CN100375097C - 个体化方法及系统 - Google Patents

个体化方法及系统 Download PDF

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Publication number
CN100375097C
CN100375097C CNB00818531XA CN00818531A CN100375097C CN 100375097 C CN100375097 C CN 100375097C CN B00818531X A CNB00818531X A CN B00818531XA CN 00818531 A CN00818531 A CN 00818531A CN 100375097 C CN100375097 C CN 100375097C
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CN
China
Prior art keywords
circuit
electrical characteristics
layer
individuation
deterministic process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB00818531XA
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English (en)
Chinese (zh)
Other versions
CN1425197A (zh
Inventor
埃夫拉伊姆·曼格尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Synamedia Ltd
Original Assignee
NDS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NDS Ltd filed Critical NDS Ltd
Publication of CN1425197A publication Critical patent/CN1425197A/zh
Application granted granted Critical
Publication of CN100375097C publication Critical patent/CN100375097C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Semiconductor Integrated Circuits (AREA)
CNB00818531XA 2000-01-20 2000-12-18 个体化方法及系统 Expired - Fee Related CN100375097C (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US17708700P 2000-01-20 2000-01-20
US60/177,087 2000-01-20
US18975600P 2000-03-16 2000-03-16
US60/189,756 2000-03-16
US19120800P 2000-03-22 2000-03-22
US60/191,208 2000-03-22
US23745800P 2000-10-02 2000-10-02
US60/237,458 2000-10-02

Publications (2)

Publication Number Publication Date
CN1425197A CN1425197A (zh) 2003-06-18
CN100375097C true CN100375097C (zh) 2008-03-12

Family

ID=27497219

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB00818531XA Expired - Fee Related CN100375097C (zh) 2000-01-20 2000-12-18 个体化方法及系统

Country Status (7)

Country Link
EP (1) EP1249042A1 (fr)
JP (1) JP2003520451A (fr)
KR (2) KR100859829B1 (fr)
CN (1) CN100375097C (fr)
AU (1) AU2001223813A1 (fr)
IL (2) IL150784A0 (fr)
WO (1) WO2001054194A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162307A1 (de) * 2001-12-19 2003-07-03 Philips Intellectual Property Verfahren und Anordnung zur Herstellung von maskenprogrammierten ROMs unter Verwendung einer mehrere Systeme umfassenden Maske sowie ein entsprechendes Computerprogrammprodukt und ein entsprechendes computerlesbares Speichermedium
DE10319976A1 (de) * 2003-05-05 2004-12-09 Infineon Technologies Ag Individualisierter Halbleiterchip und Verfahren zur Individualisierung von Halbleiterchips
CN1922727B (zh) * 2004-02-20 2011-12-21 株式会社半导体能源研究所 半导体器件及ic卡、ic标签、rfid、转发器、票据、证券、护照、电子装置、包和外衣的制造方法
GB0410975D0 (en) 2004-05-17 2004-06-16 Nds Ltd Chip shielding system and method
JP5400279B2 (ja) 2007-06-07 2014-01-29 スパンション エルエルシー 半導体装置及びその製造方法並びに半導体製造装置
JP5761947B2 (ja) 2010-09-02 2015-08-12 キヤノン株式会社 半導体集積回路装置
CN102509726A (zh) * 2011-11-14 2012-06-20 上海宏力半导体制造有限公司 具有加密结构的ip模块及其制造方法
US9672316B2 (en) 2013-07-17 2017-06-06 Arm Limited Integrated circuit manufacture using direct write lithography
TWI714419B (zh) * 2020-01-06 2020-12-21 力晶積成電子製造股份有限公司 具有隱藏的識別碼的半導體堆疊結構
DE102022110501A1 (de) 2022-04-29 2023-11-02 Infineon Technologies Ag Identifikationscodes auf halbleiterchips

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302491A (en) * 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409686A (en) 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
US4510673A (en) 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
JPH01293616A (ja) * 1988-05-23 1989-11-27 Nec Corp 半導体集積回路の製造方法
JPH0247825A (ja) * 1988-08-10 1990-02-16 Mitsubishi Electric Corp 荷電ビーム描画データ作成方法
DE69021549T2 (de) * 1989-10-13 1996-04-18 Foxboro Co Anwendungsorientiertes automatisiertes bandbonding.
EP0434141B1 (fr) * 1989-12-20 1998-11-04 Koninklijke Philips Electronics N.V. Méthode de codage d'informations visant à identifier des éléments de circuit en utilisant la lithographie pas à pas
US5208178A (en) * 1990-08-02 1993-05-04 Hitachi, Ltd. Manufacturing a semiconductor integrated circuit device having on chip logic correction
JPH07123101B2 (ja) * 1990-09-14 1995-12-25 株式会社東芝 半導体装置
JP2913817B2 (ja) * 1990-10-30 1999-06-28 日本電気株式会社 半導体メモリの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302491A (en) * 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography

Also Published As

Publication number Publication date
IL150784A (en) 2007-05-15
WO2001054194A1 (fr) 2001-07-26
KR100859829B1 (ko) 2008-09-23
CN1425197A (zh) 2003-06-18
EP1249042A1 (fr) 2002-10-16
KR20080033547A (ko) 2008-04-16
KR20020086474A (ko) 2002-11-18
AU2001223813A1 (en) 2001-07-31
IL150784A0 (en) 2003-02-12
KR100859825B1 (ko) 2008-09-23
JP2003520451A (ja) 2003-07-02

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080312

Termination date: 20101218