JP2003092273A - Dicing film for semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film which can be suitably used as a dicing film for a semiconductor wafer used for dicing the semiconductor wafer and which is composed of a material which does not contain chlorine. SOLUTION: The dicing film for the semiconductor wafer comprises at least one layer of a polyester resin layer which is substantially amorphous and whose glass transition temperature is 0 to 50 deg.C.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer dicing film used for dicing a semiconductor wafer, and more particularly to a film made of a chlorine-free material.

[0002]

2. Description of the Related Art In a semiconductor wafer manufacturing process, a silicon wafer is attached to an adhesive film in order to reliably and easily perform a die sink operation for cutting and separating the silicon wafer having a predetermined circuit pattern into individual chips. The method of cutting is done. This adhesive film is
It is usually called a dicing film (or a dicing sheet or a dicing tape).

The cutting method includes a half-cut method and a full-cut method. However, the former method has a problem that the cut silicon wafer itself becomes a foreign matter. Therefore, the latter method of cutting the entire silicon wafer in the thickness direction. Method has been adopted.

In this method, after cutting the wafer into chips, the film is expanded (stretched) radially, the intervals between the chips are spread out at regular intervals, and the chips are pushed up by a needle or the like, and at the same time, a vacuum collet or air is used. A method of picking up by a method of adsorbing with tweezers or the like is common. At this time, in order to improve the pick-up property, the intervals between the chips are sufficiently wide, and the XY
It is desirable that the intervals in the directions be uniformly aligned. Therefore, it is necessary that the film has a uniform elongation distribution that does not cause necking when expanded.

Further, when the chip is pushed up with a needle or the like, and when picking up by suction with a vacuum collet or air tweezers, the residual stress after expanding concentrates on the pick-up location, and the chip cannot be picked up, or the chips are aligned around it. It may cause disorder or scattering of other chips. Therefore, it is necessary to relieve the stress generated during the expanding process by the time of pickup. As described above, as the characteristics of the dicing film, it is necessary to define the uniformity of the elongation distribution and the stress relaxation property of the substrate film used, in other words, the specific viscoelastic characteristics and the tensile elongation characteristics.

As a dicing film for semiconductor wafers, soft polyvinyl chloride (P
Films made from VC) have been widely used. This is because the flexible PVC film has the uniformity of the elongation distribution that does not cause necking during expansion and the stress relaxation property that no local stress occurs at the time of picking up the chip.

[0007]

In recent years, resins other than PVC have been investigated because of concern about environmental impact such as generation of hydrogen chloride gas generated during incineration and elution of plasticizer contained in PVC. Also in this application, as a material replacing the flexible PVC film, a film mainly composed of an olefin resin is proposed. However, a film sufficiently satisfying the above-mentioned required quality has not been completed, and at present, almost all flexible PVC film is used.

[0008]

As a result of intensive studies, the present inventors have succeeded in obtaining a film made of a resin other than PVC which is excellent in the above-mentioned various properties. That is, an object of the present invention is to provide a dicing film for a semiconductor wafer, which is excellent in chip alignment after expanding and is excellent in pick-up during pick-up, and the gist of the present invention is substantially amorphous. And a dicing film for a semiconductor wafer having at least one polyester resin layer having a glass transition temperature of 0 ° C to 50 ° C.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.
The dicing film for a semiconductor wafer of the present invention is substantially amorphous and has at least one polyester resin layer having a glass transition temperature of 0 ° C. to 50 ° C. It has properties and tensile elongation properties.

The amorphous polyester resin used in the present invention is polyethylene terephthalate, isophthalic acid,
Copolymerization of acid components such as phthalic acid, naphthalenecarboxylic acid and aliphatic carboxylic acid and / or diol components such as 1.4-cyclohexanedimethanol, neopentyl glycol, propylene glycol, butanediol, diethylene glycol and polytetramethylene glycol And is a copolymerized polyester in which 20 to 70 mol of the ethylene glycol component of the resin is replaced with another diol component and is characterized in that the crystalline melting point is not substantially developed. .

