WO2009063793A1 - Ruban adhésif utilisable pour le traitement d'une plaquette semi-conductrice - Google Patents
Ruban adhésif utilisable pour le traitement d'une plaquette semi-conductrice Download PDFInfo
- Publication number
- WO2009063793A1 WO2009063793A1 PCT/JP2008/070211 JP2008070211W WO2009063793A1 WO 2009063793 A1 WO2009063793 A1 WO 2009063793A1 JP 2008070211 W JP2008070211 W JP 2008070211W WO 2009063793 A1 WO2009063793 A1 WO 2009063793A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor wafer
- adhesive tape
- base material
- processing semiconductor
- material sheet
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880115666A CN101855311A (zh) | 2007-11-15 | 2008-11-06 | 半导体晶片加工用粘合带 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-297182 | 2007-11-15 | ||
JP2007297182 | 2007-11-15 | ||
JP2008-130063 | 2008-05-16 | ||
JP2008130063 | 2008-05-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009063793A1 true WO2009063793A1 (fr) | 2009-05-22 |
Family
ID=40638645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/070211 WO2009063793A1 (fr) | 2007-11-15 | 2008-11-06 | Ruban adhésif utilisable pour le traitement d'une plaquette semi-conductrice |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20100097155A (fr) |
CN (1) | CN101855311A (fr) |
TW (1) | TW200930785A (fr) |
WO (1) | WO2009063793A1 (fr) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010251727A (ja) * | 2009-03-24 | 2010-11-04 | Furukawa Electric Co Ltd:The | 半導体ウエハ加工用テープ |
WO2011004825A1 (fr) * | 2009-07-08 | 2011-01-13 | 古河電気工業株式会社 | Feuille adhésive de collage de plaquette et procédé de traitement de plaquette utilisant cette dernière |
CN102373017A (zh) * | 2010-08-19 | 2012-03-14 | 古河电气工业株式会社 | 晶片加工用胶带 |
WO2012036149A1 (fr) * | 2010-09-13 | 2012-03-22 | 住友ベークライト株式会社 | Film de découpage en puces |
JP2012530375A (ja) * | 2009-06-15 | 2012-11-29 | エルジー・ケム・リミテッド | ウェーハ加工用基材 |
JP2014111680A (ja) * | 2012-12-05 | 2014-06-19 | Sumitomo Bakelite Co Ltd | 接着フィルム、電子部品の製造方法、および電子部品 |
JP2020120108A (ja) * | 2019-01-22 | 2020-08-06 | 住友ベークライト株式会社 | 粘着テープおよび粘着テープ用基材 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103189459A (zh) * | 2010-11-11 | 2013-07-03 | 古河电气工业株式会社 | 粘结膜及半导体晶片加工用带 |
TWI821679B (zh) * | 2020-08-25 | 2023-11-11 | 南韓商杰宜斯科技有限公司 | 基板處理裝置及基板處理方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019962A (ja) * | 2003-06-06 | 2005-01-20 | Hitachi Chem Co Ltd | 接着シート |
JP2006245487A (ja) * | 2005-03-07 | 2006-09-14 | Lintec Corp | レーザーダイシングシートおよびレーザーダイシング方法 |
JP2007088240A (ja) * | 2005-09-22 | 2007-04-05 | Furukawa Electric Co Ltd:The | 半導体ウェハダイシング用粘着テープ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101392159B (zh) * | 2003-06-06 | 2012-10-03 | 日立化成工业株式会社 | 粘合片、与切割胶带一体化的粘合片以及半导体的制造方法 |
-
2008
- 2008-11-06 CN CN200880115666A patent/CN101855311A/zh active Pending
- 2008-11-06 KR KR1020107013042A patent/KR20100097155A/ko not_active Application Discontinuation
- 2008-11-06 WO PCT/JP2008/070211 patent/WO2009063793A1/fr active Application Filing
- 2008-11-13 TW TW097143913A patent/TW200930785A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019962A (ja) * | 2003-06-06 | 2005-01-20 | Hitachi Chem Co Ltd | 接着シート |
JP2006245487A (ja) * | 2005-03-07 | 2006-09-14 | Lintec Corp | レーザーダイシングシートおよびレーザーダイシング方法 |
JP2007088240A (ja) * | 2005-09-22 | 2007-04-05 | Furukawa Electric Co Ltd:The | 半導体ウェハダイシング用粘着テープ |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010251727A (ja) * | 2009-03-24 | 2010-11-04 | Furukawa Electric Co Ltd:The | 半導体ウエハ加工用テープ |
JP2012530375A (ja) * | 2009-06-15 | 2012-11-29 | エルジー・ケム・リミテッド | ウェーハ加工用基材 |
US9905450B2 (en) | 2009-06-15 | 2018-02-27 | Lg Chem, Ltd. | Wafer processing base |
WO2011004825A1 (fr) * | 2009-07-08 | 2011-01-13 | 古河電気工業株式会社 | Feuille adhésive de collage de plaquette et procédé de traitement de plaquette utilisant cette dernière |
CN102473617A (zh) * | 2009-07-08 | 2012-05-23 | 古河电气工业株式会社 | 晶片粘贴用粘合片及使用该粘合片的晶片的加工方法 |
JPWO2011004825A1 (ja) * | 2009-07-08 | 2012-12-20 | 古河電気工業株式会社 | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
CN102373017A (zh) * | 2010-08-19 | 2012-03-14 | 古河电气工业株式会社 | 晶片加工用胶带 |
WO2012036149A1 (fr) * | 2010-09-13 | 2012-03-22 | 住友ベークライト株式会社 | Film de découpage en puces |
CN103098176A (zh) * | 2010-09-13 | 2013-05-08 | 住友电木株式会社 | 切割膜 |
US9570335B2 (en) | 2010-09-13 | 2017-02-14 | Sumitomo Bakelite Co., Ltd. | Dicing film |
JP2014111680A (ja) * | 2012-12-05 | 2014-06-19 | Sumitomo Bakelite Co Ltd | 接着フィルム、電子部品の製造方法、および電子部品 |
JP2020120108A (ja) * | 2019-01-22 | 2020-08-06 | 住友ベークライト株式会社 | 粘着テープおよび粘着テープ用基材 |
Also Published As
Publication number | Publication date |
---|---|
TW200930785A (en) | 2009-07-16 |
CN101855311A (zh) | 2010-10-06 |
KR20100097155A (ko) | 2010-09-02 |
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