WO2009078440A1 - Adhesive sheet for bonding wafer and wafer processing method - Google Patents

Adhesive sheet for bonding wafer and wafer processing method Download PDF

Info

Publication number
WO2009078440A1
WO2009078440A1 PCT/JP2008/072994 JP2008072994W WO2009078440A1 WO 2009078440 A1 WO2009078440 A1 WO 2009078440A1 JP 2008072994 W JP2008072994 W JP 2008072994W WO 2009078440 A1 WO2009078440 A1 WO 2009078440A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
adhesive sheet
bonding
processing method
base material
Prior art date
Application number
PCT/JP2008/072994
Other languages
French (fr)
Japanese (ja)
Inventor
Akira Yabuki
Syozo Yano
Satoshi Ota
Yuri Tamagawa
Original Assignee
The Furukawa Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008306587A external-priority patent/JP5448430B2/en
Application filed by The Furukawa Electric Co., Ltd. filed Critical The Furukawa Electric Co., Ltd.
Priority to CN2008801214941A priority Critical patent/CN101903983A/en
Publication of WO2009078440A1 publication Critical patent/WO2009078440A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C09J2453/006—Presence of block copolymer in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)

Abstract

Disclosed is an adhesive sheet for bonding a wafer. The adhesive sheet is composed of a base material film (1), and an adhesive layer (2), which is formed on the base material film and has a loss coefficient of 0.15 or more (at 23°C and a frequency of 1-100Hz) as a result of measuring the adhesive sheet by means of a dynamic viscoelastic measuring apparatus by using a test piece processed to have a width of 7mm. Also disclosed is a wafer processing method wherein a step of bonding a wafer to the adhesive sheet for bonding the wafer and a step of dicing the wafer are included, and a cut is not made up to the base material film of the adhesive sheet.
PCT/JP2008/072994 2007-12-18 2008-12-17 Adhesive sheet for bonding wafer and wafer processing method WO2009078440A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008801214941A CN101903983A (en) 2007-12-18 2008-12-17 The processing method of adhesive sheet for bonding wafer and wafer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-326555 2007-12-18
JP2007326555 2007-12-18
JP2008-306587 2008-12-01
JP2008306587A JP5448430B2 (en) 2007-12-18 2008-12-01 Wafer sticking sheet and wafer processing method

Publications (1)

Publication Number Publication Date
WO2009078440A1 true WO2009078440A1 (en) 2009-06-25

Family

ID=40795553

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072994 WO2009078440A1 (en) 2007-12-18 2008-12-17 Adhesive sheet for bonding wafer and wafer processing method

Country Status (1)

Country Link
WO (1) WO2009078440A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011004825A1 (en) * 2009-07-08 2011-01-13 古河電気工業株式会社 Wafer-pasting adhesive sheet and wafer processing method using the same
US20130171449A1 (en) * 2010-09-13 2013-07-04 Sumitomo Bakelite Co., Ltd. Dicing film
JP2013194187A (en) * 2012-03-21 2013-09-30 Furukawa Electric Co Ltd:The Vibration-damping adhesive sheet
WO2016151911A1 (en) * 2015-03-23 2016-09-29 リンテック株式会社 Semiconductor processing sheet and method for manufacturing semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320996A (en) * 1996-03-29 1997-12-12 Denso Corp Manufacturing method for semiconductor device
JP2002155249A (en) * 2000-11-22 2002-05-28 Mitsui Chemicals Inc Adhesive tape for processing wafer and method for producing the same and method for using the same
JP2002294184A (en) * 2001-03-29 2002-10-09 Toyo Chem Co Ltd Sheet for fixing semiconductor wafer
JP2003007646A (en) * 2001-06-18 2003-01-10 Nitto Denko Corp Adhesive sheet for dicing and method of manufacturing cut chip
JP2003092273A (en) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd Dicing film for semiconductor wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320996A (en) * 1996-03-29 1997-12-12 Denso Corp Manufacturing method for semiconductor device
JP2002155249A (en) * 2000-11-22 2002-05-28 Mitsui Chemicals Inc Adhesive tape for processing wafer and method for producing the same and method for using the same
JP2002294184A (en) * 2001-03-29 2002-10-09 Toyo Chem Co Ltd Sheet for fixing semiconductor wafer
JP2003007646A (en) * 2001-06-18 2003-01-10 Nitto Denko Corp Adhesive sheet for dicing and method of manufacturing cut chip
JP2003092273A (en) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd Dicing film for semiconductor wafer

