JP2014038990A - Substrate conveyance device and substrate processing system - Google Patents

Substrate conveyance device and substrate processing system Download PDF

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JP2014038990A
JP2014038990A JP2012181903A JP2012181903A JP2014038990A JP 2014038990 A JP2014038990 A JP 2014038990A JP 2012181903 A JP2012181903 A JP 2012181903A JP 2012181903 A JP2012181903 A JP 2012181903A JP 2014038990 A JP2014038990 A JP 2014038990A
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substrate
chamber
processing
common transfer
base member
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Yohei Yamada
洋平 山田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2012181903A priority Critical patent/JP2014038990A/en
Priority to PCT/JP2013/067766 priority patent/WO2014030432A1/en
Priority to TW102129656A priority patent/TW201428876A/en
Publication of JP2014038990A publication Critical patent/JP2014038990A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a substrate conveyance device for making it unnecessary to increase the rigidity of a driving mechanism for elevation, and elevate the whole device.SOLUTION: A substrate conveyance device 50 installed in a common conveyance chamber 10 to which a plurality of modules 20, 30a, 30b and 40 are connected for conveying a substrate G among the plurality of modules comprises: a base member 51 disposed so as to be horizontally rotatable in a common conveyance chamber 10; a substrate support arm unit 53 for supporting a substrate; a support member 54 for elevatably supporting the substrate support arm unit 53, the support member 54 being supported so as to be movable in a horizontal direction on the base member 51; a rotation driving section 52 for driving the base member 51 to rotate; a horizontal driving part 55 for driving the support member 54 to travel in a horizontal direction along the base member 51; and an elevation driving section 56 for elevating the substrate support arm unit 53 along the support member 54.

Description

本発明は、基板を搬送する基板搬送装置およびそのような搬送装置を備えた、基板に処理を行う基板処理システムに関する。   The present invention relates to a substrate transfer device that transfers a substrate and a substrate processing system that includes such a transfer device and processes a substrate.

液晶ディスプレイ（ＬＣＤ）に代表されるフラットパネルディスプレイ（ＦＰＤ）や太陽電池などの製造過程においては、大型のガラス基板に対し、エッチングや成膜等の所定の処理を施す複数の処理室を備え、基板一枚ずつ処理を行う枚葉方式のマルチチャンバタイプの処理システムが知られている（例えば、特許文献１）。   In the manufacturing process of flat panel displays (FPD) typified by liquid crystal displays (LCDs) and solar cells, a large glass substrate is provided with a plurality of processing chambers for performing predetermined processing such as etching and film formation, A single-wafer multi-chamber type processing system that processes substrates one by one is known (for example, Patent Document 1).

また、一度に複数枚の基板を処理するマルチチャンバタイプの処理システムも知られている（例えば特許文献２）。   A multi-chamber type processing system that processes a plurality of substrates at a time is also known (for example, Patent Document 2).

特許文献１に開示された枚葉式の処理システムおよび特許文献２に開示されたバッチ式の処理システムは、いずれも大型の基板（被処理体）を搬送する搬送装置が設けられた共通搬送室を有し、この共通搬送室の周囲に、処理前および処理後の被処理体を交換するロードロック室と、処理室等の複数のモジュールが取り付けられている。基板は、共通搬送室に設けられた搬送装置を用いて、各モジュール間で搬送される。   Both the single wafer processing system disclosed in Patent Document 1 and the batch processing system disclosed in Patent Document 2 have a common transfer chamber provided with a transfer device for transferring a large substrate (object to be processed). Around the common transfer chamber, a load lock chamber for exchanging the object to be processed before and after the processing, and a plurality of modules such as the processing chamber are attached. A board | substrate is conveyed between each module using the conveying apparatus provided in the common conveyance chamber.

ところで、上記特許文献１，２に開示されたマルチチャンバタイプの処理システムにおいては、例えば、処理室で処理された基板を搬送する際、共通搬送室の搬送装置の基板支持アームを処理室へ挿入した後、基板を受け渡すが、この際の基板の受け渡しは、処理室内で基板のエッジを支持して基板を昇降する機構を設けて、基板を昇降させることにより行われるか、または、基板を支持ピン上に支持した状態で基板支持アームを昇降駆動させることにより行われる。   By the way, in the multi-chamber type processing system disclosed in Patent Documents 1 and 2, for example, when a substrate processed in the processing chamber is transferred, the substrate support arm of the transfer device in the common transfer chamber is inserted into the processing chamber. After that, the substrate is transferred. In this case, the substrate is transferred by moving the substrate up and down by providing a mechanism for supporting the edge of the substrate and moving the substrate up and down in the processing chamber. This is performed by driving the substrate support arm up and down while being supported on the support pins.

しかし、前者の基板を昇降させる場合には、薄型基板を搬送しようとすると、基板が大きく撓むため、特にバッチ式タイプにおいてクリアランス確保が難しくなる。この場合に、基板の面内（中央部）に支持ピンを設けて撓みを抑えることが考えられるが、機構部を格納するための高さが必要となり、目的とする処理枚数（段数）の確保が難しくなる。   However, in the case where the former substrate is moved up and down, if a thin substrate is to be transferred, the substrate is greatly bent, so that it is difficult to ensure clearance especially in the batch type. In this case, it may be possible to suppress the bending by providing a support pin in the plane (center part) of the substrate. However, a height for storing the mechanism part is required, and the target number of processed sheets (number of stages) is ensured. Becomes difficult.

これに対して、後者の基板支持アームを昇降駆動させる場合には、基板のエッジおよび基板の面内に支持ピンを設けられるのでこのような問題を回避することが可能となる。基板支持アームを昇降駆動させるためには、共通搬送室の外部に設けられた駆動装置により基板支持アームを含む搬送装置自体を昇降させることが一般的である。   On the other hand, when the latter substrate support arm is driven up and down, such a problem can be avoided because the support pins are provided on the edge of the substrate and in the plane of the substrate. In order to raise and lower the substrate support arm, it is common to raise and lower the transfer device itself including the substrate support arm by a driving device provided outside the common transfer chamber.

特開平１０−９８０８５号公報JP-A-10-98085 特開２０１１−３５１０３号公報JP 2011-35103 A

しかしながら、大型のＦＰＤ基板を搬送するための搬送装置や、バッチ式装置に設けられる搬送装置においては、搬送装置自体の重量は１ｔを超えることが多い。このため、昇降のための駆動機構を高剛性にする必要がある。また、搬送装置の昇降ストロークも大きなものとなる。このため、搬送室の下方に昇降駆動のための高い空間が必要となってしまう。これにより、搬送室内の基板搬送ラインの位置が高くなり、メンテナンスや輸送等に制限がでる場合がある。また、昇降のための駆動機構を高剛性にするためには、コストが高いものとなってしまう。特に、バッチ式の搬送装置にこれらの傾向が大きい。   However, in a transport device for transporting a large FPD substrate or a transport device provided in a batch type device, the weight of the transport device itself often exceeds 1 t. For this reason, it is necessary to make the drive mechanism for raising / lowering highly rigid. Moreover, the raising / lowering stroke of a conveying apparatus also becomes a big thing. For this reason, a high space for raising and lowering drive is required below the transfer chamber. As a result, the position of the substrate transfer line in the transfer chamber is increased, which may limit maintenance, transportation, and the like. Moreover, in order to make the drive mechanism for raising / lowering highly rigid, cost will become high. In particular, these tendencies are large in batch-type transport apparatuses.

本発明はかかる事情に鑑みてなされたものであって、昇降のための駆動機構を高剛性にする必要がなく、装置全体を昇降させる必要がない基板搬送装置、およびそのような基板搬送装置を用いた処理システムを提供することを課題とする。   The present invention has been made in view of such circumstances, and there is no need to make a drive mechanism for raising and lowering high rigidity, and there is no need to raise and lower the entire apparatus, and such a substrate carrying apparatus. It is an object to provide a processing system used.

上記課題を解決するため、本発明の第１の観点では、複数のモジュールが接続された共通搬送室に設けられ、前記複数のモジュール間で基板の搬送を行う基板搬送装置であって、前記共通搬送室内に水平にかつ旋回可能に設けられたベース部材と、基板を支持する基板支持アームと、前記基板支持アームを昇降可能に支持し、前記ベース部材に水平方向に移動可能に支持された支持部材と、前記ベース部材を旋回させる旋回駆動部と、前記支持部材を前記ベース部材に沿って水平方向に走行させる水平駆動部と、前記基板支持アームを前記支持部材に沿って昇降させる昇降駆動部とを具備することを特徴とする基板搬送装置を提供する。   In order to solve the above-described problem, according to a first aspect of the present invention, there is provided a substrate transfer apparatus that is provided in a common transfer chamber to which a plurality of modules are connected, and that transfers a substrate between the plurality of modules. A base member that is horizontally and pivotably provided in the transfer chamber, a substrate support arm that supports the substrate, a support that supports the substrate support arm so that it can be raised and lowered, and a support that is supported by the base member so as to be movable in the horizontal direction. A member, a turning drive for turning the base member, a horizontal drive for moving the support member horizontally along the base member, and a lift drive for raising and lowering the substrate support arm along the support member And a substrate transfer device.

