WO2020122133A1 - Substrate transport device - Google Patents

Substrate transport device Download PDF

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Publication number
WO2020122133A1
WO2020122133A1 PCT/JP2019/048527 JP2019048527W WO2020122133A1 WO 2020122133 A1 WO2020122133 A1 WO 2020122133A1 JP 2019048527 W JP2019048527 W JP 2019048527W WO 2020122133 A1 WO2020122133 A1 WO 2020122133A1
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WO
WIPO (PCT)
Prior art keywords
substrate
wafer
robot
mounting table
aligner
Prior art date
Application number
PCT/JP2019/048527
Other languages
French (fr)
Japanese (ja)
Inventor
準一 開田
Original Assignee
平田機工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 平田機工株式会社 filed Critical 平田機工株式会社
Priority to CN201980071082.XA priority Critical patent/CN112930251A/en
Publication of WO2020122133A1 publication Critical patent/WO2020122133A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00—Manipulators mounted on wheels or on carriages
    • B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a substrate transfer device, and more particularly to a substrate transfer device that takes out a substrate from a container that stores the substrate and transfers the substrate to a processing device that performs various types of processing on the substrate.
  • the present application claims priority to Japanese Patent Application No. 2018-231643 filed on Dec. 11, 2018, and the content thereof is incorporated herein.
  • the substrate transfer apparatus includes therein an atmospheric transfer robot that takes out a wafer from a container that stores a substrate (hereinafter referred to as a wafer), and transfers and transfers the wafer.
  • the atmospheric transfer robot is capable of traveling along a traveling guide and has an end effector at its tip.
  • the atmospheric transfer robot extends and bends its arm unit to take out or reload the wafer with the end effector.
  • the wafer taken out by the end effector is transferred to the substrate aligner, the orientation of the wafer is adjusted to a predetermined direction by the substrate aligner, and the wafer is centered. In this way, the transfer of the wafer by the atmospheric transfer robot and the adjustment of the orientation and center position of the wafer by the substrate aligner are performed (see Patent Document 1).
  • a substrate transfer device a configuration is known in which a holding shaft (hereinafter referred to as a substrate aligner) is provided integrally with an atmospheric transfer robot.
  • the end effector is advanced to the wafer removal position of the cassette and the wafer is lifted up by extending and raising the arm unit of the atmosphere transfer robot. After that, by bending and lowering the arm unit, the end effector is moved to a position directly above the substrate aligner, and the wafer is transferred to the substrate aligner.
  • the substrate aligner integrally with the atmospheric transfer robot, it is not necessary to move the atmospheric transfer robot to the position of the substrate aligner in order to perform wafer alignment. Therefore, it becomes possible to shorten the moving distance of the atmospheric transfer robot as compared with the conventional one, that is, to shorten the cycle time of substrate processing in the substrate transfer apparatus (see Patent Document 2).
  • the substrate transfer devices of Patent Documents 1 and 2 have only one substrate aligner. Particularly in the case of Patent Document 2, even if the substrates are taken out by the respective robot arms, the alignment of the wafers by the substrate aligner can be performed only one by one. Therefore, while the wafers of one robot arm are being aligned, the wafers of the other robot arm are on standby, and the substrate aligner becomes a bottleneck in shortening the cycle time of substrate processing. Therefore, it is conceivable to provide a plurality of substrate aligners on the substrate transfer apparatus, but the number of installations increases the size of the apparatus configuration. In addition, due to the recent progress of IoT and the like, the demand for shortening the cycle time in substrate processing is further increasing.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate transfer apparatus having a compact device configuration and high throughput of substrate processing.
  • a substrate transfer apparatus is a substrate transfer apparatus including a substrate transfer module and an atmospheric transfer robot provided inside the substrate transfer module, wherein the atmospheric transfer robot is a robot capable of traveling with respect to the substrate transfer module.
  • the substrate transfer apparatus further includes a substrate aligner that has a base portion, is provided on an upper portion of the robot base portion, and has at least two substrate mounting tables that align the orientations of the substrates.
  • the atmospheric transfer robot is rotatably supported with respect to the robot base, and is provided with a pair of extendable and bendable arm units and a pair of arm units at the tips thereof, respectively. It may be provided with an end effector having two upper and lower stages on which the substrate can be placed.
  • the substrate aligner may include a temporary substrate placing section above each of the substrate mounting tables.
  • the substrate aligner may include at least two substrate mounting bases for aligning the orientations of the substrates and one base portion on which the substrate mounting bases are provided. Good.
  • the substrate aligner is composed of at least two substrates, and each of the substrate aligners has a substrate mounting table for aligning the orientation of the substrate, and a base portion provided with the substrate mounting table. And may have.
  • the substrate transfer apparatus further comprises a load lock chamber having a polygonal shape in plan view, which is connected to the substrate transfer module, the load lock chamber being a surface connected to the substrate transfer module and a surface connected to the load lock chamber.
  • the surface adjacent to the substrate may have an opening through which the substrate is loaded and unloaded.
  • the two load lock chambers are connected to the substrate transfer module, and the two load lock chambers are provided so that the adjacent surfaces face each other.
  • the said opening may be provided in each.
  • FIG. 6 is a perspective view illustrating an example in which the ID is read along with the alignment of the orientations of the wafers placed on the first and second substrate mounting tables of the substrate transfer apparatus.
  • FIG. 6 is a perspective view illustrating an example in which the wafers of the first and second buffers of the substrate transfer device are placed on the first and second substrate mounting tables and the ID is read while the orientation of the wafers is aligned. It is a perspective view explaining the example which the atmospheric
  • the substrate transfer apparatus 10 includes a substrate transfer module (EFEM) 12, an atmospheric transfer robot 14, and a substrate aligner 15.
  • a plurality of load ports 13 are connected to the front surface (lower surface in FIG. 1) of the shell outer wall 22 of the substrate transfer module 12.
  • a plurality of load lock chambers 16 and 17 are provided on the rear surface (the upper surface in FIG. 1) of the shell outer wall 22 of the substrate transfer module 12, and a vacuum transfer module 18 is provided between the load lock chambers 16 and 17. .
  • the board transfer module 12 is provided with a guide mechanism 24 and a drive mechanism 220 on the shell inner wall 21 of the board transfer module 12.
  • the guide mechanism 24 is provided on the bottom surface of the shell inner wall 21 of the substrate transfer module 12, and includes a pair of guide rails 24a and 24b, and a rack 24c provided along one guide rail 24a (or 24b).
  • the drive mechanism 220 provided on the robot base portion 25 of the atmosphere transfer robot 14 has a pair of engaged portions (slider) 124a and 124b which engage with the guide rails 24a and 24b, respectively, and a pinion gear 225 which meshes with the rack 24c.
  • a drive source 224 for driving the pinion gear 225.
  • the rack and pinion using the rack 24c and the pinion gear 225 has been described as the linear mechanism for moving the transport robot 14 in the present embodiment, the present invention is not limited to this.
  • all linear motion mechanisms conventionally used for robot traveling can be replaced therewith.
  • the load port 13 is a device for opening and closing the door 32a of the FOUP 32.
  • the FOUP 32 is, for example, a container having 25 stages of mounting shelves and is mounted on the load port 13.
  • a semiconductor wafer (substrate) 35 is stored in each of 25 mounting shelves.
  • 25 semiconductor wafers 35 are stored in the FOUP 32 will be described, but the number of semiconductor wafers 35 stored in the FOUP 32 can be appropriately selected.
  • an atmosphere transfer robot 14 is provided inside the substrate transfer module 12.
  • the atmosphere transfer robot 14 includes a robot base 25, a pair of arm units 26 and 27, end effectors 28 and 29 provided at the tips of the arm units 26 and 27, and a substrate aligner 15 described later.
  • the robot base 25 is supported by the guide mechanism 24 so as to be movable in the substrate transfer module 12.
  • the atmospheric transfer robot 14 can access any of the plurality of load ports 13 and the load lock chambers 16 and 17.
  • a pair of arm units 26, 27 are supported by the robot base 25 so as to be rotatable and movable up and down.
  • the robot base 25 is provided with an elevating mechanism and a rotating mechanism (not shown) therein. As a result, the pair of arm units 26, 27 can be raised and lowered and rotated with respect to the robot base 25.
  • the first arm unit 26 includes a first arm 41 and a second arm 42 that are connected so as to be extendable and bendable.
  • the base of the first arm 41 is rotatably connected to the robot base 25, and the base of the second arm 42 is rotatably connected to the tip of the first arm 41.
  • the first end effector 28 is connected to the tip of the second arm 42.
  • the second arm unit 27 includes a third arm 45 and a fourth arm 46 that are connected so as to extend and bend.
  • the base of the third arm 45 is connected to the robot base 25.
  • the base of the fourth arm 46 is rotatably connected to the tip of the third arm 45.
  • the second end effector 29 is connected to the tip of the fourth arm 46.
  • the first end effector 28 includes an upper hand member (placement portion) 51 and a lower hand member (placement portion) 52.
  • the upper hand member 51 and the lower hand member 52 are arranged vertically in two stages with their relative positions fixed in the vertical direction and the horizontal direction.
  • the wafer 35 is placed on the upper hand member 51 and the lower hand member 52.
  • the second end effector 29 includes an upper hand member (mounting portion) 53 and a lower hand member (mounting portion) 54.
  • the upper hand member 53 and the lower hand member 54 are arranged in upper and lower two stages.
  • the wafer 35 is similarly placed on the upper hand member 53 and the lower hand member 54.
  • the second end effector 29 is arranged below the first end effector 28 so as to overlap with each other.
  • a substrate aligner 15 is provided on the upper portion 25 a of the robot base 25.
  • the substrate aligner 15 is provided integrally with the robot base 25.
  • the substrate aligner 15 includes one base portion 56, two substrate mounting bases 57 and 58, two notch portion detecting means 61 and 62, and one ID reading means 63.
  • the substrate aligner 15 is a dual aligner provided with two substrate mounting bases 57 and 58, and can align two wafers 35 substantially at the same time as described later.
  • one of the two substrate mounting tables 57 and 58 will be described as the first substrate mounting table 57, and the other will be described as the second substrate mounting table 58.
  • the detection means 61 and the cutout portion detection means 62 will be described as the other.
  • a first substrate mounting table 57 and a second substrate mounting table 58 are rotatably supported on the upper portion 56a of the base portion 56 with a space therebetween.
  • the wafer 35 of the first end effector 28 is mounted on the second substrate mounting table 58.
  • the wafer 35 of the second end effector 29 is placed on the first substrate platform 57.
  • the first arm unit 26 mounts the wafer 35 on the second substrate mounting table 58
  • the second arm unit 27 mounts the wafer 35 on the first substrate mounting table 57.
  • the first substrate mounting table 57 and the second substrate mounting table 58 are formed so that the wafers 35 mounted on the substrate mounting tables 57 and 58 can be arranged side by side in a horizontal plane.
  • a first cutout detecting means 61 is provided at one end portion (lower right end portion in FIG. 4) 56b on the first substrate mounting table 57 side, and the second substrate mounting table is provided.
  • a second notch detecting means 62 is provided at the other end (upper left end in FIG. 4) 56c on the 58 side.
  • the first notch portion detecting means 61 and the second notch portion detecting means 62 are provided so as to face the edges of the respective wafers 35 placed on the first substrate placing table 57 and the second substrate placing table 58, respectively. The positions of the notches in the circumferential direction of 35 are respectively detected.
  • one ID reading means 63 is provided between the first substrate mounting table 57 and the second substrate mounting table 58.
  • the ID reading means 63 is provided so that the upper surface thereof faces the upper portion 56a of the base portion 56.
  • the ID reading unit 63 reads, for example, the ID on the back surface of the edge of the wafer 35 placed on the first substrate placing table 57 and the second substrate placing table 58 to detect, for example, processing information and history of the wafer 35.
  • each wafer is rotated by rotating the first substrate mounting table 57 and the second substrate mounting table 58 while the wafer 35 is mounted on the first substrate mounting table 57 and the second substrate mounting table 58. 35 is rotated. Then, the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the position of the notch portion (notch) provided at the edge of each wafer 35. Then, based on the detected information, the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled, and the orientation of the wafer 35 is adjusted so that the notch portion comes to a predetermined position.
  • the wafers 35 are aligned so that the crystal orientation of each wafer 35 is oriented in an arbitrary direction. Further, the ID reading unit 63 reads the ID of each wafer 35, and the processing information and history of the wafer 35 are detected.
  • the two substrate mounting bases 57 and 58 are provided on the one base portion 56 of the substrate aligner 15. Further, one ID reading means 63 is provided between the two substrate mounting bases 57 and 58 to read the IDs of the respective wafers 35 mounted on the two substrate mounting bases 57 and 58 alternately. That is, the device cost can be suppressed by sharing the ID reading unit 63, which is an expensive detection device, in common.
  • the atmosphere transfer robot 14 is run, the robot base 25 is positioned in front of the desired load port 13, and the arm units 26 and 27 are directly opposed to the load port 13. After that, the atmosphere transfer robot 14 shown in FIG. 2 is driven to extend the arm units 26 and 27 toward the FOUP 32. Then, the wafer 35 accommodated in the FOUP 32 is picked up by the upper hand member 51 and the lower hand member 52 of the first end effector 28 and the upper hand member 53 and the lower hand member 54 of the second end effector 29. , The wafer 35 is transferred from the FOUP 32 to each hand member. After that, each arm unit 26, 27 is retracted toward the robot base 25, and the wafer 35 is taken out.
  • each arm unit 26, 27 is rotated with respect to the robot base 25, and each arm unit 26, 27 is directly opposed to the substrate aligner 15.
  • the wafer 35 mounted on the lower hand member 52 of the first end effector 28 will be referred to as “wafer 35A”
  • the wafer 35 mounted on the upper hand member 51 of the first end effector 28 will be referred to as “wafer 35C”.
  • the wafer 35 mounted on the lower hand member 54 of the second end effector 29 is referred to as a “wafer 35B”
  • the wafer 35 mounted on the upper hand member 53 of the second end effector 29 is referred to as a “wafer 35D”. explain.
  • the atmospheric transfer robot 14 is driven to extend the arm units 26 and 27 toward the substrate aligner 15. As shown in FIGS. 3 and 6A, the wafer 35A mounted on the lower hand member 52 of the first end effector 28 of the arm unit 26 is transferred to the first substrate mounting table 57. Thereafter, the robot base 25 is rotated, and the wafer 35C of the upper hand member 51 of the first end effector 28 is transferred to the second substrate mounting table 58. After that, the alignment of the wafers 35A and 35C is performed on both the substrate mounting tables 57 and 58.
  • the upper hand member 51 of the first end effector 28 in the arm unit 26 picks up the wafer 35C of the second substrate mounting table 58, and the lower hand member of the second end effector 29 in the arm unit 27.
  • the wafer 35B mounted on the substrate 54 is transferred to the second substrate mounting table 58.
  • the robot base 25 is rotated in the opposite direction, and the lower hand member 52 of the first end effector 28 in the arm unit 26 scoops up the wafer 35A on the first substrate mounting table 57, and the second end effector in the arm unit 27 is picked up.
  • the wafer 35D mounted on the upper hand member 53 of the actuator 29 is transferred to the first substrate mounting table 57. After that, the alignment of the wafers 35B and 35D is performed on both the substrate mounting bases 57 and 58.
  • the upper hand member 53 of the second end effector 29 in the arm unit 27 picks up the wafer 35D on the first substrate mounting table 57. Then, the robot base 25 is rotated, and the lower hand member 54 of the second end effector 29 of the arm unit 27 picks up the wafer 35B of the second substrate mounting table 58.
