KR100859829B1 - 개별화된 하드웨어 - Google Patents

개별화된 하드웨어 Download PDF

Info

Publication number
KR100859829B1
KR100859829B1 KR1020087006747A KR20087006747A KR100859829B1 KR 100859829 B1 KR100859829 B1 KR 100859829B1 KR 1020087006747 A KR1020087006747 A KR 1020087006747A KR 20087006747 A KR20087006747 A KR 20087006747A KR 100859829 B1 KR100859829 B1 KR 100859829B1
Authority
KR
South Korea
Prior art keywords
psh
layer
wafer
photomask
electrical
Prior art date
Application number
KR1020087006747A
Other languages
English (en)
Korean (ko)
Other versions
KR20080033547A (ko
Inventor
에프레임 망겔
Original Assignee
자비탄 세미콘덕터, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 자비탄 세미콘덕터, 인코포레이티드 filed Critical 자비탄 세미콘덕터, 인코포레이티드
Publication of KR20080033547A publication Critical patent/KR20080033547A/ko
Application granted granted Critical
Publication of KR100859829B1 publication Critical patent/KR100859829B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020087006747A 2000-01-20 2000-12-18 개별화된 하드웨어 KR100859829B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US17708700P 2000-01-20 2000-01-20
US60/177,087 2000-01-20
US18975600P 2000-03-16 2000-03-16
US60/189,756 2000-03-16
US19120800P 2000-03-22 2000-03-22
US60/191,208 2000-03-22
US23745800P 2000-10-02 2000-10-02
US60/237,458 2000-10-02

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020027009346A Division KR100859825B1 (ko) 2000-01-20 2000-12-18 개별화된 하드웨어

Publications (2)

Publication Number Publication Date
KR20080033547A KR20080033547A (ko) 2008-04-16
KR100859829B1 true KR100859829B1 (ko) 2008-09-23

Family

ID=27497219

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020087006747A KR100859829B1 (ko) 2000-01-20 2000-12-18 개별화된 하드웨어
KR1020027009346A KR100859825B1 (ko) 2000-01-20 2000-12-18 개별화된 하드웨어

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020027009346A KR100859825B1 (ko) 2000-01-20 2000-12-18 개별화된 하드웨어

Country Status (7)

Country Link
EP (1) EP1249042A1 (fr)
JP (1) JP2003520451A (fr)
KR (2) KR100859829B1 (fr)
CN (1) CN100375097C (fr)
AU (1) AU2001223813A1 (fr)
IL (2) IL150784A0 (fr)
WO (1) WO2001054194A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162307A1 (de) * 2001-12-19 2003-07-03 Philips Intellectual Property Verfahren und Anordnung zur Herstellung von maskenprogrammierten ROMs unter Verwendung einer mehrere Systeme umfassenden Maske sowie ein entsprechendes Computerprogrammprodukt und ein entsprechendes computerlesbares Speichermedium
DE10319976A1 (de) * 2003-05-05 2004-12-09 Infineon Technologies Ag Individualisierter Halbleiterchip und Verfahren zur Individualisierung von Halbleiterchips
CN1922727B (zh) * 2004-02-20 2011-12-21 株式会社半导体能源研究所 半导体器件及ic卡、ic标签、rfid、转发器、票据、证券、护照、电子装置、包和外衣的制造方法
GB0410975D0 (en) 2004-05-17 2004-06-16 Nds Ltd Chip shielding system and method
JP5400279B2 (ja) 2007-06-07 2014-01-29 スパンション エルエルシー 半導体装置及びその製造方法並びに半導体製造装置
JP5761947B2 (ja) 2010-09-02 2015-08-12 キヤノン株式会社 半導体集積回路装置
CN102509726A (zh) * 2011-11-14 2012-06-20 上海宏力半导体制造有限公司 具有加密结构的ip模块及其制造方法
US9672316B2 (en) 2013-07-17 2017-06-06 Arm Limited Integrated circuit manufacture using direct write lithography
TWI714419B (zh) * 2020-01-06 2020-12-21 力晶積成電子製造股份有限公司 具有隱藏的識別碼的半導體堆疊結構
DE102022110501A1 (de) 2022-04-29 2023-11-02 Infineon Technologies Ag Identifikationscodes auf halbleiterchips

