CN100543956C - Elevating mechanism and carrying device - Google Patents

Elevating mechanism and carrying device Download PDF

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Publication number
CN100543956C
CN100543956C CNB200610128925XA CN200610128925A CN100543956C CN 100543956 C CN100543956 C CN 100543956C CN B200610128925X A CNB200610128925X A CN B200610128925XA CN 200610128925 A CN200610128925 A CN 200610128925A CN 100543956 C CN100543956 C CN 100543956C
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CN
China
Prior art keywords
conveyance unit
lifting
carrying device
elevating mechanism
drive division
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Expired - Fee Related
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CNB200610128925XA
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Chinese (zh)
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CN1925126A (en
Inventor
中山秀树
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

The invention provides a kind of elevating mechanism that can be applicable to the weight lifting, it is to dwindle each detail of construction, carries out the elevating mechanism of miniaturization.Lifting comprises as the elevating mechanism (502) of the conveyance unit (501) of weight: support conveyance unit (501) and make the load of the lifting platform (550) of its lifting, the lifting drive division (560) that makes lifting platform (550) lifting, the described conveyance unit of resistant function on lifting drive division (560) and the auxiliary body (570) of the auxiliary force that generation upwards acts on.

Description

Elevating mechanism and carrying device
Technical field
The present invention relates to the elevating mechanism of lifting weight and adopt its carrying device.As this elevating mechanism, can list employed elevating mechanism in the carrying device that is installed on flat-panel monitor (FPD) the usefulness processing unit of large-size glass substrate.
Background technology
In the manufacture process of the flat-panel monitor of representing LCD (LCD) (FPD), use have a plurality of vacuum treatment installations of under vacuum, substrate being implemented particular procedure such as etching, annealing, film forming, be many chamber profile vacuum flush system.
This vacuum flush system comprises: be provided with the conveyance substrate carrying device carrying room and be arranged on a plurality of process cavity around it, by the carrying arm in the carrying room, processed substrate is moved in each process cavity, simultaneously, the substrate of finishing dealing with is taken out of from the process cavity of each vacuum treatment installation.In addition, on carrying room, be connected with load locking room, move into when taking out of,, can handle a plurality of substrates in that treatment chamber and carrying room are maintained under the vacuum state at the substrate that carries out atmospheric side.This many chamber profile treatment system for example discloses in patent documentation 1 to some extent.
But, recently the requirement of the maximization of LCD glass substrate is increased gradually, even occur surpassing so huge substrate of 2m on one side, corresponding with it, the device maximization that also becomes, the maximization that also becomes of its employed various inscapes.Particularly, for the employed carrying device of carrying room, for example comprise: having by containing as the base plate supports portion material that carries out the substrate transmission is the conveyance unit of the driving and reversing mechanism that constitutes of the multilayer carrying arm of pick-up (pick) and the rotating mechanism that rotates this driving and reversing mechanism and the lifting unit that makes this conveyance unit lifting, follow the maximization of substrate, becoming weight as the conveyance unit of elevating mechanism lifting object installs greatly, each detail of construction of elevating mechanism increases in order to tackle load, need to improve size, have problems at aspect the disposal of part and cost aspect etc.In addition, even substrate maximizes, the requirement of the miniaturization processing unit self of doing the best is arranged also.Therefore, require the above-mentioned elevating mechanism of miniaturization as far as possible.
Patent documentation 1: 9-No. 223727 communiques of Japanese kokai publication hei
Summary of the invention
The present invention proposes in view of the above problems, is the elevating mechanism that is applicable to the weight lifting, and its purpose is to provide a kind of each detail of construction that can dwindle, and carries out the elevating mechanism of miniaturization.
In addition, its purpose is to provide a kind of carrying device that is suitable for this elevating mechanism.
In order to solve above-mentioned problem, the invention provides a kind of elevating mechanism of lifting weight, it is characterized in that, comprising: support above-mentioned weight and make the load of the lifting platform of its lifting, the lifting drive division that makes above-mentioned lifting platform lifting and the resistant function above-mentioned weight to the above-mentioned lifting drive division and produce the upwards auxiliary body of the auxiliary force of effect.
In above-mentioned elevating mechanism, as above-mentioned auxiliary body, can have spring, the elastic force of above-mentioned spring is acted on the above-mentioned lifting drive division as auxiliary force.At this moment, can use helical spring as above-mentioned spring, above-mentioned helical spring becomes the maximum state that shrinks when above-mentioned lifting platform is positioned at extreme lower position, and it is maximum that its elastic force reaches.