上記第１の観点において、前記基板支持アームは複数設けられてユニット化され、前記昇降駆動部により一括して昇降され、複数の基板を一括して支持して搬送する構成とすることができる。   In the first aspect, a plurality of the substrate support arms may be provided and unitized, and may be lifted and lowered collectively by the lift driving unit to support and transport the plurality of substrates collectively.

前記複数のモジュールは、真空中で基板に所定の処理を施す処理室と、処理前および処理後の基板を交換するロードロック室とを有し、前記共通搬送室は真空に保持されるように構成することができる。   The plurality of modules include a processing chamber for performing a predetermined process on the substrate in a vacuum, and a load lock chamber for exchanging the substrate before and after the processing, and the common transfer chamber is maintained in a vacuum. Can be configured.

前記垂直駆動部は、前記支持部材に取り付けられていてよく、この場合に、前記垂直駆動部の駆動源を取り囲む内部が大気空間となる筐体と、前記筐体に接続され、前記駆動源に接続された配線を収容して前記共通搬送室の外部に取り出すための、内部が大気空間となるケーブル挿通部材とをさらに具備し、前記ケーブル挿通部材は、複数のアームと、前記アーム間を接続する気密に形成されたリンク機構とを有し、前記支持部材の水平方向の移動に連動して伸屈するリンク式従動アームとして構成されるものとすることができる。また、前記ケーブル挿通部材と前記筐体との間に、内部を大気空間に保ったまま前記ベース部材の変更と前記ケーブル挿通部材の上下変位差を吸収するための変位差吸収機構をさらに具備してもよい。   The vertical driving unit may be attached to the support member, and in this case, the casing surrounding the driving source of the vertical driving unit is an atmospheric space, and is connected to the casing, and is connected to the driving source. A cable insertion member that accommodates the connected wiring and takes it out of the common transfer chamber, the inside of which is an air space; and the cable insertion member connects a plurality of arms and the arms. And a link-type driven arm that is bent in conjunction with the horizontal movement of the support member. Further, a displacement difference absorbing mechanism for absorbing the change of the base member and the vertical displacement difference of the cable insertion member while maintaining the inside in an air space is further provided between the cable insertion member and the housing. May be.

本発明の第２の観点では、共通搬送室と、前記共通搬送室に接続された、所定の処理を行う処理室を含む複数のモジュールと、前記共通搬送室に設けられ、前記複数のモジュール間で基板の搬送を行う基板搬送装置とを具備し、前記基板搬送装置は上記第１の観点の構成を有することを特徴とする基板処理システムを提供する。   In a second aspect of the present invention, a common transfer chamber, a plurality of modules including a processing chamber connected to the common transfer chamber and performing a predetermined process, and provided between the plurality of modules are provided in the common transfer chamber. And a substrate transfer apparatus for transferring the substrate, wherein the substrate transfer apparatus has the configuration of the first aspect.

本発明によれば、昇降駆動部が共通搬送室の内部に設けられ、昇降動作は、支持部材に対し、基板支持アームを昇降させることにより行われ、昇降駆動部以外の基板搬送装置全体を昇降する必要がないので、昇降駆動部の重量を小さくすることができる。このため、昇降駆動部を高剛性にする必要がなく、基板搬送装置を低コストで製作可能であり、装置重量も小さくなる。また、昇降駆動部を共通搬送室の内部に設け、昇降共通搬送室の下に設ける必要がないので、共通搬送室を低い位置に設けることができ、基板搬送ラインを低く保つことができる。これにより、メンテナンス性を向上させることができ、また複数の基板を搬送する場合には必要な段数を確保することができる。さらに旋回駆動部のイナーシャを共通搬送室の底板で支持させることができ、安定した動作が可能となり、制御が容易となるとともに高速動作が可能となる。   According to the present invention, the elevating drive unit is provided inside the common transfer chamber, and the elevating operation is performed by elevating the substrate support arm with respect to the support member, and the entire substrate transfer apparatus other than the elevating drive unit is raised and lowered Therefore, the weight of the lift drive unit can be reduced. For this reason, it is not necessary to make the raising / lowering drive part highly rigid, a board | substrate conveyance apparatus can be manufactured at low cost, and an apparatus weight also becomes small. In addition, since the elevating drive unit is not provided inside the common transfer chamber and below the elevating common transfer chamber, the common transfer chamber can be provided at a low position, and the substrate transfer line can be kept low. As a result, maintainability can be improved, and a necessary number of stages can be ensured when a plurality of substrates are transferred. Further, the inertia of the swivel drive unit can be supported by the bottom plate of the common transfer chamber, which enables stable operation, facilitates control, and enables high-speed operation.

本発明の一実施形態に係る基板処理システムを概略的に示す平面図である。1 is a plan view schematically showing a substrate processing system according to an embodiment of the present invention. 図１の基板処理システムの共通搬送室に設けられた基板搬送装置を側面から見た状態を示す共通搬送室および処理室の断面図である。FIG. 2 is a cross-sectional view of a common transfer chamber and a processing chamber showing a state in which a substrate transfer apparatus provided in the common transfer chamber of the substrate processing system of FIG. 図２の基板搬送装置の平面図である。It is a top view of the board | substrate conveyance apparatus of FIG. 図２の基板搬送装置の斜視図である。It is a perspective view of the board | substrate conveyance apparatus of FIG. 図２の基板搬送装置に用いられた変位差吸収機構と第１リンク機構を示す断面図である。It is sectional drawing which shows the displacement difference absorption mechanism and 1st link mechanism which were used for the board | substrate conveyance apparatus of FIG. 基板支持アームの昇降動作により処理室の基板を受け取る動作を説明するための図である。It is a figure for demonstrating the operation | movement which receives the board | substrate of a process chamber by the raising / lowering operation | movement of a substrate support arm. 従来技術として想定される基板搬送装置を側面から見た状態を示す図である。It is a figure which shows the state which looked at the board | substrate conveyance apparatus assumed as a prior art from the side surface.

以下、添付図面を参照して本発明の実施形態について説明する。参照する図面全てにわたり、同一の部分については同一の参照符号を付す。
図１は、本発明の一実施形態に係る基板処理システムを概略的に示す平面図である。この基板処理システム１は、例えば、液晶ディスプレイ（ＬＣＤ）のようなＦＰＤ用ガラス基板あるいは太陽電池用ガラス基板として用いられる矩形基板に対し例えばエッチングや成膜を行う装置として構成されている。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Throughout the drawings to be referred to, the same parts are denoted by the same reference numerals.
FIG. 1 is a plan view schematically showing a substrate processing system according to an embodiment of the present invention. The substrate processing system 1 is configured as an apparatus that performs, for example, etching and film formation on a rectangular substrate used as an FPD glass substrate such as a liquid crystal display (LCD) or a solar cell glass substrate.