The glass transition temperature (Tg) is 0 ° C to 5 ° C.
0 ° C., preferably 10 to 30 ° C. is suitable. When the glass transition temperature is less than 0 ° C, the elastic modulus of the material is too low to be a handling film, and blocking of the film is likely to occur. Also, the glass transition temperature is 50
If the temperature exceeds ℃, there is a problem that uniform expansion is not exhibited during expansion and so-called necking elongation occurs, which is not suitable for this application.

The film of the present invention has a storage elastic modulus (E ') of 70 to 700 MPa and a loss tangent (tan δ) measured at a frequency of 10 Hz and a temperature of 20 ° C. by dynamic viscoelasticity measurement.
Is preferably in the range of 0.2 to 0.8. Here, when E'is less than 70, it is too soft, and the stress against deformation is too small, and the workability is likely to decrease. Also, E'is 70
If it exceeds 0 MPa, it is hard and difficult to extend, and exhibits non-uniform elongation, so that it is not suitable for this application.

If the above tan δ is less than 0.2, the stress after expansion of the film is insufficiently relaxed, so that residual stress after expansion is concentrated at the pick-up location and the chip cannot be picked up. ,
Disturbance and scattering of the surrounding chips may occur. On the other hand, if tan δ exceeds 0.8, the film stretches too much and it takes too much time to restore the work efficiency, and the picking suitability is impaired.

In the present invention, when the stress-strain curve of the film is measured, the tensile stress ratio of the film in the TD direction (direction perpendicular to the MD direction) to the MD direction (drawing direction) is up to 200%. 0.7 ~ in the range
It is preferably in the range of 1.3. This is because, when the film is expanded, if the stress balance between the MD direction and the TD direction of the film is not balanced, it is difficult for the film to exhibit uniform elongation.

Further, in both MD and TD directions of the film
In addition, the stress of 25% tensile elongation (σ ₂₅) To
Stress with 100% elongation (σ₁₀₀) Ratio (σ₁₀₀/
σ_{Two 5}) Is preferably 1.2 or more, and
Force ratio (σ₁₀₀/ Σ₂₅) Is less than 1.2, the fill
It is difficult to show uniform elongation.

At least one mixed resin layer having the above contents
The layered film of the present invention can be laminated with a resin layer other than PVC, if desired. Examples of other laminating resins include polyolefin polymers and flexible styrene-butadiene elastomers, and by laminating these with the film forming stability, blocking resistance, tackiness, slipperiness, and tackiness Solvent resistance and the like can be imparted.

Here, as the above polyolefin-based polymer, low density polyethylene, ethylene-vinyl acetate copolymer (EVA), ethylene-alkyl alkylate copolymer, ethylene-acrylic acid copolymer and the like are preferable. Can be used. In practice, for example, EVA can be preferably used, and the EVA has a vinyl acetate content of 5 to 2
5% by weight, preferably 10 to 20% by weight, and a melt flow ratio (MFR) of 0.2 to 10 g / 10 minutes (190
(° C., 2.16 kg load) is preferable in terms of strength, flexibility, film forming processability, and the like.

Further, the resin used for the adhesive resin layer interposed between the amorphous polyester resin layer and the polyolefin resin layer is not particularly limited as long as it can bond the both well. . Preferably, a polyolefin resin modified with an unsaturated carboxylic acid or its derivative can be used.

The above-mentioned polyolefin resin is polyethylene, polypropylene, polybutene-1, poly-4.
-Olefin homopolymers such as methylpentene-1 and copolymers with α-olefins having 2 to 20 carbon atoms or unsaturated esters that are copolymerizable with α-olefins such as ethylene, propylene and butene-1 . Examples of the α-olefin include propylene, butene-1, pentene-1, hexene-1, 4-methyl-pentene-1, octene-1.
Examples of the unsaturated ester include vinyl acetate, vinyl butyrate, vinyl propionate, methyl acrylate, propyl acrylate, methyl methacrylate, ethyl methacrylate, and the like.

The unsaturated carboxylic acid used for modification includes
Acrylic acid, methacrylic acid, maleic acid, fumaric acid,
Itaconic acid, crotonic acid, citraconic acid, sorbic acid,
There are mesaconic acid, angelic acid, etc., and derivatives thereof include acid anhydrides, esters, amides, imides, metal salts, etc., and maleic anhydride, itaconic anhydride, methyl acrylate, ethyl acrylate, methacrylic acid. Examples thereof include methyl, maleic acid monoethyl ester, acrylamide, sodium acrylate and the like.

