadiene-styrene copolymer (SEEPS)
(Kuraray's product name "Septon 4033")
In Comparative Example 4, a product name “Himiran 1554” manufactured by Mitsui DuPont Polychemical Co., Ltd. was used as the ionomer and processed by film extrusion at about 200 ° C. to produce a base resin film having a thickness of 100 μm.

[Preparation of adhesive sheet]
On the one surface of said base resin film, said adhesive was apply | coated to thickness 10 micrometers, the adhesive layer was formed, and the adhesive sheet was manufactured.

[Test method for adhesive sheet]
The pressure-sensitive adhesive sheet thus produced was tested for the following physical properties. The results are shown in Table 1 below.
(Loss factor)
A test piece having a width of 5 mm and a length of 10 mm was cut out from the pressure-sensitive adhesive sheets of Examples and Comparative Examples. The test piece is fixed to a supporting jig of a dynamic viscoelasticity measuring apparatus (Rheogel-E4000 manufactured by UBM), measured at a temperature of 23 ° C. and a predetermined frequency, and the minimum value of the loss coefficient within the range. Got.
(Adhesive force)
For the pressure-sensitive adhesive sheets of Examples and Comparative Examples, the adhesive strength was measured at a tensile speed of 50 mm / min by JIS B 7721 by the 90-degree peeling method. The adherend is # 280-SUS.
(Manufacturability)
When the film could be formed at a line speed of 10 m / min or more, it was set as manufacturability. When the loss factor is increased, plastic deformation occurs, and thus the roll is wrinkled after film formation and winding by increasing the line speed. Therefore, when only film formation at less than 10 m / min can be handled, it was set as manufacturability Δ.
(Pasteability)
When the adhesive tape was cut into 25 mm × 100 mm and bonded to a # 280 SUS plate (50 mm × 150 mm × 2 mmt), the following was visually confirmed.
◎: No problem after 7 days after bonding ○: Peripheral lift after 7 days △: Peripheral lift after 1 day ×: Self-peeling immediately after pasting (reworkability)
After pasting in the above manner, it was peeled off and the following was confirmed.
◎: Easy to peel ○: Peelable △: Adhesive residue generated after peeling ×: Unpeelable (impact resistance test)
Measuring machine: DuPont impact resistance tester Adhering material: ABS plate 50mm x 50mm x 4mm
Substrate: Acrylic board 15mm x 15mm x 4mm
Adhesive area: 15mm x 15mm
[Standing at room temperature for 1 day, measurement after 30 minutes in measurement environment]
Measurement environment: 10 ° C
The impact of 300 g in weight was applied from the following various heights to test whether the acrylic plate was dropped. The results were evaluated according to the following criteria. When not falling, the height is indicated by Δ, ○, ◎. If it falls, it is indicated by a cross.
Measurement height: 10 cm (Δ), 15 cm (◯), 20 cm (◎). Drop at 10cm (×)

[Application to electronic devices]
It cut out in the adhesive sheet 100mmx45mm of the said Example in the smart phone of external dimensions 114mmx57mmx10mmt, and affixed inside the housing | casing (refer FIG. 2).
As is clear from the results in Table 1 above, Comparative Example 1 has a low loss coefficient, vibration absorption performance is insufficient, the impact resistance test results are unacceptable, and Comparative Example 2 has low adhesive strength, so that bonding is performed. The property was poor and self-peeled immediately after bonding. In Comparative Example 3, since the adhesive force was high, it was difficult to peel off after bonding, and the reworkability was poor (peeling not possible). In Comparative Example 4, the loss factor was low and the vibration absorption performance was insufficient, so the result of the impact resistance test was unacceptable. On the other hand, in Examples 1-12, adhesive force was high, and impact resistance, manufacturability, pasting property, and rework property were excellent or at least good.

DESCRIPTION OF SYMBOLS 1 Base resin film 2 Adhesive layer 10 Adhesive sheet 11 Base resin film 12 Adhesive layer 13 Electronic substrate 14 Housing | casing (front)
15 Case (Back)

Claims (6)

Measurement of dynamic viscoelasticity using a base resin film and a test piece in which a pressure-sensitive adhesive layer is formed on one surface of the base resin film, the test piece being processed to a width of 5 mm the minimum value of the loss factor in the frequency 10~100Hz at a temperature 23 ° C. as measured by the apparatus is not less than 0.15, and Ri der minimum value of the loss factor is 0.25 or more in the frequency 100 to 1000 Hz,
At the time of vibration and collision, the adhesive strength is 0.2 to 2.0 N / 25 mm when the adhesive sheet is measured by JIS B 7721 by a 90-degree peeling method at a tensile speed of 50 mm / min. A vibration-damping pressure-sensitive adhesive sheet that imparts resistance in At least one of the layers constituting the base resin film is a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-isoprene-styrene copolymer, a styrene-hydrogenated butadiene-styrene copolymer, and a styrene- 2. The vibration-damping adhesive sheet according to claim 1, comprising at least one selected from hydrogenated isoprene / butadiene-styrene copolymers. At least one of the layers constituting the base resin film is styrene-hydrogenated isoprene-styrene block copolymer, styrene-isoprene as component (B) with respect to 100 parts by mass of polypropylene resin as component (A). A resin composition containing at least one 30-100 parts by mass selected from a styrene copolymer, a styrene-hydrogenated butadiene-styrene copolymer, and a styrene-hydrogenated isoprene / butadiene-styrene copolymer. The vibration-damping adhesive sheet according to claim 1 or 2 . At least one of the layers constituting the base resin film has the component (A) as a continuous phase, the component (B) as a dispersed phase, and the average diameter of the dispersed phase is 15 nm or more. The vibration-damping adhesive sheet according to claim 3 . The vibration-damping pressure-sensitive adhesive sheet according to any one of claims 1 to 4 , wherein the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive . It is for protection at the time of transportation of a device, The damping adhesive sheet of any one of Claims 1-5.