KR100762544B1 - 전자부품 테이프-포장용 커버 테이프 - Google Patents
전자부품 테이프-포장용 커버 테이프 Download PDFInfo
- Publication number
- KR100762544B1 KR100762544B1 KR1020057019841A KR20057019841A KR100762544B1 KR 100762544 B1 KR100762544 B1 KR 100762544B1 KR 1020057019841 A KR1020057019841 A KR 1020057019841A KR 20057019841 A KR20057019841 A KR 20057019841A KR 100762544 B1 KR100762544 B1 KR 100762544B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat
- tape
- layer
- adhesive layer
- cover tape
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2813—Heat or solvent activated or sealable
- Y10T428/2817—Heat sealable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packages (AREA)
- Laminated Bodies (AREA)
- Packaging Frangible Articles (AREA)
- Wrappers (AREA)
Abstract
Description
Claims (5)
- 전자부품을 수용하는 캐리어 테이프를 열밀봉하는 전자부품의 테이프 포장용 커버 테이프로,기재필름층;유연재층; 및열접착층을 포함하고,상기 유연재층은 메탈로센 선형 저밀도 폴리에틸렌으로 형성되고, 상기 메탈로센 선형 저밀도 폴리에틸렌은 0.888 ~ 0.907의 범위의 비중을 가지고, 그리고 JIS K7196에 의한 TMA법으로 측정된 상기 메탈로센 선형 저밀도 폴리에틸렌의 연화온도는 75℃ ~ 97℃의 범위인 전자부품의 테이프 포장용 커버 테이프.
- 제1항에 있어서, 상기 메탈로센 선형 저밀도 폴리에틸렌이 0.892 ~ 0.907 범위의 비중을 갖는 전자부품의 테이프 포장용 커버 테이프.
- 삭제
- 삭제
- 제1항 또는 제2항에 있어서,상기 열접착층이 캐리어 테이프를 열밀봉하는 경우, 캐리어 테이프로부터 전자부품의 테이프 포장용 커버 테이프의 박리작업시에 열밀봉 영역에서 상기 열접착층과 상기 유연재층은 서로 분리되고,상기 열접착층으로부터 상기 유연재층이 분리될 때의 박리 강도는 0.1 N/1mm 폭 ~ 1.3N/1mm 폭이고, 그리고상기 열접착층으로부터 상기 유연재층이 분리될 때의 박리 강도의 최대값과 최소값의 차이는 O.3 N/1mm폭 이하인 전자부품의 테이프 포장용 커버 테이프.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003119929 | 2003-04-24 | ||
JPJP-P-2003-00119929 | 2003-04-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060007387A KR20060007387A (ko) | 2006-01-24 |
KR100762544B1 true KR100762544B1 (ko) | 2007-10-01 |
Family
ID=33308117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057019841A KR100762544B1 (ko) | 2003-04-24 | 2004-04-26 | 전자부품 테이프-포장용 커버 테이프 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060199005A1 (ko) |
JP (1) | JP4500769B2 (ko) |
KR (1) | KR100762544B1 (ko) |
CN (1) | CN1777547B (ko) |
TW (1) | TW200426030A (ko) |
WO (1) | WO2004094258A1 (ko) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4598598B2 (ja) * | 2005-05-26 | 2010-12-15 | 大日本印刷株式会社 | カバーテープおよびその製造方法 |
JP5259229B2 (ja) * | 2008-04-02 | 2013-08-07 | 電気化学工業株式会社 | テープ状積層フィルムの巻き取り方法およびテープ状積層フィルムの巻き取り物 |
KR100966985B1 (ko) * | 2008-08-12 | 2010-06-30 | 스미토모 베이클리트 컴퍼니 리미티드 | 전자 부품 포장용 커버 테이프 및 전자 부품 포장체 |
WO2010055804A1 (ja) * | 2008-11-12 | 2010-05-20 | 電気化学工業株式会社 | カバーテープ |
WO2010104010A1 (ja) * | 2009-03-13 | 2010-09-16 | 電気化学工業株式会社 | カバーフィルム |
JP5463193B2 (ja) * | 2010-04-22 | 2014-04-09 | 電気化学工業株式会社 | カバーテープ |
JP2012012033A (ja) * | 2010-06-29 | 2012-01-19 | Asahi Kasei Chemicals Corp | カバーテープ |
JP5752143B2 (ja) * | 2010-10-13 | 2015-07-22 | 電気化学工業株式会社 | カバーフィルム |
JP5602067B2 (ja) * | 2011-03-09 | 2014-10-08 | 三井・デュポンポリケミカル株式会社 | シーラント材、カバーテープ、及び電子部品搬送用包装体 |
KR101935978B1 (ko) * | 2011-06-08 | 2019-01-07 | 덴카 주식회사 | 커버 필름 |
KR101879879B1 (ko) * | 2011-11-30 | 2018-07-18 | 닛토덴코 가부시키가이샤 | 점착 테이프, 캐리어 테이프 접속용 필름, 캐리어 테이프의 접속 방법 및 접속 캐리어 테이프 |
WO2013095522A1 (en) * | 2011-12-22 | 2013-06-27 | Intel Corporation | Electrostatic discharge compatible dicing tape with laser scribe capability |
CN103466195A (zh) * | 2013-03-19 | 2013-12-25 | 上海吉景包装制品有限公司 | 一种防静电上盖带 |
CN103204309A (zh) * | 2013-03-26 | 2013-07-17 | 上海吉景包装制品有限公司 | 一种可撕性盖带 |
CN103600553B (zh) * | 2013-11-19 | 2015-12-30 | 江西若邦科技股份有限公司 | 一种smd热封型上盖带 |
US20170051185A1 (en) * | 2014-02-20 | 2017-02-23 | 3M Innovative Properties Company | Multi-layer cover tape constructions with graphite coatings |
