NL2015400B1 - Ceramic based Printed Circuit Board and Method for manufacturing such a Printed Circuit Board. - Google Patents

Ceramic based Printed Circuit Board and Method for manufacturing such a Printed Circuit Board. Download PDF

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Publication number
NL2015400B1
NL2015400B1 NL2015400A NL2015400A NL2015400B1 NL 2015400 B1 NL2015400 B1 NL 2015400B1 NL 2015400 A NL2015400 A NL 2015400A NL 2015400 A NL2015400 A NL 2015400A NL 2015400 B1 NL2015400 B1 NL 2015400B1
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Netherlands
Prior art keywords
layer
circuit board
printed circuit
ceramic material
patterned layer
Prior art date
Application number
NL2015400A
Other languages
Dutch (nl)
Inventor
Cadafalch Gazquez Gerard
Mammadov Bahruz
Evert Ten Elshof Johan
Original Assignee
Eurekite Holding B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eurekite Holding B V filed Critical Eurekite Holding B V
Priority to NL2015400A priority Critical patent/NL2015400B1/en
Priority to PCT/EP2016/070678 priority patent/WO2017037211A1/en
Application granted granted Critical
Publication of NL2015400B1 publication Critical patent/NL2015400B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

A printed circuit board includes a substrate and a circuit. The substrate is a layer of a ceramic substance, and the circuit is arranged on at least one surface of the substrate. The layer of the ceramic substance includes a non-woven mat of particles of the ceramic substance, and the non-woven mat has a relative density of 25% or less in comparison with the bulk density of the ceramic substance. Also, the invention relates to a method for manufacturing such a printed circuit board.