図１に示すように、基板処理システム１は、共通搬送室１０と、この共通搬送室１０に接続された基板Ｇを予備加熱する予備加熱室２０、基板Ｇにエッチングや成膜等の処理を施す２つの処理室３０ａ，３０ｂ、及び大気側に配置された基板収容容器（図示せず）と真空に保持された共通搬送室１０との間で基板Ｇを交換するロードロック室４０と、共通搬送室１０内に設けられた、基板Ｇを搬送する基板搬送装置５０とを備えている。共通搬送室１０は平面形状が矩形状をなし、複数のモジュールである予備加熱室２０、処理室３０ａ，３０ｂ、ロードロック室４０は、共通搬送室１０の各側面に、それぞれゲートバルブ６１，６２ａ，６２ｂ，６３を介して接続されている。また、ロードロック室４０の大気側にはゲートバルブ６４が設けられている。なお、本実施形態においては共通搬送室１０の平面形状は矩形状として構成されるが、共通搬送室１０の平面形状を多角形、例えば六角形あるいは八角形に構成し、予備加熱室、処理室あるいはロードロック室、あるいは他のモジュールを追加した構成にしてもよい。   As shown in FIG. 1, the substrate processing system 1 includes a common transfer chamber 10, a preheating chamber 20 that preheats the substrate G connected to the common transfer chamber 10, and processes such as etching and film formation on the substrate G. Common to the two processing chambers 30a and 30b to be applied, and the load lock chamber 40 for exchanging the substrate G between the substrate container (not shown) arranged on the atmosphere side and the common transfer chamber 10 held in vacuum. And a substrate transfer device 50 that transfers the substrate G provided in the transfer chamber 10. The common transfer chamber 10 has a rectangular planar shape, and the preheating chamber 20, the processing chambers 30 a and 30 b, and the load lock chamber 40, which are a plurality of modules, are provided on the side surfaces of the common transfer chamber 10 with gate valves 61 and 62 a, respectively. , 62b, 63 are connected. A gate valve 64 is provided on the atmosphere side of the load lock chamber 40. In the present embodiment, the plane shape of the common transfer chamber 10 is configured as a rectangular shape, but the plane shape of the common transfer chamber 10 is configured as a polygon, for example, a hexagon or an octagon, and the preheating chamber and the processing chamber. Alternatively, a load lock chamber or another module may be added.

本実施形態においては、共通搬送室１０、予備加熱室２０、処理室３０ａ，３０ｂは真空チャンバとして構成されている。共通搬送室１０の内部には基板搬送装置５０が設けられており、予備加熱室２０、処理室３０ａ，３０ｂには、それぞれ内部に基板Ｇを支持する機構（図示せず）を有し、所定の減圧雰囲気に保持されるようになっている。また、真空予備室であるロードロック室４０は、大気側に配置された基板収容容器（図示せず）と、真空に保持された共通搬送室１０との間で基板Ｇを交換するためのものであり、大気雰囲気と減圧雰囲気との間で切り替え可能な真空予備室として機能する。   In the present embodiment, the common transfer chamber 10, the preheating chamber 20, and the processing chambers 30a and 30b are configured as vacuum chambers. A substrate transfer device 50 is provided inside the common transfer chamber 10, and each of the preheating chamber 20 and the processing chambers 30a and 30b has a mechanism (not shown) for supporting the substrate G therein, and has a predetermined structure. Is maintained in a reduced pressure atmosphere. The load lock chamber 40 as a vacuum preparatory chamber is for exchanging the substrate G between a substrate container (not shown) arranged on the atmosphere side and the common transfer chamber 10 held in a vacuum. And functions as a vacuum preparatory chamber that can be switched between an air atmosphere and a reduced pressure atmosphere.

この基板処理システム１は、一度に複数枚、例えば３枚以上の基板Ｇを高さ方向に水平に配置して処理するように構成されており、外部の基板収容容器から図示しない大気側搬送装置によりゲートバルブ６４を介してロードロック室４０に複数枚の基板Ｇが搬入された後、搬入された複数枚の基板Ｇは、基板搬送装置５０により、ロードロック室４０からゲートバルブ６３を介して共通搬送室１０へ搬入され、この共通搬送室１０からゲートバルブ６１を介して予備加熱室２０へ搬送され、この予備加熱室２０からゲートバルブ６１およびゲートバルブ６２ａまたは６２ｂを介して処理室３０ａまたは３０ｂへ搬送される。そして、処理室３０ａまたは３０ｂにおいて処理が終了した基板Ｇは、処理室３０ａまたは３０ｂからゲートバルブ６２ａまたは６２ｂおよびゲートバルブ６３を介してロードロック室４０へ搬送され、ロードロック室４０が大気圧に戻された後に搬出される。   The substrate processing system 1 is configured to process a plurality of substrates G, for example, three or more substrates G at a time in a horizontal direction in the height direction. After the plurality of substrates G are loaded into the load lock chamber 40 via the gate valve 64, the loaded substrates G are transferred from the load lock chamber 40 via the gate valve 63 by the substrate transfer device 50. It is carried into the common transfer chamber 10 and transferred from the common transfer chamber 10 to the preheating chamber 20 through the gate valve 61, and from the preheating chamber 20 to the processing chamber 30a or through the gate valve 61 and the gate valve 62a or 62b. It is conveyed to 30b. Then, the substrate G that has been processed in the processing chamber 30a or 30b is transferred from the processing chamber 30a or 30b to the load lock chamber 40 via the gate valve 62a or 62b and the gate valve 63, and the load lock chamber 40 is brought to atmospheric pressure. It is carried out after being returned.

なお、本例においては、処理室３０ａおよび処理室３０ｂは同一の処理を行う処理室であるが、異なる処理を行う処理室として構成してもよい。すなわち、処理室３０ａにおいて第一工程を処理し、引き続き行われる第二工程を処理室３０ｂにおいて連続して処理するという構成でもよい。   In this example, the processing chamber 30a and the processing chamber 30b are processing chambers that perform the same processing, but may be configured as processing chambers that perform different processing. That is, a configuration in which the first step is processed in the processing chamber 30a and the subsequent second step is continuously processed in the processing chamber 30b may be employed.

基板処理システム１の各構成部は、制御部（コンピュータ）７０により制御される。制御部７０はマイクロプロセッサを備えたプロセスコントローラ７１を有しており、このプロセスコントローラ７１には、オペレータが基板処理システム１を管理するためのコマンドの入力操作等を行うキーボードや、基板処理システム１の稼働状況を可視化して表示するディスプレイ等からなるユーザーインターフェース７２と、基板処理システム１で実行される各種処理をプロセスコントローラ７１の制御にて実現するための制御プログラムや、処理条件に応じて基板処理システム１に所定の処理を実行させるための制御プログラムやレシピが格納された記憶部７３とが接続されている。記憶部７３は記憶媒体を有しており、レシピ等はその記憶媒体に記憶されている。記憶媒体は、ハードディスクや半導体メモリであってもよいし、ＣＤ−ＲＯＭ、ＤＶＤ、フラッシュメモリ等の可搬性のものであってもよい。レシピ等は、必要に応じてユーザーインターフェース７２からの指示等にて記憶部７３から読み出し、プロセスコントローラ７１に実行させることで、プロセスコントローラ７１の制御下で、基板処理システム１での所望の処理が行われる。   Each component of the substrate processing system 1 is controlled by a control unit (computer) 70. The control unit 70 includes a process controller 71 having a microprocessor. The process controller 71 includes a keyboard for an operator to input commands for managing the substrate processing system 1, and the substrate processing system 1. A user interface 72 including a display for visualizing and displaying the operation status of the computer, a control program for realizing various processes executed by the substrate processing system 1 under the control of the process controller 71, and a substrate according to the processing conditions A storage unit 73 storing a control program and recipe for causing the processing system 1 to execute a predetermined process is connected. The storage unit 73 has a storage medium, and recipes and the like are stored in the storage medium. The storage medium may be a hard disk or a semiconductor memory, or may be a portable medium such as a CD-ROM, DVD, or flash memory. Recipes and the like are read from the storage unit 73 according to instructions from the user interface 72 as necessary, and are executed by the process controller 71, so that desired processing in the substrate processing system 1 can be performed under the control of the process controller 71. Done.

次に基板搬送装置５０について詳細に説明する。
図２は基板搬送装置５０を側面から見た状態を示す共通搬送室１０および処理室３０ａの断面図、図３は基板搬送装置５０の平面図、図４はその斜視図である。 Next, the substrate transfer apparatus 50 will be described in detail.
2 is a cross-sectional view of the common transfer chamber 10 and the processing chamber 30a showing the substrate transfer apparatus 50 as viewed from the side, FIG. 3 is a plan view of the substrate transfer apparatus 50, and FIG. 4 is a perspective view thereof.

基板搬送装置５０は、共通搬送室１０と、予備加熱室２０、処理室３０ａ，３０ｂ、およびロードロック室４０との相互間で複数枚、例えば３枚以上の基板Ｇを一括して搬送するためのものであり、図２では処理室３０ａに対して基板Ｇを搬送する状態を示している。   The substrate transfer device 50 transfers a plurality of, for example, three or more substrates G at a time between the common transfer chamber 10, the preheating chamber 20, the processing chambers 30a and 30b, and the load lock chamber 40. FIG. 2 shows a state in which the substrate G is transferred to the processing chamber 30a.