In addition, above-mentioned lifting drive division can make such structure: the driving mechanism that it has the ball-screw that screws togather above-mentioned lifting platform and makes the ball-screw rotation.
In addition, the invention provides a kind of carrying device, it comprises the above-mentioned transport object of support and carries out the conveyance unit of conveyance and the elevating mechanism that makes above-mentioned conveyance unit lifting and adjust the height and position of above-mentioned conveyance unit, it is characterized in that above-mentioned elevating mechanism comprises: support above-mentioned conveyance unit and make the load of the lifting platform of its lifting, the lifting drive division that makes above-mentioned lifting platform lifting and the resistant function above-mentioned conveyance unit to the above-mentioned lifting drive division and produce the upwards auxiliary body of the auxiliary force of effect.
In above-mentioned carrying device, as above-mentioned auxiliary body, can have spring, the elastic force of above-mentioned spring is acted on the above-mentioned lifting drive division as auxiliary force.At this moment, can adopt helical spring as above-mentioned spring, above-mentioned helical spring reaches the contraction maximum rating when above-mentioned lifting platform is positioned at extreme lower position, and it is maximum that its elastic force reaches.
In addition, above-mentioned lifting drive division can make such structure: the driving mechanism that has the ball-screw that screws togather above-mentioned lifting platform and ball-screw is rotated.
As above-mentioned conveyance unit, can adopt such structure, comprising: have in the horizontal direction and to move by the transport mechanism portion of the telescopic arm of transport object and make the rotary driving part of above-mentioned transport mechanism portion rotation.In addition, also have pedestal as above-mentioned transport mechanism portion, above-mentioned telescopic arm can use such structure, that is, have the arm of translatory movement on the said base and on above-mentioned arm translatory movement and supporting by the pick-up of transport object.And above-mentioned conveyance unit can make such structure,, has two above-mentioned transport mechanism portions up and down that is.And, can make such structure as above-mentioned conveyance unit, that is, be configured in internal vacuum chamber.And, by transport object, can adopt large-size glass substrates such as LCD glass substrate as above-mentioned.
According to the present invention, in the elevating mechanism of lifting weight, because be provided with the load of the above-mentioned weight of resistant function to the lifting drive division and produce the upwards auxiliary body of the auxiliary force of effect, so the auxiliary force by auxiliary body produces alleviates the load that affacts the lifting drive division, so, can dwindle the detail of construction of elevating mechanism, can dwindle the lifting drive division especially, thereby make the miniaturization elevating mechanism self become possibility.
In addition, be used for for example carrying device of large substrate of conveyance by this elevating mechanism is applicable to, its result can the miniaturization carrying device.Therefore, by this carrying device being used for the processing unit of large substrate, can make the processing unit integral miniaturization.
Description of drawings
Fig. 1 is the stereogram that the elevating mechanism of roughly representing an embodiment of the present invention is applicable to the plasma treatment appts of carrying device.
Fig. 2 is the horizontal sectional view of the plasma treatment appts of Fig. 1.
Fig. 3 is the calcspar of the general structure of expression control part.
Fig. 4 is the vertical cross-section diagram of the carrying device of the elevating mechanism of expression with an embodiment of the present invention in the carrying room that is arranged in Fig. 1 plasma treatment appts.
Fig. 5 is the stereogram of conveyance unit of the carrying device of presentation graphs 4.
Fig. 6 is the figure of auxiliary force of auxiliary body that is used for illustrating the elevating mechanism of an embodiment of the present invention.
Fig. 7 is rotating shaft, the ball-screw in the elevating mechanism of expression an embodiment of the present invention, the planar configuration location drawing of auxiliary body.
Fig. 8 is the graph of a relation between the load of the auxiliary force of the height and position of lifter plate in the elevating mechanism of expression an embodiment of the present invention and auxiliary body and motor.
