KR100796884B1 - 적층형 반도체 장치의 제조 방법 및 적층형 전자 부품의제조 방법 - Google Patents

적층형 반도체 장치의 제조 방법 및 적층형 전자 부품의제조 방법 Download PDF

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KR100796884B1
KR100796884B1 KR1020060027518A KR20060027518A KR100796884B1 KR 100796884 B1 KR100796884 B1 KR 100796884B1 KR 1020060027518 A KR1020060027518 A KR 1020060027518A KR 20060027518 A KR20060027518 A KR 20060027518A KR 100796884 B1 KR100796884 B1 KR 100796884B1
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semiconductor element
adhesive layer
electronic component
semiconductor
film
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Korean (ko)
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KR20060104912A (ko
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아쯔시 요시무라
다다노부 오오꾸보
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가부시끼가이샤 도시바
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Priority claimed from JP2005092596A external-priority patent/JP4594777B2/ja
Priority claimed from JP2005092595A external-priority patent/JP4612450B2/ja
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
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    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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KR102658356B1 (ko) * 2018-01-25 2024-04-18 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 본딩 기계용 본딩 툴, 반도체 요소를 본딩하기 위한 본딩 기계, 및 관련 방법
JP7042713B2 (ja) 2018-07-12 2022-03-28 キオクシア株式会社 半導体装置
JP2023121355A (ja) * 2022-02-21 2023-08-31 キオクシア株式会社 半導体装置および半導体装置の製造方法

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