図２に示すように、処理室３０ａ内には、複数の下部電極２０１および複数の上部電極２０２が垂直方向に交互に配列されており、基板載置台として機能する下部電極２０１に基板Ｇを載置した状態で、真空下で処理ガスを導入しつつ、下部電極２０１または上部電極２０２に高周波電力を供給することにより、下部電極２０１と上部電極２０２との間にプラズマを形成して所定のプラズマ処理を行うように構成されている。１１は共通搬送室１０の搬出入口、３１は処理室３ａの搬出入口である。なお、図２では、処理室３０ａ内に処理ガスを供給する機構、処理室３０ａ内を排気する機構、高周波電力を供給する機構、および処理室１０内を排気する機構等は図示を省略している。   As shown in FIG. 2, a plurality of lower electrodes 201 and a plurality of upper electrodes 202 are alternately arranged in the vertical direction in the processing chamber 30a, and the substrate G is mounted on the lower electrode 201 that functions as a substrate mounting table. In a state of being placed, by introducing high-frequency power to the lower electrode 201 or the upper electrode 202 while introducing a processing gas under vacuum, a plasma is formed between the lower electrode 201 and the upper electrode 202 to form a predetermined plasma. It is configured to perform processing. 11 is a carry-in / out port of the common transfer chamber 10, and 31 is a carry-in / out port of the processing chamber 3a. In FIG. 2, a mechanism for supplying a processing gas into the processing chamber 30a, a mechanism for exhausting the processing chamber 30a, a mechanism for supplying high-frequency power, a mechanism for exhausting the processing chamber 10 and the like are not shown. Yes.

基板搬送装置５０は、図２に示すように、共通搬送室１０内の底部近傍に設けられた、水平面内で旋回可能な、水平方向に沿って長尺状に設けられたベース部材５１と、ベース部材５１を旋回させるための旋回駆動部５２と、基板を支持する基板支持アームを複数有する支持アームユニット５３と、支持アームユニット５３を昇降可能に支持し、ベース部材５１上を水平方向に直動して支持アームを伸縮させる支持部材５４と、支持部材５４をベース部材５１上で水平駆動させる水平駆動部５５と、支持アームユニット５３を支持部材５４に対して昇降させる昇降駆動部５６とを備えている。   As shown in FIG. 2, the substrate transfer device 50 is provided in the vicinity of the bottom in the common transfer chamber 10, and can be swiveled in a horizontal plane, and is provided in a long shape along the horizontal direction. A turning drive unit 52 for turning the base member 51, a support arm unit 53 having a plurality of substrate support arms for supporting the substrate, and the support arm unit 53 are supported so as to be movable up and down. A support member 54 that moves and expands and contracts the support arm, a horizontal drive unit 55 that horizontally drives the support member 54 on the base member 51, and a lift drive unit 56 that moves the support arm unit 53 up and down relative to the support member 54. I have.

旋回駆動部５２は、ベース部材５１の下面から下方に延びる中空の旋回軸１０１と、搬送室１０の底板に取り付けられ、旋回軸１０１を受ける旋回ベアリング１０２と、旋回軸１０１と旋回ベアリング１０２との間に設けられた回転シール１０３と、旋回軸１０１を回転させる旋回軸モータ１０４とを有する。この旋回駆動部５２によってベース部材５１を旋回させることにより、処理室３０ａ、３０ｂ、予備加熱室２０、およびロードロック室４０のいずれのモジュールにもアクセス可能となる。   The turning drive unit 52 includes a hollow turning shaft 101 that extends downward from the lower surface of the base member 51, a turning bearing 102 that is attached to the bottom plate of the transfer chamber 10 and receives the turning shaft 101, and the turning shaft 101 and the turning bearing 102. A rotation seal 103 provided therebetween and a turning shaft motor 104 for rotating the turning shaft 101 are provided. By turning the base member 51 by the turning drive unit 52, it becomes possible to access any of the modules of the processing chambers 30a, 30b, the preheating chamber 20, and the load lock chamber 40.

支持アームユニット５３は、支持部材５４に対して昇降する、垂直に設けられた昇降プレート１１１と、昇降プレートから水平に延びる複数の基板支持アーム１１２とを有する。   The support arm unit 53 includes a vertically movable lift plate 111 that moves up and down with respect to the support member 54 and a plurality of substrate support arms 112 that extend horizontally from the lift plate.

支持部材５４は、ベース部材５１に面して水平に延びる水平部１２１と、昇降プレート１１１に面して垂直に延びる垂直部１２２と、垂直部１２２の上端と水平部１２１の端部とを斜めに結び、補強の役割をなす補強部１２３とを有し、側面が三角形をなすように形成されている。   The support member 54 has a horizontal portion 121 extending horizontally facing the base member 51, a vertical portion 122 extending vertically facing the elevating plate 111, and an upper end of the vertical portion 122 and an end portion of the horizontal portion 121 obliquely And a reinforcing portion 123 that plays a role of reinforcement, and the side surfaces are formed in a triangular shape.

水平駆動部５５は、ベース部材５１の上面に水平に設けられた、支持部材５４を走行させるためのレール１３１と、支持部材５４の下面に設けられ、支持部材５４をレール１３１にガイドさせるガイド部材１３２と、ベース部材５１の後端側に設けられた水平駆動モータ１３３と、水平駆動モータ１３３の動力を支持部材５４に伝達して支持部材５４を水平に移動させる駆動伝達ベルト１３４と、駆動伝達ベルト１３４および支持部材５４に固定される固定部材１３５と、駆動ベルト１３４を懸架する一対のプーリ１３６および１３７とを有する。プーリ１３６は水平駆動モータ１３３の回転軸に取り付けられ、プーリ１３７はベース部材５１の先端部に取り付けられており、水平駆動モータ１３３の回転がプーリ１３６を介して駆動伝達ベルト１３４に伝達され、この駆動伝達ベルト１３４が駆動されることにより、固定部材１３５を介して支持部材５４が水平方向に駆動され、実線で示す伸長位置と二点鎖線で示す縮退位置との間で移動するようになっている。支持部材５４が伸長位置においては、図２に示すように、複数の基板支持アーム１１２が、各々処理室３ａの下部電極２０１の上方位置に達し、下部電極２０１への基板Ｇの受け渡し、および下部電極２０１からの基板の受け取りが可能となる。   The horizontal drive unit 55 is provided horizontally on the upper surface of the base member 51 for running the support member 54, and the guide member is provided on the lower surface of the support member 54 and guides the support member 54 to the rail 131. 132, a horizontal drive motor 133 provided on the rear end side of the base member 51, a drive transmission belt 134 that transmits the power of the horizontal drive motor 133 to the support member 54 and moves the support member 54 horizontally, and drive transmission A fixing member 135 fixed to the belt 134 and the support member 54 and a pair of pulleys 136 and 137 for suspending the driving belt 134 are provided. The pulley 136 is attached to the rotating shaft of the horizontal drive motor 133, and the pulley 137 is attached to the tip of the base member 51, and the rotation of the horizontal drive motor 133 is transmitted to the drive transmission belt 134 via the pulley 136. When the drive transmission belt 134 is driven, the support member 54 is driven in the horizontal direction via the fixing member 135 and moves between the extended position indicated by the solid line and the retracted position indicated by the two-dot chain line. Yes. When the support member 54 is in the extended position, as shown in FIG. 2, the plurality of substrate support arms 112 reach the position above the lower electrode 201 in the processing chamber 3a, and transfer the substrate G to the lower electrode 201 and The substrate can be received from the electrode 201.

昇降駆動部５６は、支持部材５４の垂直部１２２の垂直面に設けられた、基板支持アームユニット５３の昇降プレート１１１を走行させるためのレール１４１と、昇降プレート１１１の垂直部１２２に対向する面に設けられ、昇降プレート１１１をレール１４１にガイドさせるガイド部材１４２と、昇降プレート１１１を昇降駆動させるボールネジ機構１４３とを有している。ボールネジ機構１４３は、支持部材５４の垂直部１２２に取り付けられた駆動源であるサーボモータ１４５と、サーボモータ１４５の回転軸と直結し、上方に延びるボールネジ１４４と、ボールネジ１４４に螺合するとともに、昇降プレート１１１に固定される昇降部材１４６とを有し、サーボモータ１４５によりボールネジ１４４を回転させることにより昇降部材１４６が昇降し、それにともなって昇降プレート１１１が昇降する。そして、水平駆動部５５により支持部材５４を伸長させた状態で、昇降駆動部５６により基板支持アーム１１２を昇降させることにより、処理室３ａの下部電極２０１に対する基板Ｇの受け渡しおよび受け取りが行われる。   The raising / lowering drive unit 56 is provided on the vertical surface of the vertical part 122 of the support member 54, and is a surface facing the vertical part 122 of the elevation plate 111 and the rail 141 for running the elevation plate 111 of the substrate support arm unit 53. And a guide member 142 that guides the lifting plate 111 to the rail 141 and a ball screw mechanism 143 that drives the lifting plate 111 to move up and down. The ball screw mechanism 143 is directly connected to a servo motor 145 as a drive source attached to the vertical portion 122 of the support member 54, a rotation shaft of the servo motor 145, and extends upward, and is screwed to the ball screw 144. The elevating member 146 is fixed to the elevating plate 111. When the ball screw 144 is rotated by the servo motor 145, the elevating member 146 moves up and down, and the elevating plate 111 moves up and down accordingly. Then, with the support member 54 extended by the horizontal drive unit 55, the substrate support arm 112 is moved up and down by the lift drive unit 56, whereby the substrate G is transferred to and received from the lower electrode 201 of the processing chamber 3a.

