WO2009063793A1 - Adhesive tape for processing semiconductor wafer - Google Patents

Adhesive tape for processing semiconductor wafer Download PDF

Info

Publication number
WO2009063793A1
WO2009063793A1 PCT/JP2008/070211 JP2008070211W WO2009063793A1 WO 2009063793 A1 WO2009063793 A1 WO 2009063793A1 JP 2008070211 W JP2008070211 W JP 2008070211W WO 2009063793 A1 WO2009063793 A1 WO 2009063793A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor wafer
adhesive tape
base material
processing semiconductor
material sheet
Prior art date
Application number
PCT/JP2008/070211
Other languages
French (fr)
Japanese (ja)
Inventor
Yosuke Okawara
Hiromitsu Maruyama
Yasumasa Morishima
Shinichi Ishiwata
Original Assignee
The Furukawa Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Furukawa Electric Co., Ltd. filed Critical The Furukawa Electric Co., Ltd.
Priority to CN200880115666A priority Critical patent/CN101855311A/en
Publication of WO2009063793A1 publication Critical patent/WO2009063793A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

An adhesive tape for processing a semiconductor wafer is provided with a base material sheet (11), and an adhesive layer (12) arranged on the base material sheet (11). The base material sheet (11) does not have a yield point on a stress-elongation line up to an elongation rate of 30%, and the base material sheet has a fracture strength of 10N/10mm or more and an elongation rate of 200% or more.
PCT/JP2008/070211 2007-11-15 2008-11-06 Adhesive tape for processing semiconductor wafer WO2009063793A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880115666A CN101855311A (en) 2007-11-15 2008-11-06 Adhesive tape for processing semiconductor wafer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-297182 2007-11-15
JP2007297182 2007-11-15
JP2008130063 2008-05-16
JP2008-130063 2008-05-16

Publications (1)

Publication Number Publication Date
WO2009063793A1 true WO2009063793A1 (en) 2009-05-22

Family

ID=40638645

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070211 WO2009063793A1 (en) 2007-11-15 2008-11-06 Adhesive tape for processing semiconductor wafer

Country Status (4)

Country Link
KR (1) KR20100097155A (en)
CN (1) CN101855311A (en)
TW (1) TW200930785A (en)
WO (1) WO2009063793A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251727A (en) * 2009-03-24 2010-11-04 Furukawa Electric Co Ltd:The Tape for semiconductor wafer processing
WO2011004825A1 (en) * 2009-07-08 2011-01-13 古河電気工業株式会社 Wafer-pasting adhesive sheet and wafer processing method using the same
CN102373017A (en) * 2010-08-19 2012-03-14 古河电气工业株式会社 Wafer processing adhesive tape
WO2012036149A1 (en) * 2010-09-13 2012-03-22 住友ベークライト株式会社 Dicing film
JP2012530375A (en) * 2009-06-15 2012-11-29 エルジー・ケム・リミテッド Wafer processing substrate
JP2014111680A (en) * 2012-12-05 2014-06-19 Sumitomo Bakelite Co Ltd Adhesive film, method for producing electronic component, and electronic component
JP2020120108A (en) * 2019-01-22 2020-08-06 住友ベークライト株式会社 Adhesive tape and base material for the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103189459A (en) * 2010-11-11 2013-07-03 古河电气工业株式会社 Adhesive film and tape for semiconductor wafer processing
TWI821679B (en) * 2020-08-25 2023-11-11 南韓商杰宜斯科技有限公司 Wafer processing apparatus and wafer processing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019962A (en) * 2003-06-06 2005-01-20 Hitachi Chem Co Ltd Adhesive sheet
JP2006245487A (en) * 2005-03-07 2006-09-14 Lintec Corp Laser dicing sheet and laser dicing method
JP2007088240A (en) * 2005-09-22 2007-04-05 Furukawa Electric Co Ltd:The Adhesive tape for dicing semiconductor wafer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101471240B (en) * 2003-06-06 2011-07-20 日立化成工业株式会社 Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019962A (en) * 2003-06-06 2005-01-20 Hitachi Chem Co Ltd Adhesive sheet
JP2006245487A (en) * 2005-03-07 2006-09-14 Lintec Corp Laser dicing sheet and laser dicing method
JP2007088240A (en) * 2005-09-22 2007-04-05 Furukawa Electric Co Ltd:The Adhesive tape for dicing semiconductor wafer

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251727A (en) * 2009-03-24 2010-11-04 Furukawa Electric Co Ltd:The Tape for semiconductor wafer processing
JP2012530375A (en) * 2009-06-15 2012-11-29 エルジー・ケム・リミテッド Wafer processing substrate
US9905450B2 (en) 2009-06-15 2018-02-27 Lg Chem, Ltd. Wafer processing base
WO2011004825A1 (en) * 2009-07-08 2011-01-13 古河電気工業株式会社 Wafer-pasting adhesive sheet and wafer processing method using the same
CN102473617A (en) * 2009-07-08 2012-05-23 古河电气工业株式会社 Wafer-pasting adhesive sheet and wafer processing method using the same
JPWO2011004825A1 (en) * 2009-07-08 2012-12-20 古河電気工業株式会社 Wafer sticking adhesive sheet and wafer processing method using the same
CN102373017A (en) * 2010-08-19 2012-03-14 古河电气工业株式会社 Wafer processing adhesive tape
WO2012036149A1 (en) * 2010-09-13 2012-03-22 住友ベークライト株式会社 Dicing film
CN103098176A (en) * 2010-09-13 2013-05-08 住友电木株式会社 Dicing film
US9570335B2 (en) 2010-09-13 2017-02-14 Sumitomo Bakelite Co., Ltd. Dicing film
JP2014111680A (en) * 2012-12-05 2014-06-19 Sumitomo Bakelite Co Ltd Adhesive film, method for producing electronic component, and electronic component
JP2020120108A (en) * 2019-01-22 2020-08-06 住友ベークライト株式会社 Adhesive tape and base material for the same

Also Published As

Publication number Publication date
TW200930785A (en) 2009-07-16
KR20100097155A (en) 2010-09-02
CN101855311A (en) 2010-10-06

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