Symbol description:
1: plasma treatment appts
10a, 10b, 10C: process cavity
20: carrying room
30: load locking room (load lock chamber)
50: carrying device
60: control part
501: the conveyance unit
502: elevating mechanism
510: epimere transport mechanism portion
520: hypomere transport mechanism portion
530: box-like support portion
540: the cylinder rotating shaft
541: drive division
550: lifting platform
551: supporting bracket
552: rotating shaft (shaft)
553: lifter plate
560: spherical screw mechanism
561: ball-screw (ball screw)
562: motor
566: the guiding rotating shaft
570: auxiliary (assist) mechanism
572: helical spring (coil spring)
Embodiment
Below, with reference to accompanying drawing, preferred implementation of the present invention is described.Here, to elevating mechanism of the present invention is used for the example that FPD carries out with glass substrate S (below, only be called " substrate ") in the carrying device of many chamber profile plasma treatment appts of plasma treatment is described.At this, as FPD, illustration have LCD (LCD), light-emitting diode (LED) display, electroluminescence (Electro Luminescence:EL) display, fluorescent display tube (Vacuum Fluorescent Display, VFD) and plasma display panel (PDP) etc.
Fig. 1 is that the elevating mechanism of roughly representing an embodiment of the present invention is applicable to the stereogram in the plasma treatment appts of carrying device, and Fig. 2 is a horizontal sectional view of representing that roughly it is inner.
For this plasma treatment device 1, portion is connected with carrying room 20 and load locking room 30 in the central.Around carrying room 20, be equipped with three process cavity 10a, 10b, 10c.
Be communicated with between conveyance container 20 and the load locking room 30, the peristome of the atmospheric environment between conveyance container 20 and each process cavity 10a, 10b, the 10c and the load locking room 30 and the outside, insert respectively sealing between them the space and the gate valve 22 that can construct with opening and closing.
Arranged outside at load locking room 30 has two cartridge dispenser 41, and mounting has the box body 40 of accommodating substrate S respectively in the above.For example can accommodate untreatment base among one of these box bodys 40, among another, accommodate treatment substrate.These box bodys 40 can carry out lifting by elevating mechanism 42.
Between these two box bodys 40, brace table 44 is provided with base board delivery device 43, and this base board delivery device 43 possesses and is arranged on bilevel pick-up 45,46 and can makes their turnover keep out of the way and support rotatably their pedestal 47 integratedly.
For above-mentioned process cavity 10a, 10b, 10c, its inner space can remain on specific reduced pressure atmosphere, and portion carries out plasma treatment, for example etch processes or annealing in process etc. within it.Like this, owing to have three process cavity, therefore, for example can be with two process cavity wherein as the structure of etch process chamber, with the structure of a remaining process cavity as annealing chamber, perhaps, with three process cavity all as the structure of etch process chamber of carrying out same processing or annealing chamber.In addition, the quantity of process cavity is not limited to three, also can be more than four.
For carrying room 20.It is identical with vacuum processing chamber, can remain on specific reduced pressure atmosphere, and as shown in Figure 2, portion is equipped with carrying device 50 within it.In addition, by this carrying device 50, conveyance substrate S between load locking room 30 and three process cavity 10a, 10b, 10c.About carrying device 50, describe in detail in the back.
Load locking room 30 is identical with each process cavity 10 and carrying room 20, can remain on specific reduced pressure atmosphere.In addition, load locking room 30 is used for carrying out the transmission of substrate S between process cavity 10a, the 10b of box body 40 that is in atmospheric environment and reduced pressure atmosphere, 10c, fastens in the pass of repeating atmospheric environment and reduced pressure atmosphere, dwindles its internal container as possible and constructs.Load locking room 30 is provided with up and down two-layer substrate resettlement section 31 (Fig. 2 only illustrates the upper strata), is provided with a plurality of buffer tables 32 of supporting substrate S in each substrate resettlement section 31, and between these buffer tables 32, what form carrying arm keeps out of the way groove 32a.In addition, in load locking room 30, near the bight relative to each other of rectangular-shaped substrate S, be provided with and carry out the locator 33 that the position is adjusted.
For each structure portion of plasma treatment appts 1, itself and control part 60 are formed by connecting and are controlled structure (omitting diagram among Fig. 1).The brief description of expression control part 60 among Fig. 3.Control part 60 comprises the machining control device 61 with CPU, and this machining control device 61 is connected with keyboard of input operation that process management person instructs in order to manage plasma treatment appts 1 etc. or the user interface 62 that is made of display of the working condition of visualization display plasma treatment appts 1 etc.
In addition, control part 60 has stored record and is used for the storage part 63 that control by machining control device 61 realizes the handling procedure of the control program (software) of the various processing that plasma treatment appts 1 is carried out or treatment conditions data etc., and this storage part 63 is connected on the machining control device 61.