  • 35C is rotated.
  • the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the notch portions of the wafers 35A and 35C.
  • the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled based on the detected information, and the wafers 35A and 35C are aligned so that the cutout portions are located at predetermined positions.
  • the ID reading means 63 reads the IDs of the wafers 35A and 35C, and the processing information and history of the wafers 35A and 35C are detected.
  • the atmospheric transfer robot 14 is driven again to extend the arm units 26 and 27 toward the substrate aligner 15.
  • the wafer 35C whose alignment has been performed and whose ID has been read is picked up by the upper hand member 51 of the first end effector 28 from the second substrate mounting table 58 and transferred.
  • the robot base 25 is rotated again to extend the arm units 26 and 27 toward the substrate aligner 15.
  • the wafer 35A whose alignment has been performed and whose ID has been read is picked up by the lower hand member 52 of the first end effector 28 from the first substrate mounting table 57 and transferred.
  • the wafer 35B mounted on the first substrate mounting table 57 and the wafer 35D mounted on the second substrate mounting table 58 are separated. Is rotated.
  • the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the notch portions of the wafers 35B and 35D.
  • the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled, and the wafers 35B and 35D are aligned so that the cutout portions are located at predetermined positions.
  • the ID reading means 63 reads the IDs of the wafers 35A and 35C, and the processing information and history of the wafers 35A and 35C are detected.
  • the arm unit 27 is extended again toward the substrate aligner 15.
  • the wafer 35 ⁇ /b>B whose alignment has been performed and whose ID has been read is picked up by the upper hand member 53 of the second end effector 29 from the first substrate mounting table 57 and transferred.
  • the robot base 25 is rotated again to extend the arm unit 27 toward the substrate aligner 15.
  • the wafer 35D whose alignment has been performed and whose ID has been read is picked up by the lower hand member 54 of the first end effector 28 from the second substrate mounting table 58 and transferred.
  • the wafers 35C and 35A whose alignment has been performed and whose ID has been read are placed on the upper hand member 51 and the lower hand member 52 of the first end effector 28, respectively. Further, the wafers 35B and 35D whose alignment has been performed and whose ID has been read are placed on the upper hand member 53 and the lower hand member 54 of the second end effector 29, respectively. That is, the alignment of all the wafers 35A to 35D placed on each hand member is completed. After that, the atmospheric transfer robot 14 is moved to position the robot base 25 in front of the desired load lock chamber 16 (or 17). After that, the atmospheric transfer robot 14 is driven so that the arm units 26 and 27 are directly opposed to the load lock chamber 16.
  • each arm unit 26, 27 is extended toward the load lock chamber 16.
  • Wafers 35C, 35A, 35B and 35D placed on the upper and lower hand members 51 and 52 of the first end effector 28 and the upper and lower hand members 53 and 54 of the second end effector 29 are collectively loaded into the first load. It is carried into the lock chamber 16 (or the second load lock chamber 17).
  • the second load lock chamber 17 is shown in FIG.
  • the alignment of the wafer 35 and the traveling of the atmospheric transfer robot 14 are performed in parallel, so that the cycle time is shortened and the throughput is improved.
  • the atmospheric transfer robot 14 since the atmospheric transfer robot 14 is provided so as to be freely movable, unlike a conventional fixed transfer type transfer robot in the conventional substrate transfer apparatus, one load robot 13 can handle all the load ports 13. And both load lock chambers 16 and 17 can be covered. Therefore, the operating rate per atmospheric transfer robot is increased, and the device cost can be suppressed.
  • the robot base 25 of the atmosphere transfer robot 14 is integrally provided with a substrate aligner 15 capable of aligning two wafers 35, and the substrate aligner 15 always follows the traveling of the atmosphere transfer robot 14. Therefore, the wafer 35 can be aligned while the atmospheric transfer robot 14 is running. Therefore, the cycle time of the substrate transfer apparatus 10 is shortened and the throughput is improved.
  • the operation of the atmospheric transfer robot 14 (see FIG. 2) is temporarily stopped (idle time occurs).
  • the substrate aligner 15 is provided with the two substrate mounting bases 57 and 58, and the two wafers 35 can be simultaneously aligned in parallel. Therefore, in the substrate transfer apparatus 10 of the present embodiment, the idle time of the atmospheric transfer robot 14 is halved as compared with the conventional substrate transfer apparatus in which the substrate mounting table has one substrate aligner. As a result, it is possible to shorten the cycle time of the substrate transfer apparatus during continuous processing of the wafer 35, and thus improve the throughput.
  • the substrate aligner 15 is provided with a first buffer 64a and a second buffer 64b above the first substrate mounting table 57 and the second substrate mounting table 58, and aligns four wafers 35 in a vertical arrangement. Can be done at once. Therefore, the throughput of the substrate transfer device can be further improved.
  • two load lock chambers 16 and 17 are connected to the other long wall 22b of the shell outer wall 22 of the substrate transfer module 12.
  • the first load lock chamber 16 is the first load lock chamber 16
  • the second load lock is the first load lock chamber 16
  • the first and second load lock chambers 16 and 17 are symmetrical with respect to the vacuum transfer module 18.
  • the second load-lock chamber 17 will be denoted by the same reference numerals as the constituent members of the first load-lock chamber 16, and detailed description of the second load-lock chamber 17 will be omitted.
  • the first load lock chamber 16 includes a housing 71, a first gate valve mechanism (gate valve mechanism) 72, a second gate valve mechanism (gate valve mechanism) 73, and a multistage.
  • the substrate mounting portion 74 and the lifting/lowering rotation unit 75 are provided.
  • the housing 71 has a quadrangular shape as a polygonal shape in a plan view, and has a first surface 71a, a second surface 71b, a third surface 71c, and a fourth surface 71d.
  • the case 71 has a quadrangular shape in plan view, but the case 71 may have another polygonal shape.
  • the first surface 71a is a surface that is connected to the other long wall 22b of the shell outer wall 22 of the substrate transfer module 12.
  • a first opening (opening) 77 is formed on the first surface 71a.
  • the second surface 71b is a surface adjacent to the first surface 71a.
  • a second opening (opening) 78 is formed on the second surface 71b. In this way, the first opening 77 and the second opening 78 are provided in the adjacent first surface 71a and second surface 71b, respectively.
  • the first opening 77 and the second opening 78 allow the upper and lower hand members 51 and 52 of the first end effector 28 and the upper and lower hand members 53 of the second end effector 29 to cover the four wafers 35 at a time. It is high enough to be passed over with 54.
  • the wafer 35 is transferred from the substrate transfer module 12 side through the first opening 77 into the inside of the first load lock chamber 16 (multi-step substrate mounting part 74) by the atmospheric transfer robot 14 (direction of arrow A). ). Then, the wafer 35 inside the first load lock chamber 16 is taken out through the second opening 78 by the vacuum transfer robot (not shown) in the vacuum transfer module 18 (direction of arrow B). The vacuum transfer robot is rotatably supported inside the vacuum transfer module 18 about a rotary shaft 81. When the wafer 35 is transferred from the vacuum transfer module 18 to the substrate transfer module 12 via the first load lock chamber 16, the wafer 35 is transferred in the order of arrow C direction and arrow D direction.
  • the intersection angle ⁇ 1 between the loading direction (arrow A direction) of the wafer 35 and the loading direction (arrow B direction) of the wafer 35 is 90° (right angle). That is, the path for loading and unloading the wafer 35 is L-shaped. Accordingly, when the vacuum transfer module 18 is connected to the first load lock chamber 16, the installation position of the vacuum transfer module 18 becomes as close as possible to the substrate transfer module 12 side. As a result, the gap between the substrate transfer module 12 and the vacuum transfer module 18 becomes smaller and the dead space becomes smaller. Therefore, the overall length and depth of the substrate transfer module 12 and the vacuum transfer module 18, that is, the footprints are reduced, and the volume of the shell (not shown) forming the clean space can be reduced accordingly.
  • the wafer 35 taken out by the vacuum transfer robot in the vacuum transfer module 18 is transferred to the transfer module chamber (vacuum chamber).
  • the transfer module chamber is connected to the surface of the vacuum transfer module 18 opposite to the substrate transfer module 12.
  • the vacuum transfer robot can be made to face the transfer module chamber only by rotating the vacuum transfer robot at the rotation angle ⁇ 2 of 90°.
  • the crossing angle ⁇ 1 is larger than 90°, for example, 120 to 150°.
  • the rotation angle ⁇ 2 of the vacuum transfer robot at this time is 120 to 150°. That is, in the substrate transfer apparatus 10 according to the present embodiment, the rotation angle ⁇ 2 of the vacuum transfer robot can be made smaller than in the conventional case.
  • the cycle time from the rotation start to the rotation end of the vacuum transfer robot can be shortened as much as the rotation angle becomes smaller.
  • the cycle time can be shortened in the process of taking out the wafer 35 from the second opening 78 by the vacuum transfer robot and loading it into the transfer module.
  • the four wafers 35 are put together by the first end effector 28 and the second end effector 29 of the atmospheric transfer robot 14 and are passed through the first opening 77. It is carried in and out. That is, the four wafers 35 mounted on the upper hand member 51 and the lower hand member 52 of the first end effector 28 and the upper hand member 53 and the lower hand member 54 of the second end effector 29 shown in FIG. It is carried into the first load lock chamber 16 through the first opening 77. In addition, between the first load lock chamber 16 and the vacuum transfer module 18, the wafer 35 is loaded and unloaded through the second opening 78 by the vacuum transfer robot.
  • the respective second openings 78 of the first load lock chamber 16 and the second load lock chamber 17 are provided at opposite positions. Both second openings 78 are openings connected to the vacuum transfer module 18. Accordingly, the vacuum transfer module 18 can be arranged in the space between the first load lock chamber 16 and the second load lock chamber 17. This makes it possible to arrange the vacuum transfer module 18 so as to be adjacent to the other long wall 22b of the shell outer wall 22 of the substrate transfer module 12.
  • the first opening 77 can be opened and closed by the first gate valve mechanism 72 and can be hermetically sealed.
  • the first gate valve mechanism 72 includes a first gate valve 84 and a first opening/closing mechanism (not shown).
  • the first gate valve 84 is supported so as to be vertically movable between a closed position that closes the first opening 77 and an open position that opens the first opening 77.
  • a first opening/closing mechanism is connected to the first gate valve 84. By operating the first opening/closing mechanism, the first gate valve 84 is moved up and down, and the first opening 77 is opened/closed. When the first opening 77 is closed by the first gate valve 84, the first opening 77 is hermetically sealed by the first gate valve 84.
  • the second opening 78 can be opened and closed by the second gate valve mechanism 73 and can be hermetically sealed.
  • the second gate valve mechanism 73 includes a second gate valve 85 and a second opening/closing mechanism 86.
  • the second gate valve 85 is movably supported between a closed position that closes the second opening 78 and an open position that opens the second opening 78.
  • a second opening/closing mechanism 86 is connected to the second gate valve 85. By operating the second opening/closing mechanism 86, the second gate valve 85 is moved up and down, and the second opening 78 is opened/closed. When the second opening 78 is closed by the second gate valve 85, the second opening 78 is hermetically sealed by the second gate valve 85.
  • a multi-stage substrate mounting portion 74 is provided inside the housing 71.
  • the multi-stage substrate mounting portion 74 includes, for example, a shelf that can store 25 wafers 35 at a time and that is arranged in at least 25 stages in the vertical direction.
  • the FOUP cassette 32 can accommodate 25 wafers 35. Therefore, the multi-stage substrate mounting portion 74 can store the wafers 35 of the FOUP cassette 32 at one time.
  • 25 semiconductor wafers 35 are stored in the multi-stage substrate placing section 74 will be described, but the number of semiconductor wafers 35 stored in the multi-stage substrate placing section 74 can be appropriately selected.
  • An elevating/lowering rotation unit 75 is connected to the multi-stage substrate mounting portion 74.
  • the elevating and rotating unit 75 includes an elevating mechanism 75a and a rotating mechanism 75b.
  • the elevating mechanism 75a is a mechanism for elevating and lowering the multi-stage substrate placing section 74. For example, after the four wafers 35 are transferred by the atmospheric transfer robot 14 to arbitrary four stages of the substrate mounting portion 74 via the first opening 77, the entire substrate mounting portion 74 is moved by the elevating mechanism 75a. Is raised by 4 steps. After that, four new wafers 35 are transferred to the substrate mounting portion 74, and this process is sequentially repeated, so that the wafers 35 are transferred and accommodated in all desired stages of the substrate mounting portion 74.
  • the rotating mechanism 75b rotates the multi-stage substrate platform 74 around a vertical axis (that is, a center axis of rotation) 88.
  • the multi-stage substrate placing part 74 is provided at a position where the center position 89 of the multi-stage substrate placing part 74 is offset from the rotation center axis 88 toward the substrate transport module 12 side by L2.
  • the entire substrate platform 74 is rotated 90° toward the vacuum transfer module 18 side by the rotating mechanism 75b.
  • the wafer 35 is taken out from the substrate platform 74 by the vacuum transfer robot in the vacuum transfer module 18.
  • the center of the wafer 35 is located at the center position 89 of the multi-stage substrate placing portion 74. That is, the wafer 35 is in a position offset from the rotation center shaft 88 of the rotation mechanism 75b toward the first opening 77 side in a state of being placed on the multi-stage substrate placement portion 74.
  • This makes it possible to shorten the loading/unloading stroke (extension/retraction stroke) of the atmospheric transfer robot 14 when the atmospheric transfer robot 14 loads the wafer 35 from the substrate transfer module 12 to the multi-step substrate platform 74.
  • the cycle time when the wafer 35 is loaded from the substrate transfer module 12 to the multi-stage substrate platform 74 can be shortened by the amount that the loading/unloading stroke is shortened.
  • the substrate aligner 15 is provided on the base portion 56 with the two substrate mounting bases 57 and 58 collectively, and one ID reading means 63 is also used for reading the ID of each wafer 35.
  • the present invention is not limited to this.
  • two existing single aligners may be arranged side by side as the substrate aligner.
  • the substrate aligner of this modification is also a dual aligner having two substrate mounting tables, and it is possible to align two wafers 35 almost at the same time.
  • the existing aligner is provided with one substrate mounting table, one notch detecting means, and an ID reading means on one base.
  • a conventional or existing aligner can be applied to the substrate aligner as it is, so that the substrate aligner can be easily procured and the IDs of the two wafers 35 can be read independently. Therefore, the throughput is further increased as compared with the present embodiment.
  • the present invention is not limited to this.
  • the rotation center shaft 88 of the rotation mechanism 75b and the center position 89 of the multi-stage substrate mounting portion 74 can be provided coaxially.
  • the rotating mechanism 75b and the multi-stage substrate placing portion 74 have the same axial center, so that the multi-step substrate placing portion 74 rotates in a stable state by the rotating mechanism 75b.
  • the substrate aligner 15 includes two temporary substrate placing portions 64.
  • the temporary substrate placing portion 64 is provided on the upper portion of the base portion 56.
  • the temporary substrate rest part 64 is arranged above the first substrate rest 57 and the second substrate rest 58.
  • the substrate temporary placing unit 64 includes a first buffer 64a arranged above the first substrate mounting table 57 and a second buffer 64b arranged above the second substrate mounting table 58.
  • the first buffer 64a is an annular frame member and is capable of dropping and picking up the wafer 35 of the upper hand member 51 (see FIG. 3) of the first end effector 28.