The laminated film of the present invention preferably has the following layer structure using the above-mentioned resin. (1) Amorphous polyester resin layer (hereinafter referred to as "amorphous PE
T)) / Adhesive resin layer (hereinafter referred to as "AD") /
A laminated film comprising a polyolefin resin layer (hereinafter referred to as "PO"). Other aspects of the layer structure include (2) PO / AD / amorphous PET / AD / PO (3) amorphous PET / AD / PO / AD / amorphous PET The thickness of each layer in the above-mentioned laminated film is Crystalline PET is preferably 30% to 80% of the total thickness, and if it is less than 30%, desired viscoelastic properties cannot be obtained, and if it exceeds 80%, mechanical strength is insufficient, or film formation is stable depending on the manufacturing method. The sex becomes insufficient.

The film of the present invention can be obtained by melt-extruding a material from an extruder and forming it into a film by an inflation molding method or a T-die molding method. When forming a laminated film, it is advantageous to coextrude with a multilayer die. In order to obtain a balance between the MD-direction and TD-direction elongation characteristics of the formed film, the inflation method is suitable, and the blow-up ratio at that time is preferably 4 or more. The film thickness is 50
˜150 μm, typically 70 to 100 μm. In addition, various additives may be added to the film of the present invention, if necessary, in order to impart performances such as antistatic property and slip property.

Further, the dicing film for semiconductor wafer of the present invention is generally used by providing a pressure-sensitive adhesive layer on the substrate film having the above-mentioned contents. At this time, the range of the dynamic viscoelasticity and the tensile stress defined in the present invention should be the characteristics of the base material film to which an adhesive layer is added, but generally, the dominant one is the base material film. It is a characteristic and can be considered as a characteristic of the base film.
The adhesive layer is usually a base polymer and a cross-linking agent,
A photopolymerization initiator and a tackifying resin are contained. As the pressure-sensitive adhesive layer, one that causes a polymerization and curing reaction by ultraviolet rays and / or radiation is preferably used.

A substance which causes a polymerization-curing reaction is cured by a polymerization reaction accompanied by volume contraction by irradiating with ultraviolet rays and / or radiation after sticking a semiconductor wafer, and the plastic fluidity is lowered, so that the adhesive force is increased. The chip can be easily picked up. An acrylic polymer is often used as the base polymer of the pressure-sensitive adhesive layer. Specifically, a polymer composed of acrylic acid, methacrylic acid and their esters (hereinafter referred to as “(meth) acrylic acid ester”), acrylic It is a copolymer with an unsaturated monomer copolymerizable with acid, methacrylic acid and their esters, such as vinyl acetate, styrene and acrylonitrile. Examples of (meth) acrylic acid ester include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, propyl (meth) acrylate, and (meth) acrylic acid. Isopropyl, cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth)
Examples thereof include monomers such as nonyl acrylate and glycidyl (meth) acrylate.

In the acrylic polymer, a reaction of (meth) acrylic acid having a COOH group or a 2-hydroxyethyl (meth) acrylate having an OH group which becomes a reaction point (crosslinking point) with a crosslinking agent. 1 to 5
It is preferable to have 20 wt% and its molecular weight is 20.
Those in the range of 10,000 to 800,000 are preferable.
When the molecular weight of the acrylic polymer is less than 200,000, it is difficult to maintain sufficient cohesive force of the pressure-sensitive adhesive layer, and 80
If it exceeds 10,000, the viscosity of the solution at the time of polymerization becomes too high, and the handling tends to be difficult. To reduce the viscosity, it is possible to dilute by adding a solvent, but a large amount of solvent is required, which is not economical.

The above-mentioned photopolymerization initiator is excited and activated by irradiation with ultraviolet rays to generate radicals, and added at the same time, trimethylolpropane triacrylate,
By radical polymerization of a curing agent such as an acrylic resin compound having at least two UV- and / or radiation-polymerizable carbon-carbon double bonds in the molecule such as pentaerythritol triacrylate, polyethylene glycol diacrylate, oligoester acrylate, etc. It has the effect of hardening.

