JP2002009018A - Dicing film for semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film which can be used ideally as a dicing film for semiconductor wafer which is used at the time of dicing a semiconductor wafer and is made of a material containing no chlorine. SOLUTION: This dicing film is composed of a resin substantially containing no chlorine and has at least one mixed-resin layer containing (A) 20-80 wt.% propylene-based resin, (B) 10-50% copolymer of an aromatic vinyl compound and conjugated diene or its hydrogenated derivative resin, and (C) 0-40 wt.% petroleum resin, terpene resin, coumarone-indene resin, rosin-based resin, or their hydrogenated derivatives.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing film for a semiconductor wafer used for dicing a semiconductor wafer, and more particularly to a film made of a chlorine-free material.

[0002]

2. Description of the Related Art In a semiconductor wafer manufacturing process, a silicon wafer is attached to an adhesive film in order to reliably and easily perform a die sink operation of cutting and separating a silicon wafer having a predetermined circuit pattern formed into individual chips. A way to cut has been done. This adhesive film is
It is usually called a dicing film (or dicing sheet or dicing tape).

The cutting method includes a half-cut method and a full-cut method. The former method has a problem in that the cut silicon wafer itself becomes a foreign substance. Therefore, the latter method cuts the entire silicon wafer in the thickness direction. The method is adopted.

In this method, after a wafer is cut into chips, the film is radially expanded (stretched), the chips are widened at regular intervals, the chips are pushed up with a needle or the like, and at the same time, a vacuum collet and air are drawn. A method of picking up by a method of sucking with tweezers or the like is generally used. At this time, in order to improve the pickup property, the interval between the chips is sufficiently widened, and furthermore, XY
It is desirable that the intervals in the directions are uniformly aligned. Therefore, the film needs to have a uniform elongation distribution that does not cause necking when expanded.

In addition, when the chips are pushed up by a needle or the like, and the suction pickup is performed by a vacuum collet, air tweezers or the like, the residual stress after the expansion is concentrated at the pickup location, and the chips cannot be picked up or aligned around. This may cause turbulence or scattering of other chips. For this reason, it is necessary to reduce the stress generated at the time of expanding to a sufficient extent by the time of pickup. As described above, as the characteristics of the dicing film, it is necessary to define uniformity of the elongation distribution and stress relaxation of the base film to be used, in other words, specific viscoelastic characteristics and tensile elongation characteristics.

As a dicing film for a semiconductor wafer, a soft polyvinyl chloride (P) having an adhesive layer on its surface is used.
VC) films have been widely used. This is because the soft PVC film has uniformity of elongation distribution that does not cause necking during expansion, and stress relaxation that does not generate local stress during chip pickup.

[0007]

In recent years, there have been concerns about environmental effects such as the generation of hydrogen chloride gas generated during incineration of PVC and the elution of contained plasticizers, and resins other than PVC have been studied. Also in this application, as a material replacing the flexible PVC film, films of various material constitutions mainly composed of olefin-based resins have been proposed. However, a film that sufficiently satisfies the above-mentioned required quality has not been completed, and at present, almost at present, a soft PVC film is used.

[0008]

As a result of intensive studies, the present inventors have succeeded in obtaining a film made of a resin other than PVC excellent in the above-mentioned various properties. That is, an object of the present invention is to provide a dicing film for a semiconductor wafer which is excellent in chip alignment after expansion and has excellent pickup performance at the time of pickup, and the gist of the present invention substantially contains chlorine. A dicing film for a semiconductor wafer having at least one mixed resin layer composed of a non-resin and having the following (A), (B) and (C) as main components. (A) 20 to 80% by weight of a propylene-based resin (B) 10 to 50% by weight of a copolymer of a vinyl aromatic compound and a conjugated diene or a hydrogenated derivative thereof (C) Petroleum resin, terpene resin, cumarone-indene resin , Rosin-based resins, or their hydrogenated derivatives 0
40% by weight

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
The dicing film for a semiconductor wafer of the present invention is made of a resin that does not substantially contain chlorine and comprises the following (A), (B),
And a dicing film for a semiconductor wafer having at least one mixed resin layer containing (C) as a main component and having specific viscoelastic properties and tensile elongation properties. (A) 20 to 80% by weight of a propylene-based resin (B) 10 to 50% by weight of a copolymer of a vinyl aromatic compound and a conjugated diene or a hydrogenated derivative thereof (C) Petroleum resin, terpene resin, cumarone-indene resin , Rosin-based resins, or their hydrogenated derivatives 0
40% by weight

Here, the propylene resin as the component (A) is a resin containing propylene in an amount of 70 mol% or more.
This is a material necessary for achieving good compatibility with the component (C). A propylene homopolymer, a copolymer of propylene with ethylene or an α-olefin having 4 to 12 carbon atoms, or a mixture thereof can be exemplified. If the propylene content is less than 70 mol%, the crystallinity is too low, and the strength of the film as a whole and the above-mentioned physical properties cannot be achieved.