  • the annular frame member may be either a continuous frame member having only a part of the notch or an assembly of a plurality of discontinuous frame members.
  • the second buffer 64b has the same configuration as the first buffer 64a.
  • the wafer 35 mounted on the lower hand member 52 of the first end effector 28 will be referred to as “wafer 35A”, and the wafer 35 mounted on the upper hand member 51 of the first end effector 28 will be referred to as “wafer 35C”.
  • the wafer 35 mounted on the lower hand member 54 of the second end effector 29 is referred to as a “wafer 35B”
  • the wafer 35 mounted on the upper hand member 53 of the second end effector 29 is referred to as a “wafer 35D”.
  • the arm units 26 and 27 are rotated with respect to the robot base 25, and the arm units 26 and 27 are made to face the substrate aligner 15.
  • the atmospheric transfer robot 14 is driven to extend the arm units 26 and 27 toward the substrate aligner 15.
  • the wafer 35A mounted on the lower hand member 52 of the first end effector 28 in the arm unit 26 is transferred to the first substrate mounting table 57, and the first end effector 28 is transferred.
  • the wafer 35C of the upper hand member 51 is transferred to the first buffer 64a (see FIG. 5).
  • the second end effector 29 in the arm unit 27 is placed on the lower hand member 54 at the same timing as the transfer by the arm unit 26 (or almost the same with a slight time difference).
  • the wafer 35B is transferred to the second substrate mounting table 58, and the wafer 35D of the upper hand member 53 of the second end effector 29 is transferred to the second buffer 64b (see FIG. 5).
  • the wafer 35A mounted on the first substrate mounting table 57 and the wafer 35B mounted on the second substrate mounting table 58 rotate.
  • the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the notch portions of the wafers 35A and 35B. Then, based on the detected information, the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled, and the alignment of the wafers 35A and 35B is adjusted so that the cutout portion is located at a predetermined position.
  • the ID reading means 63 reads the IDs of the wafers 35A and 35B, and the processing information and history of the wafers 35A and 35B are detected.
  • the atmospheric transfer robot 14 is driven again to extend the arm units 26 and 27 toward the substrate aligner 15.
  • the wafer 35A whose alignment has been performed and whose ID has been read is transferred from the first substrate mounting table 57 to the lower hand member 52 of the first end effector 28, and the wafer 35C is transferred from the first buffer 64a to the first end effector. 28 is transferred to the upper hand member 51.
  • the wafer 35B whose alignment has been performed and whose ID has been read is transferred from the second substrate mounting table 58 to the lower hand member 54 of the second end effector 29, 35D is transferred from the second buffer 64b to the upper hand member 53 of the second end effector 29.
  • the elevating mechanism (not shown) of the atmospheric transfer robot 14 is driven to lower the pair of arm units 26 and 27, and at the same time, the arm units 26 and 27 are extended again toward the substrate aligner 15.
  • the wafer 35C is transferred from the upper hand member 51 of the first end effector 28 to the first substrate mounting table 57.
  • the wafer 35D is transferred from the upper hand member 53 of the second end effector 29 to the second substrate mounting table 58 at the same timing as the transfer of the wafer 35C.
  • the wafer 35C mounted on the first substrate mounting table 57 and the wafer 35D mounted on the second substrate mounting table 58 are separated. Is rotated.
  • the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the notch portions of the wafers 35C and 35D.
  • the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled, and the alignment of the wafers 35C and 35D is adjusted so that the cutout portion is located at a predetermined position.
  • the ID reading means 63 reads the IDs of the wafers 35C and 35D, and the processing information and history of the wafers 35C and 35D are detected.
  • each arm unit 26, 27 is extended again toward the substrate aligner 15.
  • the wafer 35C for which the alignment has been performed and the ID has been read is transferred from the first substrate mounting table 57 to the upper hand member 51 of the first end effector 28.
  • the alignment is performed and the ID-read wafer 35D is transferred from the second substrate mounting table 58 to the upper hand member 53 of the second end effector 29.
  • the wafers 35C and 35A whose alignment has been performed and whose ID has been read are placed on the upper hand member 51 and the lower hand member 52 of the first end effector 28, respectively.
  • the wafers 35D and 35B from which the IDs have been read are placed on the upper hand member 53 and the lower hand member 54 of the second end effector 29, respectively, in which the orientation is aligned. That is, the alignment of all the wafers 35A to 35D placed on each hand member is completed.
  • the wafers 35B, 35A, 35D and 35C mounted on the upper and lower hand members 51 and 52 of the first end effector 28 and the upper and lower hand members 53 and 54 of the second end effector 29. are collectively loaded into the first load lock chamber 16 (or the second load lock chamber 17).
  • the embodiment of the present invention has been described in detail above with reference to the drawings. However, the specific configuration is not limited to this embodiment, and any design change that does not depart from the gist of the present invention can be applied to the present invention. included.
  • the substrate transfer apparatus 10 of the present embodiment the example in which the substrate aligner 15 is provided with the two substrate mounting bases 57 and 58 has been described, but as another example, it is also possible to provide three or more substrate mounting bases. is there.
  • the first modification an example in which two existing aligners are arranged as the substrate aligner 15 has been described, but it is also possible to provide three or more existing aligners.

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Abstract

Provided is a substrate transport device that has a compact configuration and achieves high substrate processing throughput. This substrate transport device comprises a substrate transport module and an air transport robot that is provided inside the substrate transport module and has a robot base part that can travel on the substrate transport module. The substrate transport device also comprises a substrate aligner that is provided to an upper part of the robot base part and has at least two substrate mounting stands that perform substrate alignment.

Description

基板搬送装置Substrate transfer device
　本発明は、基板搬送装置に係り、基板を収容する容器から基板を取り出し、基板に各種処理を施す処理装置へと受け渡す基板搬送装置に関する。
　本願は、２０１８年１２月１１日に出願された特願２０１８－２３１６４３号に対して優先権を主張し、その内容をここに援用する。 The present invention relates to a substrate transfer device, and more particularly to a substrate transfer device that takes out a substrate from a container that stores the substrate and transfers the substrate to a processing device that performs various types of processing on the substrate.
The present application claims priority to Japanese Patent Application No. 2018-231643 filed on Dec. 11, 2018, and the content thereof is incorporated herein.
　基板搬送装置は、その内部に、基板（以下、ウエハという）を収容する容器からウエハを取り出し、移載及び搬送を行う大気搬送ロボットを備える。大気搬送ロボットは、走行ガイドに沿って走行可能であり、その先端にエンドイフェクタを備える。大気搬送ロボットは、そのアームユニットを伸長・屈曲させることで、エンドイフェクタでウエハを取り出したり、載せ直したりする。基板搬送装置では、エンドイフェクタで取り出したウエハが基板アライナに受け渡され、基板アライナによりウエハの向きが所定の向きに調整されるとともに、ウエハの心出しが行われる。
　このように、大気搬送ロボットによるウエハの受け渡しと、基板アライナによるウエハの向き及び中心位置の調整が行われる（特許文献１参照）。 The substrate transfer apparatus includes therein an atmospheric transfer robot that takes out a wafer from a container that stores a substrate (hereinafter referred to as a wafer), and transfers and transfers the wafer. The atmospheric transfer robot is capable of traveling along a traveling guide and has an end effector at its tip. The atmospheric transfer robot extends and bends its arm unit to take out or reload the wafer with the end effector. In the substrate transfer device, the wafer taken out by the end effector is transferred to the substrate aligner, the orientation of the wafer is adjusted to a predetermined direction by the substrate aligner, and the wafer is centered.
In this way, the transfer of the wafer by the atmospheric transfer robot and the adjustment of the orientation and center position of the wafer by the substrate aligner are performed (see Patent Document 1).
　また、基板搬送装置として、大気搬送ロボットと一体に保持軸（以下、基板アライナという）が設けられた構成が知られている。その基板搬送装置では、大気搬送ロボットのアームユニットを伸長・上昇させることにより、エンドイフェクタがカセットのウエハ取り出し位置に前進されるとともに、ウエハが上方に持ち上げられる。その後、アームユニットを屈曲・下降させることにより、エンドイフェクタが基板アライナの直上位置に移動され、ウエハが基板アライナに移載される。
　このように、大気搬送ロボットと一体に基板アライナを設けることにより、ウエハのアライメントを行うために大気搬送ロボットを基板アライナの位置までわざわざ走行させる必要が無い。よって、大気搬送ロボットの移動距離を従来に比べて短縮すること、すなわち基板搬送装置における基板処理のサイクルタイムを短縮することが可能になる（特許文献２参照）。 Further, as a substrate transfer device, a configuration is known in which a holding shaft (hereinafter referred to as a substrate aligner) is provided integrally with an atmospheric transfer robot. In the substrate transfer apparatus, the end effector is advanced to the wafer removal position of the cassette and the wafer is lifted up by extending and raising the arm unit of the atmosphere transfer robot. After that, by bending and lowering the arm unit, the end effector is moved to a position directly above the substrate aligner, and the wafer is transferred to the substrate aligner.
Thus, by providing the substrate aligner integrally with the atmospheric transfer robot, it is not necessary to move the atmospheric transfer robot to the position of the substrate aligner in order to perform wafer alignment. Therefore, it becomes possible to shorten the moving distance of the atmospheric transfer robot as compared with the conventional one, that is, to shorten the cycle time of substrate processing in the substrate transfer apparatus (see Patent Document 2).
特開２００９－２１５０４号公報JP, 2009-21504, A 特開平８－２５５８２１号公報JP-A-8-255821
　特許文献１、特許文献２の基板搬送装置は、基板アライナを１つのみ備えている。特に特許文献２の場合、それぞれのロボットアームで基板を取り出したとしても、基板アライナによるウエハの位置合わせは１枚ずつしか行うことができない。このため、一方のロボットアームのウエハの位置合わせを行っている間は、他方のロボットアームのウエハは待機中となり、基板アライナが基板処理のサイクルタイム短縮におけるボトルネックとなってしまう。そこで、基板搬送装置に複数の基板アライナを設けることが考えられるが、設置の数の分だけ、装置構成が大掛かりとなってしまう。また、近年のＩｏＴ化の進展などにより、基板処理におけるサイクルタイム短縮の要求が更に高まっている。 The substrate transfer devices of Patent Documents 1 and 2 have only one substrate aligner. Particularly in the case of Patent Document 2, even if the substrates are taken out by the respective robot arms, the alignment of the wafers by the substrate aligner can be performed only one by one. Therefore, while the wafers of one robot arm are being aligned, the wafers of the other robot arm are on standby, and the substrate aligner becomes a bottleneck in shortening the cycle time of substrate processing. Therefore, it is conceivable to provide a plurality of substrate aligners on the substrate transfer apparatus, but the number of installations increases the size of the apparatus configuration. In addition, due to the recent progress of IoT and the like, the demand for shortening the cycle time in substrate processing is further increasing.
　本発明は上記の事情に鑑みてなされたもので、装置構成がコンパクトで、かつ、基板処理のスループットが高い基板搬送装置を提供することを目的としている。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate transfer apparatus having a compact device configuration and high throughput of substrate processing.
　本発明に係る基板搬送装置は、基板搬送モジュールと、該基板搬送モジュールの内部に設けられる大気搬送ロボットとを備える基板搬送装置において、前記大気搬送ロボットは前記基板搬送モジュールに対して走行自在なロボット基部を有し、該ロボット基部の上部に設けられ、基板の向きの位置合わせを行う少なくとも２つの基板載置台を有する基板アライナを更に備える基板搬送装置である。 A substrate transfer apparatus according to the present invention is a substrate transfer apparatus including a substrate transfer module and an atmospheric transfer robot provided inside the substrate transfer module, wherein the atmospheric transfer robot is a robot capable of traveling with respect to the substrate transfer module. The substrate transfer apparatus further includes a substrate aligner that has a base portion, is provided on an upper portion of the robot base portion, and has at least two substrate mounting tables that align the orientations of the substrates.
　本発明に係る基板搬送装置において、前記大気搬送ロボットは、前記ロボット基部に対して回転自在に支持され、伸長・屈曲可能な一対のアームユニットと、一対の前記アームユニットの先端にそれぞれ設けられ、前記基板を載置可能な載置部を上下二段に有するエンドイフェクタとを備えていてもよい。 In the substrate transfer apparatus according to the present invention, the atmospheric transfer robot is rotatably supported with respect to the robot base, and is provided with a pair of extendable and bendable arm units and a pair of arm units at the tips thereof, respectively. It may be provided with an end effector having two upper and lower stages on which the substrate can be placed.
　本発明に係る基板搬送装置において、前記基板アライナは、それぞれの前記基板載置台の上方に基板仮置き部を備えていてもよい。 In the substrate transfer apparatus according to the present invention, the substrate aligner may include a temporary substrate placing section above each of the substrate mounting tables.
　本発明に係る基板搬送装置において、前記基板アライナは、基板の向きの位置合わせを行う少なくとも２つの基板載置台と、それらの基板載置台が設けられる１つのベース部と、を有していてもよい。 In the substrate transfer apparatus according to the present invention, the substrate aligner may include at least two substrate mounting bases for aligning the orientations of the substrates and one base portion on which the substrate mounting bases are provided. Good.
　本発明に係る基板搬送装置において、前記基板アライナは、少なくとも２台で構成され、それぞれの前記基板アライナは、基板の向きの位置合わせを行う基板載置台と、該基板載置台が設けられるベース部と、を有していてもよい。 In the substrate transfer apparatus according to the present invention, the substrate aligner is composed of at least two substrates, and each of the substrate aligners has a substrate mounting table for aligning the orientation of the substrate, and a base portion provided with the substrate mounting table. And may have.
　本発明に係る基板搬送装置において、前記基板搬送モジュールに接続される平面視多角形状のロードロックチャンバをさらに備え、前記ロードロックチャンバは、前記基板搬送モジュールに接続される面及び該接続される面に隣接する面に、それぞれ前記基板が搬入出される開口部を有していてもよい。 The substrate transfer apparatus according to the present invention further comprises a load lock chamber having a polygonal shape in plan view, which is connected to the substrate transfer module, the load lock chamber being a surface connected to the substrate transfer module and a surface connected to the load lock chamber. The surface adjacent to the substrate may have an opening through which the substrate is loaded and unloaded.
　本発明に係る基板搬送装置において、前記基板搬送モジュールに、２つの前記ロードロックチャンバが接続され、２つの前記ロードロックチャンバは、前記隣接する面同士が対向するように設けられ、対向する隣接面それぞれに前記開口部が設けられてもよい。 In the substrate transfer apparatus according to the present invention, the two load lock chambers are connected to the substrate transfer module, and the two load lock chambers are provided so that the adjacent surfaces face each other. The said opening may be provided in each.
　本発明によれば、装置構成がコンパクトで、かつ、基板処理のスループットが高い基板搬送装置を得ることができる。 According to the present invention, it is possible to obtain a substrate transfer device having a compact device configuration and high throughput of substrate processing.