Specifically, for example, 4-phenoxydichloroacetophenone, 4-t-butyldichloroacetophenone, diethoxyacetophenone, 2-hydroxy-2.
-Methyl-1-phenylpropan-1-one, 1- (4
-Isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-dodecylphenyl)
2-hydroxy-2-methylpropan-1-one, 4
Such as-(2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1 Acetophenone-based photopolymerization initiator,

Benzoin, benzoin methyl ether,
Benzoin-based photopolymerization initiators such as benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and 2,2-dimethoxy-2-phenylacetophenone, benzophenone, benzoylbenzoic acid,
Methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, 4-benzoyl-4 '
Benzophenone-based photopolymerization initiators such as -methyldiphenyl sulfide and 3,3'-dimethyl-4-methoxybenzophenone, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone,

A thioxanthone photoinitiator such as 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropylthioxanthone, α-acyloxime ester, and acylphosphine. Specific photopolymerization initiators such as oxide, methylphenylglyoxylate, benzyl, camphorquinone, dibenzosuberone, 2-ethylanthraquinone, 4 ′, 4 ″ -diethylisophthalophenone and the like can be mentioned.

In the present invention, a crosslinking agent may be added, if desired, in order to impart a sufficient cohesive force to the pressure-sensitive adhesive layer. The cross-linking agent can three-dimensionally cross-link the acrylic polymer, and can further impart sufficient cohesive force to the pressure-sensitive adhesive layer. As the cross-linking agent, known ones such as polyisocyanate compound, polyglycidyl compound, aziridine compound, melamine compound, polyvalent metal chelate compound and the like can be used. The mixing ratio when adding the cross-linking agent is 0.05 parts by weight or more and less than 15 parts by weight, especially 0.1 part by weight based on 100 parts by weight of the acrylic polymer.
It is preferably in the range of not less than 12 parts by weight and not less than 12 parts by weight.
If the blending ratio of the cross-linking agent is less than 0.05 parts by weight, the effect of adding the cross-linking agent is difficult to obtain, and if it is more than 15 parts by weight, it becomes excessive and remains in the pressure-sensitive adhesive layer. This is not preferable because it easily causes contamination of the chip.

Further, a tackifying resin is added to the pressure-sensitive adhesive layer in order to keep the balance between the pressure-sensitive adhesive force and the cohesive force before and after irradiation with ultraviolet rays and / or radiation. Examples of the tackifying resin include rosin resin, rosin ester resin, terpene resin, terpene phenol resin, phenol resin, xylene resin, coumarone resin, coumarone indene resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin, Examples thereof include aliphatic aromatic copolymer-based petroleum resins, alicyclic hydrocarbon resins, and modified products, derivatives, and hydrogenated products thereof, but are not particularly limited, and are compatible with acrylic polymers. Can be appropriately selected in consideration of the above.

The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably about 5 to 30 μm. In the present invention, a pressure-sensitive adhesive layer is formed on the base material, and in order to produce a dicing film for a semiconductor wafer, the components constituting the pressure-sensitive adhesive layer are used as they are, or they are solubilized with an appropriate organic solvent, and applied or sprayed. It can be obtained by coating on a base material by, and drying by heat treatment, for example, at 80 to 100 ° C. for about 30 seconds to 10 minutes.

The dicing film for semiconductor wafer of the present invention can be used by a known method. For example, after the dicing film for semiconductor wafer is attached and fixed to a semiconductor wafer, the semiconductor wafer is rotated by a rotary blade. Is cut into element pieces (chips). After that, ultraviolet rays and / or radiation is irradiated from the base material side of the processing pressure-sensitive adhesive sheet, and then the wafer processing pressure-sensitive adhesive sheet is radially expanded (enlarged) by using a dedicated jig so that the space between element small pieces (chips) is increased. After spreading it at regular intervals, push up the element small piece (chip) with a needle etc. and use a vacuum collet,
It may be mounted at the same time as picking up by a method of adsorbing with air tweezers or the like.

[0034]

EXAMPLES Experiments (NO1 to 7) Hereinafter, the effects of the present invention will be clarified by examples, but the present invention is not limited to these examples. The characteristics and performance of the base film itself were measured and evaluated by the methods described below.