The content of the propylene resin depends on the crystallinity, but is 20 to 80% by weight, preferably 30 to 80% by weight.
The content is preferably set to 70% by weight. If it is less than 20% by weight, the strength of the mixed resin layer is insufficient, and if it exceeds 80% by weight, the crystallinity becomes too high, and it is difficult to obtain the viscoelastic behavior and tensile elongation characteristics required for this application. .

The copolymer (B) of a vinyl aromatic compound and a conjugated diene or a hydrogenated derivative resin thereof generally has rubber elasticity, is soft and resistant to tearing, and has good transparency. It is suitable for achieving the object of the present invention by balancing the rigidity of the vinyl aromatic compound and the elastomeric property of the conjugated diene depending on the polymerization form and the like. Known copolymers of this type include styrene-butadiene copolymers, styrene-isoprene copolymers, and hydrogenated derivatives thereof. The styrene content is preferably from 10 to 40% by weight, and if it is less than 10% by weight, strength is insufficient or sufficient flexibility cannot be obtained, and if it exceeds 40% by weight, uniform elongation characteristics cannot be obtained. And the compatibility with other components is reduced.

The proportion of the component (B) to the mixed resin layer is preferably from 10 to 50% by weight, and if it is less than 10% by weight, the effect of addition cannot be sufficiently obtained. If it exceeds 50% by weight, the mechanical strength is insufficient. In addition, since the elastic modulus is too low, various properties required for the present application cannot be achieved physically. As this kind of material, from the viewpoint of compatibility with the propylene polymer resin as the component (A) and suppressing a crosslinking reaction at the time of melt extrusion molding,
Hydrogenated derivatives are preferred.

With only the copolymer of a propylene resin as the component (A) and a vinyl aromatic compound and a conjugated diene as the component (B), or a hydrogenated derivative thereof, only the glass as a whole mixture is obtained. Low transition temperature,
When the crystallinity is still too high, the range in which the predetermined viscoelastic properties can be secured is narrow, and the cost tends to be disadvantageous. Therefore, it is preferable to further add the component (C) as a third component. By adding a component (C) such as a petroleum resin, the glass transition temperature of the composition can be increased, and the crystallinity of the propylene-based resin can be reduced, so that desired viscoelastic properties and tensile elongation properties can be achieved.

The proportion of the component (C) with respect to the mixed resin layer is in the range of 0 to 40% by weight, preferably 10 to 40% by weight. %, The mechanical strength is insufficient, and when it exceeds the limit of compatibility, bleeding of the surface over time is caused, which may cause blocking of the film.

The film of the present invention has a storage elastic modulus (E ') of 70 to 700 MPa measured at a frequency of 10 Hz and a temperature of 20 ° C. by dynamic viscoelasticity measurement, and a loss tangent (tan δ).
Is preferably in the range of 0.2 to 0.8. Here, if E ′ is less than 70, the workability is likely to be too low because the stress for deformation is too small. If E 'is 70
If it exceeds 0 MPa, it is hard and difficult to elongate, and exhibits non-uniform elongation.

If the tan δ is less than 0.2, the stress after the expansion of the film is insufficiently relaxed, so that the residual stress after the expansion is concentrated at the pickup location, and the chip cannot be picked up. ,
There is a possibility that turbulence or scattering of the surrounding aligned chips may occur. On the other hand, if tan δ exceeds 0.8, the film is excessively stretched, and it takes too much time for restoration, and the work efficiency is likely to be reduced, or on the contrary, the suitability for pickup is impaired.

In the present invention, when the stress-strain curve of the film is measured, the ratio of the tensile stress in the TD direction (the direction perpendicular to the MD direction) to the MD direction (the drawing direction) of the film is up to a tensile elongation of 200%. 0.7 ~ in range
It is preferably in the range of 1.3. This is because, when the film is expanded, if the stress in the MD direction and the TD direction of the film is not balanced, the film is less likely to exhibit uniform elongation.

Further, in the MD and TD directions of the film,
The stress (σ) at a tensile elongation of 25% ₂₅) Against tension
Stress at 100% elongation (σ₁₀₀) Ratio (σ₁₀₀/
σ_{2 5}) Is preferably 1.2 or more.
Force ratio (σ₁₀₀/ Σ₂₅) Is less than 1.2, fill
Is difficult to exhibit uniform elongation.

At least one mixed resin layer having the above-described content
If desired, the film of the present invention having a layer can be laminated with a resin layer other than PVC. Other laminating resins include polyolefin polymers and flexible styrene-butadiene elastomers, and by laminating with these, impart film-forming stability, blocking resistance, tackiness, and slipperiness. be able to.

As the polyolefin polymer, low density polyethylene, ethylene-vinyl acetate copolymer (EVA), ethylene-alkyl alkylate copolymer, ethylene-acrylic acid copolymer and the like are preferably used. Can be used. In practical use, for example, EVA can be suitably used, and the EVA has a vinyl acetate content of 5 to 5.
25% by weight, preferably 10 to 20% by weight, having a melt flow ratio (MFR) of 0.2 to 10 g / 10 min (19
(0 ° C., 2.16 kg load) are preferable in terms of strength, flexibility, film forming processability, and the like.

The film of the present invention can be obtained by melt-extruding a material from an extruder and forming it into a film by an inflation molding method or a T-die molding method. In the case of forming a laminated film, it is advantageous to co-extrude with a multilayer die. In order to substantially obtain the balance between the elongation characteristics in the MD and TD directions of the formed film, the inflation method is suitable, and the blow-up ratio at this time is preferably 4 or more. The thickness of the film is 50
１５０150 μm, typically 70-100 μm. Further, the film of the present invention may contain various additives as necessary to impart properties such as antistatic properties and slip properties.

The dicing film for a semiconductor wafer of the present invention is generally used by providing a pressure-sensitive adhesive layer on the substrate film described above. At this time, the range of the dynamic viscoelasticity and the tensile stress specified in the present invention should be strictly the characteristics of the base film plus the pressure-sensitive adhesive layer. It is a characteristic and may be considered as a characteristic of the base film.
In the pressure-sensitive adhesive layer, usually, a base polymer and a crosslinking agent,
A photopolymerization initiator and a tackifier resin are contained. As the pressure-sensitive adhesive layer, one that causes a polymerization and curing reaction by ultraviolet light and / or radiation is suitably used.

[0099] The one which causes a polymerization-curing reaction is cured by a polymerization reaction accompanied by volume shrinkage by irradiating ultraviolet rays and / or radiation after attaching a semiconductor wafer, and the plastic fluidity is lowered. Therefore, the chip can be easily picked up. As the base polymer of the pressure-sensitive adhesive layer, an acrylic polymer is often used. Specifically, a polymer composed of acrylic acid, methacrylic acid and their esters (hereinafter, referred to as “(meth) acrylic ester”), acrylic It is a copolymer with an unsaturated monomer copolymerizable with an acid, methacrylic acid or an ester thereof, for example, vinyl acetate, styrene, acrylonitrile and the like. Examples of (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, propyl (meth) acrylate, and (meth) acrylic acid. Isopropyl, cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth)
Monomers such as nonyl acrylate and glycidyl (meth) acrylate can be mentioned.

In the acrylic polymer, a reaction such as (meth) acrylic acid having a COOH group or 2-hydroxyethyl (meth) acrylate having an OH group, which serves as a reaction point (crosslinking point) with a crosslinking agent. 1 to
5% by weight, and its molecular weight is 2
Those in the range of 00,000 to 800,000 are preferred. If the molecular weight of the acrylic polymer is less than 200,000, it is difficult to maintain a sufficient cohesive force of the pressure-sensitive adhesive layer.
If it exceeds 000, the viscosity of the solution at the time of polymerization becomes too high, and handling tends to be difficult. It is possible to add a solvent to dilute the mixture to reduce the viscosity, but it requires a large amount of solvent and is not economical.

The above-mentioned photopolymerization initiator is excited and activated by irradiation with ultraviolet rays to generate radicals, and trimethylolpropane triacrylate, which is added at the same time,
A curing agent such as an acrylic resin-based compound having at least two ultraviolet and / or radiation polymerizable carbon-carbon double bonds in a molecule such as pentaerythritol triacrylate, polyethylene glycol diacrylate, or oligoester acrylate is subjected to radical polymerization. Has the effect of curing.