本発明に係る基板搬送装置を示す平面図である。It is a top view which shows the board|substrate conveyance apparatus which concerns on this invention. 図１のII部拡大図である。It is the II section enlarged view of FIG. 図２のIII部拡大図である。It is a III section enlarged view of FIG. 基板搬送装置の基板アライナを示す斜視図である。It is a perspective view which shows the board|substrate aligner of a board|substrate conveyance apparatus. 基板搬送装置の基板アライナを示す正面図である。It is a front view which shows the board|substrate aligner of a board|substrate conveyance apparatus. 基板搬送装置の第１基板載置台及び第１バッファにウエハを載せる例を説明する斜視図である。It is a perspective view explaining the example which mounts a wafer on the 1st substrate mounting stand and 1st buffer of a substrate conveyance device. 基板搬送装置の第１、第２の基板載置台に載せたウエハの向きの位置合わせとともにＩＤの読み取りを行う例を説明する斜視図である。FIG. 6 is a perspective view illustrating an example in which the ID is read along with the alignment of the orientations of the wafers placed on the first and second substrate mounting tables of the substrate transfer apparatus. 基板搬送装置の第１、第２のバッファのウエハを第１、第２の基板載置台に載せてウエハの向きの位置合わせとともにＩＤの読み取りを行う例を説明する斜視図である。FIG. 6 is a perspective view illustrating an example in which the wafers of the first and second buffers of the substrate transfer device are placed on the first and second substrate mounting tables and the ID is read while the orientation of the wafers is aligned. 基板搬送装置の第１の基板載置台におけるウエハを大気搬送ロボットが取り出した例を説明する斜視図である。It is a perspective view explaining the example which the atmospheric|air transfer robot took out the wafer in the 1st board|substrate mounting base of a board|substrate transfer apparatus. 基板搬送装置の第１ロードロックチャンバを示す平面図である。It is a top view which shows the 1st load lock chamber of a board|substrate conveyance apparatus. 基板搬送装置の第１ロードロックチャンバ示す断面模式図である。It is a cross-sectional schematic diagram which shows the 1st load lock chamber of a board|substrate conveyance apparatus.
　本発明に係る基板搬送装置の実施形態について以下に説明する。
　図１に示すように、基板搬送装置１０は、基板搬送モジュール（ＥＦＥＭ）１２と、大気搬送ロボット１４と、基板アライナ１５とを備えている。基板搬送モジュール１２における殻体外壁２２の前面（図１中では下面）に複数のロードポート１３が接続される。また、基板搬送モジュール１２における殻体外壁２２の後面（図１中では上面）に、複数のロードロックチャンバ１６，１７が設けられるとともに、ロードロックチャンバ１６，１７間に真空搬送モジュール１８が設けられる。 An embodiment of the substrate transfer device according to the present invention will be described below.
As shown in FIG. 1, the substrate transfer apparatus 10 includes a substrate transfer module (EFEM) 12, an atmospheric transfer robot 14, and a substrate aligner 15. A plurality of load ports 13 are connected to the front surface (lower surface in FIG. 1) of the shell outer wall 22 of the substrate transfer module 12. Further, a plurality of load lock chambers 16 and 17 are provided on the rear surface (the upper surface in FIG. 1) of the shell outer wall 22 of the substrate transfer module 12, and a vacuum transfer module 18 is provided between the load lock chambers 16 and 17. ..
　基板搬送モジュール１２には、基板搬送モジュール１２の殻体内壁２１にガイド機構２４及び駆動機構２２０が設けられている。ガイド機構２４は、基板搬送モジュール１２における殻体内壁２１の底面に設けられ、一対のガイドレール２４ａ，２４ｂと、一方のガイドレール２４ａ（又は２４ｂ）に沿って設けられるラック２４ｃと、を備える。また、大気搬送ロボット１４のロボット基部２５に設けられる駆動機構２２０は、ガイドレール２４ａ，２４ｂとそれぞれ係合する一対の被係合部（スライダ）１２４ａ，１２４ｂと、ラック２４ｃに噛合するピニオンギア２２５と、ピニオンギア２２５を駆動する駆動源２２４と、を備える。本実施の形態においては、搬送ロボット１４を走行させる直動機構として、ラック２４ｃとピニオンギア２２５を用いたラックアンドピニオンを挙げて説明を行ったが、これに限定するものではない。例えば、ロボット走行のために慣用的に用いられている全ての直動機構が、これに置換可能である。 The board transfer module 12 is provided with a guide mechanism 24 and a drive mechanism 220 on the shell inner wall 21 of the board transfer module 12. The guide mechanism 24 is provided on the bottom surface of the shell inner wall 21 of the substrate transfer module 12, and includes a pair of guide rails 24a and 24b, and a rack 24c provided along one guide rail 24a (or 24b). Further, the drive mechanism 220 provided on the robot base portion 25 of the atmosphere transfer robot 14 has a pair of engaged portions (slider) 124a and 124b which engage with the guide rails 24a and 24b, respectively, and a pinion gear 225 which meshes with the rack 24c. And a drive source 224 for driving the pinion gear 225. Although the rack and pinion using the rack 24c and the pinion gear 225 has been described as the linear mechanism for moving the transport robot 14 in the present embodiment, the present invention is not limited to this. For example, all linear motion mechanisms conventionally used for robot traveling can be replaced therewith.
　ロードポート１３は、ＦＯＵＰ３２のドア３２ａを開閉するための装置である。ＦＯＵＰ３２は、例えば、２５段の載置棚を有する容器であって、ロードポート１３に載置される。２５段の載置棚のそれぞれに半導体ウエハ（基板）３５が格納される。なお、本実施形態では、ＦＯＵＰ３２に２５枚の半導体ウエハ３５を格納する例について説明するが、ＦＯＵＰ３２に格納する半導体ウエハ３５の枚数は適宜選択可能である。
　ＦＯＵＰ３２のドア３２ａをロードポート１３にて開放することにより、ＦＯＵＰ３２に格納された半導体ウエハ３５が殻体内壁２１に面するようになり、ＦＯＵＰ３２と大気搬送ロボット１４との間において半導体ウエハ３５の受け渡しが可能になる。 The load port 13 is a device for opening and closing the door 32a of the FOUP 32. The FOUP 32 is, for example, a container having 25 stages of mounting shelves and is mounted on the load port 13. A semiconductor wafer (substrate) 35 is stored in each of 25 mounting shelves. In the present embodiment, an example in which 25 semiconductor wafers 35 are stored in the FOUP 32 will be described, but the number of semiconductor wafers 35 stored in the FOUP 32 can be appropriately selected.
By opening the door 32a of the FOUP 32 at the load port 13, the semiconductor wafer 35 stored in the FOUP 32 comes to face the shell inner wall 21, and the semiconductor wafer 35 is transferred between the FOUP 32 and the atmospheric transfer robot 14. Will be possible.
　図２に示すように、基板搬送モジュール１２の内部には、大気搬送ロボット１４が設けられている。大気搬送ロボット１４は、ロボット基部２５と、一対のアームユニット２６，２７と、各アームユニット２６，２７の先端に設けられるエンドイフェクタ２８，２９と、後述する基板アライナ１５とを備えている。
　ロボット基部２５は、ガイド機構２４により基板搬送モジュール１２内において走行自在に支持されている。これにより、大気搬送ロボット１４は、複数のロードポート１３及びロードロックチャンバ１６，１７のいずれに対してもアクセス自在となる。ロボット基部２５に対して一対のアームユニット２６，２７が回転自在に、かつ昇降自在に支持されている。また、ロボット基部２５は、その内部に図示しない昇降機構及び回動機構を備えている。これらにより、ロボット基部２５に対して、一対のアームユニット２６，２７が昇降及び旋回自在とされる。 As shown in FIG. 2, an atmosphere transfer robot 14 is provided inside the substrate transfer module 12. The atmosphere transfer robot 14 includes a robot base 25, a pair of arm units 26 and 27, end effectors 28 and 29 provided at the tips of the arm units 26 and 27, and a substrate aligner 15 described later.
The robot base 25 is supported by the guide mechanism 24 so as to be movable in the substrate transfer module 12. As a result, the atmospheric transfer robot 14 can access any of the plurality of load ports 13 and the load lock chambers 16 and 17. A pair of arm units 26, 27 are supported by the robot base 25 so as to be rotatable and movable up and down. Further, the robot base 25 is provided with an elevating mechanism and a rotating mechanism (not shown) therein. As a result, the pair of arm units 26, 27 can be raised and lowered and rotated with respect to the robot base 25.
　図３に示すように、一対のアームユニット２６，２７のうち、第１アームユニット２６は、伸長・屈曲可能に連結された第１アーム４１及び第２アーム４２を備えている。具体的には、第１アーム４１の基部がロボット基部２５に回転自在に連結され、第１アーム４１の先端に第２アーム４２の基部が回動自在に連結されている。また、第２アーム４２の先端に第１エンドイフェクタ２８が連結されている。 As shown in FIG. 3, of the pair of arm units 26 and 27, the first arm unit 26 includes a first arm 41 and a second arm 42 that are connected so as to be extendable and bendable. Specifically, the base of the first arm 41 is rotatably connected to the robot base 25, and the base of the second arm 42 is rotatably connected to the tip of the first arm 41. Further, the first end effector 28 is connected to the tip of the second arm 42.
　第２アームユニット２７は、第１アームユニット２６と同様に、伸長・屈曲可能に連結された第３アーム４５及び第４アーム４６を備えている。具体的には、第３アーム４５の基部がロボット基部２５に連結されている。第３アーム４５の先端に第４アーム４６の基部が回動自在に連結されている。また、第４アーム４６の先端に第２エンドイフェクタ２９が連結されている。 Like the first arm unit 26, the second arm unit 27 includes a third arm 45 and a fourth arm 46 that are connected so as to extend and bend. Specifically, the base of the third arm 45 is connected to the robot base 25. The base of the fourth arm 46 is rotatably connected to the tip of the third arm 45. The second end effector 29 is connected to the tip of the fourth arm 46.
　第１エンドイフェクタ２８は、上ハンド部材（載置部）５１と、下ハンド部材（載置部）５２とを備えている。上ハンド部材５１及び下ハンド部材５２は、上下方向及び水平方向における相対的位置が固定された状態で上下二段に配置されている。上ハンド部材５１及び下ハンド部材５２上にウエハ３５が載置される。
　第２エンドイフェクタ２９は、第１エンドイフェクタ２８と同様に、上ハンド部材（載置部）５３と、下ハンド部材（載置部）５４とを備えている。上ハンド部材５３及び下ハンド部材５４は、第１エンドイフェクタ２８の上ハンド部材５１及び下ハンド部材５２と同様に、上下二段に配置されている。また、上ハンド部材５３及び下ハンド部材５４上にも、同様にウエハ３５が載置される。
　第１アームユニット２６と第２アームユニット２７とが屈曲された状態（図３の状態）において、第１エンドイフェクタ２８の下方に第２エンドイフェクタ２９が重なるように配置される。 The first end effector 28 includes an upper hand member (placement portion) 51 and a lower hand member (placement portion) 52. The upper hand member 51 and the lower hand member 52 are arranged vertically in two stages with their relative positions fixed in the vertical direction and the horizontal direction. The wafer 35 is placed on the upper hand member 51 and the lower hand member 52.
Like the first end effector 28, the second end effector 29 includes an upper hand member (mounting portion) 53 and a lower hand member (mounting portion) 54. Like the upper hand member 51 and the lower hand member 52 of the first end effector 28, the upper hand member 53 and the lower hand member 54 are arranged in upper and lower two stages. The wafer 35 is similarly placed on the upper hand member 53 and the lower hand member 54.
In a state where the first arm unit 26 and the second arm unit 27 are bent (state of FIG. 3 ), the second end effector 29 is arranged below the first end effector 28 so as to overlap with each other.
　図２、図４及び図５に示すように、ロボット基部２５の上部２５ａに基板アライナ１５が備えられている。言い換えると、基板アライナ１５はロボット基部２５と一体に設けられている。基板アライナ１５は、１つのベース部５６と、２つの基板載置台５７，５８と、２つの切欠き部検出手段６１，６２と、１つのＩＤ読み取り手段６３とを備えている。この基板アライナ１５は、２つの基板載置台５７，５８を備えたデュアルアライナであり、後述するように２枚のウエハ３５をほぼ同時にアライメントすることが可能である。以下、２つの基板載置台５７，５８の一方を第１基板載置台５７、他方を第２基板載置台５８として説明し、２つの切欠き部検出手段６１，６２の一方を第１切欠き部検出手段６１、他方を切欠き部検出手段６２として説明する。 As shown in FIGS. 2, 4 and 5, a substrate aligner 15 is provided on the upper portion 25 a of the robot base 25. In other words, the substrate aligner 15 is provided integrally with the robot base 25. The substrate aligner 15 includes one base portion 56, two substrate mounting bases 57 and 58, two notch portion detecting means 61 and 62, and one ID reading means 63. The substrate aligner 15 is a dual aligner provided with two substrate mounting bases 57 and 58, and can align two wafers 35 substantially at the same time as described later. Hereinafter, one of the two substrate mounting tables 57 and 58 will be described as the first substrate mounting table 57, and the other will be described as the second substrate mounting table 58. The detection means 61 and the cutout portion detection means 62 will be described as the other.
　ベース部５６の上部５６ａには、第１基板載置台５７及び第２基板載置台５８が間隔をおいて回転自在に支持されている。第２基板載置台５８には第１エンドイフェクタ２８のウエハ３５が載置される。第１基板載置台５７には第２エンドイフェクタ２９のウエハ３５が載置される。言い換えると、第１アームユニット２６がウエハ３５を第２基板載置台５８に載置し、第２アームユニット２７がウエハ３５を第１基板載置台５７に載置する。　第１基板載置台５７及び第２基板載置台５８は、各基板載置台５７，５８に載置されたウエハ３５を水平面内に並べて配置可能に形成されている。
　また、ベース部５６の上部５６ａにおいて、第１基板載置台５７側の一端部（図４中では右下側端部）５６ｂに第１切欠き部検出手段６１が設けられ、第２基板載置台５８側の他端部（図４中では左上側端部）５６ｃに第２切欠き部検出手段６２が設けられている。第１切欠き部検出手段６１及び第２切欠き部検出手段６２は、第１基板載置台５７及び第２基板載置台５８に載置された各ウエハ３５のエッジに臨んでそれぞれ設けられ、ウエハ３５の周方向における切欠き部の位置をそれぞれ検出する。 A first substrate mounting table 57 and a second substrate mounting table 58 are rotatably supported on the upper portion 56a of the base portion 56 with a space therebetween. The wafer 35 of the first end effector 28 is mounted on the second substrate mounting table 58. The wafer 35 of the second end effector 29 is placed on the first substrate platform 57. In other words, the first arm unit 26 mounts the wafer 35 on the second substrate mounting table 58, and the second arm unit 27 mounts the wafer 35 on the first substrate mounting table 57. The first substrate mounting table 57 and the second substrate mounting table 58 are formed so that the wafers 35 mounted on the substrate mounting tables 57 and 58 can be arranged side by side in a horizontal plane.
Further, in the upper portion 56a of the base portion 56, a first cutout detecting means 61 is provided at one end portion (lower right end portion in FIG. 4) 56b on the first substrate mounting table 57 side, and the second substrate mounting table is provided. A second notch detecting means 62 is provided at the other end (upper left end in FIG. 4) 56c on the 58 side. The first notch portion detecting means 61 and the second notch portion detecting means 62 are provided so as to face the edges of the respective wafers 35 placed on the first substrate placing table 57 and the second substrate placing table 58, respectively. The positions of the notches in the circumferential direction of 35 are respectively detected.