In addition, as required, access handling procedure arbitrarily from storage part 63, machining control device 61 is carried out, like this, under the control of machining control device 61, carry out the processing of the expectation on the plasma treatment appts 1 by the indication of sending etc. from user interface 62.
Handling procedures such as above-mentioned control program or treatment conditions data, can utilize and be stored in for example data of the state of CD-ROM, hard disk, disk, flash memory etc. of computer readable memory medium, perhaps, utilize, for example transmit at any time and carry out online utilization by special circuit from other devices.
Below, the carrying device 50 to the carrying room 20 of elevating mechanism with present embodiment at length describes.
Fig. 4 represents the vertical cross-section diagram of this carrying device 50, and Fig. 5 is the stereogram of this conveyance unit of expression.This carrying device 50 has the conveyance unit 501 that carries out conveyance action and the elevating mechanism 502 of lifting conveyance unit 501.
Conveyance unit 501 is such types: two-layer slip pick-up is set, carries out moving into of substrate respectively independently and take out of, have upper strata transport mechanism portion 510 and transport mechanism portion of lower floor 520.
Upper strata transport mechanism portion 510 comprises: base portion 511, be slidably disposed on the travelling arm 512 on the base portion 511 and be slidably disposed on the slip pick-up 513 of the brace table of the substrate on this travelling arm 512 as support.In addition, on the side arm of travelling arm 512, be provided with and be used for slide relative arm 512 and make the guide rail 515 that slip pick-up 513 slides and be used for the guide rail 516 that relative base portion 511 is slided travelling arm 512.In addition, on pick-up 513, be provided with the slide block 517 that slides along guide rail 515, on base portion 511, be provided with the slide block 518 that slides along guide rail 516.
Hypomere transport mechanism portion 520 comprises: base portion 521, be slidably disposed on the travelling arm 522 of base portion 521 and be slidably disposed on the slip pick-up 523 of the brace table of the substrate on this travelling arm 522 as support.In addition, on the side arm of travelling arm 522, be provided with and be used for slide relative arm 522 and make the guide rail 525 that slip pick-up 523 slides and be used for the guide rail 526 that relative base portion 521 is slided travelling arm 522.In addition, on pick-up 523, be provided with the slide block 527 that slides along guide rail 525, on base portion 521, be provided with the slide block 528 that slides along guide rail 526.
Base portion 511 and base portion 521 link by linking part 531 and 532, constitute box-like support portion 530 by base portion 511,521, linking part 531,532, this box-like support portion 530 can be rotatably set on the supporting bracket 551 described later, be rotated by box-like support portion 530, top transport mechanism portion 510 and bottom transport mechanism portion 520 are rotated.Three cylinder rotating shafts 540 of coaxial shape configuration extend to the below of the base plate 201 of carrying room 20 from the bottom of box-like support portion 530, are connecting drive division 541 in its lower end.In drive division 541, be built-in with the travelling arm 512 and the driving mechanism of the driving mechanism of slip pick-up 513, the travelling arm 522 that drives hypomere transport mechanism 520 and slip pick-up 523 and the rotary drive mechanism (all not shown) that makes 530 rotations of box-like support portion that drive epimere transport mechanism 510, the actuating force of these driving mechanisms passes to each several part by three cylinder rotating shafts 540.Wherein, drive division 541 is configured in the positive upper/lower positions of lifter plate 553 described later.From the base plate 201 of cylinder rotating shaft 540 to be provided with bellows (not shown) around the lower part as sealing mechanism.
In hypomere transport mechanism 520, from a plurality of pulleys and volume extension thereon the transmission such as band of power by being built in travelling arm 522 that driving mechanism sends, in view of the above, travelling arm 522 and slip pick-up 523 slide point-blank.At this moment, by adjusting the diameter ratio of pulley, for the mobile stroke of travelling arm 522, can enlarge the mobile stroke of slip pick-up 523, reply large substrate easily becomes.
In top transport mechanism 510, the Poewr transmission mechanism transmission of power by constituting of sending from driving mechanism by pulley that is built in base portion 521, linking part 531, base portion 511 and band etc., and, by a plurality of pulleys and the transmission such as band thereon of volume extension that is built in travelling arm 512, in view of the above, travelling arm 512 and slip pick-up 513 slide point-blank.Identical with hypomere transport mechanism 520, by adjusting the diameter ratio of pulley,, can enlarge the mobile stroke of slip pick-up 513 for the mobile stroke of travelling arm 512.