Description

Ceramic based Printed Circuit Board and Method for manufacturing such a Printed Circuit Board
Field of invention
The present invention relates to a ceramic based printed circuit board. Also, the invention relates to a method for manufacturing such a printed circuit board.
Background
Printed circuit board (PCB) technology is an essential part for electronics. A printed circuit board mechanically supports and electrically connects electronic components that are mounted on the printed circuit board. PCBs allow a more compact configuration of electronic devices and avoid the use of cables, which makes the assembly process easier and faster.
Moreover, PCB technology is also used to fabricate microstrips. Microstrip technology is used to convey microwave frequency radio signals to form antennas, couplers, filter, power dividers, etc. The advantage of microstrip to classic antenna design is space reduction and conformity.
In the prior art various types of printed circuit board are known based on the board material: 1. Glassfiber-plate printed circuit boards based on glassfibers embedded in a resin, typically epoxy resin; 2. Polymer based printed circuit boards based on a polymer foil; 3. Ceramic based printed circuit boards based on a ceramic substrate, and 4. Insulated metal substrate printed circuit boards.
Of these categories the ceramic based printed circuit board is predominantly used for highly demanding electronics such as power electronics or high frequency applications.
Electronic devices, especially power electronics, achieve high temperatures during operation. Certain applications such as automotive, aerospace or military, also require extreme working conditions. Moreover, during electronic assembly the PCB has to undergo high temperature cycles to solder the electronic elements.
High frequency applications also require a low dielectric loss to improve the electrical signal.
There is an increasing demand for PCBs that are flexible to reduce size and weight of products, to allow more complex PCB configurations and allow flexibility in application.
Summary of invention
It is an object of the invention to overcome or mitigate the disadvantages of the printed circuit board from the prior art.
The object is achieved by a printed circuit board comprising a substrate and a circuit, the substrate being a layer of a ceramic substance, and the circuit being arranged on at least one surface of the substrate, wherein the layer of the ceramic substance comprises a non-woven mat of particles of the ceramic substance, and the non-woven mat has a relative density of 25% or less in comparison with the bulk density of the ceramic substance.
The invention is based on the observation that the weight of a solid ceramic substrate can be reduced strongly by replacing the solid substrate with a non-woven layer of ceramic nano- or microfibers, since the density of the non-woven mat can be 10% or less of the density of the solid. In addition to the reduction in weight, due to the porous structure, the non-woven structure of the ceramic substance offers substantially lower dielectric losses than a solid substrate of the same material, with a still a relatively high dielectric strength and low dielectric constant. Moreover, the porosity of the material also offers high thermal conductivity (value of air over value of ceramic).
According to an aspect, the invention provides a printed circuit board as described above, wherein the particles of the ceramic substance are nanofibers or micro fibers.
Advantageously, it has been found that on the non-woven mat of ceramic nano-or microfibers an electric circuit can be formed that adheres well to the surface of the non-woven mat.
As a result of the properties of the non-woven structure the printed circuit board according to the invention is highly flexible and can be folded or wrapped in any shape basically only limited by the circuit layer and components. This feature provides additional freedom of design in terms of required footprint for such a printed circuit board.
According to an aspect, the invention provides a printed circuit board as described above, wherein the ceramic substance is one selected from a group of ceramic substances comprising zirconia, yttrium stabilized zirconia, silicon-oxide, titanium-oxide, a silicate compound, a titanate compound and a nitride compound.
According to an aspect, the invention provides a printed circuit board as described above, wherein the density of the non-woven mat is about 1.4 g/cm3 or less.
According to an aspect, the invention provides a printed circuit board as described above, wherein the non-woven mat of the ceramic material has a dielectric loss of 75% of the dielectric loss of the ceramic material in bulk form, or less.
According to an aspect, the invention provides a printed circuit board as described above, wherein the circuit comprises a conductive patterned layer.