　さらに、ベース部５６の上部５６ａにおいて、第１基板載置台５７及び第２基板載置台５８間に、１つのＩＤ読み取り手段６３が設けられている。ＩＤ読み取り手段６３は、その上面がベース部５６の上部５６ａに臨んで設けられる。ＩＤ読み取り手段６３は、第１基板載置台５７及び第２基板載置台５８に載置されたウエハ３５のエッジ裏面のＩＤを読み取ることにより、例えばウエハ３５の処理情報・履歴などを検出する。 Further, on the upper portion 56a of the base portion 56, one ID reading means 63 is provided between the first substrate mounting table 57 and the second substrate mounting table 58. The ID reading means 63 is provided so that the upper surface thereof faces the upper portion 56a of the base portion 56. The ID reading unit 63 reads, for example, the ID on the back surface of the edge of the wafer 35 placed on the first substrate placing table 57 and the second substrate placing table 58 to detect, for example, processing information and history of the wafer 35.
　基板アライナ１５によれば、第１基板載置台５７及び第２基板載置台５８にウエハ３５を載置した状態において、第１基板載置台５７及び第２基板載置台５８を回転させることにより各ウエハ３５が回転される。そして、第１切欠き部検出手段６１及び第２切欠き部検出手段６２により、各ウエハ３５のエッジに設けられた切欠き部（ノッチ）の位置を検出する。そして、その検出情報を基に第１基板載置台５７及び第２基板載置台５８の回転を制御し、切欠き部が所定の位置にくるようにウエハ３５の向きが調整される。これにより、各ウエハ３５の結晶方位が任意の方向を向くように、ウエハ３５がアライメントされる。また、ＩＤ読み取り手段６３が各ウエハ３５のＩＤを読み取り、ウエハ３５の処理情報・履歴などが検出される。 According to the substrate aligner 15, each wafer is rotated by rotating the first substrate mounting table 57 and the second substrate mounting table 58 while the wafer 35 is mounted on the first substrate mounting table 57 and the second substrate mounting table 58. 35 is rotated. Then, the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the position of the notch portion (notch) provided at the edge of each wafer 35. Then, based on the detected information, the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled, and the orientation of the wafer 35 is adjusted so that the notch portion comes to a predetermined position. As a result, the wafers 35 are aligned so that the crystal orientation of each wafer 35 is oriented in an arbitrary direction. Further, the ID reading unit 63 reads the ID of each wafer 35, and the processing information and history of the wafer 35 are detected.
　このように、基板アライナ１５における１つのベース部５６に、２つの基板載置台５７，５８が設けられている。また、２つの基板載置台５７，５８間に１つのＩＤ読み取り手段６３を設け、２つの基板載置台５７，５８に載置された各ウエハ３５のＩＤを交互に読み取らせている。すなわち、高額な検出機器であるＩＤ読み取り手段６３を共用とし１つとすることで、装置コストを抑えることができる。 As described above, the two substrate mounting bases 57 and 58 are provided on the one base portion 56 of the substrate aligner 15. Further, one ID reading means 63 is provided between the two substrate mounting bases 57 and 58 to read the IDs of the respective wafers 35 mounted on the two substrate mounting bases 57 and 58 alternately. That is, the device cost can be suppressed by sharing the ID reading unit 63, which is an expensive detection device, in common.
　次に、基板アライナ１５によりウエハ３５のアライメントを行い、ウエハ３５のＩＤを読み取る例を図２、図３、図６Ａ、図６Ｂ、図７Ａ及び図７Ｂに基づいて説明する。
　大気搬送ロボット１４を走行させ、ロボット基部２５を所望のロードポート１３の前に位置させるとともに、ロードポート１３に各アームユニット２６，２７を正対させる。その後、図２に示す大気搬送ロボット１４を駆動させ、各アームユニット２６，２７をＦＯＵＰ３２に向かって伸長させる。そして、ＦＯＵＰ３２内に収容されるウエハ３５を、第１エンドイフェクタ２８の上ハンド部材５１及び下ハンド部材５２と、第２エンドイフェクタ２９の上ハンド部材５３及び下ハンド部材５４とで掬い上げ、ウエハ３５がＦＯＵＰ３２から各ハンド部材に移載される。その後、各アームユニット２６，２７をロボット基部２５に向かって退縮させ、ウエハ３５が取り出される。 Next, an example in which the wafer 35 is aligned by the substrate aligner 15 and the ID of the wafer 35 is read will be described with reference to FIGS. 2, 3, 6A, 6B, 7A and 7B.
The atmosphere transfer robot 14 is run, the robot base 25 is positioned in front of the desired load port 13, and the arm units 26 and 27 are directly opposed to the load port 13. After that, the atmosphere transfer robot 14 shown in FIG. 2 is driven to extend the arm units 26 and 27 toward the FOUP 32. Then, the wafer 35 accommodated in the FOUP 32 is picked up by the upper hand member 51 and the lower hand member 52 of the first end effector 28 and the upper hand member 53 and the lower hand member 54 of the second end effector 29. , The wafer 35 is transferred from the FOUP 32 to each hand member. After that, each arm unit 26, 27 is retracted toward the robot base 25, and the wafer 35 is taken out.
　その後、ロボット基部２５に対して各アームユニット２６，２７を回動させ、基板アライナ１５に各アームユニット２６，２７を正対させる。
　以下、第１エンドイフェクタ２８の下ハンド部材５２に載置されるウエハ３５を「ウエハ３５Ａ」、第１エンドイフェクタ２８の上ハンド部材５１に載置されるウエハ３５を「ウエハ３５Ｃ」とする。また、第２エンドイフェクタ２９の下ハンド部材５４に載置されるウエハ３５を「ウエハ３５Ｂ」、第２エンドイフェクタ２９の上ハンド部材５３に載置されるウエハ３５を「ウエハ３５Ｄ」として説明する。 After that, each arm unit 26, 27 is rotated with respect to the robot base 25, and each arm unit 26, 27 is directly opposed to the substrate aligner 15.
Hereinafter, the wafer 35 mounted on the lower hand member 52 of the first end effector 28 will be referred to as “wafer 35A”, and the wafer 35 mounted on the upper hand member 51 of the first end effector 28 will be referred to as “wafer 35C”. To do. Further, the wafer 35 mounted on the lower hand member 54 of the second end effector 29 is referred to as a “wafer 35B”, and the wafer 35 mounted on the upper hand member 53 of the second end effector 29 is referred to as a “wafer 35D”. explain.
　大気搬送ロボット１４を駆動させ、各アームユニット２６，２７を基板アライナ１５に向かって伸長させる。図３及び図６Ａに示すように、アームユニット２６における第１エンドイフェクタ２８の下ハンド部材５２に載置されるウエハ３５Ａが第１基板載置台５７に移載される。その後、ロボット基部２５を回動させ、第１エンドイフェクタ２８の上ハンド部材５１のウエハ３５Ｃが第２基板載置台５８に移載される。その後、両基板載置台５７，５８でウエハ３５Ａ，３５Ｃのアライメントが行われる。
　１回目のアライメント終了後、アームユニット２６における第１エンドイフェクタ２８の上ハンド部材５１で第２基板載置台５８のウエハ３５Ｃを掬い上げ、アームユニット２７における第２エンドイフェクタ２９の下ハンド部材５４に載置されるウエハ３５Ｂが第２基板載置台５８に移載される。その後、ロボット基部２５を反対向きに回動させ、アームユニット２６における第１エンドイフェクタ２８の下ハンド部材５２で第１基板載置台５７のウエハ３５Ａを掬い上げ、アームユニット２７における第２エンドイフェクタ２９の上ハンド部材５３に載置されるウエハ３５Ｄが第１基板載置台５７に移載される。その後、両基板載置台５７，５８でウエハ３５Ｂ，３５Ｄのアライメントが行われる。 The atmospheric transfer robot 14 is driven to extend the arm units 26 and 27 toward the substrate aligner 15. As shown in FIGS. 3 and 6A, the wafer 35A mounted on the lower hand member 52 of the first end effector 28 of the arm unit 26 is transferred to the first substrate mounting table 57. Thereafter, the robot base 25 is rotated, and the wafer 35C of the upper hand member 51 of the first end effector 28 is transferred to the second substrate mounting table 58. After that, the alignment of the wafers 35A and 35C is performed on both the substrate mounting tables 57 and 58.
After the first alignment is completed, the upper hand member 51 of the first end effector 28 in the arm unit 26 picks up the wafer 35C of the second substrate mounting table 58, and the lower hand member of the second end effector 29 in the arm unit 27. The wafer 35B mounted on the substrate 54 is transferred to the second substrate mounting table 58. Then, the robot base 25 is rotated in the opposite direction, and the lower hand member 52 of the first end effector 28 in the arm unit 26 scoops up the wafer 35A on the first substrate mounting table 57, and the second end effector in the arm unit 27 is picked up. The wafer 35D mounted on the upper hand member 53 of the actuator 29 is transferred to the first substrate mounting table 57. After that, the alignment of the wafers 35B and 35D is performed on both the substrate mounting bases 57 and 58.
　２回目のアライメント終了後、アームユニット２７における第２エンドイフェクタ２９の上ハンド部材５３で第１基板載置台５７のウエハ３５Ｄを掬い上げる。その後、ロボット基部２５を回動させ、アームユニット２７における第２エンドイフェクタ２９の下ハンド部材５４で第２基板載置台５８のウエハ３５Ｂを掬い上げる。 After completion of the second alignment, the upper hand member 53 of the second end effector 29 in the arm unit 27 picks up the wafer 35D on the first substrate mounting table 57. Then, the robot base 25 is rotated, and the lower hand member 54 of the second end effector 29 of the arm unit 27 picks up the wafer 35B of the second substrate mounting table 58.
　ここで、基板アライナ１５を駆動させ、第１基板載置台５７及び第２基板載置台５８を回転させることにより、第１基板載置台５７に載るウエハ３５Ａと、第２基板載置台５８に載るウエハ３５Ｃが回転される。このウエハ３５Ａ及びウエハ３５Ｃの回転により、第１切欠き部検出手段６１及び第２切欠き部検出手段６２が、各ウエハ３５Ａ，３５Ｃの切欠き部を検出する。そして、その検出情報を基に第１基板載置台５７及び第２基板載置台５８の回転が制御され、切欠き部が所定の位置にくるようにウエハ３５Ａ，３５Ｃがアライメントされる。また、このウエハ３５Ａ，３５Ｃの回転の際、ＩＤ読み取り手段６３が、各ウエハ３５Ａ，３５ＣのＩＤを読み取り、各ウエハ３５Ａ，３５Ｃの処理情報・履歴などが検出される。
　その後、大気搬送ロボット１４を再び駆動させ、各アームユニット２６，２７を基板アライナ１５に向かって伸長させる。アライメントが行われ、ＩＤが読み取られたウエハ３５Ｃが、第２基板載置台５８から第１エンドイフェクタ２８の上ハンド部材５１で掬い上げられ、移載される。そして、ロボット基部２５を再び回動させ、各アームユニット２６，２７を基板アライナ１５に向かって伸長させる。アライメントが行われ、ＩＤが読み取られたウエハ３５Ａが、第１基板載置台５７から第１エンドイフェクタ２８の下ハンド部材５２で掬い上げられ、移載される。 Here, by driving the substrate aligner 15 and rotating the first substrate mounting table 57 and the second substrate mounting table 58, the wafer 35A mounted on the first substrate mounting table 57 and the wafer mounted on the second substrate mounting table 58. 35C is rotated. By the rotation of the wafers 35A and 35C, the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the notch portions of the wafers 35A and 35C. Then, the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled based on the detected information, and the wafers 35A and 35C are aligned so that the cutout portions are located at predetermined positions. When the wafers 35A and 35C are rotated, the ID reading means 63 reads the IDs of the wafers 35A and 35C, and the processing information and history of the wafers 35A and 35C are detected.
After that, the atmospheric transfer robot 14 is driven again to extend the arm units 26 and 27 toward the substrate aligner 15. The wafer 35C whose alignment has been performed and whose ID has been read is picked up by the upper hand member 51 of the first end effector 28 from the second substrate mounting table 58 and transferred. Then, the robot base 25 is rotated again to extend the arm units 26 and 27 toward the substrate aligner 15. The wafer 35A whose alignment has been performed and whose ID has been read is picked up by the lower hand member 52 of the first end effector 28 from the first substrate mounting table 57 and transferred.
　基板アライナ１５を再び駆動させ、第１基板載置台５７及び第２基板載置台５８を回転させることにより、第１基板載置台５７に載るウエハ３５Ｂと、第２基板載置台５８に載るウエハ３５Ｄが回転される。このウエハ３５Ｂ及びウエハ３５Ｄの回転により、第１切欠き部検出手段６１及び第２切欠き部検出手段６２が、各ウエハ３５Ｂ，３５Ｄの切欠き部を検出する。そして、その検出情報を基に第１基板載置台５７及び第２基板載置台５８の回転が制御され、切欠き部が所定の位置にくるようにウエハ３５Ｂ，３５Ｄがアライメントされる。また、このウエハ３５Ｂ，３５Ｄの回転の際、ＩＤ読み取り手段６３が、各ウエハ３５Ａ，３５ＣのＩＤを読み取り、各ウエハ３５Ａ，３５Ｃの処理情報・履歴などが検出される。 By driving the substrate aligner 15 again and rotating the first substrate mounting table 57 and the second substrate mounting table 58, the wafer 35B mounted on the first substrate mounting table 57 and the wafer 35D mounted on the second substrate mounting table 58 are separated. Is rotated. By the rotation of the wafers 35B and 35D, the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the notch portions of the wafers 35B and 35D. Then, based on the detection information, the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled, and the wafers 35B and 35D are aligned so that the cutout portions are located at predetermined positions. Further, when the wafers 35B and 35D are rotated, the ID reading means 63 reads the IDs of the wafers 35A and 35C, and the processing information and history of the wafers 35A and 35C are detected.
　その後、アームユニット２７を基板アライナ１５に向かって再び伸長させる。図３及び図７Ｂに示すように、アライメントが行われ、ＩＤが読み取られたウエハ３５Ｂが、第１基板載置台５７から第２エンドイフェクタ２９の上ハンド部材５３で掬い上げられ、移載される。そして、ロボット基部２５を再び回動させ、アームユニット２７を基板アライナ１５に向かって伸長させる。アライメントが行われ、ＩＤが読み取られたウエハ３５Ｄが、第２基板載置台５８から第１エンドイフェクタ２８の下ハンド部材５４で掬い上げられ、移載される。
　これにより、第１エンドイフェクタ２８の上ハンド部材５１及び下ハンド部材５２に、アライメントが行われ、ＩＤが読み取られた各ウエハ３５Ｃ，３５Ａがそれぞれ載せられる。また、第２エンドイフェクタ２９の上ハンド部材５３及び下ハンド部材５４に、アライメントが行われ、ＩＤが読み取られた各ウエハ３５Ｂ，３５Ｄがそれぞれ載せられる。すなわち、各ハンド部材に載置される全てのウエハ３５Ａ～３５Ｄのアライメントが完了する。
　その後、大気搬送ロボット１４を走行させ、ロボット基部２５を所望のロードロックチャンバ１６（又は１７）の前に位置させる。その後、大気搬送ロボット１４を駆動させ、ロードロックチャンバ１６に各アームユニット２６，２７を正対させる。その後、各アームユニット２６，２７をロードロックチャンバ１６に向かって伸長させる。第１エンドイフェクタ２８の上下のハンド部材５１，５２、第２エンドイフェクタ２９の上下のハンド部材５３，５４に載せられたウエハ３５Ｃ，３５Ａ，３５Ｂ，３５Ｄは、４枚まとめて第１ロードロックチャンバ１６（又は第２ロードロックチャンバ１７）に搬入される。第２ロードロックチャンバ１７は図１に示す。ここで、大気搬送ロボット１４の走行、位置合わせは、ウエハ３５のアライメント中に完了させておくことが好ましい。これによって、ウエハ３５のアライメントと大気搬送ロボット１４の走行とが並行してなされるため、サイクルタイムが短縮され、ひいてはスループットが向上する。 After that, the arm unit 27 is extended again toward the substrate aligner 15. As shown in FIGS. 3 and 7B, the wafer 35</b>B whose alignment has been performed and whose ID has been read is picked up by the upper hand member 53 of the second end effector 29 from the first substrate mounting table 57 and transferred. It Then, the robot base 25 is rotated again to extend the arm unit 27 toward the substrate aligner 15. The wafer 35D whose alignment has been performed and whose ID has been read is picked up by the lower hand member 54 of the first end effector 28 from the second substrate mounting table 58 and transferred.
As a result, the wafers 35C and 35A whose alignment has been performed and whose ID has been read are placed on the upper hand member 51 and the lower hand member 52 of the first end effector 28, respectively. Further, the wafers 35B and 35D whose alignment has been performed and whose ID has been read are placed on the upper hand member 53 and the lower hand member 54 of the second end effector 29, respectively. That is, the alignment of all the wafers 35A to 35D placed on each hand member is completed.
After that, the atmospheric transfer robot 14 is moved to position the robot base 25 in front of the desired load lock chamber 16 (or 17). After that, the atmospheric transfer robot 14 is driven so that the arm units 26 and 27 are directly opposed to the load lock chamber 16. Then, each arm unit 26, 27 is extended toward the load lock chamber 16. Wafers 35C, 35A, 35B and 35D placed on the upper and lower hand members 51 and 52 of the first end effector 28 and the upper and lower hand members 53 and 54 of the second end effector 29 are collectively loaded into the first load. It is carried into the lock chamber 16 (or the second load lock chamber 17). The second load lock chamber 17 is shown in FIG. Here, it is preferable that the traveling and alignment of the atmospheric transfer robot 14 be completed during the alignment of the wafer 35. As a result, the alignment of the wafer 35 and the traveling of the atmospheric transfer robot 14 are performed in parallel, so that the cycle time is shortened and the throughput is improved.
　本実施形態の基板搬送装置１０においては、大気搬送ロボット１４を走行自在に設けているため、従来の基板搬送装置における固定回動式の搬送ロボットと異なり、１台のロボットで全てのロードポート１３及び両ロードロックチャンバ１６，１７をカバーすることができる。よって、大気搬送ロボット１台当たりの稼働率が高くなるとともに、装置コストを抑制することができる。そして、この大気搬送ロボット１４におけるロボット基部２５には、２枚のウエハ３５をアライメント可能な基板アライナ１５が一体に設けられており、基板アライナ１５は大気搬送ロボット１４の走行に常に追従する。このため、大気搬送ロボット１４の走行中に、ウエハ３５のアライメントを行うことができる。よって、基板搬送装置１０のサイクルタイムが短縮され、スループットが向上する。 In the substrate transfer apparatus 10 of the present embodiment, since the atmospheric transfer robot 14 is provided so as to be freely movable, unlike a conventional fixed transfer type transfer robot in the conventional substrate transfer apparatus, one load robot 13 can handle all the load ports 13. And both load lock chambers 16 and 17 can be covered. Therefore, the operating rate per atmospheric transfer robot is increased, and the device cost can be suppressed. The robot base 25 of the atmosphere transfer robot 14 is integrally provided with a substrate aligner 15 capable of aligning two wafers 35, and the substrate aligner 15 always follows the traveling of the atmosphere transfer robot 14. Therefore, the wafer 35 can be aligned while the atmospheric transfer robot 14 is running. Therefore, the cycle time of the substrate transfer apparatus 10 is shortened and the throughput is improved.
　また、基板アライナ１５によるウエハ３５のアライメントの間、大気搬送ロボット１４（図２参照）の動作が一時停止する（アイドルタイムが生じる）。しかしながら、基板アライナ１５は、図４及び図５に示すように、２つの基板載置台５７，５８を備えており、２枚のウエハ３５のアライメントを同時並行に行うことができる。よって、本実施形態の基板搬送装置１０は、基板載置台が１つの基板アライナを備えた従来の基板搬送装置と比較して、大気搬送ロボット１４のアイドルタイムが半減する。これにより、ウエハ３５の連続処理の際における基板搬送装置のサイクルタイムの短縮、ひいてはスループットの向上を図ることができる。さらに、この基板アライナ１５は、第１基板載置台５７及び第２基板載置台５８の上方に、第１バッファ６４ａ及び第２バッファ６４ｂを備えており、上下段合わせて４枚のウエハ３５のアライメントを一度に行うことができる。よって、基板搬送装置のスループットを更に向上させることできる。 During the alignment of the wafer 35 by the substrate aligner 15, the operation of the atmospheric transfer robot 14 (see FIG. 2) is temporarily stopped (idle time occurs). However, as shown in FIGS. 4 and 5, the substrate aligner 15 is provided with the two substrate mounting bases 57 and 58, and the two wafers 35 can be simultaneously aligned in parallel. Therefore, in the substrate transfer apparatus 10 of the present embodiment, the idle time of the atmospheric transfer robot 14 is halved as compared with the conventional substrate transfer apparatus in which the substrate mounting table has one substrate aligner. As a result, it is possible to shorten the cycle time of the substrate transfer apparatus during continuous processing of the wafer 35, and thus improve the throughput. Further, the substrate aligner 15 is provided with a first buffer 64a and a second buffer 64b above the first substrate mounting table 57 and the second substrate mounting table 58, and aligns four wafers 35 in a vertical arrangement. Can be done at once. Therefore, the throughput of the substrate transfer device can be further improved.
　図１及び図２に戻って、基板搬送モジュール１２の殻体外壁２２のうち、他方の長壁２２ｂに２つのロードロックチャンバ１６，１７が接続されている。以下、２つのロードロックチャンバ１６，１７のうち、真空搬送モジュール１８の一方側に接続されるものを第１ロードロックチャンバ１６、真空搬送モジュール１８の他方側に接続されるものを第２ロードロックチャンバ１７として説明する。
　また、第１、第２のロードロックチャンバ１６，１７は、真空搬送モジュール１８に対して対称の構成である。以下、第２ロードロックチャンバ１７に第１ロードロックチャンバ１６の構成部材と同じ符号を付して、第２ロードロックチャンバ１７の詳しい説明を省略する。 Returning to FIG. 1 and FIG. 2, two load lock chambers 16 and 17 are connected to the other long wall 22b of the shell outer wall 22 of the substrate transfer module 12. Of the two load lock chambers 16 and 17, the one connected to one side of the vacuum transfer module 18 is the first load lock chamber 16, and the one connected to the other side of the vacuum transfer module 18 is the second load lock. The chamber 17 will be described.
Further, the first and second load lock chambers 16 and 17 are symmetrical with respect to the vacuum transfer module 18. Hereinafter, the second load-lock chamber 17 will be denoted by the same reference numerals as the constituent members of the first load-lock chamber 16, and detailed description of the second load-lock chamber 17 will be omitted.
　図８及び図９に示すように、第１ロードロックチャンバ１６は、筐体７１と、第１ゲートバルブ機構（ゲートバルブ機構）７２と、第２ゲートバルブ機構（ゲートバルブ機構）７３と、多段の基板載置部７４と、昇降回動ユニット７５とを備える。
　筐体７１は、平面視多角形状として四角形状を呈しており、第１面７１ａと、第２面７１ｂと、第３面７１ｃと、第４面７１ｄと、を有する。本実施形態においては、筐体７１として平面視四角形を例示するが、筐体７１を他の多角形状とすることも可能である。 As shown in FIGS. 8 and 9, the first load lock chamber 16 includes a housing 71, a first gate valve mechanism (gate valve mechanism) 72, a second gate valve mechanism (gate valve mechanism) 73, and a multistage. The substrate mounting portion 74 and the lifting/lowering rotation unit 75 are provided.
The housing 71 has a quadrangular shape as a polygonal shape in a plan view, and has a first surface 71a, a second surface 71b, a third surface 71c, and a fourth surface 71d. In this embodiment, the case 71 has a quadrangular shape in plan view, but the case 71 may have another polygonal shape.
　第１面７１ａは、基板搬送モジュール１２の殻体外壁２２のうち、他方の長壁２２ｂに接続される面である。第１面７１ａに第１開口部（開口部）７７が形成されている。第２面７１ｂは、第１面７１ａに隣接する面である。第２面７１ｂに第２開口部（開口部）７８が形成されている。このように、隣接する第１面７１ａ及び第２面７１ｂに第１開口部７７及び第２開口部７８がそれぞれ設けられている。第１開口部７７及び第２開口部７８は、４枚のウエハ３５を一度に、第１エンドイフェクタ２８の上下のハンド部材５１，５２及び第２エンドイフェクタ２９の上下のハンド部材５３，５４と受け渡しできるだけの十分な高さを有する。 The first surface 71a is a surface that is connected to the other long wall 22b of the shell outer wall 22 of the substrate transfer module 12. A first opening (opening) 77 is formed on the first surface 71a. The second surface 71b is a surface adjacent to the first surface 71a. A second opening (opening) 78 is formed on the second surface 71b. In this way, the first opening 77 and the second opening 78 are provided in the adjacent first surface 71a and second surface 71b, respectively. The first opening 77 and the second opening 78 allow the upper and lower hand members 51 and 52 of the first end effector 28 and the upper and lower hand members 53 of the second end effector 29 to cover the four wafers 35 at a time. It is high enough to be passed over with 54.
　大気搬送ロボット１４により、ウエハ３５が、基板搬送モジュール１２側から第１開口部７７を介して第１ロードロックチャンバ１６の内部（多段の基板載置部７４）に移載される（矢印Ａ方向）。そして、第１ロードロックチャンバ１６の内部のウエハ３５は、真空搬送モジュール１８における真空搬送ロボット（図示せず）により、第２開口部７８を介して取り出される（矢印Ｂ方向）。真空搬送ロボットは、真空搬送モジュール１８の内部に回転軸８１を軸にして旋回自在に支持されている。ウエハ３５を真空搬送モジュール１８から第１ロードロックチャンバ１６を介して基板搬送モジュール１２に受け渡す際は、矢印Ｃ方向、矢印Ｄ方向の順にウエハ３５が搬送される。 The wafer 35 is transferred from the substrate transfer module 12 side through the first opening 77 into the inside of the first load lock chamber 16 (multi-step substrate mounting part 74) by the atmospheric transfer robot 14 (direction of arrow A). ). Then, the wafer 35 inside the first load lock chamber 16 is taken out through the second opening 78 by the vacuum transfer robot (not shown) in the vacuum transfer module 18 (direction of arrow B). The vacuum transfer robot is rotatably supported inside the vacuum transfer module 18 about a rotary shaft 81. When the wafer 35 is transferred from the vacuum transfer module 18 to the substrate transfer module 12 via the first load lock chamber 16, the wafer 35 is transferred in the order of arrow C direction and arrow D direction.
　ここで、ウエハ３５の搬入方向（矢印Ａ方向）とウエハ３５の搬出方向（矢印Ｂ方向）の交差角θ１が９０°（直角）である。すなわち、ウエハ３５の搬入、搬出の経路はＬ字状となる。これによって、真空搬送モジュール１８を第１ロードロックチャンバ１６に対して接続する際、真空搬送モジュール１８の設置位置が限りなく基板搬送モジュール１２側に近くなる。その結果、基板搬送モジュール１２と真空搬送モジュール１８との間の隙間が小さくなり、デッドスペースが小さくなる。したがって、基板搬送モジュール１２及び真空搬送モジュール１８の全長、奥行き、すなわちフットプリントが小さくなり、その分だけ、クリーン空間を構成する殻体（図示せず）の容積を小さくすることができる。　真空搬送モジュール１８における真空搬送ロボットにより取り出されたウエハ３５は、搬送モジュールチャンバ（真空チャンバ）に受け渡される。搬送モジュールチャンバは、真空搬送モジュール１８における基板搬送モジュール１２と反対側の面に接続される。このとき、真空搬送ロボットを９０°の回動角θ２で回動させるだけで真空搬送ロボットを搬送モジュールチャンバに正対させることができる。ここで、従来の真空搬送ロボットにおいては、交差角θ１は９０°よりも大きく、例えば、１２０～１５０°であった。このときの真空搬送ロボットの回動角θ２は１２０～１５０°となる。すなわち、本実施形態における基板搬送装置１０においては、従来と比較して、真空搬送ロボットの回動角θ２を小さくすることができる。そのため、この回動角度が小さくなる分だけ、真空搬送ロボットの回動開始から回動終了までのサイクルタイムを短縮することができる。これにより、ウエハ３５を真空搬送ロボットにより第２開口部７８から取り出し、搬送モジュールに搬入する工程において、サイクルタイムを短縮することができる。 Here, the intersection angle θ1 between the loading direction (arrow A direction) of the wafer 35 and the loading direction (arrow B direction) of the wafer 35 is 90° (right angle). That is, the path for loading and unloading the wafer 35 is L-shaped. Accordingly, when the vacuum transfer module 18 is connected to the first load lock chamber 16, the installation position of the vacuum transfer module 18 becomes as close as possible to the substrate transfer module 12 side. As a result, the gap between the substrate transfer module 12 and the vacuum transfer module 18 becomes smaller and the dead space becomes smaller. Therefore, the overall length and depth of the substrate transfer module 12 and the vacuum transfer module 18, that is, the footprints are reduced, and the volume of the shell (not shown) forming the clean space can be reduced accordingly. The wafer 35 taken out by the vacuum transfer robot in the vacuum transfer module 18 is transferred to the transfer module chamber (vacuum chamber). The transfer module chamber is connected to the surface of the vacuum transfer module 18 opposite to the substrate transfer module 12. At this time, the vacuum transfer robot can be made to face the transfer module chamber only by rotating the vacuum transfer robot at the rotation angle θ2 of 90°. Here, in the conventional vacuum transfer robot, the crossing angle θ1 is larger than 90°, for example, 120 to 150°. The rotation angle θ2 of the vacuum transfer robot at this time is 120 to 150°. That is, in the substrate transfer apparatus 10 according to the present embodiment, the rotation angle θ2 of the vacuum transfer robot can be made smaller than in the conventional case. Therefore, the cycle time from the rotation start to the rotation end of the vacuum transfer robot can be shortened as much as the rotation angle becomes smaller. As a result, the cycle time can be shortened in the process of taking out the wafer 35 from the second opening 78 by the vacuum transfer robot and loading it into the transfer module.
　第１ロードロックチャンバ１６及び基板搬送モジュール１２間においては、大気搬送ロボット１４の第１エンドイフェクタ２８及び第２エンドイフェクタ２９により４枚のウエハ３５がまとめて、第１開口部７７を介して搬入、搬出される。すなわち、図３に示す第１エンドイフェクタ２８の上ハンド部材５１及び下ハンド部材５２、第２エンドイフェクタ２９の上ハンド部材５３及び下ハンド部材５４に載る４枚のウエハ３５が、まとめて第１開口部７７から第１ロードロックチャンバ１６に搬入される。
　また、第１ロードロックチャンバ１６及び真空搬送モジュール１８間においては、真空搬送ロボットによりウエハ３５が第２開口部７８を介して搬入、搬出される。 Between the first load-lock chamber 16 and the substrate transfer module 12, the four wafers 35 are put together by the first end effector 28 and the second end effector 29 of the atmospheric transfer robot 14 and are passed through the first opening 77. It is carried in and out. That is, the four wafers 35 mounted on the upper hand member 51 and the lower hand member 52 of the first end effector 28 and the upper hand member 53 and the lower hand member 54 of the second end effector 29 shown in FIG. It is carried into the first load lock chamber 16 through the first opening 77.
