KR100787887B1 - 포지티브 감광성 조성물 - Google Patents
포지티브 감광성 조성물 Download PDFInfo
- Publication number
- KR100787887B1 KR100787887B1 KR1020010041877A KR20010041877A KR100787887B1 KR 100787887 B1 KR100787887 B1 KR 100787887B1 KR 1020010041877 A KR1020010041877 A KR 1020010041877A KR 20010041877 A KR20010041877 A KR 20010041877A KR 100787887 B1 KR100787887 B1 KR 100787887B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- acid
- substituted
- fluorine atoms
- compound
- Prior art date
Links
- 0 Cc(c(*)c(*)c(*)c1*)c1S(C(C1O*)=C(*)C(*)=C(*=C)C1=*)c1c(*)c(O*)c(*)c(*)c1* Chemical compound Cc(c(*)c(*)c(*)c1*)c1S(C(C1O*)=C(*)C(*)=C(*=C)C1=*)c1c(*)c(O*)c(*)c(*)c1* 0.000 description 9
- AISMXTSBROTYAV-UHFFFAOYSA-N CCC(C)(C)C(OC(C(C(C)(C)O1)O)C1=O)=O Chemical compound CCC(C)(C)C(OC(C(C(C)(C)O1)O)C1=O)=O AISMXTSBROTYAV-UHFFFAOYSA-N 0.000 description 1
- RHOSMMDYFHXHHY-UHFFFAOYSA-N CCC(C)(C)C(OC(C)(C)C(C1)COC1=O)=O Chemical compound CCC(C)(C)C(OC(C)(C)C(C1)COC1=O)=O RHOSMMDYFHXHHY-UHFFFAOYSA-N 0.000 description 1
- VBUKDTZUQWRLKK-UHFFFAOYSA-N CCC(C)(C)C(OC(C)(CCO1)C1=O)=O Chemical compound CCC(C)(C)C(OC(C)(CCO1)C1=O)=O VBUKDTZUQWRLKK-UHFFFAOYSA-N 0.000 description 1
- GYKLPJKVFYFGKT-UHFFFAOYSA-N CCC(C)C(OC(C(C)(C)CO1)C1=O)=O Chemical compound CCC(C)C(OC(C(C)(C)CO1)C1=O)=O GYKLPJKVFYFGKT-UHFFFAOYSA-N 0.000 description 1
- UKMBWYAEVPPBPB-UHFFFAOYSA-N C[S](c(cc1)ccc1OS=O)(O)(=O)=O Chemical compound C[S](c(cc1)ccc1OS=O)(O)(=O)=O UKMBWYAEVPPBPB-UHFFFAOYSA-N 0.000 description 1
- RAHPHBZJFQVXPV-UHFFFAOYSA-N C[S](c1ccc(C(F)(F)F)cc1[N+]([O-])=O)(O)(=O)=O Chemical compound C[S](c1ccc(C(F)(F)F)cc1[N+]([O-])=O)(O)(=O)=O RAHPHBZJFQVXPV-UHFFFAOYSA-N 0.000 description 1
- YPFUCUBUEIHMQS-UHFFFAOYSA-N c(cc1)ccc1S1c(cccc2)c2Sc2c1cccc2 Chemical compound c(cc1)ccc1S1c(cccc2)c2Sc2c1cccc2 YPFUCUBUEIHMQS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2000-00212946 | 2000-07-13 | ||
JP2000212946A JP4150491B2 (ja) | 2000-07-13 | 2000-07-13 | ポジ型感光性組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020006602A KR20020006602A (ko) | 2002-01-23 |
KR100787887B1 true KR100787887B1 (ko) | 2007-12-27 |
Family
ID=18708780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010041877A KR100787887B1 (ko) | 2000-07-13 | 2001-07-12 | 포지티브 감광성 조성물 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4150491B2 (de) |
KR (1) | KR100787887B1 (de) |
TW (1) | TWI288858B (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7521168B2 (en) * | 2002-02-13 | 2009-04-21 | Fujifilm Corporation | Resist composition for electron beam, EUV or X-ray |
JP4639062B2 (ja) | 2003-11-21 | 2011-02-23 | 富士フイルム株式会社 | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
JP4300131B2 (ja) * | 2004-02-16 | 2009-07-22 | 富士フイルム株式会社 | 液浸プロセス用化学増幅型レジスト組成物及びそれを用いたパターン形成方法 |
