JP2007069991A - 昇降機構および搬送装置 - Google Patents
昇降機構および搬送装置 Download PDFInfo
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- JP2007069991A JP2007069991A JP2005255292A JP2005255292A JP2007069991A JP 2007069991 A JP2007069991 A JP 2007069991A JP 2005255292 A JP2005255292 A JP 2005255292A JP 2005255292 A JP2005255292 A JP 2005255292A JP 2007069991 A JP2007069991 A JP 2007069991A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
【解決手段】重量物である搬送ユニット501を昇降する昇降機構502は、搬送ユニット501を支持して昇降させる昇降台550と、昇降台550を昇降させる昇降駆動部560と、昇降駆動部560に及ぼされる前記搬送ユニットの負荷に抗して上向きに作用するアシスト力を及ぼすアシスト機構570とを具備する。
【選択図】図4
Description
また、このような昇降機構を適用した搬送装置を提供することを目的とする。
このプラズマ処理装置1は、その中央部に搬送室20とロードロック室30とが連設されている。搬送室20の周囲には、3つのプロセスチャンバ10a,10b,10cが配設されている。
図4はこの搬送装置50を示す垂直断面図であり、図5はその搬送ユニットを示す斜視図である。この搬送装置50は、搬送動作を行う搬送ユニット501と、搬送ユニット501を昇降する昇降機構502とを有している。
まず、搬送機構43の2枚のピック45、46を進退駆動させて、未処理基板を収容した一方のカセット40から2枚の基板Sをロードロック室30の上下2段の基板収容部31に搬入する。
10a,10b,10c;プロセスチャンバ
20;搬送室
30;ロードロック室
50;搬送装置
60;制御部
501;搬送ユニット
502;昇降機構
510;上段搬送機構部
520;下段搬送機構部
530;ボックス状支持部
540;円筒シャフト
541;駆動部
550;昇降台
551;支持板
552;シャフト
553;昇降板
560;ボールねじ機構
561;ボールねじ
562;モータ
566;ガイドシャフト
570;アシスト機構
572;コイルばね
Claims (13)
- 重量物を昇降する昇降機構であって、
前記重量物を支持して昇降させる昇降台と、
前記昇降台を昇降させる昇降駆動部と、
前記昇降駆動部に及ぼされる前記重量物の負荷に抗して上向きに作用するアシスト力を及ぼすアシスト機構と
を具備することを特徴とする昇降機構。 - 前記アシスト機構は、ばねを有し、前記ばねの付勢力をアシスト力として前記昇降駆動部に作用させることを特徴とする請求項1に記載の昇降機構。
- 前記ばねは、コイルばねであり、前記昇降台が最低位置にあるときに前記コイルばねが最も縮んだ状態となってその付勢力が最大となることを特徴とする請求項2に記載の昇降機構。
- 前記昇降駆動部は、前記昇降台が螺合されるボールねじと、ボールねじを回転させる駆動機構とを有することを特徴とする請求項1から請求項3のいずれか1項に記載の昇降機構。
- 被搬送物を支持して搬送する搬送ユニットと、
前記搬送ユニットを昇降させて前記搬送ユニットの高さ位置を合わせる昇降機構と
を具備する搬送装置であって、
前記昇降機構は、
前記搬送ユニットを支持して昇降させる昇降台と、
前記昇降台を昇降させる昇降駆動部と、
前記昇降駆動部に及ぼされる前記搬送ユニットの負荷に抗して上向きに作用するアシスト力を及ぼすアシスト機構と
を具備することを特徴とする搬送装置。 - 前記アシスト機構は、ばねを有し、前記ばねの付勢力をアシスト力として前記昇降駆動部に作用させることを特徴とする請求項5に記載の搬送装置。
- 前記ばねは、コイルばねであり、前記昇降台が最低位置にあるときに前記コイルばねが最も縮んだ状態となってその付勢力が最大となることを特徴とする請求項6に記載の搬送装置。
- 前記昇降駆動部は、前記昇降台が螺合されるボールねじと、ボールねじを回転させる駆動機構とを有することを特徴とする請求項5から請求項7のいずれか1項に記載の搬送装置。
- 前記搬送ユニットは、被搬送物を水平方向に移動させる伸縮アームを有する搬送機構部と、前記搬送機構部を回転させる回転駆動部とを有することを特徴とする請求項5から請求項8のいずれか1項に記載の搬送装置。
- 前記搬送機構部は、さらにベースを有し、前記伸縮アームは、前記ベース上を直進動するアームと、前記アーム上を直進動し、被搬送物を支持するピックとを有することを特徴とする請求項9に記載の搬送装置。
- 前記搬送ユニットは、上下に2つの前記搬送機構部を有することを特徴とする請求項10に記載の搬送装置。
- 前記搬送ユニットは、真空室内部に配置されていることを特徴とする請求項5から請求項11のいずれか1項に記載の搬送装置。
- 前記被搬送物は、大型ガラス基板であることを特徴とする請求項5から請求項12のいずれか1項に記載の搬送装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005255292A JP5264050B2 (ja) | 2005-09-02 | 2005-09-02 | 昇降機構および搬送装置 |
KR1020060083846A KR100832926B1 (ko) | 2005-09-02 | 2006-08-31 | 승강 기구 및 반송 장치 |
TW095132468A TWI435403B (zh) | 2005-09-02 | 2006-09-01 | Lifting mechanism and conveying device |
CNB200610128925XA CN100543956C (zh) | 2005-09-02 | 2006-09-04 | 升降机构及搬送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005255292A JP5264050B2 (ja) | 2005-09-02 | 2005-09-02 | 昇降機構および搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007069991A true JP2007069991A (ja) | 2007-03-22 |
JP5264050B2 JP5264050B2 (ja) | 2013-08-14 |
Family
ID=37817691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005255292A Expired - Fee Related JP5264050B2 (ja) | 2005-09-02 | 2005-09-02 | 昇降機構および搬送装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5264050B2 (ja) |
KR (1) | KR100832926B1 (ja) |