In addition, between the first load lock chamber 16 and the vacuum transfer module 18, the wafer 35 is loaded and unloaded through the second opening 78 by the vacuum transfer robot.
　図１に示すように、第１ロードロックチャンバ１６及び第２ロードロックチャンバ１７のそれぞれの第２開口部７８は、対向する位置に設けられている。両第２開口部７８は真空搬送モジュール１８に接続される開口である。これにより、第１ロードロックチャンバ１６と第２ロードロックチャンバ１７との間の空間に真空搬送モジュール１８を配置することができる。これにより、真空搬送モジュール１８を基板搬送モジュール１２の殻体外壁２２のうち他方の長壁２２ｂに隣接させるように配置することが可能になる。 As shown in FIG. 1, the respective second openings 78 of the first load lock chamber 16 and the second load lock chamber 17 are provided at opposite positions. Both second openings 78 are openings connected to the vacuum transfer module 18. Accordingly, the vacuum transfer module 18 can be arranged in the space between the first load lock chamber 16 and the second load lock chamber 17. This makes it possible to arrange the vacuum transfer module 18 so as to be adjacent to the other long wall 22b of the shell outer wall 22 of the substrate transfer module 12.
　第１開口部７７は、第１ゲートバルブ機構７２により、開閉自在であり、かつ、気密に封止可能である。第１ゲートバルブ機構７２は、第１ゲートバルブ８４と、第１開閉機構（図示せず）とを備えている。第１ゲートバルブ８４は、第１開口部７７を閉じる閉位置と、第１開口部７７を開放する開位置との間で昇降自在に支持されている。第１ゲートバルブ８４に第１開閉機構が連結されている。第１開閉機構を作動させることにより、第１ゲートバルブ８４が昇降され、第１開口部７７が開閉される。第１開口部７７を第１ゲートバルブ８４により閉じた状態において、第１開口部７７は第１ゲートバルブ８４により気密状態に封止される。 The first opening 77 can be opened and closed by the first gate valve mechanism 72 and can be hermetically sealed. The first gate valve mechanism 72 includes a first gate valve 84 and a first opening/closing mechanism (not shown). The first gate valve 84 is supported so as to be vertically movable between a closed position that closes the first opening 77 and an open position that opens the first opening 77. A first opening/closing mechanism is connected to the first gate valve 84. By operating the first opening/closing mechanism, the first gate valve 84 is moved up and down, and the first opening 77 is opened/closed. When the first opening 77 is closed by the first gate valve 84, the first opening 77 is hermetically sealed by the first gate valve 84.
　第２開口部７８は、第２ゲートバルブ機構７３により、開閉自在であり、かつ、気密に封止可能である。第２ゲートバルブ機構７３は、第１ゲートバルブ機構７２と同様に、第２ゲートバルブ８５と、第２開閉機構８６とを備えている。第２ゲートバルブ８５は、第２開口部７８を閉じる閉位置と、第２開口部７８を開放する開位置との間で移動自在に支持されている。第２ゲートバルブ８５に第２開閉機構８６が連結されている。第２開閉機構８６を作動させることにより、第２ゲートバルブ８５が昇降され、第２開口部７８が開閉される。第２開口部７８を第２ゲートバルブ８５により閉じた状態において、第２開口部７８は第２ゲートバルブ８５により気密状態に封止される。 The second opening 78 can be opened and closed by the second gate valve mechanism 73 and can be hermetically sealed. Like the first gate valve mechanism 72, the second gate valve mechanism 73 includes a second gate valve 85 and a second opening/closing mechanism 86. The second gate valve 85 is movably supported between a closed position that closes the second opening 78 and an open position that opens the second opening 78. A second opening/closing mechanism 86 is connected to the second gate valve 85. By operating the second opening/closing mechanism 86, the second gate valve 85 is moved up and down, and the second opening 78 is opened/closed. When the second opening 78 is closed by the second gate valve 85, the second opening 78 is hermetically sealed by the second gate valve 85.
　筐体７１の内部に多段の基板載置部７４が設けられている。多段の基板載置部７４は、例えば、２５枚のウエハ３５を一度に収納可能な上下方向に少なくとも２５段並ぶ棚を備える。
　ここで、一般に、ＦＯＵＰカセット３２には２５枚のウエハ３５を収納可能である。よって、多段の基板載置部７４はＦＯＵＰカセット３２のウエハ３５を一度に収納することができる。
　本実施形態では、多段の基板載置部７４に２５枚の半導体ウエハ３５を格納する例について説明するが、多段の基板載置部７４に格納する半導体ウエハ３５の枚数は適宜選択可能である。 A multi-stage substrate mounting portion 74 is provided inside the housing 71. The multi-stage substrate mounting portion 74 includes, for example, a shelf that can store 25 wafers 35 at a time and that is arranged in at least 25 stages in the vertical direction.
Here, in general, the FOUP cassette 32 can accommodate 25 wafers 35. Therefore, the multi-stage substrate mounting portion 74 can store the wafers 35 of the FOUP cassette 32 at one time.
In the present embodiment, an example in which 25 semiconductor wafers 35 are stored in the multi-stage substrate placing section 74 will be described, but the number of semiconductor wafers 35 stored in the multi-stage substrate placing section 74 can be appropriately selected.
　多段の基板載置部７４に昇降回動ユニット７５が連結されている。昇降回動ユニット７５は、昇降機構７５ａと、回動機構７５ｂとを備えている。昇降機構７５ａは、多段の基板載置部７４を昇降させる機構である。例えば、大気搬送ロボット１４により、４枚のウエハ３５を、第１開口部７７を介して基板載置部７４の任意の４段に移載させた後、昇降機構７５ａにより基板載置部７４全体を４段分上昇させる。その後、新たな４枚のウエハ３５を基板載置部７４に移載し、順次、この工程を繰り返すことで、基板載置部７４の所望の段全てにウエハ３５が移載、収容される。
　回動機構７５ｂは、多段の基板載置部７４を鉛直軸（すなわち、回動中心軸）８８の回りに回動させる。多段の基板載置部７４は、多段の基板載置部７４の中心位置８９が回動中心軸８８から基板搬送モジュール１２側へＬ２だけオフセットした位置に設けられている。例えば、基板載置部７４の所望の段全てにウエハ３５が移載、収容された後、回動機構７５ｂにより基板載置部７４全体を真空搬送モジュール１８側に向けて９０°回動させる。その後、真空搬送モジュール１８における真空搬送ロボットにより、ウエハ３５が基板載置部７４から取り出される。 An elevating/lowering rotation unit 75 is connected to the multi-stage substrate mounting portion 74. The elevating and rotating unit 75 includes an elevating mechanism 75a and a rotating mechanism 75b. The elevating mechanism 75a is a mechanism for elevating and lowering the multi-stage substrate placing section 74. For example, after the four wafers 35 are transferred by the atmospheric transfer robot 14 to arbitrary four stages of the substrate mounting portion 74 via the first opening 77, the entire substrate mounting portion 74 is moved by the elevating mechanism 75a. Is raised by 4 steps. After that, four new wafers 35 are transferred to the substrate mounting portion 74, and this process is sequentially repeated, so that the wafers 35 are transferred and accommodated in all desired stages of the substrate mounting portion 74.
The rotating mechanism 75b rotates the multi-stage substrate platform 74 around a vertical axis (that is, a center axis of rotation) 88. The multi-stage substrate placing part 74 is provided at a position where the center position 89 of the multi-stage substrate placing part 74 is offset from the rotation center axis 88 toward the substrate transport module 12 side by L2. For example, after the wafer 35 is transferred and housed in all the desired steps of the substrate platform 74, the entire substrate platform 74 is rotated 90° toward the vacuum transfer module 18 side by the rotating mechanism 75b. After that, the wafer 35 is taken out from the substrate platform 74 by the vacuum transfer robot in the vacuum transfer module 18.
　ここで、第１開口部７７を通して多段の基板載置部７４に載置されたウエハ３５は、ウエハ３５の中心が多段の基板載置部７４の中心位置８９に位置する。すなわち、ウエハ３５は、多段の基板載置部７４に載置された状態において、回動機構７５ｂの回動中心軸８８よりも第１開口部７７側にオフセットした位置にある。
　これにより、大気搬送ロボット１４が基板搬送モジュール１２から多段の基板載置部７４にウエハ３５を搬入する際に、大気搬送ロボット１４の搬入出ストローク（伸退ストローク）を短くすることができる。その結果、搬入出ストロークが短くなる分だけ、基板搬送モジュール１２から多段の基板載置部７４にウエハ３５を搬入する際のサイクルタイムを短縮することができる。 Here, in the wafer 35 placed on the multi-stage substrate placing portion 74 through the first opening 77, the center of the wafer 35 is located at the center position 89 of the multi-stage substrate placing portion 74. That is, the wafer 35 is in a position offset from the rotation center shaft 88 of the rotation mechanism 75b toward the first opening 77 side in a state of being placed on the multi-stage substrate placement portion 74.
This makes it possible to shorten the loading/unloading stroke (extension/retraction stroke) of the atmospheric transfer robot 14 when the atmospheric transfer robot 14 loads the wafer 35 from the substrate transfer module 12 to the multi-step substrate platform 74. As a result, the cycle time when the wafer 35 is loaded from the substrate transfer module 12 to the multi-stage substrate platform 74 can be shortened by the amount that the loading/unloading stroke is shortened.
　次に、本実施形態の第１変形例～第３変形例について説明する。
（第１変形例）
　本実施形態の基板搬送装置１０においては、基板アライナ１５をベース部５６に２つの基板載置台５７，５８をまとめて設け、各ウエハ３５のＩＤの読み取りに１つのＩＤ読み取り手段６３を兼用する例について説明したが、これに限らない。
　例えば、本変形例のように、基板アライナとして、既存の単独アライナが左右に２台並べて配置してもよい。本変形例の基板アライナもまた、２つの基板載置台を備えたデュアルアライナであり、２枚のウエハ３５をほぼ同時にアライメントすることが可能である。既存のアライナは、１つのベース部に、１つの基板載置台、１つの切欠き部検出手段、及びＩＤ読み取り手段をそれぞれ設けてなるものである。
　本変形例の基板搬送装置１０によれば、基板アライナに、慣用、既存のアライナをそのまま適用することができるため調達が容易であり、また、２つのウエハ３５のＩＤ読み取りを独立して行うことができるため、本実施形態と比較して更にスループットが高まる。 Next, first to third modifications of the present embodiment will be described.
(First modification)
In the substrate transfer apparatus 10 of the present embodiment, the substrate aligner 15 is provided on the base portion 56 with the two substrate mounting bases 57 and 58 collectively, and one ID reading means 63 is also used for reading the ID of each wafer 35. However, the present invention is not limited to this.
For example, as in the present modification, two existing single aligners may be arranged side by side as the substrate aligner. The substrate aligner of this modification is also a dual aligner having two substrate mounting tables, and it is possible to align two wafers 35 almost at the same time. The existing aligner is provided with one substrate mounting table, one notch detecting means, and an ID reading means on one base.
According to the substrate transfer apparatus 10 of the present modified example, a conventional or existing aligner can be applied to the substrate aligner as it is, so that the substrate aligner can be easily procured and the IDs of the two wafers 35 can be read independently. Therefore, the throughput is further increased as compared with the present embodiment.
（第２変形例）
　本変形例の基板搬送装置１０においては、多段の基板載置部７４の中心位置８９を、回動機構７５ｂの回動中心軸８８から基板搬送モジュール１２側へＬ２だけオフセットした位置に配置する例について説明したが、これに限らない。
　例えば、第２変形例のように、回動機構７５ｂの回動中心軸８８と、多段の基板載置部７４の中心位置８９とを同軸に設けることも可能である。これにより、回動機構７５ｂと多段の基板載置部７４との軸心が一致するため、多段の基板載置部７４が回動機構７５ｂにより安定した状態で回転する。 (Second modified example)
In the substrate transfer apparatus 10 of the present modification, an example in which the center position 89 of the multi-step substrate platform 74 is arranged at a position offset by L2 from the rotation center axis 88 of the rotating mechanism 75b toward the substrate transfer module 12 side. However, the present invention is not limited to this.
For example, as in the second modified example, the rotation center shaft 88 of the rotation mechanism 75b and the center position 89 of the multi-stage substrate mounting portion 74 can be provided coaxially. As a result, the rotating mechanism 75b and the multi-stage substrate placing portion 74 have the same axial center, so that the multi-step substrate placing portion 74 rotates in a stable state by the rotating mechanism 75b.
（第３変形例）
　本変形例の基板搬送装置１０においては、図４～図６Ｂに示すように、基板アライナ１５が２つの基板仮置き部６４を備えている。 (Third modification)
In the substrate transfer apparatus 10 of the present modified example, as shown in FIGS. 4 to 6B, the substrate aligner 15 includes two temporary substrate placing portions 64.
　本変形例の基板アライナ１５は、ベース部５６の上部に基板仮置き部６４が設けられている。基板仮置き部６４は、第１基板載置台５７及び第２基板載置台５８の上方に配置されている。具体的には、基板仮置き部６４は、第１基板載置台５７の上方に配置された第１バッファ６４ａと、第２基板載置台５８の上方に配置された第２バッファ６４ｂとを備えている。
　第１バッファ６４ａは、円環状のフレーム部材であり、第１エンドイフェクタ２８のうち上ハンド部材５１（図３参照）のウエハ３５を落とし込み、掬い上げ可能である。円環状のフレーム部材は、一部のみに切り込みがある連続フレーム部材、又は複数の不連続なフレーム部材の集合体のいずれであってもよい。第２バッファ６４ｂは、第１バッファ６４ａと同様に構成される。 In the substrate aligner 15 of this modification, the temporary substrate placing portion 64 is provided on the upper portion of the base portion 56. The temporary substrate rest part 64 is arranged above the first substrate rest 57 and the second substrate rest 58. Specifically, the substrate temporary placing unit 64 includes a first buffer 64a arranged above the first substrate mounting table 57 and a second buffer 64b arranged above the second substrate mounting table 58. There is.
The first buffer 64a is an annular frame member and is capable of dropping and picking up the wafer 35 of the upper hand member 51 (see FIG. 3) of the first end effector 28. The annular frame member may be either a continuous frame member having only a part of the notch or an assembly of a plurality of discontinuous frame members. The second buffer 64b has the same configuration as the first buffer 64a.