サーボモータ１４５は、筐体１４７で囲まれており、その中が大気空間とされる。筐体１４７とボールネジ１４４との間は回転シール１４８によりシールされている。   The servo motor 145 is surrounded by a housing 147, and the inside thereof is an atmospheric space. A space between the housing 147 and the ball screw 144 is sealed with a rotary seal 148.

図３に示すように、筐体１４７には、サーボモータ１４５へ給電するため、信号を伝達するため、ブレーキのため等のケーブルを挿通するためのケーブル挿通部材として、内部が大気空間とされたリンク式従動アーム１５０が接続されている。リンク式従動アーム１５０はベース部材５１に取り付けられた中空の旋回軸１０１に接続されており、ケーブルは中空の旋回軸１０１の中空部を経て外部に取り出されるようになっている。リンク式従動アーム１５０は、筐体１４７から延びる中空部材１４９に設けられた上下変位差を吸収する変位差吸収機構１５１に接続されており、変位差吸収機構１５１の下に設けられた中空の第１アーム１５３と、中空の第２アーム１５５と、ベース部材５１の中央部に取り付けられ、旋回軸１０１の上方まで延びる中空部材１５７と、変位差吸収機構１５１と第１アームとの間を回動可能にかつ気密に接続する第１リンク機構１５２と、第１アーム１５３と第２アーム１５５とを回動可能にかつ気密に接続する第２リンク機構１５４と、第２アーム１５５と中空部材１５７とを回動可能にかつ気密に接続する第３リンク機構１５６とを有している。そして、リンク式従動アーム１５０は、支持部材５４が伸長位置にあるときは、実線で示すように伸びた状態となり、支持部材５４が縮退位置にあるときは、二点鎖線で示すように屈曲した状態となる。このようにすることにより、支持部材５４が移動しても、大気空間の筐体４７の内部に配置されたサーボモータ１４５からのケーブルを、大気空間を保ったまま這いまわすことができる。これにより、サーボモータ４７やケーブルからの発塵が真空雰囲気の共通搬送室１０内に拡散することを防止することができる。   As shown in FIG. 3, the casing 147 has an air space inside as a cable insertion member for inserting a cable for supplying a signal to the servo motor 145, transmitting a signal, and for a brake or the like. A link type driven arm 150 is connected. The link type follower arm 150 is connected to a hollow turning shaft 101 attached to the base member 51, and the cable is taken out through the hollow portion of the hollow turning shaft 101. The link driven arm 150 is connected to a displacement difference absorbing mechanism 151 that absorbs a vertical displacement difference provided in a hollow member 149 extending from the housing 147, and a hollow first arm provided below the displacement difference absorbing mechanism 151. 1 arm 153, a hollow second arm 155, a hollow member 157 attached to the center of the base member 51 and extending above the pivot shaft 101, and a displacement difference absorbing mechanism 151 and a first arm. A first link mechanism 152 capable of being connected in an airtight manner, a second link mechanism 154 for connecting the first arm 153 and the second arm 155 in a rotatable and airtight manner, a second arm 155 and a hollow member 157 And a third link mechanism 156 that is pivotally and airtightly connected. When the support member 54 is in the extended position, the link driven arm 150 is extended as shown by a solid line, and when the support member 54 is in the retracted position, the link driven arm 150 is bent as shown by a two-dot chain line. It becomes a state. By doing so, even if the support member 54 moves, the cable from the servo motor 145 arranged inside the housing 47 in the atmospheric space can be twisted while maintaining the atmospheric space. Thereby, it is possible to prevent the dust generated from the servo motor 47 and the cable from diffusing into the common transfer chamber 10 in a vacuum atmosphere.

変位差吸収機構１５１は、支持部材５４および基板支持アームユニット５３の重量によるベース部材５１の変形とリンク式従動アーム１５０の上下変位差を吸収するためのものであり、図５に示すように、中空部材１４９に繋がる上部管１６１と第１リンク機構１５２に繋がる下部管１６２とが入れ子状に配置され、その継ぎ目部分の周囲を溶接ベローズ１６３で覆った構造を有しており、内部を大気空間に保ったまま上下動を許容する構造を有している。１６４はボールスプラインからなるガイドであり、１６５はケーシングである。また、第１リンク機構１５２ａは、変位差吸収機構１５１の下部管１６２に繋がる内側部材１６６と、第１アーム１５３に繋がる外側部材１６７とを有し、これらの間に回転シール１６８とベアリング１６９とが介在されており、内部を大気空間に保ったまま、第１アーム１５３の回動を許容する構造を有している。第２リンク機構１５４および第３リンク機構１５６も同様の構造を有している。なお、１７０はケーブルである。   The displacement difference absorbing mechanism 151 is for absorbing the deformation of the base member 51 due to the weight of the support member 54 and the substrate support arm unit 53 and the vertical displacement difference of the link type driven arm 150. As shown in FIG. The upper pipe 161 connected to the hollow member 149 and the lower pipe 162 connected to the first link mechanism 152 are arranged in a nested manner, and the periphery of the joint portion is covered with a welded bellows 163, and the inside is an atmospheric space. It has a structure that allows vertical movement while being maintained at the same position. Reference numeral 164 denotes a guide made of a ball spline, and 165 denotes a casing. The first link mechanism 152a includes an inner member 166 connected to the lower pipe 162 of the displacement difference absorbing mechanism 151 and an outer member 167 connected to the first arm 153, and a rotary seal 168 and a bearing 169 are interposed therebetween. And has a structure that allows the first arm 153 to rotate while keeping the inside in an atmospheric space. The second link mechanism 154 and the third link mechanism 156 have the same structure. Reference numeral 170 denotes a cable.

次に、このように構成される基板処理システムの処理動作について説明する。
まず、ゲートバルブ６４を開けて大気側基板搬送装置（図示せず）により複数枚（例えば３枚以上）の未処理の基板Ｇを大気雰囲気のロードロック室４０に搬入し、ゲートバルブ６４を閉じてロードロック室４０内を減圧雰囲気とする。そして、ゲートバルブ６３を開け、基板搬送装置５０の複数の基板支持アーム１１２をロードロック室４０内に進出させ、ロードロック室４０内に搬入された未処理の基板Ｇを一括して受け取る。次いで、基板搬送装置５０の基板支持アーム１１２を共通搬送室１０に退避させ、ゲートバルブ６３を閉じる。 Next, the processing operation of the substrate processing system configured as described above will be described.
First, the gate valve 64 is opened, a plurality of (for example, three or more) unprocessed substrates G are carried into the load lock chamber 40 in the atmospheric atmosphere by an atmosphere side substrate transfer device (not shown), and the gate valve 64 is closed. Thus, the inside of the load lock chamber 40 is made a reduced pressure atmosphere. Then, the gate valve 63 is opened, the plurality of substrate support arms 112 of the substrate transfer apparatus 50 are advanced into the load lock chamber 40, and the unprocessed substrates G carried into the load lock chamber 40 are collectively received. Next, the substrate support arm 112 of the substrate transfer apparatus 50 is retracted to the common transfer chamber 10 and the gate valve 63 is closed.

次いで、基板搬送装置５０の複数の基板支持アーム１１２を予備加熱室２０に相対するようにさせて、ゲートバルブ６１を開け、基板支持アーム１１２を予備加熱室２０に進出させ、未処理の基板Ｇを予備加熱室２０へ搬送する。   Next, the plurality of substrate support arms 112 of the substrate transfer apparatus 50 are made to face the preheating chamber 20, the gate valve 61 is opened, the substrate support arm 112 is advanced into the preheating chamber 20, and the unprocessed substrate G Is conveyed to the preheating chamber 20.