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011004825A1 (en) * 2009-07-08 2011-01-13 古河電気工業株式会社 Wafer-pasting adhesive sheet and wafer processing method using the same
CN102473617A (en) * 2009-07-08 2012-05-23 古河电气工业株式会社 Wafer-pasting adhesive sheet and wafer processing method using the same
JPWO2011004825A1 (en) * 2009-07-08 2012-12-20 古河電気工業株式会社 Wafer sticking adhesive sheet and wafer processing method using the same
KR101336430B1 (en) * 2009-07-08 2013-12-04 후루카와 덴키 고교 가부시키가이샤 Wafer-pasting adhesive sheet and wafer processing method using the same
TWI447202B (en) * 2009-07-08 2014-08-01 Furukawa Electric Co Ltd Wafer bonding adhesive tape and the use of its wafer processing methods
US20130171449A1 (en) * 2010-09-13 2013-07-04 Sumitomo Bakelite Co., Ltd. Dicing film
US9570335B2 (en) * 2010-09-13 2017-02-14 Sumitomo Bakelite Co., Ltd. Dicing film
JP2013194187A (en) * 2012-03-21 2013-09-30 Furukawa Electric Co Ltd:The Vibration-damping adhesive sheet
WO2016151911A1 (en) * 2015-03-23 2016-09-29 リンテック株式会社 Semiconductor processing sheet and method for manufacturing semiconductor device

Similar Documents

Publication Publication Date Title
MY154860A (en) Adhesive sheet for wafer bonding and method of processing a wafer by using the same
WO2007044277A3 (en) Parametrized material and performance properties based on virtual testing
TW200700527A (en) Adhesive sheet for dicing
DE602004013163D1 (en) Method of Making a Germanium On Insulator Wafer (GeOI)
EP2096153A3 (en) Adhesive sheet for grinding back surface of semiconductor wafer and method for grinding back surface of semiconductor wafer using the same
WO2010111632A3 (en) Method for laser singulation of chip scale packages on glass substrates
WO2007015264A3 (en) Self adhesive material with a water soluble protective layer
WO2007019188A3 (en) Manufacture of photovoltaic devices
WO2008133104A1 (en) Pressure-sensitive adhesive sheet for water jet laser dicing
WO2009014881A3 (en) Flame-perforated films having controlled tear characteristics and methods, systems, and apparatus for making same
WO2009082158A3 (en) Sheet for absorbing impact and sealing comprising adhesive layer and method of preparing the same
WO2009078440A1 (en) Adhesive sheet for bonding wafer and wafer processing method
WO2008067098A3 (en) Applications of polycrystalline wafers
WO2009063793A1 (en) Adhesive tape for processing semiconductor wafer
SG11201808212XA (en) Film adhesive, semiconductor processing sheet, and method for manufacturing semiconductor apparatus
TW200746235A (en) Table for cutting sheet
TW200640283A (en) Method of manufacturing an organic electronic device
WO2008142934A1 (en) Apparatus and method for attaching sheet
WO2010073162A3 (en) Integrated circuit with spurrious acoustic mode suppression and mehtod of manufacture thereof
MY150009A (en) Laser dicing sheet and method for manufacturing chip body
WO2006050292A8 (en) Processing apparatus
WO2011149180A3 (en) Rice-hill seeding biodegrading-mulching film fabrication device, method for fabricating same, rice-hill seeding biodegrading-mulching film, and method for cropping rice using same
EP3949865A4 (en) Acoustic matching sheet, composition for acoustic matching layer, acoustic wave probe, acoustic wave measurement device, and method for manufacturing acoustic wave probe
WO2010057016A3 (en) Semiconductor device support for bonding
WO2011021183A8 (en) Aligned nanoarray and method for fabricating the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880121494.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08863392

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20107014958

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 08863392

Country of ref document: EP

Kind code of ref document: A1