IL150784A0 - Personalized hardware - Google Patents

Personalized hardware

Info

Publication number
IL150784A0
IL150784A0 IL15078400A IL15078400A IL150784A0 IL 150784 A0 IL150784 A0 IL 150784A0 IL 15078400 A IL15078400 A IL 15078400A IL 15078400 A IL15078400 A IL 15078400A IL 150784 A0 IL150784 A0 IL 150784A0
Authority
IL
Israel
Prior art keywords
personalized hardware
personalized
hardware
Prior art date
Application number
IL15078400A
Other languages
English (en)
Original Assignee
Zavitan Semiconductors Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zavitan Semiconductors Inc filed Critical Zavitan Semiconductors Inc
Publication of IL150784A0 publication Critical patent/IL150784A0/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54433Marks applied to semiconductor devices or parts containing identification or tracking information
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54433Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Semiconductor Integrated Circuits (AREA)
IL15078400A 2000-01-20 2000-12-18 Personalized hardware IL150784A0 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US17708700P 2000-01-20 2000-01-20
US18975600P 2000-03-16 2000-03-16
US19120800P 2000-03-22 2000-03-22
US23745800P 2000-10-02 2000-10-02
PCT/GB2000/004869 WO2001054194A1 (en) 2000-01-20 2000-12-18 Personalized hardware

Publications (1)

Publication Number Publication Date
IL150784A0 true IL150784A0 (en) 2003-02-12

Family

ID=27497219

Family Applications (2)

Application Number Title Priority Date Filing Date
IL15078400A IL150784A0 (en) 2000-01-20 2000-12-18 Personalized hardware
IL150784A IL150784A (en) 2000-01-20 2002-07-17 Personalized hardware

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL150784A IL150784A (en) 2000-01-20 2002-07-17 Personalized hardware

Country Status (7)

Country Link
EP (1) EP1249042A1 (xx)
JP (1) JP2003520451A (xx)
KR (2) KR100859829B1 (xx)
CN (1) CN100375097C (xx)
AU (1) AU2001223813A1 (xx)
IL (2) IL150784A0 (xx)
WO (1) WO2001054194A1 (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162307A1 (de) * 2001-12-19 2003-07-03 Philips Intellectual Property Verfahren und Anordnung zur Herstellung von maskenprogrammierten ROMs unter Verwendung einer mehrere Systeme umfassenden Maske sowie ein entsprechendes Computerprogrammprodukt und ein entsprechendes computerlesbares Speichermedium
DE10319976A1 (de) * 2003-05-05 2004-12-09 Infineon Technologies Ag Individualisierter Halbleiterchip und Verfahren zur Individualisierung von Halbleiterchips
CN1922727B (zh) * 2004-02-20 2011-12-21 株式会社半导体能源研究所 半导体器件及ic卡、ic标签、rfid、转发器、票据、证券、护照、电子装置、包和外衣的制造方法
GB0410975D0 (en) 2004-05-17 2004-06-16 Nds Ltd Chip shielding system and method
JP5400279B2 (ja) 2007-06-07 2014-01-29 スパンション エルエルシー 半導体装置及びその製造方法並びに半導体製造装置
JP5761947B2 (ja) 2010-09-02 2015-08-12 キヤノン株式会社 半導体集積回路装置
CN102509726A (zh) * 2011-11-14 2012-06-20 上海宏力半导体制造有限公司 具有加密结构的ip模块及其制造方法
US9672316B2 (en) 2013-07-17 2017-06-06 Arm Limited Integrated circuit manufacture using direct write lithography
TWI714419B (zh) * 2020-01-06 2020-12-21 力晶積成電子製造股份有限公司 具有隱藏的識別碼的半導體堆疊結構
DE102022110501A1 (de) 2022-04-29 2023-11-02 Infineon Technologies Ag Identifikationscodes auf halbleiterchips

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409686A (en) 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
US4510673A (en) 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
JPH01293616A (ja) * 1988-05-23 1989-11-27 Nec Corp 半導体集積回路の製造方法
JPH0247825A (ja) * 1988-08-10 1990-02-16 Mitsubishi Electric Corp 荷電ビーム描画データ作成方法
DE69021549T2 (de) * 1989-10-13 1996-04-18 Foxboro Co Anwendungsorientiertes automatisiertes bandbonding.
US5302491A (en) 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography
EP0434141B1 (en) * 1989-12-20 1998-11-04 Koninklijke Philips Electronics N.V. Method for encoding identification information on circuit dice using step and repeat lithography
US5208178A (en) * 1990-08-02 1993-05-04 Hitachi, Ltd. Manufacturing a semiconductor integrated circuit device having on chip logic correction
JPH07123101B2 (ja) * 1990-09-14 1995-12-25 株式会社東芝 半導体装置
JP2913817B2 (ja) * 1990-10-30 1999-06-28 日本電気株式会社 半導体メモリの製造方法

Also Published As

Publication number Publication date
IL150784A (en) 2007-05-15
CN100375097C (zh) 2008-03-12
WO2001054194A1 (en) 2001-07-26
KR100859829B1 (ko) 2008-09-23
CN1425197A (zh) 2003-06-18
EP1249042A1 (en) 2002-10-16
KR20080033547A (ko) 2008-04-16
KR20020086474A (ko) 2002-11-18
AU2001223813A1 (en) 2001-07-31
KR100859825B1 (ko) 2008-09-23
JP2003520451A (ja) 2003-07-02

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Legal Events

Date Code Title Description
FF Patent granted
MM9K Patent not in force due to non-payment of renewal fees