Specifically, for example, 4-phenoxydichloroacetophenone, 4-t-butyldichloroacetophenone, diethoxyacetophenone, 2-hydroxy-2
-Methyl-1-phenylpropan-1-one, 1- (4
-Isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-dodecylphenyl)
-2-hydroxy-2-methylpropan-1-one, 4
Such as-(2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenylketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1 Acetophenone-based photopolymerization initiator,

Benzoin, benzoin methyl ether,
Benzoin-based photopolymerization initiators such as benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-2-phenylacetophenone, benzophenone, benzoylbenzoic acid,
Methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, 4-benzoyl-4 '
Benzophenone-based photopolymerization initiators such as -methyldiphenylsulfide, 3,3'-dimethyl-4-methoxybenzophenone, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone,

Thioxanthone-based photopolymerization initiators such as 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone and 2,4-diisopropylthioxanthone, α-acyloxime esters, acylphosphines Specific photopolymerization initiators such as oxide, methylphenylglyoxylate, benzyl, camphorquinone, dibenzosuberone, 2-ethylanthraquinone, 4 ′, 4 ″ -diethylisophthalophenone and the like can be mentioned.

In the present invention, a cross-linking agent may be added, if desired, in order to impart a sufficient cohesive force to the pressure-sensitive adhesive layer. The cross-linking agent can three-dimensionally cross-link the acrylic polymer, and can impart more sufficient cohesive force to the pressure-sensitive adhesive layer. As the crosslinking agent, for example, known compounds such as a polyisocyanate compound, a polyglycidyl compound, an aziridine compound, a melamine compound, and a polyvalent metal chelate compound can be used. The mixing ratio when the crosslinking agent is added is 0.05 parts by weight or more and less than 15 parts by weight, particularly 0.1 parts by weight, based on 100 parts by weight of the acrylic polymer.
It is preferably in the range of not less than 12 parts by weight and not more than 12 parts by weight.
When the compounding ratio of the crosslinking agent is less than 0.05 part by weight, the effect of adding the crosslinking agent is hardly obtained, and when it is 15 parts by weight or more, it becomes excessive and remains free in the pressure-sensitive adhesive layer, and the wafer ( This is not preferable because it easily causes contamination of the chip).

Further, a tackifying resin is added to the pressure-sensitive adhesive layer in order to properly maintain the balance between the pressure-sensitive adhesive force and the cohesive force before and after the irradiation of ultraviolet light and / or radiation. As the tackifier resin, rosin resin, rosin ester resin, terpene resin, terpene phenol resin, phenol resin, xylene resin, coumarone resin, coumarone indene resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin, Aliphatic aromatic copolymer petroleum resins, alicyclic hydrocarbon resins, and modified products, derivatives and hydrogenated products thereof, but are not particularly limited, and are compatible with acrylic polymers. Can be appropriately selected in consideration of the above.

The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably about 5 to 30 μm. In the present invention, to form a pressure-sensitive adhesive layer on the substrate, to produce a dicing film for a semiconductor wafer, the components constituting the pressure-sensitive adhesive layer as it is, or a solution with an appropriate organic solvent, and applied or sprayed For example, at 80 to 100 ° C. for about 30 seconds to 10 minutes, followed by drying by heat treatment or the like.

The dicing film for a semiconductor wafer of the present invention can be used by a known method. For example, after a dicing film for a semiconductor wafer is attached to a semiconductor wafer and fixed, the semiconductor wafer is rotated with a rotary round blade. Is cut into element pieces (chips). Then, ultraviolet rays and / or radiation are irradiated from the substrate side of the pressure-sensitive adhesive sheet for processing, and then the pressure-sensitive adhesive sheet for wafer processing is radially expanded (expanded) using a special jig, and the space between the element pieces (chips) is reduced. After spreading at regular intervals, push up the element pieces (chips) with a needle or the like, and use a vacuum collet,
The pickup may be carried out at the same time as the pickup by a method of sucking with air tweezers or the like.

[0034]

EXAMPLES Experiments (NO1 to 7) Hereinafter, the effects of the present invention will be clarified by Examples.
The present invention is not limited by these examples. The properties and performance of the base film itself were measured and evaluated by the following methods.

1) E ', tan δ “Viscoelastic spectrum meter VES” manufactured by Iwamoto Seisakusho Co., Ltd.
-F3 "was measured and evaluated in the transverse direction of the film at a vibration frequency of 10 Hz and a temperature of 20 ° C.

2) Tensile elongation-stress characteristics Using an "AGS-H500N" manufactured by Shimadzu Corporation, a film having a width of 10 m in each of the MD and TD directions.
A strip-shaped sample having a length of 100 mm and a length of 100 mm was collected, the distance between chucks was 40 mm, the pulling speed was 200 mm / min, and the temperature was
A tensile test was performed at 0 ° C. to measure and evaluate.

(NO1) Component (A) Propylene-ethylene random copolymer (ethylene 3 mol%, MFR at 230 ° C. = 2.3 g / 10 min): 40% by weight Component (B) Component styrene 20% by weight, polyisoprene Hydrogenated derivative of triblock copolymer of styrene-isoprene-styrene consisting of 80% by weight: 40% by weight Component (C) Hydrogenated derivative of cyclopentadiene-based petroleum resin (softening point 125 ° C.): 20% by weight An intermediate layer of a three-component resin mixture is used for 50
μm, while the vinyl acetate content is 15% by weight, MFR = 2.3
Blow-up ratio (diameter of expanded tubular film / diameter of annular die BU) by co-extrusion using an ethylene-vinyl acetate copolymer (EVA) as a front and back layer so as to have a thickness of 15 μm and a total thickness of 80 μm, respectively.
R) was set to 5, and a film was formed.

Results of measuring the physical properties of the film (1) Viscoelastic properties (20 ° C., 10 Hz) E ′ = 200 MPa tan δ = 4.0 (2) Tensile elongation-stress properties Stress ratio (σ _MD ) in MD and TD directions _{/ TD} ) 50% elongation: σ _{TD / MD} = 1.11 100% elongation: σ _{TD / MD} = 1.14 Tensile elongation characteristics (σ ₁₀₀ / σ ₂₅ ) MD direction 1.42 TD direction 1.36

(NO2) A film was collected in the same manner as in NO1, except that BUR was set to 4.

(NO3) A film was sampled in the same manner as in NO1, except that the mixing ratio of the mixed resin layer of the intermediate layer was as described below. (A) component: 30% by weight (B) component: 50% by weight (C) component: 20% by weight

(NO4) A film was sampled in the same manner as in NO1, except that the mixing ratio of the mixed resin layer of the intermediate layer was as described below. (A) component: 90% by weight (B) component: 5% by weight (C) component: 5% by weight

(NO5) NO1 except that BUR was set to 3.
A film was collected with the same contents as described above.

(NO6) A film was sampled in the same manner as in NO1 except that the mixing ratio of the mixed resin layer of the intermediate layer was as follows, and BUR was 4. (A) component: 20% by weight (B) component: 60% by weight (C) component: 20% by weight

(NO7) The physical properties of a commercially available PVC dicing film (thickness: 100 μm) were evaluated.

[0045]

[Table 1]

Experiments (NO8-13) 50 parts by weight of 2-ethylhexyl acrylate, 10 parts by weight of butyl acrylate, 37 parts by weight of vinyl acetate, and 3 parts by weight of 2-hydroxyethyl methacrylate were obtained. 100 weight parts of a copolymer (acrylic polymer) having a weight average molecular weight of 500,000,
000 polyfunctional urethane acrylate oligomer 69
Parts by weight, 2,2-dimethoxy-2- as a photopolymerization initiator
8 parts by weight of phenylacetophenone per 100 parts by weight of a polyfunctional urethane acrylate oligomer, and a softening point of 1
An aliphatic-aromatic copolymer petroleum resin having a molar ratio of aliphatic: aromatic of 6: 4 at 00 ° C. was converted to an acrylic polymer 100
A 38 μm-thick PET film (Mitsubishi Corporation) obtained by subjecting a resin solution to be an adhesive layer prepared by mixing 14 parts by weight to 7 parts by weight of a polyisocyanate-based crosslinking agent to 100 parts by weight of an acrylic polymer with respect to 100 parts by weight of the acrylic polymer "Diafoil T-100-30" manufactured by Chemical Polyester Film Co., Ltd.
Dried for minutes.

Thereafter, the release film with the adhesive is
The substrate films of NO1 to NO7 were laminated to produce a dicing film for a semiconductor wafer with an adhesive. After aging the obtained dicing film at room temperature for 7 days or more, it was affixed to a semiconductor wafer, and cut (diced), expanded, and picked up using a rotating round blade. The results were shown in Table 2. Indicated. In addition,
The processing suitability test was measured and evaluated by the following methods.