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409686A (en) 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
US4510673A (en) 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
JPH01293616A (ja) * 1988-05-23 1989-11-27 Nec Corp 半導体集積回路の製造方法
US5008830A (en) 1988-08-10 1991-04-16 Mitsubishi Denki Kabushiki Kaisha Method of preparing drawing data for charged beam exposure system
US5302491A (en) 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69021549T2 (de) * 1989-10-13 1996-04-18 Foxboro Co Anwendungsorientiertes automatisiertes bandbonding.
EP0434141B1 (fr) * 1989-12-20 1998-11-04 Koninklijke Philips Electronics N.V. Méthode de codage d'informations visant à identifier des éléments de circuit en utilisant la lithographie pas à pas
US5208178A (en) * 1990-08-02 1993-05-04 Hitachi, Ltd. Manufacturing a semiconductor integrated circuit device having on chip logic correction
JPH07123101B2 (ja) * 1990-09-14 1995-12-25 株式会社東芝 半導体装置
JP2913817B2 (ja) * 1990-10-30 1999-06-28 日本電気株式会社 半導体メモリの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409686A (en) 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
US4510673A (en) 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
JPH01293616A (ja) * 1988-05-23 1989-11-27 Nec Corp 半導体集積回路の製造方法
US5008830A (en) 1988-08-10 1991-04-16 Mitsubishi Denki Kabushiki Kaisha Method of preparing drawing data for charged beam exposure system
US5302491A (en) 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography

Also Published As

Publication number Publication date
IL150784A (en) 2007-05-15
CN100375097C (zh) 2008-03-12
WO2001054194A1 (fr) 2001-07-26
CN1425197A (zh) 2003-06-18
EP1249042A1 (fr) 2002-10-16
KR20080033547A (ko) 2008-04-16
KR20020086474A (ko) 2002-11-18
AU2001223813A1 (en) 2001-07-31
IL150784A0 (en) 2003-02-12
KR100859825B1 (ko) 2008-09-23
JP2003520451A (ja) 2003-07-02

Similar Documents

Publication Publication Date Title
US20080119956A1 (en) Personalized hardware
US7172840B2 (en) Photomask features with interior nonprinting window using alternating phase shifting
US20070155052A1 (en) Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light
US7023530B1 (en) Dual source lithography for direct write application
EP2092534A2 (fr) Dessin stencil et procédé de lithographie par faisceau à particules à projection de cellules
KR100859829B1 (ko) 개별화된 하드웨어
JP2004134553A (ja) レジストパターンの形成方法及び半導体装置の製造方法
US5840627A (en) Method of customizing integrated circuits using standard masks and targeting energy beams for single resist development
JP2002118049A (ja) 半導体集積回路装置の製造方法
US6346748B1 (en) Electronic circuit structure with photoresist layer that has non-precision openings formed by a laser
US7005215B2 (en) Mask repair using multiple exposures
JP4753234B2 (ja) 半導体装置の製造方法
TW202101114A (zh) 半導體元件的晶粒級唯一認證與編序方法
US6228564B1 (en) Method of patterning photoresist using precision and non-precision techniques
KR19990088432A (ko) 집적회로,집적회로의제조시스템및제조방법
US11862497B2 (en) Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking
US5985518A (en) Method of customizing integrated circuits using standard masks and targeting energy beams
US6130173A (en) Reticle based skew lots
JPH11163146A (ja) 集積回路
KR100341531B1 (ko) 집적회로용스테퍼스캐너리소그래피및공통마스크임의선택리소그래피
US8227177B2 (en) Method for multiple irradiation of a resist
JPH1197503A (ja) 異常チップ処理装置及び異常チップ処理方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20110812

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee