KR100750040B1 - 연삭 휠 - Google Patents
연삭 휠 Download PDFInfo
- Publication number
- KR100750040B1 KR100750040B1 KR1020010065505A KR20010065505A KR100750040B1 KR 100750040 B1 KR100750040 B1 KR 100750040B1 KR 1020010065505 A KR1020010065505 A KR 1020010065505A KR 20010065505 A KR20010065505 A KR 20010065505A KR 100750040 B1 KR100750040 B1 KR 100750040B1
- Authority
- KR
- South Korea
- Prior art keywords
- grinding wheel
- base
- coolant
- circumferential direction
- grinding
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Description
연삭숫돌마모량(㎜) | 연삭비 | |
실시예 | 20.0 | 14950 |
비교예 | 32.0 | 9344 |
Claims (9)
- 환상 베이스와 상기 베이스의 하면에 장착된 숫돌수단으로 구성된 연삭 휠에 있어서,상기 베이스는 상기 베이스의 내측에서 반지름방향 안쪽으로 개방된 냉각액풀이 형성된 내주면 및 하면을 포함하고,상기 베이스의 내주면과 하면을 포함하는 표면은 상기 냉각액풀로부터 유동되는 냉각수가 상기 냉각액 풀에 잔류 및 상기 베이스에서 상기 숫돌수단까지 가이드 되도록 내측 반지름 방향으로 냉각수를 전도 하는 것을 특징으로 하는 연삭 휠.
- 제 1 항에 있어서, 상기 냉각액 풀은 주위 방향으로 연속해서 연장하게 되어 있는 것을 특징으로 하는 연삭 휠.
- 제 1 항에 있어서, 상기 냉각액 풀은 하방으로 향해 반지름방향 바깥쪽으로 경사져 연장되는 상부 경사면과 상기 상부 경사면의 하방을 반지름방향 바깥쪽으로 실질상 수평으로 또는 반지름방향 안쪽으로 향해 하방으로 경사져 연장되는 돌출면과의 사이에 규정되어 있는 것을 특징으로 하는 연삭 휠.
- 제 1 항에 있어서, 상기 베이스에는 그 상면에서 상기 냉각액 풀에 연결되는 복수개의 연결 노치(notch) 또는 연결 홀(hole)이 주위 방향으로 간격을 두고 형성되어 있는 것을 특징으로 하는 연삭 휠.
- 제 1 항에 있어서, 상기 베이스는 상기 돌출면의 하방에 있어서 하방으로 향 해 반지름방향 바깥쪽으로 경사져 연장되는 하부 경사면을 가지는 것을 특징으로 하는 연삭 휠.
- 제 1 항에 있어서, 상기 연삭숫돌수단은 주위 방향으로 간격을 두고 배치되어 주위 방향으로 호 모양으로 연장되는 복수개의 연삭숫돌로 구성되어 있는 것을 특징으로 하는 연삭 휠.
- 제 1 항에 있어서, 상기 베이스의 내주면 및 하면에는 주위 방향으로 간격을 두고 상기 냉각액 풀에서 상기 연삭숫돌수단까지 연장되는 복수개의 냉각액 안내 홈이 형성되어 있는 것을 특징으로 하는 연삭 휠.
- 제 7 항에 있어서, 상기 냉각액 안내 홈은 상기 냉각액 풀에서 상기 연삭숫돌수단으로 향해 주위 방향 한쪽으로 향해 경사져 연장되어 있는 것을 특징으로 하는 연삭 휠.
- 제 7 항에 있어서, 상기 연삭숫돌수단은 주위 방향으로 간격을 두고 배치되어 주위 방향으로 호 모양으로 연장되는 복수개의 연삭숫돌으로 구성되어 있고, 상기 냉각액 안내 홈이 상기 연삭숫돌의 각각에 대응해서 형성되어 있는 것을 특징으로 하는 연삭 휠.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001203115A JP4885376B2 (ja) | 2001-07-04 | 2001-07-04 | 研削ホイール |
JPJP-P-2001-00203115 | 2001-07-04 | ||
JPJP-P-2001-00281505 | 2001-09-17 | ||
JP2001281505A JP4837853B2 (ja) | 2001-09-17 | 2001-09-17 | 研削ホイール |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030004007A KR20030004007A (ko) | 2003-01-14 |
KR100750040B1 true KR100750040B1 (ko) | 2007-08-16 |
Family
ID=26618098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010065505A KR100750040B1 (ko) | 2001-07-04 | 2001-10-23 | 연삭 휠 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6966826B2 (ko) |
KR (1) | KR100750040B1 (ko) |
DE (1) | DE10149712B4 (ko) |
MY (1) | MY134523A (ko) |
SG (1) | SG119140A1 (ko) |
TW (1) | TW491751B (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7052117B2 (en) * | 2002-07-03 | 2006-05-30 | Dimatix, Inc. | Printhead having a thin pre-fired piezoelectric layer |
JP2004050313A (ja) * | 2002-07-17 | 2004-02-19 | Memc Japan Ltd | 研削用砥石および研削方法 |
AT414105B (de) * | 2003-09-04 | 2006-09-15 | Schrottner Gerhard | Abdeckung zur mediumsführung bei schleifscheiben |
AT502503B1 (de) * | 2003-09-04 | 2007-04-15 | Schrottner Gerhard | Ringsystem zur mediumsführung bei schleifscheiben |
JP2009094326A (ja) * | 2007-10-10 | 2009-04-30 | Disco Abrasive Syst Ltd | ウェーハの研削方法 |
JP2009095947A (ja) * | 2007-10-18 | 2009-05-07 | Disco Abrasive Syst Ltd | 研削装置及びウェーハの研削方法 |
JP4662083B2 (ja) * | 2008-02-27 | 2011-03-30 | トヨタ自動車株式会社 | 研磨装置 |
KR20110056976A (ko) * | 2009-11-23 | 2011-05-31 | 삼성전자주식회사 | 휠 팁의 높이를 조절할 수 있는 웨이퍼 연마 장치 |
KR101395947B1 (ko) * | 2010-01-13 | 2014-05-16 | 가부시끼가이샤 아라이도 마테리아루 | 초지립 휠 및 그것을 사용한 웨이퍼의 제조 방법 및 웨이퍼 |
JP5855959B2 (ja) * | 2012-02-01 | 2016-02-09 | コマツNtc株式会社 | 研削砥石および研削装置 |
JP2015223691A (ja) * | 2014-05-30 | 2015-12-14 | 天龍製鋸株式会社 | カップホイール |
SE540285C2 (en) * | 2015-01-20 | 2018-05-22 | Htc Sweden Ab | System comprising a carrier disk and a floor grinding machine |
JP7204318B2 (ja) * | 2017-11-06 | 2023-01-16 | 株式会社ディスコ | 研削ホイール |
AT17877U1 (de) * | 2018-03-12 | 2023-06-15 | Tyrolit Schleifmittelwerke Swarovski Ag & Co K G | Schleifwerkzeug zum Schleifen eines Motorblocks |
KR102608901B1 (ko) * | 2018-12-24 | 2023-12-01 | 삼성전자주식회사 | 웨이퍼 그라인딩 휠 |
CN109483417B (zh) * | 2018-12-28 | 2023-12-26 | 西安增材制造国家研究院有限公司 | 一种金属基微量润滑砂轮及制作方法 |
CN109483418B (zh) * | 2018-12-28 | 2023-11-17 | 西安增材制造国家研究院有限公司 | 金属基微量润滑砂轮及金属基微量润滑砂轮的制作方法 |
US11699634B2 (en) * | 2019-05-03 | 2023-07-11 | Applied Materials, Inc. | Water cooled plate for heat management in power amplifiers |
JP2022018650A (ja) * | 2020-07-16 | 2022-01-27 | 株式会社ディスコ | 被加工物の研削方法 |
JP2022096834A (ja) * | 2020-12-18 | 2022-06-30 | 株式会社ディスコ | 研削ホイール |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1215064A (en) * | 1967-09-02 | 1970-12-09 | Schlageter Bayerische Maschf | Improvements relating to stone cutting and finishing wheels |
JPH0569338A (ja) * | 1991-06-24 | 1993-03-23 | Mitsubishi Materials Corp | 通水性カツプ型砥石 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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DE7236091U (de) * | 1973-02-01 | Sielemann H | Schleifvorrichtung | |
US2455597A (en) * | 1945-12-07 | 1948-12-07 | Super Cut | Grinding wheel |
CH321620A (fr) * | 1955-05-26 | 1957-05-15 | Fehlmann Henri | Dispositif d'arrosage d'une meule rotative |
US2840960A (en) * | 1956-10-22 | 1958-07-01 | Sheldon M Booth | Liquid feed for a grinding wheel |
FR1318959A (fr) * | 1962-03-23 | 1963-02-22 | Guilhon & Barthelemy Ets | Dispositif de grèsage et de son alimentation en eau |
US3110993A (en) * | 1962-07-18 | 1963-11-19 | Continental Granite Corp | Grinding wheel with provision for coolant application |
DE2425179A1 (de) * | 1973-05-31 | 1975-01-02 | Pramet N P Z Praskove Metalurg | Schleifscheibe |
SU566725A1 (ru) * | 1976-03-29 | 1977-07-30 | Ордена Трудового Красного Знамени Институт Сверхтвердых Материалов Ан Украинской Сср | Шлифовальный торцовый круг |
US4854087A (en) * | 1987-02-28 | 1989-08-08 | Zahnradfabrik Friedrichshafen A.G. | Grinding disc |
US4791760A (en) * | 1987-07-09 | 1988-12-20 | Corning Glass Works | Grinding wheel coolant distributor |
DE4109647A1 (de) * | 1991-03-23 | 1992-09-24 | Winter & Sohn Ernst | Schleifscheibe |
DE29604423U1 (de) * | 1996-03-09 | 1996-05-23 | Derkom & Klein Gmbh & Co Kg | Schleifring |
JPH10180624A (ja) * | 1996-12-19 | 1998-07-07 | Shin Etsu Handotai Co Ltd | ラッピング装置及び方法 |
DE29708235U1 (de) * | 1997-05-07 | 1997-09-11 | Lippert H Gmbh | Schleifkörper |
DE20002338U1 (de) * | 2000-01-14 | 2000-05-04 | Wolters Peter Werkzeugmasch | Maschine zum einseitigen Bearbeiten der Oberflächen von Werkstücken |
JP2001205560A (ja) * | 2000-01-28 | 2001-07-31 | Disco Abrasive Syst Ltd | 研削ホイール及び該研削ホイールの製造方法 |
-
2001
- 2001-10-05 SG SG200106155A patent/SG119140A1/en unknown
- 2001-10-09 DE DE10149712A patent/DE10149712B4/de not_active Expired - Lifetime
- 2001-10-09 TW TW090124947A patent/TW491751B/zh not_active IP Right Cessation
- 2001-10-10 US US09/972,872 patent/US6966826B2/en not_active Expired - Lifetime
- 2001-10-10 MY MYPI20014711A patent/MY134523A/en unknown
- 2001-10-23 KR KR1020010065505A patent/KR100750040B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1215064A (en) * | 1967-09-02 | 1970-12-09 | Schlageter Bayerische Maschf | Improvements relating to stone cutting and finishing wheels |
JPH0569338A (ja) * | 1991-06-24 | 1993-03-23 | Mitsubishi Materials Corp | 通水性カツプ型砥石 |
Non-Patent Citations (2)
Title |
---|
영국 특허공보 제1,215,064(1968. 3. 11) |
일본 공개특허공보 평05-069338호(1993.03.23) |
Also Published As
Publication number | Publication date |
---|---|
MY134523A (en) | 2007-12-31 |
KR20030004007A (ko) | 2003-01-14 |
DE10149712A1 (de) | 2003-01-16 |
SG119140A1 (en) | 2006-02-28 |
TW491751B (en) | 2002-06-21 |
DE10149712B4 (de) | 2013-02-14 |
US20030032382A1 (en) | 2003-02-13 |
US6966826B2 (en) | 2005-11-22 |
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