Elevating mechanism 502 comprises: liftably support conveyance unit 501 lifting platform 550, be arranged on the below of the base plate 201 of carrying room 20, the spherical screw mechanism 560 by lifting platform 330 lifting conveyance unit 501 and bring the upwards auxiliary body 570 of auxiliary force when utilizing spherical screw mechanism 560 conveyance unit 501 to be risen by lifting platform 550.
Spherical screw mechanism 560 has three (only two of diagrams) ball-screws 561 and four the guiding rotating shafts 566 (only two of diagrams) that extend downwards below base plate 201.The below of base plate 201 is a belfry, is provided with base framework 202 at foot, and the lower end of ball-screw 561 connects this base framework 202 and is provided with.Base framework 202 is provided with the motor 562 that is used for swing roller leading screw 561.Extend the axial below of this motor 562, and the tip of the axis is installed on the pulley 563.In addition, the lower end of each ball-screw 561 is provided with pulley 564, and volume hangs with and is with 565 on the pulley 564 of the pulley 563 of motor 562 and each ball-screw 561, and by the driving of motor 562, each ball-screw 561 is rotated.
Four rotating shafts 552 that lifting platform 550 has the supporting bracket 551 that supports box-like support portion 530, extend to the below of supporting bracket 551 and the lower end of supporting rotating shaft 552 also are screwed on the lifter plate 553 that carries out lifting on above-mentioned three each ball-screws 561.In addition, make each ball-screw 561 rotation by motor 562, like this, lifter plate 553 is directed rotating shaft 566 guiding by slide block 567 and carries out lifting, accompanies with it, and the conveyance unit 501 on the supporting bracket 551 carries out lifting, when lifter plate 553 is positioned at the solid line position of Fig. 4, conveyance unit 501 is positioned at topmost, and when lifter plate 553 was positioned at two pecked lines, conveyance unit 501 was positioned at foot.In addition, around the rotating shaft 552 between base plate 201 and the lifter plate 553, be provided with bellows 554 as sealing mechanism.
Auxiliary body 570 comprises: the upper end is installed on the base plate 201 of carrying room 20, hang below four rotating shafts 571, the helical spring 572 that is provided with along rotating shaft 571, the upper end of helical spring 572 is fixed on the fixed part material 573 on the above-mentioned lifter plate 553 and is arranged on the lower end of rotating shaft 571, the block 574 of the lower end of the helical spring 572 that is standing.
Fig. 6 is the figure that is used to illustrate the auxiliary force of auxiliary body 570.The left side expression makes lifter plate 553 be positioned at the state of topmost among the figure, and the right side represents to make lifter plate 553 to be positioned at the state of foot among the figure.In the present embodiment, the elastic force of the auxiliary force of auxiliary body 570 by helical spring 572 is created in the lifter plate 553 in left side is positioned under the state of topmost, helical spring 572 is the state of long extension, it is minimum that its elastic force reaches, it is minimum that auxiliary force also reaches, and is positioned under the state of foot at the lifter plate 553 that makes the right side, and helical spring 572 is for shrinking maximum state, it is maximum that its elastic force reaches, and it is maximum that auxiliary force also reaches.
Wherein, for example such for Fig. 7 signal of the planar configuration position of the rotating shaft 552 in the elevating mechanism 502, ball-screw 561, guiding rotating shaft 566, auxiliary body 570.In addition, also illustrate cylinder rotating shaft 540 and bellows on every side 543 thereof, rotating shaft 552 bellows 544 on every side among Fig. 7.
Below, to as the action of the plasma treatment appts 1 of above-mentioned structure describe.
At first, advance and retreat drive two pick-ups 45,46 of transport mechanism 43, two plate base S are moved into the bilevel substrate resettlement section 31 of load locking room 30 from a box body 40 of accommodating untreatment base.
After pick-up 45,46 is kept out of the way, close the gate valve 22 of the atmospheric side of load locking room 30.Then, discharge the gas in the load locking room 30, specific vacuum degree is arrived in inner pressure relief.After vacuumizing end, press substrate by giving as security with locator 33, carry out the position adjustment of substrate S.