According to an aspect, the invention provides a printed circuit board as described above, wherein the conductive patterned layer is one selected from a lithographically patterned layer, an inkjet-printed patterned layer, a screen-printed patterned layer, a laminated patterned layer and an electroplated patterned layer.
According to an aspect, the invention provides a printed circuit board as described above, wherein the circuit comprises a micro-strip transmission line element or an RFID element.
According to an aspect, the invention provides a printed circuit board as described above, wherein the circuit comprises a conductive connection pattern for components of an electrical or electronic circuit that are mounted on the printed circuit board.
According to an aspect, the invention provides a printed circuit board as described above, wherein the conductive patterned layer comprises one or more of silver, copper, nickel, platinum and their alloys.
Additionally, the invention relates to a method for manufacturing a printed circuit board comprising a substrate and a circuit layer, the substrate being a layer of a ceramic substance, the method comprising: - providing the layer of the ceramic substance as substrate; - creating the circuit layer on at least one surface of the substrate, wherein the layer of the ceramic substance comprises a non-woven mat of particles of the ceramic substance, and the non-woven mat has a relative density of 25% or less in comparison with the bulk density of the ceramic substance.
According to an aspect, the invention provides a method as described above, wherein the circuit layer comprises a conductive patterned layer and the creation of the circuit on the at least one surface comprises a process selected from a group comprising: inkjet-printing of the conductive patterned layer; screen-printing of the conductive patterned layer; lamination of the conductive patterned layer, and electroplating of the conductive patterned layer.
According to an aspect, the invention provides a method as described above, wherein the circuit comprises a conductive patterned layer and the creation of the circuit on the at least one surface comprises one process selected from a group comprising: creating a blanket conductive layer by means of one process selected from a group comprising: layer deposition, inkjet-printing, screen-printing, lamination, and electroplating, and subsequently processing by a lithographical patterning of the blanket conductive layer to form the conductive patterned layer.
According to an aspect, the invention provides a method as described above, further comprising: fabricating the non-woven mat of ceramic substance particles by a process selected from electrospinning, forcespinning and melt-blowing of a precursor of the ceramic substance.
According to an aspect, the invention provides a method as described above, wherein the ceramic substance is one selected from a group of ceramic substances comprising zirconia, yttrium stabilized zirconia, silicon-oxide, titanium-oxide, a silicate compound, a titanate compound and a nitride compound.
According to an aspect, the invention provides a method as described above, wherein the conductive patterned layer comprises one or more of silver, copper, nickel, platinum and their alloys.
Advantageous embodiments are further defined by the dependent claims.
Brief description of drawings
The invention will be explained in more detail below with reference to drawings in which illustrative non-limiting embodiments thereof are shown. The scope of the invention is only limited by the definitions presented in the appended claims.
Figures 1 A, IB show a cross-section and a top view, respectively, of a printed circuit board according to an embodiment of the invention.
Detailed description of embodiments
Figure 1A shows a cross-section of a printed circuit board according to an embodiment of the invention.
The present invention relates to a printed circuit board 10 that comprises as a substrate 20 a non-woven mat of a ceramic substance. On a surface of the non-woven mat at least one circuit layer 30 is arranged.
The non-woven mat typically comprises nano fibers (sometimes referred to as microfibers) of the ceramic substance. Nanofibers in this respect are defined as fibers with a diameter of 5 micrometer or less. Production of ceramic nano fibers can be done by any known technique, inter alia by electrospinning or forcespinning or melt-blowing techniques
The nano fibers are processed in a manner that a non-woven mat of the nano fibers is created.
The nano fibers are arranged in a porous but cohesive network, which provides internal strength to the non-woven structure. The non-woven mat therefore has a stable shape.
Also, the cohesion of the network allows that the non-woven mat is flexible and can folded or wrapped without rupture.
The ceramic substance can be any ceramic material that can be produced in the shape of nano fibers.
