KR100847997B1 - 노광장치용 기판 스테이지 - Google Patents
노광장치용 기판 스테이지 Download PDFInfo
- Publication number
- KR100847997B1 KR100847997B1 KR1020020022431A KR20020022431A KR100847997B1 KR 100847997 B1 KR100847997 B1 KR 100847997B1 KR 1020020022431 A KR1020020022431 A KR 1020020022431A KR 20020022431 A KR20020022431 A KR 20020022431A KR 100847997 B1 KR100847997 B1 KR 100847997B1
- Authority
- KR
- South Korea
- Prior art keywords
- suction
- substrate
- cavity
- support
- suction hole
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
- G03B27/60—Baseboards, masking frames, or other holders for the sensitive material using a vacuum or fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (9)
- 삭제
- 삭제
- 프린트 배선기판을 제조하기 위한 노광장치용 기판 스테이지로서,복수개의 기판 흡인공을 형성하는 기판 흡인판과,이 기판 흡인판의 기판흡인공에 연통되는 흡인용 공동을 갖춘 지지체와,상기 흡인용 공동에 연통되고, 이 흡인용 공동과 상기 흡인공을 통해서 기판을 흡인하기 위한 수단을 가지며,상기 기판 흡인공을 기판에 흡인시킬 때 노광장애를 일으키는 휨이 일어나지 않을 정도의 크기를 갖도록 하는 것을 특징으로 하는 노광장치용 기판 스테이지.
- 삭제
- 삭제
- 제 3항에 있어서,상기 흡인공의 직경이 0 mm 보다 크고 0.4 mm 이하인 것을 특징으로 하는 노광장치용 스테이지.
- 제 3항 있어서,상기 흡인용 공동이 상기 지지체의 한쪽 면에 개구되고, 상기 기판 흡인판이 이 지지체의 한쪽 면에 장착되어 있음을 특징으로 하는 노광장치용 스테이지.
- 제 3항에 있어서,상기 흡인용 공동의 크기를 기판 흡인판에 흡인 되었을때 노광장애를 일으키지 않을 정도의 크기를 갖도록 하는 것을 특징으로 하는 노광장치용 스테이지.
- 제 3항에 있어서,상기 지지체가 흡인용 공동과 연통하는 공기통로를 가지며, 이 공기통로의 직경이 상기 흡인용 공통의 직경보다 적도록 된 것을 특징으로 하는 노광장치용 스테이지.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00155131 | 2001-05-24 | ||
JP2001155131A JP2002351082A (ja) | 2001-05-24 | 2001-05-24 | 露光装置用基板ステージ |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020090115A KR20020090115A (ko) | 2002-11-30 |
KR100847997B1 true KR100847997B1 (ko) | 2008-07-23 |
Family
ID=18999372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020022431A KR100847997B1 (ko) | 2001-05-24 | 2002-04-24 | 노광장치용 기판 스테이지 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6597432B2 (ko) |
JP (1) | JP2002351082A (ko) |
KR (1) | KR100847997B1 (ko) |
DE (1) | DE10222134A1 (ko) |
TW (1) | TW522289B (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1437767A1 (en) * | 2001-09-28 | 2004-07-14 | Shin-Etsu Handotai Co., Ltd | Grinding work holding disk, work grinding device and grinding method |
JP2005003799A (ja) * | 2003-06-10 | 2005-01-06 | Fuji Photo Film Co Ltd | 感光性板状部材吸着機構及び画像記録装置 |
TWI220451B (en) * | 2003-10-14 | 2004-08-21 | Ind Tech Res Inst | Positioning measurement platform of optoelectronic device |
JP4733929B2 (ja) * | 2004-04-20 | 2011-07-27 | 株式会社ディスコ | 半導体ウエーハの切断方法 |
US20060032037A1 (en) * | 2004-08-13 | 2006-02-16 | Dar-Wen Lo | [assembling method and device thereof] |
CN100375132C (zh) * | 2005-01-17 | 2008-03-12 | 友达光电股份有限公司 | 对位机台 |
CN1955336B (zh) * | 2005-10-28 | 2010-05-05 | 鸿富锦精密工业(深圳)有限公司 | 承载机构 |
US7678458B2 (en) * | 2007-01-24 | 2010-03-16 | Asml Holding N.V. | Bonding silicon silicon carbide to glass ceramics |
JP4991495B2 (ja) * | 2007-11-26 | 2012-08-01 | 東京エレクトロン株式会社 | 検査用保持部材及び検査用保持部材の製造方法 |
US8145349B2 (en) | 2008-05-14 | 2012-03-27 | Formfactor, Inc. | Pre-aligner search |
US8336188B2 (en) * | 2008-07-17 | 2012-12-25 | Formfactor, Inc. | Thin wafer chuck |
JP5482012B2 (ja) * | 2008-09-19 | 2014-04-23 | セイコーエプソン株式会社 | ターゲット支持装置、ターゲット搬送機構及び液体噴射装置 |
DE102009018434B4 (de) * | 2009-04-22 | 2023-11-30 | Ev Group Gmbh | Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten |
KR101232909B1 (ko) * | 2010-10-13 | 2013-02-13 | 엘아이지에이디피 주식회사 | 기판 척킹장치 |
KR20120108229A (ko) * | 2011-03-23 | 2012-10-05 | 삼성디스플레이 주식회사 | 레이저 가공용 워크 테이블 |
TWI505400B (zh) * | 2011-08-26 | 2015-10-21 | Lg Siltron Inc | 基座 |
JP5888051B2 (ja) * | 2012-03-27 | 2016-03-16 | 三菱電機株式会社 | ウエハ吸着方法、ウエハ吸着ステージ、ウエハ吸着システム |
KR101246864B1 (ko) * | 2012-05-07 | 2013-04-02 | 엘아이지에이디피 주식회사 | 기판 척킹장치 |
CN112087870B (zh) * | 2020-09-22 | 2022-10-25 | 江苏鑫迈迪电子有限公司 | 一种光器件用柔性电路板生产的成型折弯装置 |
US11728204B2 (en) * | 2020-10-23 | 2023-08-15 | Kla Corporation | High flow vacuum chuck |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990023901A (ko) * | 1997-08-27 | 1999-03-25 | 미따라이 하지메 | 기판처리장치, 기판지지장치, 기판처리방법 및 기판제조방법 |
JP2000301453A (ja) * | 1999-02-15 | 2000-10-31 | Ebara Corp | ポリッシング装置 |
KR20020041591A (ko) * | 2000-11-28 | 2002-06-03 | 윤종용 | 노광 설비 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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NL8300220A (nl) * | 1983-01-21 | 1984-08-16 | Philips Nv | Inrichting voor het stralingslithografisch behandelen van een dun substraat. |
US4529303A (en) * | 1983-06-02 | 1985-07-16 | Ternes Norman A | Apparatus for producing lithographic plates |
JPS63312035A (ja) * | 1987-06-10 | 1988-12-20 | Hitachi Ltd | 薄板保持装置 |
US5180000A (en) * | 1989-05-08 | 1993-01-19 | Balzers Aktiengesellschaft | Workpiece carrier with suction slot for a disk-shaped workpiece |
JPH05121543A (ja) * | 1991-08-09 | 1993-05-18 | Teikoku Seiki Kk | ウエハーマウンタのウエハー支持方法、その装置及びその装置を備えるウエハーマウンタ |
JP2919158B2 (ja) * | 1992-02-10 | 1999-07-12 | キヤノン株式会社 | 基板保持装置 |
JPH07110455B2 (ja) * | 1992-10-27 | 1995-11-29 | 住友電気工業株式会社 | ウェハ固定装置 |
US5923408A (en) * | 1996-01-31 | 1999-07-13 | Canon Kabushiki Kaisha | Substrate holding system and exposure apparatus using the same |
US6164633A (en) * | 1999-05-18 | 2000-12-26 | International Business Machines Corporation | Multiple size wafer vacuum chuck |
US6446948B1 (en) * | 2000-03-27 | 2002-09-10 | International Business Machines Corporation | Vacuum chuck for reducing distortion of semiconductor and GMR head wafers during processing |
US6513796B2 (en) * | 2001-02-23 | 2003-02-04 | International Business Machines Corporation | Wafer chuck having a removable insert |
-
2001
- 2001-05-24 JP JP2001155131A patent/JP2002351082A/ja active Pending
-
2002
- 2002-04-23 TW TW091108354A patent/TW522289B/zh not_active IP Right Cessation
- 2002-04-24 KR KR1020020022431A patent/KR100847997B1/ko active IP Right Grant
- 2002-05-02 US US10/137,574 patent/US6597432B2/en not_active Expired - Fee Related
- 2002-05-17 DE DE10222134A patent/DE10222134A1/de not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990023901A (ko) * | 1997-08-27 | 1999-03-25 | 미따라이 하지메 | 기판처리장치, 기판지지장치, 기판처리방법 및 기판제조방법 |
JP2000301453A (ja) * | 1999-02-15 | 2000-10-31 | Ebara Corp | ポリッシング装置 |
KR20020041591A (ko) * | 2000-11-28 | 2002-06-03 | 윤종용 | 노광 설비 |
Also Published As
Publication number | Publication date |
---|---|
US6597432B2 (en) | 2003-07-22 |
TW522289B (en) | 2003-03-01 |
KR20020090115A (ko) | 2002-11-30 |
JP2002351082A (ja) | 2002-12-04 |
DE10222134A1 (de) | 2002-12-05 |
US20020176064A1 (en) | 2002-11-28 |
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