CN (1) | CN100543956C (ja) |
TW (1) | TWI435403B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009249092A (ja) * | 2008-04-02 | 2009-10-29 | Toyota Motor Corp | 昇降装置およびその使用方法 |
JP2011148596A (ja) * | 2010-01-21 | 2011-08-04 | Sanshin Seiki:Kk | 缶底弁の昇降装置 |
CN113942829A (zh) * | 2021-11-09 | 2022-01-18 | 内蒙古创维智能科技有限公司 | 一种自动移载装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102686367B (zh) * | 2009-12-28 | 2015-05-20 | 株式会社爱发科 | 驱动装置及输送装置 |
TWI624307B (zh) * | 2013-11-06 | 2018-05-21 | All Ring Tech Co Ltd | Carrier transfer method and device |
CN105355581B (zh) * | 2014-08-19 | 2018-09-18 | 北京北方华创微电子装备有限公司 | 一种反应腔室、半导体加工设备及被加工工件的传输方法 |
CN104291248B (zh) * | 2014-09-03 | 2016-08-24 | 天奇自动化工程股份有限公司 | 工位转换装置 |
JP7050090B2 (ja) * | 2017-12-21 | 2022-04-07 | 東京エレクトロン株式会社 | 基板搬送装置 |
KR101987576B1 (ko) * | 2018-01-24 | 2019-06-10 | 주식회사 기가레인 | 승강하는 유도부와 연동하는 연동부를 포함하는 기판 처리 장치 |
KR102288577B1 (ko) * | 2019-09-30 | 2021-08-11 | 주식회사 탑시스템 | 고효율 밸런싱 디스플레이 위치조절장치 |
CN111048466B (zh) * | 2019-12-26 | 2022-08-16 | 北京北方华创微电子装备有限公司 | 晶圆夹持装置 |
CN113248130A (zh) * | 2021-05-24 | 2021-08-13 | 黄文仙 | 一种中空玻璃生产加工用定段裁切装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6226391U (ja) * | 1985-07-31 | 1987-02-18 | ||
JPS63225100A (ja) * | 1987-03-05 | 1988-09-20 | セイフテック プロプライエタリー リミテッド | 荷物昇降装置、荷物昇降装置用ばねおよび荷物昇降装置の高さ調整方法 |
JPH09223727A (ja) * | 1995-12-12 | 1997-08-26 | Tokyo Electron Ltd | 半導体処理装置、その基板交換機構及び基板交換方法 |
JP2000306978A (ja) * | 1999-02-15 | 2000-11-02 | Kokusai Electric Co Ltd | 基板処理装置、基板搬送装置、および基板処理方法 |
JP2005059988A (ja) * | 2003-08-08 | 2005-03-10 | Seiko Giken Kk | 昇降装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3850951B2 (ja) * | 1997-05-15 | 2006-11-29 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
KR100289848B1 (ko) * | 1998-09-18 | 2001-06-01 | 윤종용 | 반도체 웨이퍼 이송장치 |
-
2005
- 2005-09-02 JP JP2005255292A patent/JP5264050B2/ja not_active Expired - Fee Related
-
2006
- 2006-08-31 KR KR1020060083846A patent/KR100832926B1/ko not_active IP Right Cessation
- 2006-09-01 TW TW095132468A patent/TWI435403B/zh active
- 2006-09-04 CN CNB200610128925XA patent/CN100543956C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6226391U (ja) * | 1985-07-31 | 1987-02-18 | ||
JPS63225100A (ja) * | 1987-03-05 | 1988-09-20 | セイフテック プロプライエタリー リミテッド | 荷物昇降装置、荷物昇降装置用ばねおよび荷物昇降装置の高さ調整方法 |
JPH09223727A (ja) * | 1995-12-12 | 1997-08-26 | Tokyo Electron Ltd | 半導体処理装置、その基板交換機構及び基板交換方法 |
JP2000306978A (ja) * | 1999-02-15 | 2000-11-02 | Kokusai Electric Co Ltd | 基板処理装置、基板搬送装置、および基板処理方法 |
JP2005059988A (ja) * | 2003-08-08 | 2005-03-10 | Seiko Giken Kk | 昇降装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009249092A (ja) * | 2008-04-02 | 2009-10-29 | Toyota Motor Corp | 昇降装置およびその使用方法 |
JP2011148596A (ja) * | 2010-01-21 | 2011-08-04 | Sanshin Seiki:Kk | 缶底弁の昇降装置 |
CN113942829A (zh) * | 2021-11-09 | 2022-01-18 | 内蒙古创维智能科技有限公司 | 一种自动移载装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI435403B (zh) | 2014-04-21 |
KR20070026216A (ko) | 2007-03-08 |
KR100832926B1 (ko) | 2008-05-27 |
CN100543956C (zh) | 2009-09-23 |
JP5264050B2 (ja) | 2013-08-14 |
CN1925126A (zh) | 2007-03-07 |
TW200723433A (en) | 2007-06-16 |
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