次いで、基板支持アーム１１２を共通搬送室１０に退避させ、ゲートバルブ６１を閉じた後、予備加熱室２０にて基板Ｇの予備加熱を開始する。   Next, after the substrate support arm 112 is retracted to the common transfer chamber 10 and the gate valve 61 is closed, preheating of the substrate G is started in the preheating chamber 20.

予備加熱が終了したら、ゲートバルブ６１を開け、基板支持アーム１１２を予備加熱室２０に進出させ、予備加熱済みの基板Ｇを受け取る。次いで、基板支持アーム１１２を共通搬送室１０に退避させ、ゲートバルブ６１を閉じる。   When the preheating is completed, the gate valve 61 is opened, the substrate support arm 112 is advanced into the preheating chamber 20, and the preheated substrate G is received. Next, the substrate support arm 112 is retracted to the common transfer chamber 10 and the gate valve 61 is closed.

次いで、複数の基板支持アーム１１２を処理室３０ａまたは３０ｂに相対するようにさせ、ゲートバルブ６２ａまたは６２ｂを開け、基板支持アーム１１２を処理室３０ａまたは３０ｂに進出させ、予備加熱済みの基板Ｇを処理室３０ａまたは３０ｂへ搬送する。次いで、基板支持アーム１１２を共通搬送室１０に退避させ、ゲートバルブ６２ａまたは６２ｂを閉じ、処理室３０ａまたは３０ｂにおける処理を開始する。この間に、次の基板Ｇの搬送が可能であれば、例えば、基板支持アーム１１２によりロードロック室４０から複数の基板Ｇを取り出し、予備加熱室２０へ搬送する。   Next, the plurality of substrate support arms 112 are made to face the process chamber 30a or 30b, the gate valve 62a or 62b is opened, the substrate support arm 112 is advanced into the process chamber 30a or 30b, and the preheated substrate G is It is transferred to the processing chamber 30a or 30b. Next, the substrate support arm 112 is retracted to the common transfer chamber 10, the gate valve 62a or 62b is closed, and processing in the processing chamber 30a or 30b is started. During this time, if the next substrate G can be transferred, for example, the substrate support arm 112 takes out the plurality of substrates G from the load lock chamber 40 and transfers them to the preheating chamber 20.

処理室処理が終了したら、ゲートバルブ６２ａまたは６２ｂを開け、基板支持アーム１１２を処理室３０ａまたは３０ｂに進出させ、処理済みの基板Ｇを受け取る。次いで、基板支持アーム１１２を共通搬送室１０に退避させ、ゲートバルブ６２ａまたは６２ｂを閉じる。次いで、基板支持１１２をロードロック室４０に相対するようにさせ、ゲートバルブ６３を開け、基板支持アーム１１２をロードロック室４０に進出させ、処理済みの基板Ｇをロードロック室４０へ搬送する。次いで、基板支持アーム１１２を共通搬送室１０に退避させ、ゲートバルブ６３を閉じ、ロードロック室４０内を大気雰囲気にする。この後、ゲートバルブ６４を開けて大気側基板搬送装置（図示せず）により処理済みの基板Ｇをロードロック室４０から搬出する。   When the processing chamber processing is completed, the gate valve 62a or 62b is opened, the substrate support arm 112 is advanced to the processing chamber 30a or 30b, and the processed substrate G is received. Next, the substrate support arm 112 is retracted to the common transfer chamber 10, and the gate valve 62a or 62b is closed. Next, the substrate support 112 is made to face the load lock chamber 40, the gate valve 63 is opened, the substrate support arm 112 is advanced into the load lock chamber 40, and the processed substrate G is transferred to the load lock chamber 40. Next, the substrate support arm 112 is retracted to the common transfer chamber 10, the gate valve 63 is closed, and the inside of the load lock chamber 40 is set to an atmospheric atmosphere. Thereafter, the gate valve 64 is opened, and the processed substrate G is carried out of the load lock chamber 40 by an atmosphere side substrate transfer device (not shown).

この一連の動作の際、基板搬送装置５０は、旋回駆動部５２によってベース部材５１を旋回させることにより、基板支持アーム１１２を処理室３０ａ、３０ｂ、予備加熱室２０、およびロードロック室４０のうちアクセスしようとするものへ相対させることができる。そして、支持アーム１１２を例えば処理室３０ａに相対させ、ゲートバルブ６２ａを開けた状態で、水平駆動部５５により、基板支持アーム１１２を支持する支持部材５４を伸長させることにより、基板支持アーム１１２を処理室３０ａに挿入することができる。この状態で、昇降駆動部５６により支持アームユニット５３を昇降させることにより、基板Ｇの受け取りまたは受け渡しが行われる。   During this series of operations, the substrate transfer device 50 turns the base member 51 by the turning drive unit 52 to move the substrate support arm 112 out of the processing chambers 30 a and 30 b, the preheating chamber 20, and the load lock chamber 40. It can be relative to what you are trying to access. Then, the support arm 112 is opposed to, for example, the processing chamber 30a, and the support member 54 that supports the substrate support arm 112 is extended by the horizontal driving unit 55 in a state where the gate valve 62a is opened. It can be inserted into the processing chamber 30a. In this state, the support arm unit 53 is moved up and down by the lift drive unit 56, whereby the substrate G is received or delivered.

このときの基板支持アーム１１２の昇降動作による基板Ｇの受け取りまたは受け渡しについて、処理室３０ａから基板Ｇを受け取る場合を例にとって、図６を参照して説明する。まず、基板Ｇを処理する際には、図６（ａ）に示すように、複数の下部電極２０１上に基板Ｇを載せた状態で、下部電極２０１と上部電極２０２を近接させる。基板支持ピン２０３は、下段の上部電極２０２から上方に伸び下部電極２０１に挿通されている。なお、最下段の基板支持ピン２０３は、処理室３０ａの底部から上方に延び、最下段の下部電極に挿通されている。   The reception or delivery of the substrate G by the raising / lowering operation of the substrate support arm 112 at this time will be described with reference to FIG. 6 by taking as an example the case of receiving the substrate G from the processing chamber 30a. First, when processing the substrate G, the lower electrode 201 and the upper electrode 202 are brought close to each other with the substrate G placed on the plurality of lower electrodes 201 as shown in FIG. The substrate support pins 203 extend upward from the lower upper electrode 202 and are inserted into the lower electrode 201. The lowermost substrate support pin 203 extends upward from the bottom of the processing chamber 30a and is inserted through the lowermost lower electrode.

次に、処理が終了した後の基板Ｇの入れ替え時には、図６（ｂ）に示すように、下部電極２０１を駆動機構（図示せず）により下降させて、基板Ｇと下部電極２０１との間に隙間を形成し、その隙間へ基板支持アーム１１２を挿入する。   Next, when replacing the substrate G after the processing is completed, the lower electrode 201 is lowered by a drive mechanism (not shown) as shown in FIG. A gap is formed in the substrate, and the substrate support arm 112 is inserted into the gap.

次に、図６（ｃ）に示すように、基板支持アーム１１２を上昇させて基板Ｇを基板支持アーム１１２上に受け取る。   Next, as shown in FIG. 6C, the substrate support arm 112 is raised to receive the substrate G on the substrate support arm 112.

基板支持アーム１１２から下部電極２０１への基板Ｇの受け渡しは、以上と逆の動作、すなわち、下部電極２０１を下降させて、基板支持ピン２０３が下部電極２０１の表面から突出した状態とし、この状態で基板Ｇを支持した基板支持アーム１１２を、基板Ｇが基板支持ピン２０３の上方に位置するようにして挿入し（図６（ｃ）の状態）、次いで、基板搬送アーム１１２を下降させて基板支持ピン２０３上に基板Ｇを支持させ（図６（ｂ）の状態）、その後、基板支持アーム１１２を退避させて、下部電極２０１を上昇させ（図６（ａ）の状態）、所定の処理を行う。   The transfer of the substrate G from the substrate support arm 112 to the lower electrode 201 is the reverse of the above operation, that is, the lower electrode 201 is lowered and the substrate support pins 203 protrude from the surface of the lower electrode 201. Then, the substrate support arm 112 that supports the substrate G is inserted so that the substrate G is positioned above the substrate support pins 203 (the state shown in FIG. 6C), and then the substrate transport arm 112 is lowered to place the substrate. The substrate G is supported on the support pins 203 (the state shown in FIG. 6B), and then the substrate support arm 112 is retracted to raise the lower electrode 201 (the state shown in FIG. 6A). I do.