After the position is adjusted as described above, open the gate valve 22 between carrying room 20 and the load locking room 30, by the carrying device 50 in the carrying room 20, the substrate S that acceptance is housed in the substrate resettlement section 31 of load locking room 30 moves into any process cavity 10a, 10b, 10C.In addition, the substrate S that handles at process cavity 10a, 10b, 10C takes out of by carrying device 50, through load locking room 30, is housed in the box body 40 by transport mechanism 43.At this moment, both can turn back in the original box body 40, also can be housed in the other box body 40.
In addition, from load locking room 30 taking-up substrate S the time, the slip pick-up 523 that partly send portion of mechanism 520 with the slip pick-up 513 and/or the hypomere of the epimere transport mechanism portion 510 in the carrying device 50 inserts load locking rooms 30, accepts substrate S by slip pick-up 513 and/or slip pick-up 523.Slip pick-up 513 and/or 523 is moved into the substrate S that receives among any process cavity 10a, 10b, the 10C.At this moment, in the process cavity that will move into substrate S, exist under the situation of the substrate S finish dealing with, can take out of after this substrate S, the substrate S that is stated from another slip pick-up is inserted in the process cavity with a slip pick-up.The substrate S that finishes dealing with is delivered to load locking room 30 after being accepted by slip pick-up 513 and/or 523.
When carrying out above conveyance, utilize rotary drive mechanism, make epimere transport mechanism portion 510 or 520 rotations of hypomere transport mechanism portion, carry out their position adjustment by box-like support portion 530 by the carrying device 50 in the carrying room 20.In addition, fasten in the pass with two-layer up and down transport mechanism portion 510,520, the lifting action of the conveyance unit 501 that is undertaken by the lifting unit 502 by carrying device 50 is adjusted the height and position of slip pick-up.
Carrying out as described above the stage that the position is adjusted, releasing or be retracted into, carrying out the conveyance of substrate S by making travelling arm 512,522, slip pick-up 513,523.
In elevating mechanism 502, utilize motor 562 by being with 565 to make 561 rotations of each ball-screw, by like this, make lifter plate 553 carry out lifting, make conveyance unit 501 liftings on the supporting bracket 551 by rotating shaft 552.
At this moment, follow the maximization of substrate, it is very big that carrying device 50 also becomes, and weight also increases, and also becomes extremely heavy as the conveyance unit 501 of the lifting object of elevating mechanism 502, therefore, elevating mechanism 502 applied bigger load.Particularly, spherical screw mechanism 560, portion is for motor 562 within it, the loading of conveyance unit 501 directly becomes load, in order to make the structure that can bear this load, at present, have to maximize more each structural element of elevating mechanism 502, particularly motor 562, to improve endurance.
In contrast, in the present embodiment, the auxiliary body 570 with helical spring 572 is set, by with the elastic force of helical spring 572 as the auxiliary force utilization, can alleviate the load that elevating mechanism 502 is applied, particularly among spherical screw mechanism 560 for the load of motor 562.
Specifically, when lifter plate 553 was positioned at foot, when promptly conveyance unit 501 was positioned at foot, the helical spring 572 of auxiliary body 570 shrank maximum, and it is maximum that the elastic force of helical spring 572 reaches, and therefore, it is maximum that auxiliary force also reaches.That is, because the elastic force of helical spring 572 upwards plays a role, therefore, by this auxiliary force, the feasible load that the motor 562 of spherical screw mechanism 560 is applied is alleviated.
If by spherical screw mechanism 560 conveyance unit 501 is risen, then helical spring 572 is stretched out at leisure, and its elastic force reduces at leisure, and auxiliary force also reduces at leisure.Therefore, the load that the motor 562 of spherical screw mechanism 560 is applied rises.
Relation table between the load of the height and position (being the height and position of conveyance unit) of the lifter plate 553 of this moment and the auxiliary force of auxiliary body 570 and motor 562 is shown among Fig. 8.As shown in the drawing, along with the height and position increase of lifter plate 553, the auxiliary force of auxiliary body 570 reduces point-blank, and the load that motor 562 is applied increases point-blank.
At this moment, can consider load that motor 562 is applied, at random set the elastic force of the helical spring 572 of performance auxiliary force.For example, can set the spring constant of helical spring 572 etc., make auxiliary force reach maximum (extreme lower position) 9800N (1000kgf), minimum (extreme higher position) reach its 50%.Like this, conveyance unit 501 can make the load that motor 562 is applied be almost 0 in extreme lower position, even in the extreme higher position, load is also alleviated greatly.