For example, the ceramic substance can be selected from a group of materials comprising zirconia (zirconium-oxide), yttrium stabilized zirconia, titanium-oxide, titanate, silicon-oxide, silicate, or nitride. The skilled in the art will appreciate that the choice of the ceramic substance may not be limited to a ceramic material of this list.
Due to the porous network of nano fibers the density of the non-woven mat is low and can be about 25% or less of the bulk density of the ceramic substance. For example, the density of a zirconia based non-woven mat is about 1.4 g/cm3 or lower.
In a preferred embodiment, the non-woven mat is substantially free of a binder material. In particular, for applications of the non-woven mat at elevated temperature (i.e., at about 100°C or higher), binder material may be undesirable due to instability and/or decomposition at such temperature. It is observed that creation of the non-woven mat from ceramic nano fibers in absence of binder material can result in a ceramic substrate with sufficient cohesion and strength to be used as printed circuit board substrate. In this manner, the invention provides that the printed circuit board 10 comprising the non-woven mat 20 can be configured for stable operation at such elevated temperatures, for example at 100°C or higher.
On a surface of the non-woven mat 20, a conductive layer 30 is arranged that embodies a circuit layer. The conductive layer 30 comprises a conductive material, i.e., a metal or a conductive metal compound.
The circuit layer is typically patterned in accordance with a desired functionality of the printed circuit board.
The circuit layer is created on at least one surface of the non-woven mat by a deposition technique selected from a group comprising inkjet printing, screen printing, lamination, and electroplating.
For example, the non-woven mat may have a thickness between about 10 micrometer and one or more millimeter (~10 pm to >1 mm).
The conductive material of the circuit layer can comprise one or more of silver, copper, nickel, platinum and their alloys, but is not limited to these materials.
It should be noted that due to the porosity of the substrate non-woven mat, the interface between the substrate and the circuit layer may display some roughness and intermixing.
Patterning of the created circuit layer can be done in any manner known for the selected deposition technique.
Figure 2 shows a schematic top view of a printed circuit board according to an embodiment of the invention. On the surface of the non-woven mat 20 of ceramic fibers, the patterned circuit layer 30 is arranged. It will be appreciated that for illustration the circuit layer 30 is only schematically patterned in an arbitrary shape.
The patterned circuit layer 30 may comprise one or more patterned layer areas.
According to an embodiment, the patterned circuit layer 30 is a stand-alone circuit such as a micro-strip transmission line or an RFID (Radio-Frequency IDentification) circuit.
In case of a micro-strip transmission line a further metallic backplane (not shown) is required on the surface of the non-woven mat that opposes the surface with the circuit layer 30.
According to an alternative embodiment, the patterned circuit layer 30 can be arranged as a conductive connection pattern for components (not shown) of an electric or electronic circuit that are mounted on the printed circuit board 10.
The printed circuit board of the present invention can be used as a free standing circuit board or be incorporated into a body (shape) of a device.
Moreover, due to the thermal properties of the ceramic nanofibers, the printed circuit board can advantageously be used in relatively high temperature applications, by embedding in a fire resistant resin body or package or even in a ceramic body or package to form high temperature sensors. Also, the thermal properties allow relatively high manufacturing temperatures, in particular, the application in the ceramic package would require relatively extreme temperature during manufacturing.
In comparison to prior art printed circuit boards, the printed circuit board according to the invention has some advantages: the printed circuit board is flexible and relatively light-weight due to the use of a non-woven mat of ceramic fibers. Moreover, the printed circuit board has a relatively higher heat dissipation and thermal stability. In addition, due to the low density of the substrate , the dielectric losses are significantly lower than for solid substrates from the prior art. As a result, the printed circuit board according to the invention can enhance applications in for example the fields of high frequency RF telecommunications, power electronics, energy storage (batteries), LED lighting and high temperature sensing.
The invention has been described with reference to the preferred embodiment. Obvious modifications and alterations will occur to the skilled in the art upon reading and understanding the preceding detailed description. It is intended that the invention be construed as including all such modifications and alterations insofar as they come within the scope of the invention as defined by the appended claims.