この場合には、基板Ｇを昇降させることなく基板支持アーム１１２を昇降させることにより基板Ｇの授受を行うため、基板Ｇの面内位置（中央位置）に基板支持ピン２０３を設けても基板Ｇが割れるおそれがないため、基板を昇降させて基板の授受を行う場合のような薄い大型基板の授受の際における基板の反りの問題が生じ難い。   In this case, since the substrate G is transferred by raising and lowering the substrate support arm 112 without raising and lowering the substrate G, the substrate G is provided even if the substrate support pins 203 are provided at the in-plane position (center position) of the substrate G. Since there is no possibility of cracking, the problem of warping of the substrate is unlikely to occur when a thin large substrate is transferred, such as when the substrate is transferred up and down.

このような基板Ｇの昇降動作については、従来、駆動系を真空室に入れることによるパーティクルの影響を回避する観点から、共通搬送室１０の外部に設けた昇降駆動部を用いて行うことが多く、基板搬送装置としては、図７に示すようなものが多用されている。なお、図７では、便宜上、図２と同じものには同じ符号を付している。   Such a raising / lowering operation of the substrate G has been conventionally performed by using a raising / lowering drive unit provided outside the common transfer chamber 10 from the viewpoint of avoiding the influence of particles caused by placing the drive system in the vacuum chamber. As the substrate transfer device, the one shown in FIG. 7 is frequently used. In FIG. 7, for the sake of convenience, the same components as those in FIG.

図７に示すように、従来技術として想定される基板搬送装置５０′は、昇降駆動部５６′として、共通搬送室１０の底板の外側に取り付けられ本体部３０１と、ベース部材３０１に対して、旋回駆動部５２、ベース部材５１、支持部材５４、基板搬送アーム１１２、水平駆動機構５５を昇降させる昇降ベース３０２と、本体部３０１に対して昇降ベース３０２を昇降駆動させるボールネジ機構３０３とを有している。３０４は昇降ベース３０２と共通搬送室１０の底板との間をシールするための溶接ベローズである。   As shown in FIG. 7, the substrate transfer apparatus 50 ′ assumed as the prior art is attached to the outside of the bottom plate of the common transfer chamber 10 as the elevating drive unit 56 ′. The turning drive unit 52, the base member 51, the support member 54, the substrate transfer arm 112, and a lift base 302 that lifts and lowers the horizontal drive mechanism 55, and a ball screw mechanism 303 that drives the lift base 302 to move up and down relative to the main body 301. ing. Reference numeral 304 denotes a welding bellows for sealing between the lifting base 302 and the bottom plate of the common transfer chamber 10.

本実施形態のようなバッチ式装置に設けられる搬送装置においては、搬送装置自体の重量は１ｔを超えることが多いため、図７の基板搬送装置５０′の場合には、昇降駆動部５６′に大きな負荷がかかり、昇降駆動部５６′の本体部３０１、昇降ベース３０２、ボールネジ機構３０３を高剛性にする必要がある。また、基板搬送装置の昇降ストロークも大きなものとなる。このため、図７の基板搬送装置５０′を用いる場合、共通搬送室１０の下方に昇降駆動のための高い空間が必要となってしまう。これにより、共通搬送室１０内の基板搬送ラインが高くなり、メンテナンスや輸送等に制限がでる場合があり、また装置コストも高いものとなる。また、図７の基板搬送装置５０′では、旋回駆動部５２のイナーシャ支持が昇降駆動ベース３０２へ付加されるため、高速動作では、ねじれが発生しやすく、動作の安定性に問題がある。さらに、上述のように昇降駆動部５６′を高剛性にする必要から製作コストが高くなってしまう。   In the transfer apparatus provided in the batch type apparatus as in the present embodiment, the weight of the transfer apparatus itself often exceeds 1 t. Therefore, in the case of the substrate transfer apparatus 50 ′ of FIG. A large load is applied, and it is necessary to make the main body 301, the lift base 302, and the ball screw mechanism 303 of the lift drive unit 56 'highly rigid. Moreover, the raising / lowering stroke of a board | substrate conveyance apparatus also becomes a big thing. For this reason, when the substrate transfer apparatus 50 ′ of FIG. 7 is used, a high space for raising and lowering drive is required below the common transfer chamber 10. As a result, the substrate transfer line in the common transfer chamber 10 becomes high, and there are cases where maintenance, transportation, and the like are restricted, and the apparatus cost is high. Further, in the substrate transfer apparatus 50 ′ of FIG. 7, since the inertia support of the turning drive unit 52 is added to the lifting drive base 302, twisting is likely to occur at high speed operation, and there is a problem in operation stability. Further, as described above, since the elevating drive unit 56 'needs to be highly rigid, the manufacturing cost is increased.

これに対して、本実施形態の基板搬送装置５０では、昇降駆動部５６は共通搬送室１０の内部に設けられ、昇降動作は、支持部材５４に対し、基板支持アーム１１２をユニット化した基板支持アームユニット５３を昇降させることにより行われ、昇降駆動部以外の基板搬送装置全体を昇降する必要がないので、昇降駆動部の重量が図７の基板搬送装置５０′に比較して格段に小さくなる。このため、昇降駆動部５６を高剛性にする必要がなく、基板搬送装置を低コストで製作可能であり、装置重量も小さくなる。また、昇降駆動部５６を共通搬送室１０の内部に設け、昇降共通搬送室１０の下に設ける必要がないので、共通搬送室１０を低い位置に設けることができ、基板搬送ラインを低く保つことができる。これにより、メンテナンス性を向上させることができ、また基板搬送の際の必要な段数を確保しやすくなり、輸送制限も出にくくなり、装置コストを低減することもできる。さらに旋回駆動部５２のイナーシャが共通搬送室１０の底板で支持されるため、安定した動作が可能となり、制御が容易となるとともに高速動作が可能となる。   On the other hand, in the substrate transfer apparatus 50 of the present embodiment, the elevating drive unit 56 is provided in the common transfer chamber 10, and the elevating operation is a substrate support in which the substrate support arm 112 is unitized with respect to the support member 54. This is done by raising and lowering the arm unit 53, and it is not necessary to raise and lower the entire substrate transfer device other than the elevation drive unit, so that the weight of the elevation drive unit is significantly smaller than the substrate transfer device 50 'of FIG. . For this reason, it is not necessary to make the raising / lowering drive part 56 highly rigid, a board | substrate conveyance apparatus can be manufactured at low cost, and an apparatus weight also becomes small. Further, since the elevating drive unit 56 is provided inside the common transfer chamber 10 and does not need to be provided below the elevating common transfer chamber 10, the common transfer chamber 10 can be provided at a low position, and the substrate transfer line can be kept low. Can do. Thereby, maintainability can be improved, it becomes easy to secure the necessary number of steps when transporting the substrate, it is difficult to limit transportation, and the apparatus cost can be reduced. Furthermore, since the inertia of the turning drive unit 52 is supported by the bottom plate of the common transfer chamber 10, stable operation is possible, control becomes easy, and high-speed operation is possible.

また、本実施形態では昇降駆動部５６のサーボモータ１４５が共通搬送室１０の内部に存在し、かつ水平駆動される支持部材５４に取り付けられているため、サーボモータ１４５からの発塵および支持部材５４を伸縮動するときのケーブルからの発塵により、基板Ｇにパーティクルが付着したり、共通搬送室１０内の真空度が十分に上がらなくなったりする懸念がある。しかし、本実施形態では、昇降駆動部５６のサーボモータ１４５が、内部が大気空間とされた筐体１４７内に収納され、筐体１４７には、支持部材５４の伸縮動に連動し、内部が大気空間となるリンク式の従動アーム１５０が接続され、ケーブルはこのリンク式従動アーム１５０を通って共通搬送室１０の外部に取り出されるため、共通搬送室１０内にサーボモータ１４５やケーブルからの塵埃が到達することはほとんどない。そのため、基板Ｇにパーティクルが付着したり、真空度が十分に上がらなくなることはほとんど生じない。内部が大気空間となる筐体１４７およびリンク式の従動アーム１５０を用いた場合には、共通搬送室１０内を１０−１Ｐａオーダーまでは十分に到達し、通常の真空処理であれば十分に処理が可能である。なお、リンク式従動アーム１５０等の設置により幾分コストがかかるが、図７のように昇降駆動部を高剛性に構成するよりも格段に低コストである。 In this embodiment, since the servo motor 145 of the lift drive unit 56 exists inside the common transfer chamber 10 and is attached to the support member 54 that is horizontally driven, dust generation from the servo motor 145 and the support member There is a concern that particles are attached to the substrate G due to dust generation from the cable when the 54 is expanded and contracted, and the degree of vacuum in the common transfer chamber 10 is not sufficiently increased. However, in the present embodiment, the servo motor 145 of the elevating drive unit 56 is housed in a housing 147 whose inside is an atmospheric space, and the housing 147 is interlocked with the expansion and contraction of the support member 54, A link type follower arm 150 serving as an atmospheric space is connected, and the cable is taken out of the common transfer chamber 10 through the link type follower arm 150. Therefore, dust from the servo motor 145 and the cable is contained in the common transfer chamber 10. Is rarely reached. For this reason, particles hardly adhere to the substrate G and the degree of vacuum does not sufficiently increase. When the casing 147 and the link type driven arm 150 are used, the inside of the common transfer chamber 10 is sufficiently reached to the order of 10 −1 Pa, and normal vacuum processing is sufficient. Processing is possible. Although the installation of the link type driven arm 150 and the like is somewhat expensive, the cost is much lower than when the elevating drive unit is configured with high rigidity as shown in FIG.