3) Suitability for dicing A 6-inch wafer that has been adhered is cut into a sheet with a diamond blade of 25 μm at a cutting amount of 20 μm.
Full cut into 1 mm square chips. At this time, the presence or absence of chip fly was observed. A sample without chip fly was evaluated as good (○), and a sample with chip fly was evaluated as (x).

After the dicing, ultraviolet rays were irradiated from a distance of 10 cm from the substrate surface using a high-pressure mercury lamp of 80 W / cm for 15 seconds to cure the pressure-sensitive adhesive layer. Thereafter, the temperature was cooled to room temperature, and the next evaluation was performed.

4) Suitability for Expanding Using a dedicated jig, the dicing film for a semiconductor wafer was radially expanded (stretched) at a stroke of 20 mm. At this time, the difference between the average chip interval and the interval between the chips in the XY directions was measured. In addition, the degree of loosening of the pressure-sensitive adhesive sheet and the presence or absence of peeling and falling off of the pressure-sensitive adhesive sheet from the aluminum ring were visually observed. In the measurement of the gap difference, an average chip gap of 1.0 mm or more, a chip gap difference in the X-Y direction of less than 0.1 mm, and a sheet in which loosening, peeling, or falling off of the pressure-sensitive adhesive sheet did not occur (（) ), Those having a chip interval other than the above range, and those in which the pressure-sensitive adhesive sheet was loosened, peeled, or dropped were evaluated as (x).

5) Suitability for pickup 1.04 m with four needles at 1.5 mm intervals from the lower part of the base material
m, the number of chips that could not be picked up when 200 chips were picked up by the vacuum pyramid collet was measured. Further, the disturbance and scattering of the chip around the pickup location were visually observed. There is no pick-up mistake,
If there is no chip disturbance or scattering (○), there is no pick-up error, and no scattering is observed, but there is slight disturbance (△). The ones with were recognized as (x).

6) Comprehensive evaluation A dicing film which is good in all of the evaluations and has no problem as a dicing film and which can be used with little environmental impact (）), and a film which has some problem but can be used (△) Those which had a problem and could not be used as a dicing film and those which had a large environmental impact were rated as (x).

[0053]

[Table 2]

[0054]

The dicing film for a semiconductor wafer of the present invention has uniformity of elongation distribution and stress relaxation, that is, specific viscoelastic properties and tensile elongation properties. Excellent, chips are evenly aligned. In addition, since it has a sufficient stress relaxation property, there is no local concentration of stress at the time of pickup, the alignment of the chips is maintained, and the pickup becomes easy.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09J 7/02 C09J 123/14 123/14 151/02 151/02 H01L 21/78 MF term (Reference) 4F071 AA13 AA20 AA22 AA39 AF06Y AF14Y AF21Y AH19 BC01 4J002 AC08X AF02Y BA01Y BB12W BB14W BB15W BK00Y GJ00 4J004 AA10 AB07 CA04 CC03 CE01 DB02 FA08 4J040 DF031 DF03212 DF061B06 EA07 LA11 MA04 MB03 NA20

Claims (4)

[Claims] (1) a resin substantially free of chlorine;
A dicing film for a semiconductor wafer having at least one mixed resin layer containing the following (A), (B) and (C) as main components. (A) 20 to 80% by weight of a propylene-based resin (B) 10 to 50% by weight of a copolymer of a vinyl aromatic compound and a conjugated diene or a hydrogenated derivative thereof (C) Petroleum resin, terpene resin, cumarone-indene resin , Rosin-based resins, or their hydrogenated derivatives 0
40% by weight 2. A dynamic viscoelasticity measurement at a frequency of 10 Hz,
The storage elastic modulus (E ′) measured at a temperature of 20 ° C. is 70 to 70.
2. The dicing film for a semiconductor wafer according to claim 1, wherein the loss tangent (tan δ) is in a range of 0.2 to 0.8. 3. The tensile stress ratio (σ _{MD / TD} ) in the TD direction (perpendicular to the MD direction) with respect to the MD direction (drawing direction) of the film is 0.7 to 1. 3. The dicing film for a semiconductor wafer according to claim 1, wherein the thickness is in the range of 3. 4. MD direction of the film, in the TD direction both the ratio of the tensile elongation of 25% stress (sigma ₂₅₎ for the tensile elongation of 100% of the stress _{(σ 100) (σ 10 0} /
σ ₂₅ ) is 1.2 or more.
4. The dicing film for a semiconductor wafer according to any one of items 1 to 3.