Claims (18)

1. Printed circuit board omvattend een substraat en een circuit, waarbij het substraat een laag keramisch materiaal is, en het circuit is aangebracht op ten minste één oppervlak van het substraat, waarbij de laag keramisch materiaal een non-woven mat bestaand uit keramische materiaaldeeltjes omvat, en de non-woven mat een relatieve dichtheid van 25% of minder heeft in vergelijking met de bulk dichtheid van het keramisch materiaal.A printed circuit board comprising a substrate and a circuit, wherein the substrate is a layer of ceramic material, and the circuit is arranged on at least one surface of the substrate, the layer of ceramic material comprising a non-woven mat consisting of ceramic material particles and the non-woven mat has a relative density of 25% or less compared to the bulk density of the ceramic material. 2. Printed circuit board volgens conclusie 1, waarbij de keramisch materiaaldeeltjes nano vezels of micro vezels omvatten.A printed circuit board according to claim 1, wherein the ceramic material particles comprise nano fibers or micro fibers. 3. Printed circuit board volgens conclusie 1 of conclusie 2, waarbij het keramisch materiaal er één is die gekozen wordt uit een groep keramisch materialen omvattend zirconia, yttrium gestabilizeerd zirconia, silicon-oxide, titanium-oxide, een silicaatverbinding, een titanaatverbinding en een nitrideverbinding.A printed circuit board according to claim 1 or claim 2, wherein the ceramic material is one selected from a group of ceramic materials comprising zirconia, yttrium-stabilized zirconia, silicon oxide, titanium oxide, a silicate compound, a titanate compound and a nitride compound . 4. Printed circuit board volgens één van de conclusies 1-3, waarbij de dichtheid van de non-woven mat ongeveer 1.4 g/cm3 of minder is.Printed circuit board according to any of claims 1-3, wherein the density of the non-woven mat is approximately 1.4 g / cm 3 or less. 5. Printed circuit board volgens één van de voorgaande conclusies, waarbij de non-woven mat van keramisch materiaal een dielectrisch verlies (dielectric loss) heeft van 75% van het dielectrisch verlies van het keramisch materiaal in bulk vorm, of minder.Printed circuit board according to any of the preceding claims, wherein the non-woven mat of ceramic material has a dielectric loss (75%) of the dielectric loss of the ceramic material in bulk form, or less. 6. Printed circuit board volgens één van de voorgaande conclusies, waarbij het circuit een geleidende in patroon gebrachte laag omvat.A printed circuit board according to any one of the preceding claims, wherein the circuit comprises a conductive patterned layer. 7. Printed circuit board volgens conclusie 5 of conclusie 6, waarbij de geleidende in patroon gebrachte laag er één is die gekozen wordt uit een lithografisch in patroon gebrachte laag, een met behulp van inkjet-printing in patroon gebrachte laag, een met behulp van screen-printing in patroon gebrachte laag, een gelamineerde in patroon gebrachte laag en een door electroplating in patroon gebrachte laag.A printed circuit board according to claim 5 or claim 6, wherein the conductive patterned layer is one selected from a lithographically patterned layer, a layer patterned using inkjet printing, a screen patterned printing patterned layer, a laminated patterned layer and an electroplated patterned layer. 8. Printed circuit board volgens één van de voorgaande conclusies 5-7, waarbij het circuit een micro-strip transmissielijnelement of een RFID element omvat.Printed circuit board according to any of the preceding claims 5-7, wherein the circuit comprises a micro-strip transmission line element or an RFID element. 9. Printed circuit board volgens één van de voorgaande conclusies 5-7, waarbij het circuit een geleidend verbindingspatroon voor componenten van een elektrisch of elektronisch circuit omvat die worden aangebracht op het printed circuit board.Printed circuit board according to any of the preceding claims 5-7, wherein the circuit comprises a conductive connection pattern for components of an electrical or electronic circuit which are arranged on the printed circuit board. 10. Printed circuit board volgens één van de voorgaande conclusies 6-9, waarbij de geleidende in patroon gebrachte laag één of meer van zilver, koper, nikkel, platina en hun legeringen omvat.A printed circuit board according to any of the preceding claims 6-9, wherein the conductive patterned layer comprises one or more of silver, copper, nickel, platinum and their alloys. 11. Printed circuit board volgens één van de voorgaande conclusies, waarbij het printed circuit board tijdens gebruik een gebogen, opgevouwen of opgerolde vorm heeft.A printed circuit board according to any one of the preceding claims, wherein the printed circuit board has a curved, folded or rolled shape during use. 12. Werkwijze voor het vervaardigen van een printed circuit board dat een substraat en een circuitlaag omvat, waarbij het substraat een laag keramisch materiaal is; waarbij de werkwijze omvat: - verschaffen van de laag keramisch materiaal als substraat; - vormen van de circuitlaag op tenminste één oppervlak van het substraat, waarbij de laag keramisch materiaal een non-woven mat van keramische materiaaldeeltjes omvat, en de non-woven mat een relatieve dichtheid van 25% of minder heeft in vergelijking met de bulk dichtheid van het keramisch materiaal.A method of manufacturing a printed circuit board comprising a substrate and a circuit layer, wherein the substrate is a layer of ceramic material; wherein the method comprises: - providing the layer of ceramic material as a substrate; - forming the circuit layer on at least one surface of the substrate, wherein the layer of ceramic material comprises a non-woven mat of ceramic material particles, and the non-woven mat has a relative density of 25% or less in comparison with the bulk density of the ceramic material. 