なお、本発明は、上記実施の形態に限定されることなく種々変形可能である。例えば、上記実施の形態においては、複数の基板を一括して搬送し、処理する基板処理システムを示したが、基板を１枚ずつ処理する枚葉式のものであってもよい。また、基板が複数の場合でもその枚数は限定されないが、本発明では一括して処理する基板の枚数が多いほど効果が大きく、３枚以上の場合に好適である。さらに、昇降機構としてボールネジ機構を用いた例を示したが、これに限らず、他の機構であってもよい。また、回転部分のシールとして回転シールを用いた例を示したが、磁性流体シール等、他のシールであってもよい。   The present invention can be variously modified without being limited to the above embodiment. For example, in the above-described embodiment, a substrate processing system that transports and processes a plurality of substrates at once is shown. However, a single wafer processing system that processes substrates one by one may be used. In addition, the number of substrates is not limited even when there are a plurality of substrates, but in the present invention, the effect is greater as the number of substrates processed in a lump is larger, and it is suitable for the case of three or more substrates. Furthermore, although the example which used the ball screw mechanism as an raising / lowering mechanism was shown, not only this but another mechanism may be sufficient. Moreover, although the example which used the rotation seal as a seal | sticker of a rotation part was shown, other seals, such as a magnetic fluid seal, may be sufficient.

さらに、処理室での処理として上部電極および下部電極との間で行われるプラズマ処理を例にとって示したが、これに限るものではない。また、予備加熱室は必須ではなく、共通搬送室に接続されるモジュールの数も本実施形態に限定されるものではない   Furthermore, although the plasma treatment performed between the upper electrode and the lower electrode is shown as an example of the treatment in the treatment chamber, it is not limited to this. Further, the preheating chamber is not essential, and the number of modules connected to the common transfer chamber is not limited to this embodiment.

１；基板処理システム
１０；共通搬送室
２０；予備加熱室
３０ａ，３０ｂ；処理室
４０；ロードロック室（真空予備室）
５０；基板搬送装置
５１；ベース部材
５２；旋回駆動部
５３；基板支持アームユニット
５４；支持部材
５５；水平駆動部
５６；昇降駆動部
６１，６２ａ，６２ｂ，６３，６４…ゲートバルブ
７０；制御部
１１１；昇降プレート
１１２；基板搬送アーム
１４３；ボールネジ機構
１４５；サーボモータ
１４７；筐体
１５０；リンク式従動アーム（ケーブル挿通部材）
１５１；変位差吸収機構
Ｇ；基板 DESCRIPTION OF SYMBOLS 1; Substrate processing system 10; Common transfer chamber 20; Preheating chamber 30a, 30b; Processing chamber 40; Load lock chamber (vacuum preliminary chamber)
50; substrate transport device 51; base member 52; turning drive unit 53; substrate support arm unit 54; support member 55; horizontal drive unit 56; lift drive units 61, 62a, 62b, 63, 64 ... gate valve 70; 111; Lift plate 112; Substrate transport arm 143; Ball screw mechanism 145; Servo motor 147; Housing 150; Link-type driven arm (cable insertion member)
151; Displacement difference absorbing mechanism G: Substrate

Claims (7)

複数のモジュールが接続された共通搬送室に設けられ、前記複数のモジュール間で基板の搬送を行う基板搬送装置であって、
前記共通搬送室内に水平にかつ旋回可能に設けられたベース部材と、
基板を支持する基板支持アームと、
前記基板支持アームを昇降可能に支持し、前記ベース部材に水平方向に移動可能に支持された支持部材と、
前記ベース部材を旋回させる旋回駆動部と、
前記支持部材を前記ベース部材に沿って水平方向に走行させる水平駆動部と、
前記基板支持アームを前記支持部材に沿って昇降させる昇降駆動部と
を具備することを特徴とする基板搬送装置。 A substrate transfer apparatus that is provided in a common transfer chamber to which a plurality of modules are connected, and that transfers a substrate between the plurality of modules,
A base member horizontally and pivotably provided in the common transfer chamber;
A substrate support arm for supporting the substrate;
A support member that supports the substrate support arm so as to be movable up and down, and is supported by the base member so as to be movable in a horizontal direction;
A turning drive for turning the base member;
A horizontal drive section for causing the support member to travel horizontally along the base member;
An apparatus for transporting a substrate, comprising: an elevating drive unit configured to elevate and lower the substrate support arm along the support member. 前記基板支持アームは複数設けられてユニット化され、前記昇降駆動部により一括して昇降され、複数の基板を一括して支持して搬送することを特徴とする請求項１に記載の基板搬送装置。   2. The substrate transfer apparatus according to claim 1, wherein a plurality of the substrate support arms are provided as a unit, and are lifted / lowered collectively by the lifting / lowering drive unit to support and transfer the plurality of substrates collectively. . 前記複数のモジュールは、真空中で基板に所定の処理を施す処理室と、処理前および処理後の基板を交換するロードロック室とを有し、前記共通搬送室は真空に保持されることを特徴とする請求項１または請求項２に記載の基板搬送装置。   The plurality of modules include a processing chamber for performing predetermined processing on the substrate in a vacuum, and a load lock chamber for exchanging the substrate before and after the processing, and the common transfer chamber is maintained in vacuum. The substrate transfer apparatus according to claim 1, wherein the substrate transfer apparatus is characterized. 前記昇降駆動部は、前記支持部材に取り付けられていることを特徴とする請求項３に記載の基板搬送装置。   The substrate transport apparatus according to claim 3, wherein the elevating drive unit is attached to the support member. 前記昇降駆動部の駆動源を取り囲む内部が大気空間となる筐体と、前記筐体に接続され、前記駆動源に接続された配線を収容して前記共通搬送室の外部に取り出すための、内部が大気空間となるケーブル挿通部材とをさらに具備し、前記ケーブル挿通部材は、複数のアームと、前記アーム間を接続する気密に形成されたリンク機構とを有し、前記支持部材の水平方向の移動に連動して伸屈するリンク式従動アームとして構成されることを特徴とする請求項４に記載の基板搬送装置。   A housing that surrounds the drive source of the elevating drive unit is an atmospheric space, and an interior that is connected to the housing and accommodates wiring connected to the drive source and is taken out of the common transfer chamber Further comprising a cable insertion member that serves as an atmospheric space, and the cable insertion member includes a plurality of arms and an airtight link mechanism that connects the arms, and the horizontal direction of the support member The substrate transfer apparatus according to claim 4, wherein the substrate transfer apparatus is configured as a link type driven arm that bends in conjunction with movement. 前記ケーブル挿通部材と前記筐体との間に、内部を大気空間に保ったまま前記ベース部材の変更と前記ケーブル挿通部材の上下変位差を吸収するための変位差吸収機構をさらに具備することを特徴とする請求項５に記載の基板搬送装置。   A displacement difference absorbing mechanism for absorbing the change of the base member and the vertical displacement difference of the cable insertion member while maintaining the inside in an air space is further provided between the cable insertion member and the housing. The board | substrate conveyance apparatus of Claim 5 characterized by the above-mentioned. 共通搬送室と、
前記共通搬送室に接続された、所定の処理を行う処理室を含む複数のモジュールと、
前記共通搬送室に設けられ、前記複数のモジュール間で基板の搬送を行う基板搬送装置と
を具備し、
前記基板搬送装置は請求項１から請求項６のいずれかの構成を有することを特徴とする基板処理システム。 A common transfer room,
A plurality of modules connected to the common transfer chamber and including a processing chamber for performing a predetermined process;
A substrate transfer device provided in the common transfer chamber and configured to transfer a substrate between the plurality of modules;
7. The substrate processing system, wherein the substrate transfer apparatus has the configuration according to any one of claims 1 to 6.
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