JP2015166253A (ja) * | 2014-03-04 | 2015-09-24 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ及び電子部品包装体 |
JP6383165B2 (ja) * | 2014-03-28 | 2018-08-29 | 五洋紙工株式会社 | ポリオレフィン系樹脂積層フィルム |
JP6011750B1 (ja) * | 2015-03-10 | 2016-10-19 | 住友ベークライト株式会社 | 電子部品包装用カバーテープおよび電子部品用包装体 |
JP6597011B2 (ja) * | 2015-07-17 | 2019-10-30 | 大日本印刷株式会社 | 太陽電池モジュール用の封止材一体型裏面保護シート及びそれを用いてなる太陽電池モジュール |
TWI580578B (zh) * | 2016-07-06 | 2017-05-01 | 俊馳材料科技股份有限公司 | 覆蓋帶與其製程方法 |
JP7261537B2 (ja) * | 2016-12-02 | 2023-04-20 | 大日本印刷株式会社 | 透明導電性カバーテープ |
DE102018000407A1 (de) * | 2018-01-19 | 2019-07-25 | MChef GmbH & Co.KG | Geschirreinheit und Verfahren zum Versiegeln von teilzubereiteten Speisen |
JP2019204933A (ja) * | 2018-05-25 | 2019-11-28 | デクセリアルズ株式会社 | 電子部品供給体、電子部品供給リール |
TW202200378A (zh) * | 2020-03-17 | 2022-01-01 | 日商大日本印刷股份有限公司 | 電子零件包裝用覆蓋帶及包裝體 |
CN112277412B (zh) * | 2020-10-15 | 2022-10-21 | 河北泰达包装材料有限公司 | 一种塑料载带专用上盖带 |
JPWO2022255338A1 (ko) * | 2021-05-31 | 2022-12-08 | ||
CN113478931A (zh) * | 2021-07-06 | 2021-10-08 | 靖江瑞泰电子材料有限公司 | 一种热封型中脱盖带及制备方法 |
CN113426643B (zh) * | 2021-07-06 | 2023-08-22 | 靖江瑞泰电子材料有限公司 | 一种多层结构的热封盖带及制备方法 |
CN117227287B (zh) * | 2023-08-21 | 2024-04-09 | 青岛伟东包装有限公司 | 一种服装用品防尘塑料膜及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08258888A (ja) * | 1995-03-23 | 1996-10-08 | Sumitomo Bakelite Co Ltd | 表面実装用エンボスキャリアテープ用カバーテープ |
KR0174328B1 (ko) * | 1996-06-11 | 1999-03-20 | 구형우 | 캐리어테이프용 열 접착테이프 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5929128A (en) * | 1993-08-18 | 1999-07-27 | The Dow Chemical Company | Gaskets made from olefin polymers |
JP3192380B2 (ja) * | 1995-11-22 | 2001-07-23 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ |
JPH09175592A (ja) * | 1995-12-26 | 1997-07-08 | Du Pont Mitsui Polychem Co Ltd | 電子部品包装用カバーテープ |
JPH10166523A (ja) * | 1996-12-13 | 1998-06-23 | Tosoh Corp | 多層フィルム |
US6231975B1 (en) * | 1997-01-24 | 2001-05-15 | Mobil Oil Corporation | Sealable film |
US6586061B1 (en) * | 1999-04-01 | 2003-07-01 | Japan Polychem Corporation | Multi-layer film and medical bag using the same |
JP2002012288A (ja) * | 2000-06-28 | 2002-01-15 | Nitto Denko Corp | 電子部品搬送用カバーテープ及び電子部品搬送体 |
JP2003012027A (ja) * | 2001-06-26 | 2003-01-15 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
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2004
- 2004-04-26 US US10/553,724 patent/US20060199005A1/en not_active Abandoned
- 2004-04-26 TW TW93111634A patent/TW200426030A/zh not_active IP Right Cessation
- 2004-04-26 WO PCT/JP2004/005981 patent/WO2004094258A1/ja active Application Filing
- 2004-04-26 KR KR1020057019841A patent/KR100762544B1/ko active IP Right Grant
- 2004-04-26 CN CN200480010930XA patent/CN1777547B/zh not_active Expired - Lifetime
- 2004-04-26 JP JP2005505812A patent/JP4500769B2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08258888A (ja) * | 1995-03-23 | 1996-10-08 | Sumitomo Bakelite Co Ltd | 表面実装用エンボスキャリアテープ用カバーテープ |
KR0174328B1 (ko) * | 1996-06-11 | 1999-03-20 | 구형우 | 캐리어테이프용 열 접착테이프 |
Also Published As
Publication number | Publication date |
---|---|
CN1777547A (zh) | 2006-05-24 |
WO2004094258A1 (ja) | 2004-11-04 |
TWI327107B (ko) | 2010-07-11 |
JPWO2004094258A1 (ja) | 2006-07-13 |
TW200426030A (en) | 2004-12-01 |
KR20060007387A (ko) | 2006-01-24 |
JP4500769B2 (ja) | 2010-07-14 |
CN1777547B (zh) | 2010-09-01 |
US20060199005A1 (en) | 2006-09-07 |
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