TW200723433A - Lifting mechanism and conveying device - Google Patents

Lifting mechanism and conveying device

Info

Publication number
TW200723433A
TW200723433A TW095132468A TW95132468A TW200723433A TW 200723433 A TW200723433 A TW 200723433A TW 095132468 A TW095132468 A TW 095132468A TW 95132468 A TW95132468 A TW 95132468A TW 200723433 A TW200723433 A TW 200723433A
Authority
TW
Taiwan
Prior art keywords
lifting
lifting mechanism
conveying unit
conveying device
driving part
Prior art date
Application number
TW095132468A
Other languages
Chinese (zh)
Other versions
TWI435403B (en
Inventor
Hideki Nakayama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200723433A publication Critical patent/TW200723433A/en
Application granted granted Critical
Publication of TWI435403B publication Critical patent/TWI435403B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

To provide a lifting mechanism capable of making respective constitution parts small and compact in the lifting mechanism applied for lifting a heavy article. The lifting mechanism 502 for lifting a conveying unit 501 being a heavy article is provided with a lifting base 550 for supporting and lifting the conveying unit 501; a lifting driving part 560 for lifting the lifting base 550; and an assist mechanism 570 for applying assist force upwardly acted against the load of the conveying unit applied to the lifting driving part 560.
TW095132468A 2005-09-02 2006-09-01 Lifting mechanism and conveying device TWI435403B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005255292A JP5264050B2 (en) 2005-09-02 2005-09-02 Lifting mechanism and transfer device

Publications (2)

Publication Number Publication Date
TW200723433A true TW200723433A (en) 2007-06-16
TWI435403B TWI435403B (en) 2014-04-21

Family

ID=37817691

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132468A TWI435403B (en) 2005-09-02 2006-09-01 Lifting mechanism and conveying device

Country Status (4)

Country Link
JP (1) JP5264050B2 (en)
KR (1) KR100832926B1 (en)
CN (1) CN100543956C (en)
TW (1) TWI435403B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624307B (en) * 2013-11-06 2018-05-21 All Ring Tech Co Ltd Carrier transfer method and device

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5400315B2 (en) * 2008-04-02 2014-01-29 株式会社 タイコー Lifting device and method of using the same
CN102686367B (en) * 2009-12-28 2015-05-20 株式会社爱发科 Drive device and conveyance device
JP5524636B2 (en) * 2010-01-21 2014-06-18 株式会社三信精機 Lifting device for can bottom valve
CN105355581B (en) * 2014-08-19 2018-09-18 北京北方华创微电子装备有限公司 A kind of transmission method of reaction chamber, semiconductor processing equipment and workpiece to be machined
CN104291248B (en) * 2014-09-03 2016-08-24 天奇自动化工程股份有限公司 Station conversion device
JP7050090B2 (en) * 2017-12-21 2022-04-07 東京エレクトロン株式会社 Board transfer device
KR101987576B1 (en) * 2018-01-24 2019-06-10 주식회사 기가레인 Substrate processing apparatus including an interlocking part linked with an elevating inducing part
KR102288577B1 (en) * 2019-09-30 2021-08-11 주식회사 탑시스템 Position control apparatus of display
CN111048466B (en) * 2019-12-26 2022-08-16 北京北方华创微电子装备有限公司 Wafer clamping device
CN113248130A (en) * 2021-05-24 2021-08-13 黄文仙 Fixed-section cutting device for production and processing of hollow glass
CN113942829A (en) * 2021-11-09 2022-01-18 内蒙古创维智能科技有限公司 Automatic move and carry device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226391U (en) * 1985-07-31 1987-02-18
JPH07112920B2 (en) * 1987-03-05 1995-12-06 セイフテック プロプライエタリー リミテッド Luggage lifting device, spring for luggage lifting device, and height adjusting method for luggage lifting device
JP3650495B2 (en) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 Semiconductor processing apparatus, substrate replacement mechanism and substrate replacement method thereof
JP3850951B2 (en) * 1997-05-15 2006-11-29 東京エレクトロン株式会社 Substrate transport apparatus and substrate transport method
KR100289848B1 (en) * 1998-09-18 2001-06-01 윤종용 Semiconductor Wafer Transfer Device
JP2000306978A (en) * 1999-02-15 2000-11-02 Kokusai Electric Co Ltd Substrate treatment apparatus, substrate transfer apparatus, and substrate treatment method
JP4412941B2 (en) * 2003-08-08 2010-02-10 精工技研株式会社 lift device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624307B (en) * 2013-11-06 2018-05-21 All Ring Tech Co Ltd Carrier transfer method and device

Also Published As

Publication number Publication date
JP5264050B2 (en) 2013-08-14
TWI435403B (en) 2014-04-21
CN100543956C (en) 2009-09-23
CN1925126A (en) 2007-03-07
KR100832926B1 (en) 2008-05-27
JP2007069991A (en) 2007-03-22
KR20070026216A (en) 2007-03-08

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