　以下、第１エンドイフェクタ２８の下ハンド部材５２に載置されるウエハ３５を「ウエハ３５Ａ」、第１エンドイフェクタ２８の上ハンド部材５１に載置されるウエハ３５を「ウエハ３５Ｃ」とする。また、第２エンドイフェクタ２９の下ハンド部材５４に載置されるウエハ３５を「ウエハ３５Ｂ」、第２エンドイフェクタ２９の上ハンド部材５３に載置されるウエハ３５を「ウエハ３５Ｄ」として説明する。
　ロボット基部２５に対して各アームユニット２６，２７を回動させ、基板アライナ１５に各アームユニット２６，２７を正対させる。その後、大気搬送ロボット１４を駆動させ、各アームユニット２６，２７を基板アライナ１５に向かって伸長させる。図３及び図６Ａに示すように、アームユニット２６における第１エンドイフェクタ２８の下ハンド部材５２に載置されるウエハ３５Ａが第１基板載置台５７に移載され、第１エンドイフェクタ２８の上ハンド部材５１のウエハ３５Ｃが第１バッファ６４ａ（図５参照）に移載される。アームユニット２６による移載と同じ（又はわずかに時間差のあるほぼ同じ）タイミングで、図３及び図６Ｂに示すように、アームユニット２７における第２エンドイフェクタ２９の下ハンド部材５４に載置されるウエハ３５Ｂが第２基板載置台５８に移載され、第２エンドイフェクタ２９の上ハンド部材５３のウエハ３５Ｄが第２バッファ６４ｂ（図５参照）に移載される。 Hereinafter, the wafer 35 mounted on the lower hand member 52 of the first end effector 28 will be referred to as “wafer 35A”, and the wafer 35 mounted on the upper hand member 51 of the first end effector 28 will be referred to as “wafer 35C”. To do. Further, the wafer 35 mounted on the lower hand member 54 of the second end effector 29 is referred to as a “wafer 35B”, and the wafer 35 mounted on the upper hand member 53 of the second end effector 29 is referred to as a “wafer 35D”. explain.
The arm units 26 and 27 are rotated with respect to the robot base 25, and the arm units 26 and 27 are made to face the substrate aligner 15. After that, the atmospheric transfer robot 14 is driven to extend the arm units 26 and 27 toward the substrate aligner 15. As shown in FIGS. 3 and 6A, the wafer 35A mounted on the lower hand member 52 of the first end effector 28 in the arm unit 26 is transferred to the first substrate mounting table 57, and the first end effector 28 is transferred. The wafer 35C of the upper hand member 51 is transferred to the first buffer 64a (see FIG. 5). As shown in FIGS. 3 and 6B, the second end effector 29 in the arm unit 27 is placed on the lower hand member 54 at the same timing as the transfer by the arm unit 26 (or almost the same with a slight time difference). The wafer 35B is transferred to the second substrate mounting table 58, and the wafer 35D of the upper hand member 53 of the second end effector 29 is transferred to the second buffer 64b (see FIG. 5).
　基板アライナ１５を駆動させ、第１基板載置台５７及び第２基板載置台５８を回転させることにより、第１基板載置台５７に載るウエハ３５Ａと、第２基板載置台５８に載るウエハ３５Ｂが回転される。このウエハ３５Ａ及びウエハ３Ｂの回転により、第１切欠き部検出手段６１及び第２切欠き部検出手段６２が、各ウエハ３５Ａ，３５Ｂの切欠き部を検出する。そして、その検出情報を基に第１基板載置台５７及び第２基板載置台５８の回転が制御され、切欠き部が所定の位置にくるようにウエハ３５Ａ，３５Ｂのアライメントが調整される。また、このウエハ３５Ａ，３５Ｂの回転の際、ＩＤ読み取り手段６３が、各ウエハ３５Ａ，３５ＢのＩＤを読み取り、各ウエハ３５Ａ，３５Ｂの処理情報・履歴などが検出される。
　その後、大気搬送ロボット１４を再び駆動させ、各アームユニット２６，２７を基板アライナ１５に向かって伸長させる。アライメントが行われ、ＩＤが読み取られたウエハ３５Ａが、第１基板載置台５７から第１エンドイフェクタ２８の下ハンド部材５２に移載され、ウエハ３５Ｃが第１バッファ６４ａから第１エンドイフェクタ２８の上ハンド部材５１に移載される。ウエハ３５Ａ，３５Ｃの移載と同じタイミングで、アライメントが行われ、ＩＤが読み取られたウエハ３５Ｂが、第２基板載置台５８から第２エンドイフェクタ２９の下ハンド部材５４に移載され、ウエハ３５Ｄが第２バッファ６４ｂから第２エンドイフェクタ２９の上ハンド部材５３に移載される。 By driving the substrate aligner 15 and rotating the first substrate mounting table 57 and the second substrate mounting table 58, the wafer 35A mounted on the first substrate mounting table 57 and the wafer 35B mounted on the second substrate mounting table 58 rotate. To be done. By the rotation of the wafer 35A and the wafer 3B, the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the notch portions of the wafers 35A and 35B. Then, based on the detected information, the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled, and the alignment of the wafers 35A and 35B is adjusted so that the cutout portion is located at a predetermined position. When the wafers 35A and 35B are rotated, the ID reading means 63 reads the IDs of the wafers 35A and 35B, and the processing information and history of the wafers 35A and 35B are detected.
After that, the atmospheric transfer robot 14 is driven again to extend the arm units 26 and 27 toward the substrate aligner 15. The wafer 35A whose alignment has been performed and whose ID has been read is transferred from the first substrate mounting table 57 to the lower hand member 52 of the first end effector 28, and the wafer 35C is transferred from the first buffer 64a to the first end effector. 28 is transferred to the upper hand member 51. At the same timing as the transfer of the wafers 35A and 35C, the wafer 35B whose alignment has been performed and whose ID has been read is transferred from the second substrate mounting table 58 to the lower hand member 54 of the second end effector 29, 35D is transferred from the second buffer 64b to the upper hand member 53 of the second end effector 29.
　その後、大気搬送ロボット１４の昇降機構（図示せず）を駆動させ、一対のアームユニット２６，２７を下降させるとともに、各アームユニット２６，２７を基板アライナ１５に向かって再び伸長させる。図３及び図７Ａに示すように、ウエハ３５Ｃが第１エンドイフェクタ２８の上ハンド部材５１から第１基板載置台５７に移載される。ウエハ３５Ｃの移載と同じタイミングで、ウエハ３５Ｄが第２エンドイフェクタ２９の上ハンド部材５３から第２基板載置台５８に移載される。 After that, the elevating mechanism (not shown) of the atmospheric transfer robot 14 is driven to lower the pair of arm units 26 and 27, and at the same time, the arm units 26 and 27 are extended again toward the substrate aligner 15. As shown in FIGS. 3 and 7A, the wafer 35C is transferred from the upper hand member 51 of the first end effector 28 to the first substrate mounting table 57. The wafer 35D is transferred from the upper hand member 53 of the second end effector 29 to the second substrate mounting table 58 at the same timing as the transfer of the wafer 35C.
　基板アライナ１５を再び駆動させ、第１基板載置台５７及び第２基板載置台５８を回転させることにより、第１基板載置台５７に載るウエハ３５Ｃと、第２基板載置台５８に載るウエハ３５Ｄが回転される。このウエハ３５Ｃ及びウエハ３５Ｄの回転により、第１切欠き部検出手段６１及び第２切欠き部検出手段６２が、各ウエハ３５Ｃ，３５Ｄの切欠き部を検出する。そして、その検出情報を基に第１基板載置台５７及び第２基板載置台５８の回転が制御され、切欠き部が所定の位置にくるようにウエハ３５Ｃ，３５Ｄのアライメントが調整される。また、このウエハ３５Ｃ，３５Ｄの回転の際、ＩＤ読み取り手段６３が、各ウエハ３５Ｃ，３５ＤのＩＤを読み取り、各ウエハ３５Ｃ，３５Ｄの処理情報・履歴などが検出される。 By driving the substrate aligner 15 again and rotating the first substrate mounting table 57 and the second substrate mounting table 58, the wafer 35C mounted on the first substrate mounting table 57 and the wafer 35D mounted on the second substrate mounting table 58 are separated. Is rotated. By the rotation of the wafers 35C and 35D, the first notch portion detecting means 61 and the second notch portion detecting means 62 detect the notch portions of the wafers 35C and 35D. Then, based on the detection information, the rotations of the first substrate mounting table 57 and the second substrate mounting table 58 are controlled, and the alignment of the wafers 35C and 35D is adjusted so that the cutout portion is located at a predetermined position. When the wafers 35C and 35D are rotated, the ID reading means 63 reads the IDs of the wafers 35C and 35D, and the processing information and history of the wafers 35C and 35D are detected.
　その後、各アームユニット２６，２７を基板アライナ１５に向かって再び伸長させる。図３及び図７Ｂに示すように、アライメントが行われ、ＩＤが読み取られたウエハ３５Ｃが、第１基板載置台５７から第１エンドイフェクタ２８の上ハンド部材５１に移載される。ウエハ３５Ｃの移載と同じタイミングで、アライメントが行われ、ＩＤが読み取られたウエハ３５Ｄが、第２基板載置台５８から第２エンドイフェクタ２９の上ハンド部材５３に移載される。
　これにより、第１エンドイフェクタ２８の上ハンド部材５１及び下ハンド部材５２に、アライメントが行われ、ＩＤが読み取られた各ウエハ３５Ｃ，３５Ａがそれぞれ載せられる。また、第２エンドイフェクタ２９の上ハンド部材５３及び下ハンド部材５４に、向きの位置合わせが行われ、ＩＤが読み取られた各ウエハ３５Ｄ，３５Ｂがそれぞれ載せられる。すなわち、各ハンド部材に載置される全てのウエハ３５Ａ～３５Ｄのアライメントが完了する。
　その後は本実施形態と同様に、第１エンドイフェクタ２８の上下のハンド部材５１，５２、第２エンドイフェクタ２９の上下のハンド部材５３，５４に載せられたウエハ３５Ｂ，３５Ａ，３５Ｄ，３５Ｃは、４枚まとめて第１ロードロックチャンバ１６（又は第２ロードロックチャンバ１７）に搬入される。 After that, each arm unit 26, 27 is extended again toward the substrate aligner 15. As shown in FIGS. 3 and 7B, the wafer 35C for which the alignment has been performed and the ID has been read is transferred from the first substrate mounting table 57 to the upper hand member 51 of the first end effector 28. At the same timing as the transfer of the wafer 35C, the alignment is performed and the ID-read wafer 35D is transferred from the second substrate mounting table 58 to the upper hand member 53 of the second end effector 29.
As a result, the wafers 35C and 35A whose alignment has been performed and whose ID has been read are placed on the upper hand member 51 and the lower hand member 52 of the first end effector 28, respectively. Further, the wafers 35D and 35B from which the IDs have been read are placed on the upper hand member 53 and the lower hand member 54 of the second end effector 29, respectively, in which the orientation is aligned. That is, the alignment of all the wafers 35A to 35D placed on each hand member is completed.
After that, similarly to the present embodiment, the wafers 35B, 35A, 35D and 35C mounted on the upper and lower hand members 51 and 52 of the first end effector 28 and the upper and lower hand members 53 and 54 of the second end effector 29. Are collectively loaded into the first load lock chamber 16 (or the second load lock chamber 17).
　以上、図面を参照して、本発明の実施形態を詳述してきたが、具体的な構成は、この実施形態に限らず、本発明の要旨を逸脱しない程度の設計的変更は、本発明に含まれる。
　例えば、本実施形態の基板搬送装置１０では、基板アライナ１５に２つの基板載置台５７，５８を備えた例について説明したが、その他の例として、基板載置台を３つ以上備えることも可能である。
　また、第１変形例では、基板アライナ１５として、既存のアライナを２台並べて構成する例について説明したが、既存のアライナを３つ以上備えることも可能である。 The embodiment of the present invention has been described in detail above with reference to the drawings. However, the specific configuration is not limited to this embodiment, and any design change that does not depart from the gist of the present invention can be applied to the present invention. included.
For example, in the substrate transfer apparatus 10 of the present embodiment, the example in which the substrate aligner 15 is provided with the two substrate mounting bases 57 and 58 has been described, but as another example, it is also possible to provide three or more substrate mounting bases. is there.
Further, in the first modification, an example in which two existing aligners are arranged as the substrate aligner 15 has been described, but it is also possible to provide three or more existing aligners.

Claims (7)

  1. 　基板搬送モジュールと、該基板搬送モジュールの内部に設けられる大気搬送ロボットとを備える基板搬送装置において、
    　前記大気搬送ロボットは前記基板搬送モジュールに対して走行自在なロボット基部を有し、
    　前記基板搬送装置は、該ロボット基部の上部に設けられ、基板の向きの位置合わせを行う少なくとも２つの基板載置台を有する基板アライナを更に備えることを特徴とする基板搬送装置。     In a substrate transfer device comprising a substrate transfer module and an atmospheric transfer robot provided inside the substrate transfer module,
    The atmosphere transfer robot has a robot base that can travel with respect to the substrate transfer module,
    The substrate transfer apparatus further comprises a substrate aligner which is provided on an upper portion of the robot base and has at least two substrate mounting tables for aligning the orientations of the substrates.
  2. 　前記大気搬送ロボットは、
    　前記ロボット基部に対して回転自在に支持され、伸長・屈曲可能な一対のアームユニットと、
    　一対の前記アームユニットの先端にそれぞれ設けられ、前記基板を載置可能な載置部を上下二段に有するエンドイフェクタとを備えることを特徴とする、請求項１に記載の基板搬送装置。     The atmosphere transfer robot,
    A pair of arm units that are rotatably supported with respect to the robot base and that can be extended and bent,
    2. The substrate transfer apparatus according to claim 1, further comprising: end effectors, which are respectively provided at the tips of the pair of arm units and have mounting portions on which the substrate can be mounted in two upper and lower stages.
  3. 　前記基板アライナは、
    　それぞれの前記基板載置台の上方に基板仮置き部を備えることを特徴とする、請求項２に記載の基板搬送装置。     The substrate aligner is
    The substrate transfer apparatus according to claim 2, further comprising a temporary substrate placing section above each of the substrate mounting tables.
  4. 　前記基板アライナは、
    　基板の向きの位置合わせを行う少なくとも２つの基板載置台と、
    　それらの基板載置台が設けられる１つのベース部と、を有することを特徴とする、請求項３に記載の基板搬送装置。     The substrate aligner is
    At least two substrate mounts for aligning the orientations of the substrates;
    The substrate transfer apparatus according to claim 3, further comprising: one base portion provided with the substrate mounting table.
  5. 　前記基板アライナは、少なくとも２台で構成され、
    　それぞれの前記基板アライナは、
    　基板の向きの位置合わせを行う基板載置台と、
    　該基板載置台が設けられるベース部と、を有することを特徴とする、請求項３に記載の基板搬送装置。     The substrate aligner includes at least two units,
    Each of the substrate aligners is
    A board mounting table that aligns the orientation of the board,
    The substrate transfer apparatus according to claim 3, further comprising a base portion on which the substrate mounting table is provided.
  6. 　前記基板搬送モジュールに接続される平面視多角形状のロードロックチャンバをさらに備え、
    　前記ロードロックチャンバは、前記基板搬送モジュールに接続される面及び該接続される面に隣接する面に、それぞれ前記基板が搬入出される開口部を有することを特徴とする、請求項１から５のいずれか一項に記載の基板搬送装置。     Further comprising a load lock chamber having a polygonal shape in plan view connected to the substrate transfer module,
    6. The load lock chamber according to claim 1, wherein the load lock chamber has openings for loading and unloading the substrate on a surface connected to the substrate transfer module and a surface adjacent to the connected surface, respectively. The substrate transfer apparatus according to any one of claims.
  7. 　前記基板搬送モジュールに、２つの前記ロードロックチャンバが接続され、
    　２つの前記ロードロックチャンバは、前記隣接する面同士が対向するように設けられ、対向する隣接面それぞれに前記開口部が設けられることを特徴とする、請求項６に記載の基板搬送装置。     Two load lock chambers are connected to the substrate transfer module,
    7. The substrate transfer apparatus according to claim 6, wherein the two load lock chambers are provided so that the adjacent surfaces are opposed to each other, and the opening is provided on each of the opposed adjacent surfaces.
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