JP7406983B2 (ja) * | 2019-12-26 | 2023-12-28 | 住友化学株式会社 | 組成物および表示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06194842A (ja) * | 1992-09-14 | 1994-07-15 | Wako Pure Chem Ind Ltd | 微細パターン形成材料及びパターン形成方法 |
EP0789279A1 (de) * | 1996-02-09 | 1997-08-13 | Wako Pure Chemical Industries Ltd | Polymer und Resistmaterial |
KR20000015770A (ko) * | 1998-08-18 | 2000-03-15 | 윤종용 | 백본이 환상 구조를 가지는 감광성 폴리머 및 이를 포함하는 레지스트 조성물 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69027799T2 (de) * | 1989-03-14 | 1997-01-23 | Ibm | Chemisch amplifizierter Photolack |
JPH07140666A (ja) * | 1993-06-04 | 1995-06-02 | Internatl Business Mach Corp <Ibm> | マイクロリトグラフィックレジスト組成物、酸不安定化合物、マイクロリトグラフィックレリーフ画像形成方法及び酸感知性ポリマー組成物 |
US6037107A (en) * | 1997-08-28 | 2000-03-14 | Shipley Company, L.L.C. | Photoresist compositions |
US6037097A (en) * | 1998-01-27 | 2000-03-14 | International Business Machines Corporation | E-beam application to mask making using new improved KRS resist system |
JP3989087B2 (ja) * | 1998-05-25 | 2007-10-10 | 住友ベークライト株式会社 | フォトレジスト用被膜形成材料、フォトレジスト組成物及びパターン形成方法 |
JP2000047387A (ja) * | 1998-07-28 | 2000-02-18 | Fuji Photo Film Co Ltd | 遠紫外線露光用ポジ型フォトレジスト組成物 |
US7704668B1 (en) * | 1998-08-04 | 2010-04-27 | Rohm And Haas Electronic Materials Llc | Photoresist compositions and methods and articles of manufacture comprising same |
JP3876571B2 (ja) * | 1998-08-26 | 2007-01-31 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物 |
US6569971B2 (en) * | 1998-08-27 | 2003-05-27 | Hyundai Electronics Industries Co., Ltd. | Polymers for photoresist and photoresist compositions using the same |
JP3640290B2 (ja) * | 1998-10-02 | 2005-04-20 | 東京応化工業株式会社 | ポジ型ホトレジスト塗布液及びそれを用いた表示素子用基材 |
JP4007570B2 (ja) * | 1998-10-16 | 2007-11-14 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
JP4410326B2 (ja) * | 1998-10-29 | 2010-02-03 | 信越化学工業株式会社 | 化学増幅ポジ型レジスト材料及びパターン形成方法 |
-
2000
- 2000-07-13 JP JP2000212946A patent/JP4150491B2/ja not_active Expired - Fee Related
-
2001
- 2001-06-20 TW TW090114950A patent/TWI288858B/zh not_active IP Right Cessation
- 2001-07-12 KR KR1020010041877A patent/KR100787887B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06194842A (ja) * | 1992-09-14 | 1994-07-15 | Wako Pure Chem Ind Ltd | 微細パターン形成材料及びパターン形成方法 |
EP0789279A1 (de) * | 1996-02-09 | 1997-08-13 | Wako Pure Chemical Industries Ltd | Polymer und Resistmaterial |
KR20000015770A (ko) * | 1998-08-18 | 2000-03-15 | 윤종용 | 백본이 환상 구조를 가지는 감광성 폴리머 및 이를 포함하는 레지스트 조성물 |
Also Published As
Publication number | Publication date |
---|---|
JP4150491B2 (ja) | 2008-09-17 |
JP2002023353A (ja) | 2002-01-23 |
KR20020006602A (ko) | 2002-01-23 |
TWI288858B (en) | 2007-10-21 |
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