WO2008067098A3 - Applications de tranches polycristallines - Google Patents
Applications de tranches polycristallines Download PDFInfo
- Publication number
- WO2008067098A3 WO2008067098A3 PCT/US2007/082904 US2007082904W WO2008067098A3 WO 2008067098 A3 WO2008067098 A3 WO 2008067098A3 US 2007082904 W US2007082904 W US 2007082904W WO 2008067098 A3 WO2008067098 A3 WO 2008067098A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- applications
- polycrystalline wafers
- polycrystalline
- wafers
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800438160A CN102067311A (zh) | 2006-11-27 | 2007-10-29 | 多晶晶片的应用 |
DE112007002906T DE112007002906T5 (de) | 2006-11-27 | 2007-10-29 | Anwendungen polykristalliner Wafer |
KR1020097010724A KR101225822B1 (ko) | 2006-11-27 | 2007-10-29 | 다결정 웨이퍼들의 응용들 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/563,626 US20080122042A1 (en) | 2006-11-27 | 2006-11-27 | Applications of polycrystalline wafers |
US11/563,626 | 2006-11-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008067098A2 WO2008067098A2 (fr) | 2008-06-05 |
WO2008067098A3 true WO2008067098A3 (fr) | 2011-06-16 |
Family
ID=39471659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/082904 WO2008067098A2 (fr) | 2006-11-27 | 2007-10-29 | Applications de tranches polycristallines |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080122042A1 (fr) |
KR (1) | KR101225822B1 (fr) |
CN (1) | CN102067311A (fr) |
DE (1) | DE112007002906T5 (fr) |
TW (1) | TW200847346A (fr) |
WO (1) | WO2008067098A2 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101755075A (zh) * | 2007-07-20 | 2010-06-23 | Bp北美公司 | 从籽晶制造浇铸硅的方法和装置 |
JP5279828B2 (ja) * | 2008-07-10 | 2013-09-04 | Jx日鉱日石金属株式会社 | ハイブリッドシリコンウエハ及びその製造方法 |
WO2011055672A1 (fr) * | 2009-11-06 | 2011-05-12 | Jx日鉱日石金属株式会社 | Tranche de silicium hybride |
KR101382918B1 (ko) * | 2009-11-06 | 2014-04-08 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 하이브리드 실리콘 웨이퍼 |
JPWO2011161975A1 (ja) * | 2010-06-25 | 2013-08-19 | Dowaエレクトロニクス株式会社 | エピタキシャル成長基板及び半導体装置、エピタキシャル成長方法 |
JP5512426B2 (ja) * | 2010-07-08 | 2014-06-04 | Jx日鉱日石金属株式会社 | ハイブリッドシリコンウエハ及びその製造方法 |
US8252422B2 (en) | 2010-07-08 | 2012-08-28 | Jx Nippon Mining & Metals Corporation | Hybrid silicon wafer and method of producing the same |
US8647747B2 (en) | 2010-07-08 | 2014-02-11 | Jx Nippon Mining & Metals Corporation | Hybrid silicon wafer and method of producing the same |
JP5606189B2 (ja) * | 2010-07-08 | 2014-10-15 | Jx日鉱日石金属株式会社 | ハイブリッドシリコンウエハ及びその製造方法 |
US20230031662A1 (en) * | 2021-04-02 | 2023-02-02 | Innoscience (Suzhou) Technology Co., Ltd. | Iii nitride semiconductor wafers |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5091330A (en) * | 1990-12-28 | 1992-02-25 | Motorola, Inc. | Method of fabricating a dielectric isolated area |
JPH0964051A (ja) * | 1995-08-23 | 1997-03-07 | Shin Etsu Handotai Co Ltd | シリコンウエーハ及びその製造方法 |
KR20020026670A (ko) * | 2000-10-02 | 2002-04-12 | 윤종용 | 일괄 식각 장치에서 더미 웨이퍼를 사용한 금속배선 형성방법 |
US6388290B1 (en) * | 1998-06-10 | 2002-05-14 | Agere Systems Guardian Corp. | Single crystal silicon on polycrystalline silicon integrated circuits |
US20060097266A1 (en) * | 2002-07-11 | 2006-05-11 | Mitsui Engineering & Shipbuilding Co., Ltd | Large-diameter sic wafer and manufacturing method thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3968695B2 (ja) * | 1999-12-27 | 2007-08-29 | 信越半導体株式会社 | ウェーハ外周部の加工能力評価方法 |
US7098047B2 (en) * | 2003-11-19 | 2006-08-29 | Intel Corporation | Wafer reuse techniques |
-
2006
- 2006-11-27 US US11/563,626 patent/US20080122042A1/en not_active Abandoned
-
2007
- 2007-10-26 TW TW096140457A patent/TW200847346A/zh unknown
- 2007-10-29 WO PCT/US2007/082904 patent/WO2008067098A2/fr active Application Filing
- 2007-10-29 DE DE112007002906T patent/DE112007002906T5/de not_active Ceased
- 2007-10-29 CN CN2007800438160A patent/CN102067311A/zh active Pending
- 2007-10-29 KR KR1020097010724A patent/KR101225822B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5091330A (en) * | 1990-12-28 | 1992-02-25 | Motorola, Inc. | Method of fabricating a dielectric isolated area |
JPH0964051A (ja) * | 1995-08-23 | 1997-03-07 | Shin Etsu Handotai Co Ltd | シリコンウエーハ及びその製造方法 |
US6388290B1 (en) * | 1998-06-10 | 2002-05-14 | Agere Systems Guardian Corp. | Single crystal silicon on polycrystalline silicon integrated circuits |
KR20020026670A (ko) * | 2000-10-02 | 2002-04-12 | 윤종용 | 일괄 식각 장치에서 더미 웨이퍼를 사용한 금속배선 형성방법 |
US20060097266A1 (en) * | 2002-07-11 | 2006-05-11 | Mitsui Engineering & Shipbuilding Co., Ltd | Large-diameter sic wafer and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
DE112007002906T5 (de) | 2009-09-24 |
TW200847346A (en) | 2008-12-01 |
US20080122042A1 (en) | 2008-05-29 |
WO2008067098A2 (fr) | 2008-06-05 |
KR20090084892A (ko) | 2009-08-05 |
KR101225822B1 (ko) | 2013-01-23 |
CN102067311A (zh) | 2011-05-18 |
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