1) E ', tan δ "Viscoelasticity spectrum meter VES" manufactured by Iwamoto Manufacturing Co., Ltd.
-F3 "was used to measure and evaluate the transverse direction of the film at a vibration frequency of 10 Hz and a temperature of 20 ° C.

2) Tensile Elongation-Stress Property Width 10 m in each of MD and TD directions of the film using "AGS-H500N" manufactured by Shimadzu Corporation
A strip-shaped sample having a length of 100 mm was sampled, the chuck distance was 40 mm, the pulling speed was 200 mm / min, and the temperature was 2.
A tensile test was performed at 0 ° C. to measure and evaluate.

(NO1) As amorphous polyester resin, 100 moles of terephthalic acid, 60 moles of ethylene glycol, 32 moles of cyclohexanedimethanol, 6 moles of 1,4 butbutanediol, 9 moles of polytetramethylene glycol
An amorphous polyester resin (glass transition temperature: 15 ° C.) consisting of a 3 mol ratio was used as an intermediate layer of 50 μm, and a maleic acid-modified polyethylene-based adhesive resin as an adhesive resin was placed on each side of 5 μm. 5% by weight, MFR = 2.3 ethylene-vinyl acetate copolymer (E
VA) as the front and back layers, 10 μm each, total thickness 80 μm
A film was formed by a co-extrusion inflation method with a blow-up ratio (diameter of expanded tubular film / diameter of annular die BUR) of 5 so as to be m.

Measurement results of physical properties of the film (1) Viscoelastic property (20 ° C., 10 Hz) E ′ = 120 M
Patan δ = 0.45 (2) Tensile Elongation-Stress Characteristic MD Ratio, TD Direction Stress Ratio (σ _{MD / TD} ) 50% Elongation: σ _{TD / MD} = 1.11 100% Elongation: σ _{TD / MD} = 1 .14 Tensile elongation property (σ ₁₀₀ / σ ₂₅ ) MD direction 1.42 TD direction 1.36

(NO2) A film was taken with the same contents as NO1 except that BUR was set to 4.

As the (NO3) amorphous polyester resin, an amorphous polyester resin (glass transition temperature: 94 mol, terephthalic acid: 6 mol, isophthalic acid: 6 mol, 1,4 butane diol: 100 mol, polytetramethylene glycol: 21 mol) is used. A film having the same content as that of NO1 was taken except that the intermediate layer at 23 ° C. was 50 μm.

(NO4) Amorphous polyester resin (glass transition temperature 68 ° C.) composed of 100 moles of terephthalic acid, 68 moles of ethylene glycol, and 32 moles of cyclohexanedimethanol as the amorphous polyester resin was used as the intermediate layer with a thickness of 50 μm. A film was collected with the same contents as NO1 except for the above.

(NO5) NO1 except that BUR is set to 3
A film was taken with the same contents as above.

(NO6) The physical properties of a commercially available PVC dicing film (thickness 80 μm) were evaluated.

[0044]

[Table 1]

Experiment (NO7-11) Obtained by copolymerizing 50 parts by weight of 2-ethylhexyl acrylate, 10 parts by weight of butyl acrylate, 37 parts by weight of vinyl acetate and 3 parts by weight of 2-hydroxyethyl methacrylate. 100 parts by weight of a copolymer (acrylic polymer) having a weight average molecular weight of 500,000 has a molecular weight of 25,
000 multifunctional urethane acrylate oligomer 69
Parts by weight, 2,2-dimethoxy-2- as a photopolymerization initiator
8 parts by weight of phenylacetophenone based on 100 parts by weight of polyfunctional urethane acrylate oligomer, softening point 1
Acrylic polymer 100 was prepared by combining an aliphatic-aromatic copolymer petroleum resin having a molar ratio of aliphatic: aromatic of 6: 4 at 00 ° C.
A PET film (thickness: 38 μm) obtained by peeling a resin solution as a pressure-sensitive adhesive layer containing 14 parts by weight with respect to parts by weight and 7 parts by weight with respect to 100 parts by weight of an acrylic polymer as a polyisocyanate crosslinking agent. "Diafoil T-100-30" manufactured by Chemical Polyester Film Co., Ltd.) is applied so that the thickness after drying is 10 μm, and the temperature is 5 ° C. at 80 ° C.
Dry for minutes.

