KR100757024B1 - 전기 회로의 제조 방법 - Google Patents
전기 회로의 제조 방법 Download PDFInfo
- Publication number
- KR100757024B1 KR100757024B1 KR1020040028187A KR20040028187A KR100757024B1 KR 100757024 B1 KR100757024 B1 KR 100757024B1 KR 1020040028187 A KR1020040028187 A KR 1020040028187A KR 20040028187 A KR20040028187 A KR 20040028187A KR 100757024 B1 KR100757024 B1 KR 100757024B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive layer
- substrate
- circuit pattern
- electric
- fluids
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Textile Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
Claims (22)
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 침투성을 갖는 전기 기판에 도전성 재료를 포함하는 유동체를 침투시키고 고화시켜서 인덕턴스를 형성시키는 전기 회로의 제조 방법으로서,상기 전기 기판의 한쪽 면에 대하여 상기 유동체를 토출하여, 상기 한쪽 면의 표층측(表層側)에 소용돌이 모양 도전층을 형성하는 공정과,상기 소용돌이 모양 도전층의 중심에 상기 유동체를 토출하여, 상기 전기 기판의 다른쪽 면측에 연결되는 제 1 도전층을 형성하는 공정과,상기 다른쪽 면에 대하여 상기 유동체를 토출하여, 상기 다른쪽 면의 표층측에, 상기 다른쪽 면의 표층측에 노출된 상기 제 1 도전층에 접속하는 제 2 도전층을 형성하는 공정을 갖는 것을 특징으로 하는 전기 회로의 제조 방법.
- 삭제
- 삭제
- 삭제
- 제 11 항에 있어서,상기 제 2 도전층은 상기 제 1 도전층으로부터 바깥쪽으로 직선 모양으로 연장되는 인출선으로서 형성되는 것을 특징으로 하는 전기 회로의 제조 방법.
- 제 11 항에 있어서,상기 제 2 도전층은 상기 전기 기판의 상기 다른쪽 면에서, 상기 전기 기판의 상기 한쪽 면의 상기 소용돌이 모양 도전층보다도 바깥쪽으로 연장되는 것을 특징으로 하는 전기 회로의 제조 방법.
- 제 11 항에 있어서,상기 소용돌이 모양 도전층의 나선(螺旋) 사이에, 자성 재료를 갖는 것을 특징으로 하는 전기 회로의 제조 방법.
- 제 11 항에 있어서,상기 소용돌이 모양 도전층을 형성하는 공정은, 상기 전기 기판의 상기 한쪽 면에 대향하는 잉크젯 헤드로부터 상기 유동체를 토출하는 공정을 더 포함하는 것을 특징으로 하는 전기 회로의 제조 방법.
- 제 11 항에 있어서,상기 제 1 도전층을 형성하는 공정은, 상기 전기 기판의 상기 한쪽 면에 대향하는 잉크젯 헤드로부터 상기 유동체를 토출하는 공정을 더 포함하는 것을 특징으로 하는 전기 회로의 제조 방법.
- 제 19 항에 있어서,상기 제 1 도전층을 형성하는 공정은, 상기 전기 기판의 상기 다른쪽 면에 대향하고 상기 소용돌이 모양 도전층의 중심에 거의 나란한 다른 잉크젯 헤드로부터, 추가분의 상기 유동체를 토출하는 공정을 더 포함하는 것을 특징으로 하는 전기 회로의 제조 방법.
- 제 11 항에 있어서,상기 제 2 도전층을 형성하는 공정은, 상기 전기 기판의 상기 다른쪽 면에 대향하는 잉크젯 헤드로부터 상기 유동체를 토출하는 공정을 더 포함하는 것을 특징으로 하는 전기 회로의 제조 방법.
- 제 11 항에 있어서,상기 전기 기판은 실리카 섬유, 알루미나 섬유, 및 세라믹스로 이루어지는 그룹으로부터 선택되는 1종을 더 포함하는 것을 특징으로 하는 전기 회로의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2003-00151059 | 2003-05-28 | ||
JP2003151059A JP3861854B2 (ja) | 2003-05-28 | 2003-05-28 | 電気回路の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060060253A Division KR100695794B1 (ko) | 2003-05-28 | 2006-06-30 | 전기 회로의 제조 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040104356A KR20040104356A (ko) | 2004-12-10 |
KR100757024B1 true KR100757024B1 (ko) | 2007-09-07 |
Family
ID=33487204
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040028187A KR100757024B1 (ko) | 2003-05-28 | 2004-04-23 | 전기 회로의 제조 방법 |
KR1020060060253A KR100695794B1 (ko) | 2003-05-28 | 2006-06-30 | 전기 회로의 제조 장치 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060060253A KR100695794B1 (ko) | 2003-05-28 | 2006-06-30 | 전기 회로의 제조 장치 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20040247842A1 (ko) |
JP (1) | JP3861854B2 (ko) |
KR (2) | KR100757024B1 (ko) |
CN (1) | CN1316859C (ko) |
TW (1) | TWI243632B (ko) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
WO2006076613A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Metal nanoparticle compositions |
US8334464B2 (en) | 2005-01-14 | 2012-12-18 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
WO2006076604A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Processes for planarizing substrates and encapsulating printable electronic features |
WO2006076607A1 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Ink-jet printing of passive electricalcomponents |
US7867561B2 (en) | 2005-06-22 | 2011-01-11 | Canon Kabushiki Kaisha | Circuit pattern forming method and circuit pattern forming device |
US20070048439A1 (en) * | 2005-08-24 | 2007-03-01 | Motohiro Yasui | Method Of Producing Film And Method Of Producing Ink-Jet Head |
KR100649445B1 (ko) * | 2005-10-17 | 2006-11-27 | 삼성전기주식회사 | 배선형성 방법 및 장치 |
FR2893478B1 (fr) * | 2005-11-14 | 2011-05-20 | Eads Space Transp Sas | Circuit imprime a surface non developpable a trois dimensions et son procede de fabrication. |
KR100836654B1 (ko) * | 2006-10-17 | 2008-06-10 | 삼성전기주식회사 | 인쇄회로기판 제조장치 및 제조방법 |
EP1926357A3 (en) * | 2006-11-21 | 2009-09-30 | Ricoh Company, Ltd. | Functional device fabrication apparatus and functional device fabricated with the same |
KR100901490B1 (ko) * | 2007-05-15 | 2009-06-08 | 삼성전기주식회사 | 배선형성장치 및 인쇄회로기판 제조방법 |
JP4935743B2 (ja) * | 2008-04-08 | 2012-05-23 | 株式会社日立プラントテクノロジー | フラックス形成装置 |
KR100999502B1 (ko) * | 2008-09-05 | 2010-12-09 | 삼성전기주식회사 | 잉크젯인쇄장치 및 인쇄회로기판의 제조방법 |
KR100999920B1 (ko) * | 2008-09-10 | 2010-12-13 | 삼성전기주식회사 | 잉크젯 장치를 이용한 배선 인쇄 방법 |
KR100999509B1 (ko) * | 2008-09-23 | 2010-12-09 | 삼성전기주식회사 | 보완용 인쇄 노즐을 포함하는 잉크젯 장치를 이용한 배선인쇄 방법 |
KR101075630B1 (ko) * | 2010-08-26 | 2011-10-21 | 삼성전기주식회사 | 인쇄 회로 기판 제조용 레지스트 도포 장치 |
KR20120052043A (ko) * | 2010-11-15 | 2012-05-23 | 삼성전자주식회사 | 잉크젯 프린트용 기판의 표면 개질 방법 |
JP2013110369A (ja) * | 2011-11-24 | 2013-06-06 | Kyocera Corp | 配線基板の製造方法 |
US20150197063A1 (en) * | 2014-01-12 | 2015-07-16 | Zohar SHINAR | Device, method, and system of three-dimensional printing |
US20150197062A1 (en) * | 2014-01-12 | 2015-07-16 | Zohar SHINAR | Method, device, and system of three-dimensional printing |
US20150201500A1 (en) * | 2014-01-12 | 2015-07-16 | Zohar SHINAR | System, device, and method of three-dimensional printing |
NL2015400B1 (en) | 2015-09-04 | 2017-03-22 | Eurekite Holding B V | Ceramic based Printed Circuit Board and Method for manufacturing such a Printed Circuit Board. |
US11191678B2 (en) * | 2018-02-07 | 2021-12-07 | Raja Singh Tuli | Method of manufacturing a diaper with moisture sensors |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11274671A (ja) | 1998-03-25 | 1999-10-08 | Seiko Epson Corp | 電気回路、その製造方法および電気回路製造装置 |
JP2003100553A (ja) * | 2001-09-26 | 2003-04-04 | Toshiba Corp | 受動素子部品及び受動素子内蔵基板 |
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US5002824A (en) * | 1986-11-28 | 1991-03-26 | Rockwell International Corporation | Substrates containing electrically conducting coatings and method of producing same |
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JPH101999A (ja) * | 1996-06-17 | 1998-01-06 | Kyowa Plast Sangyo Kk | 便器用接続フランジおよび同フランジと便器との連結構造 |
JP4003273B2 (ja) * | 1998-01-19 | 2007-11-07 | セイコーエプソン株式会社 | パターン形成方法および基板製造装置 |
WO2003022453A1 (en) * | 2001-09-13 | 2003-03-20 | Koninklijke Philips Electronics N.V. | Apparatus for and method of applying a substance to a substrate |
US6835889B2 (en) * | 2001-09-21 | 2004-12-28 | Kabushiki Kaisha Toshiba | Passive element component and substrate with built-in passive element |
JP2003115650A (ja) * | 2001-10-03 | 2003-04-18 | Yazaki Corp | 回路体の製造方法および製造装置 |
-
2003
- 2003-05-28 JP JP2003151059A patent/JP3861854B2/ja not_active Expired - Fee Related
-
2004
- 2004-04-01 US US10/816,222 patent/US20040247842A1/en not_active Abandoned
- 2004-04-02 TW TW093109259A patent/TWI243632B/zh not_active IP Right Cessation
- 2004-04-23 KR KR1020040028187A patent/KR100757024B1/ko active IP Right Grant
- 2004-04-29 CN CNB2004100385246A patent/CN1316859C/zh not_active Expired - Fee Related
-
2006
- 2006-06-30 KR KR1020060060253A patent/KR100695794B1/ko not_active IP Right Cessation
- 2006-12-20 US US11/642,732 patent/US20070098882A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11274671A (ja) | 1998-03-25 | 1999-10-08 | Seiko Epson Corp | 電気回路、その製造方法および電気回路製造装置 |
JP2003100553A (ja) * | 2001-09-26 | 2003-04-04 | Toshiba Corp | 受動素子部品及び受動素子内蔵基板 |
Also Published As
Publication number | Publication date |
---|---|
JP3861854B2 (ja) | 2006-12-27 |
US20070098882A1 (en) | 2007-05-03 |
TW200505308A (en) | 2005-02-01 |
JP2004356296A (ja) | 2004-12-16 |
US20040247842A1 (en) | 2004-12-09 |
KR100695794B1 (ko) | 2007-03-16 |
KR20060085225A (ko) | 2006-07-26 |
CN1575093A (zh) | 2005-02-02 |
KR20040104356A (ko) | 2004-12-10 |
CN1316859C (zh) | 2007-05-16 |
TWI243632B (en) | 2005-11-11 |
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