13. Werkwijze volgens conclusie 12, waarbij de circuitlaag een geleidende in patroon gebrachte laag omvat en het vormen van de circuitlaag op tenminste één oppervlak een bewerking omvat die gekozen wordt uit een groep omvattend: inkjet-printen van de geleidende in patroon gebrachte laag; screen-printen van de geleidende in patroon gebrachte laag; lamineren van de geleidende in patroon gebrachte laag, en electroplating van de geleidende in patroon gebrachte laag.The method of claim 12, wherein the circuit layer comprises a conductive patterned layer and forming the circuit layer on at least one surface comprises an operation selected from a group comprising: inkjet printing of the conductive patterned layer; screen printing of the conductive patterned layer; laminating the conductive patterned layer, and electroplating the conductive patterned layer. 14. Werkwijze volgens conclusie 12, waarbij het circuit een geleidende in patroon gebrachte laag omvat en het vormen van het circuit op tenminste één oppervlak een bewerking omvat die gekozen wordt uit een groep omvattend: vormen van een bedekkende geleidende laag door een bewerking gekozen uit een groep omvattend: laagdepositie, inkjet-printen, screen-printen, lamineren, en electroplating; en vervolgens bewerken door een lithografisch in patroon brengen van de bedekkende geleidende laag om zo de geleidende in patroon gebrachte laag te vormen.The method of claim 12, wherein the circuit comprises a conductive patterned layer and forming the circuit on at least one surface comprises an operation selected from a group comprising: forming an overlying conductive layer by an operation selected from a group comprising: layer deposition, inkjet printing, screen printing, laminating, and electroplating; and then processing by lithographically patterning the covering conductive layer to thereby form the conductive patterned layer. 15. Werkwijze volgens één van de voorgaande conclusies 12 - 14, omvattend: vervaardingen van de non-woven mat van keramische materiaaldeeltjes door een bewerking gekozen uit electrospinnen, forcespinnen en smelt-blazen van een precursor materiaal van het keramisch materiaal.A method according to any one of the preceding claims 12-14, comprising: manufacturing the non-woven mat of ceramic material particles by an operation selected from electrospinning, force spinning and melt-blowing of a precursor material of the ceramic material. 16. Werkwijze volgens één van de voorgaande conclusies 12 - 15, waarbij het keramisch materiaal er één is die gekozen wordt uit een groep van keramische materialen omvattend zirconia, yttrium gestabilizeerd zirconia, silicon-oxide, titanium-oxide, een silicaatverbinding, een titanaatverbinding en een nitrideverbinding.A method according to any one of the preceding claims 12-15, wherein the ceramic material is one selected from a group of ceramic materials comprising zirconia, yttrium stabilized zirconia, silicon oxide, titanium oxide, a silicate compound, a titanate compound and a nitride compound. 17. Werkwijze volgens één van de voorgaande conclusies 12 - 16, waarbij de geleidende in patroon gebrachte laag één of meer van zilver, koper, nikkel, platina en hun legeringen omvat.The method of any one of the preceding claims 12-16, wherein the conductive patterned layer comprises one or more of silver, copper, nickel, platinum and their alloys. 18. Werkwijze volgens één van de voorgaande conclusies 12 - 17, waarbij de keramische materiaaldeeltjes nano vezels of micro vezels omvatten.A method according to any one of the preceding claims 12 - 17, wherein the ceramic material particles comprise nano fibers or micro fibers.
NL2015400A 2015-09-04 2015-09-04 Ceramic based Printed Circuit Board and Method for manufacturing such a Printed Circuit Board. NL2015400B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
NL2015400A NL2015400B1 (en) 2015-09-04 2015-09-04 Ceramic based Printed Circuit Board and Method for manufacturing such a Printed Circuit Board.
PCT/EP2016/070678 WO2017037211A1 (en) 2015-09-04 2016-09-02 Ceramic based printed circuit board and method for manufacturing such a printed circuit board

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Application Number Priority Date Filing Date Title
NL2015400A NL2015400B1 (en) 2015-09-04 2015-09-04 Ceramic based Printed Circuit Board and Method for manufacturing such a Printed Circuit Board.

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WO2019003111A1 (en) * 2017-06-29 2019-01-03 3M Innovative Properties Company Flexible circuit with metal and metal oxide layers having the same metal

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030005723A1 (en) * 2001-06-08 2003-01-09 Japan Vilene Co., Ltd. Process for manufacturing inorganic article, inorganic article, and circuit substrate
US20040247842A1 (en) * 2003-05-28 2004-12-09 Minoru Koyama Electronic substrate, electronic circuit and method and device for manufacture of the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030005723A1 (en) * 2001-06-08 2003-01-09 Japan Vilene Co., Ltd. Process for manufacturing inorganic article, inorganic article, and circuit substrate
US20040247842A1 (en) * 2003-05-28 2004-12-09 Minoru Koyama Electronic substrate, electronic circuit and method and device for manufacture of the same

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