In addition, about the load and the equilbrium position of auxiliary force, for example, can be made as half the position of pact of the lifting stroke of conveyance unit 501.But the equilbrium position is consulted and used condition and space etc. is set according to spring constant of helical spring 572 etc., can change arbitrarily.
Like this, by the auxiliary force that auxiliary body 570 produces, make the load that elevating mechanism 502 is applied, the load that particularly motor 562 is applied alleviate, therefore, can dwindle the detail of construction of elevating mechanism 502, particularly motor 562, make it possible to miniaturization elevating mechanism self.In addition, auxiliary body 570 becomes the structure that rotating spring 572 is set along rotating shaft 571 from base plate 201 rotating shaft 571 of hanging oneself down, himself also becomes the few minor structure of detail of construction in addition.And, can obtain the load and the balance of auxiliary force (elastic force) by auxiliary body 570, therefore,, can obtain to prevent conveyance unit 501 such effect of landing rapidly at motor 562 or when being with breakages such as 565.
Wherein, the invention is not restricted to above-mentioned execution mode, can carry out all distortion.For example, in the above-described embodiment, as transport mechanism, the situation that the transport mechanism portion of Direct Action Type is set up and down is illustrated two-layerly, still, is not limited to two-layer, also can be more than three layers, to be not limited to Direct Action Type, be the structure of multi-joint type also for example.In addition, in the above-described embodiment, be illustrated on elevating mechanism, adopting the mode of spherical screw mechanism, but be not limited thereto, also can adopt other mechanisms such as cylinder.In addition,, be illustrated, still,, be not limited to helical spring, also can adopt cylinder etc. if can give auxiliary force to being suitable for helical spring mode as auxiliary body.
In addition, in the above-described embodiment, the mode that elevating mechanism of the present invention is applicable to the lifting of the carrying device of processing handled object in vacuum environment (reduced pressure atmosphere) is illustrated, still, is not limited in a vacuum.In addition, be not limited to carrying device, go for whole weight liftings.

Claims (9)

1. a carrying device is characterized in that,
Have: support as the handled object of vacuum flush system by transport object and the conveyance unit that carries out conveyance; With the elevating mechanism that makes described conveyance unit lifting with the height and position of adjusting described conveyance unit, wherein,
Described elevating mechanism comprises:
Support described conveyance unit and make the lifting platform of its lifting;
Make the lifting drive division of described lifting platform lifting; With
The load of the described conveyance unit of resistant function to the described lifting drive division, and produce the upwards auxiliary body of the auxiliary force of effect plays a role when described auxiliary force rises on comprising described conveyance unit and in the time during decline always.
2. carrying device as claimed in claim 1 is characterized in that:
Described auxiliary body has spring, and the elastic force of described spring is acted on the described lifting drive division as auxiliary force.
3. carrying device as claimed in claim 2 is characterized in that:
Described spring is a helical spring, and when described lifting platform was positioned at extreme lower position, described helical spring reached the maximum state that shrinks, and it is maximum that its elastic force reaches.
4. as each described carrying device in the claim 1～3, it is characterized in that:
Described lifting drive division has the ball-screw that screws togather described lifting platform and makes the driving mechanism of ball-screw rotation.
5. as each described carrying device in the claim 1～3, it is characterized in that:
Described conveyance unit comprises having in the horizontal direction and moves by the transport mechanism portion of the telescopic arm of transport object and make the rotary driving part of described transport mechanism portion rotation.
6. carrying device as claimed in claim 5 is characterized in that:
Described transport mechanism portion also has pedestal, described telescopic arm have the arm of translatory movement on the described pedestal and on described arm translatory movement and supporting by the pick-up of transport object.
7. carrying device as claimed in claim 6 is characterized in that:
Described conveyance unit has two described transport mechanism portions up and down.
8. as each described carrying device in the claim 1～3, it is characterized in that:
Described conveyance unit is configured in internal vacuum chamber.
9. as each described carrying device in the claim 1～3, it is characterized in that:
Described is large-size glass substrate by transport object.
CNB200610128925XA 2005-09-02 2006-09-04 Elevating mechanism and carrying device Expired - Fee Related CN100543956C (en)

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TWI435403B (en) 2014-04-21
CN1925126A (en) 2007-03-07
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KR20070026216A (en) 2007-03-08
TW200723433A (en) 2007-06-16

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