Thereafter, the release film with the adhesive was
The above-mentioned base films of NO1 to NO6 were laminated to prepare a dicing film for a semiconductor wafer with an adhesive. The obtained dicing film was aged at room temperature for 7 days or more, then attached to a semiconductor wafer, and subjected to processing suitability tests such as cutting (dicing), expanding and pickup tests using a rotary round blade, and the results are shown in Table 2. Indicated. In addition,
The processing suitability test was measured and evaluated by the following method.

3) Dicing aptitude The 6-inch wafer adhered was set to 20 μm in the cut amount with a 25 μm diamond blade into the sheet.
Full cut into 1 mm square chips. At this time, the presence or absence of chip fly was observed. Good chips without chip fly were evaluated as (◯), and chips with chip fly occurred as (x).

After dicing, the pressure-sensitive adhesive layer was cured by irradiating it with ultraviolet rays from a distance of 10 cm from the substrate surface for 15 seconds using a high pressure mercury lamp of 80 W / cm. Then, it was cooled to room temperature and the following evaluation was performed.

4) Expanding suitability A dicing film for semiconductor wafer was radially expanded (stretched) with a stroke of 20 mm by using a dedicated jig. At this time, the average chip interval and the chip interval difference in the XY directions were measured. Further, the degree of slack of the pressure-sensitive adhesive sheet and the presence or absence of peeling or dropping of the pressure-sensitive adhesive sheet from the aluminum ring were visually observed. In the measurement of the above-mentioned interval difference, the average chip interval is 1.0 mm or more, and the chip interval difference in the XY direction is less than 0.1 mm, and the adhesive sheet was not loosened, peeled, or dropped (○). ), A chip interval other than the above range, and a case where the pressure-sensitive adhesive sheet was loosened, peeled off, or dropped off was defined as (x).

5) Suitable for pickup: 1.04 m with 4 needles spaced 1.5 mm from the bottom of the substrate.
When 200 chips were picked up by the m-thrust and vacuum pyramid collet, the number that could not be picked up was measured. Further, the chip around the pick-up location was visually observed for scattering and scattering. There are no pick-up mistakes,
Disturbances of chips are not recognized (○), there is no pick-up mistake, scattering is not recognized but there is some disturbance (△), pick-up mistakes occur, chip dislocation, scattering What was recognized was made into (x).

6) Comprehensive Evaluation All of the evaluations were good, and those having no problem as a dicing film and being usable with less environmental impact (○), those having some problems but being usable (△) , (×), which has a problem and cannot be used as a dicing film, and which has a large environmental impact.

[0052]

[Table 2]

[0053]

EFFECTS OF THE INVENTION The dicing film for semiconductor wafers of the present invention has uniform elongation distribution and stress relaxation property, that is, it has specific viscoelastic properties and tensile elongation properties, and therefore has excellent stretchability during expanding. Excellent, chips are evenly aligned. Further, since it has a sufficient stress relaxation property, there is no local concentration of stress at the time of pick-up, the alignment of the chips is maintained, and pick-up becomes easy.

Claims (4)

[Claims] 1. A dicing film for a semiconductor wafer, which is substantially amorphous and has at least one polyester resin layer having a glass transition temperature of 0 ° C. to 50 ° C. 2. A frequency of 10 Hz measured by dynamic viscoelasticity,
Storage elastic modulus (E ') measured at a temperature of 20 ° C is 70 to 70
The dicing film for a semiconductor wafer according to claim 1, which has a loss tangent (tan δ) of 0 MPa and a range of 0.2 to 0.8. 3. The tensile stress ratio (σ _{MD / TD} ) in the TD direction (direction perpendicular to the MD direction) with respect to the MD direction (drawing direction) of the film is 0.7-1. 3. The dicing film for a semiconductor wafer according to claim 1, which is in the range of 3. 4. MD direction of the film, in the TD direction both the ratio of the tensile elongation of 25% stress (sigma ₂₅₎ for the tensile elongation of 100% of the stress _{(σ 100) (σ 10 0} /
σ ₂₅ ) is 1.2 or more.
4. The dicing film for semiconductor wafer according to any one of items 1 to 3.