KR100832926B1 - 승강 기구 및 반송 장치 - Google Patents

승강 기구 및 반송 장치 Download PDF

Info

Publication number
KR100832926B1
KR100832926B1 KR1020060083846A KR20060083846A KR100832926B1 KR 100832926 B1 KR100832926 B1 KR 100832926B1 KR 1020060083846 A KR1020060083846 A KR 1020060083846A KR 20060083846 A KR20060083846 A KR 20060083846A KR 100832926 B1 KR100832926 B1 KR 100832926B1
Authority
KR
South Korea
Prior art keywords
lifting
conveying
unit
conveyance
assist
Prior art date
Application number
KR1020060083846A
Other languages
English (en)
Korean (ko)
Other versions
KR20070026216A (ko
Inventor
히데키 나카야마
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20070026216A publication Critical patent/KR20070026216A/ko
Application granted granted Critical
Publication of KR100832926B1 publication Critical patent/KR100832926B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020060083846A 2005-09-02 2006-08-31 승강 기구 및 반송 장치 KR100832926B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005255292A JP5264050B2 (ja) 2005-09-02 2005-09-02 昇降機構および搬送装置
JPJP-P-2005-00255292 2005-09-02

Publications (2)

Publication Number Publication Date
KR20070026216A KR20070026216A (ko) 2007-03-08
KR100832926B1 true KR100832926B1 (ko) 2008-05-27

Family

ID=37817691

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060083846A KR100832926B1 (ko) 2005-09-02 2006-08-31 승강 기구 및 반송 장치

Country Status (4)

Country Link
JP (1) JP5264050B2 (zh)
KR (1) KR100832926B1 (zh)
CN (1) CN100543956C (zh)
TW (1) TWI435403B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5400315B2 (ja) * 2008-04-02 2014-01-29 株式会社 タイコー 昇降装置およびその使用方法
CN102686367B (zh) * 2009-12-28 2015-05-20 株式会社爱发科 驱动装置及输送装置
JP5524636B2 (ja) * 2010-01-21 2014-06-18 株式会社三信精機 缶底弁の昇降装置
TWI624307B (zh) * 2013-11-06 2018-05-21 All Ring Tech Co Ltd Carrier transfer method and device
CN105355581B (zh) * 2014-08-19 2018-09-18 北京北方华创微电子装备有限公司 一种反应腔室、半导体加工设备及被加工工件的传输方法
CN104291248B (zh) * 2014-09-03 2016-08-24 天奇自动化工程股份有限公司 工位转换装置
JP7050090B2 (ja) * 2017-12-21 2022-04-07 東京エレクトロン株式会社 基板搬送装置
KR101987576B1 (ko) * 2018-01-24 2019-06-10 주식회사 기가레인 승강하는 유도부와 연동하는 연동부를 포함하는 기판 처리 장치
KR102288577B1 (ko) * 2019-09-30 2021-08-11 주식회사 탑시스템 고효율 밸런싱 디스플레이 위치조절장치
CN111048466B (zh) * 2019-12-26 2022-08-16 北京北方华创微电子装备有限公司 晶圆夹持装置
CN113248130A (zh) * 2021-05-24 2021-08-13 黄文仙 一种中空玻璃生产加工用定段裁切装置
CN113942829A (zh) * 2021-11-09 2022-01-18 内蒙古创维智能科技有限公司 一种自动移载装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980087124A (ko) * 1997-05-15 1998-12-05 히가시 테쯔로우 기판반송장치 및 기판반송방법
KR100289848B1 (ko) * 1998-09-18 2001-06-01 윤종용 반도체 웨이퍼 이송장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226391U (zh) * 1985-07-31 1987-02-18
JPH07112920B2 (ja) * 1987-03-05 1995-12-06 セイフテック プロプライエタリー リミテッド 荷物昇降装置、荷物昇降装置用ばねおよび荷物昇降装置の高さ調整方法
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
JP2000306978A (ja) * 1999-02-15 2000-11-02 Kokusai Electric Co Ltd 基板処理装置、基板搬送装置、および基板処理方法
JP4412941B2 (ja) * 2003-08-08 2010-02-10 精工技研株式会社 昇降装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980087124A (ko) * 1997-05-15 1998-12-05 히가시 테쯔로우 기판반송장치 및 기판반송방법
KR100289848B1 (ko) * 1998-09-18 2001-06-01 윤종용 반도체 웨이퍼 이송장치

Also Published As

Publication number Publication date
JP5264050B2 (ja) 2013-08-14
TWI435403B (zh) 2014-04-21
CN100543956C (zh) 2009-09-23
CN1925126A (zh) 2007-03-07
JP2007069991A (ja) 2007-03-22
KR20070026216A (ko) 2007-03-08
TW200723433A (en) 2007-06-16

Similar Documents

Publication Publication Date Title
KR100832926B1 (ko) 승강 기구 및 반송 장치
JP4754304B2 (ja) 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法
KR100853573B1 (ko) 기판 처리 장치 및 기판 처리 시스템
JP5013987B2 (ja) 基板処理装置および基板搬送装置
KR100809125B1 (ko) 처리 장치, 위치설정 방법 및 컴퓨터 기억 매체
KR100952524B1 (ko) 기판 수용 유닛
JP4795893B2 (ja) 基板検知機構および基板収容容器
JP4903027B2 (ja) 基板搬送装置および基板支持体
KR20110013310A (ko) 기판 위치맞춤 기구, 그것을 이용한 진공 예비실 및 기판 처리 시스템
JP4023543B2 (ja) 基板搬送装置および基板搬送方法ならびに真空処理装置
JP3350234B2 (ja) 被処理体のバッファ装置、これを用いた処理装置及びその搬送方法
KR102581283B1 (ko) 포드 오프너
CN101599449B (zh) 搬送装置以及处理装置
KR20090130498A (ko) 기판로딩장치
JP5073686B2 (ja) 基板処理装置及び基板処理装置内部の工程空間を開閉する方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120507

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20130503

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee